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Matches 251 - 300 out of 10,440

Document Document Title
WO/2012/141266
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...  
WO/2012/141267
A pressure-sensitive adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including t...  
WO/2012/137858
Provided are: a method for efficiently producing a polarizing plate which is free from entrance of air bubbles, which are large enough to deteriorate the quality of the polarizing plate, into an adhesive layer; a polarizing plate that is...  
WO/2012/132520
The present invention relates to a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer on at least one surface of a backing, wherein: the pressure sensitive adhesive layer has a two-layer configuration of a first...  
WO/2012/132500
Provided is a heat-shielding material comprising a metal particulate-containing layer containing at least one type of metal particulate, and an overcoat layer disposed in close contact with at least one surface of the metal particulate-c...  
WO/2012/133418
The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be suffici...  
WO/2012/134034
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/134034
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/127777
Provided is a zeolite-free adhesive for inorganic fibers that contains SiO2, CaO, and Al2O3 within a range excluding range I enclosed by the following point A, point 8, point 18, point 19, and point 20 in the phase diagram of SiO2-Al2O3-...  
WO/2012/127978
A light-reflective anisotropic conductive adhesive for use in anisotropically electrically connecting a light-emitting element to a wiring board, the adhesive comprising a thermosetting resin composition, electroconductive particles, and...  
WO/2012/124670
Provided are: a pressure-sensitive adhesive composition for optical members having excellent durability, adhesiveness (adhesion), and removability; a pressure-sensitive adhesive layer for optical members that uses the pressure-sensitive ...  
WO/2012/124389
An adhesive sheet (1A) comprising a release sheet (12), an adhesive agent layer (11) laminated on a release surface of the release sheet (12), and a base (13) laminated on the adhesive agent layer (11), wherein the adhesive agent layer (...  
WO/2012/124519
Provided is an adhesive tape which has unevenness followability capable of sufficiently filling unevenness of an adherend and can hold a state in which unevenness is sufficiently filled over time. The adhesive tape includes an adhesive a...  
WO/2012/121155
The purpose of the invention is to provide, substantially without using any phthalate plasticizers such as DOP or DBP, a polyvinyl chloride adhesive tape or sheet that has properties equaling or exceeding adhesive tapes or sheets that us...  
WO/2012/121374
Provided is a shatterproofing member with a hardenable pressure-sensitive adhesive layer, wherein the member: has excellent workability such as being capable of instantaneously fixing adherends to each other while also allowing mutual re...  
WO/2012/121336
One purpose of the present invention is to provide an adhesive for electronic components that suppresses the formation of voids and is not susceptible to piling up on a semiconductor chip surface. Furthermore, another purpose of the pres...  
WO/2012/118152
When a heat-peelable adhesive sheet is to be used, the heat-peelable adhesive sheet intended for a different work piece, a different step, or the like may be mistakenly used on occasion. For this reason, it is necessary to clearly confir...  
WO/2012/117902
The purpose of the present invention is to provide a curable composition with which initial adhesion is realized early, adhesive strength is high, and adhesion is long-lasting, and which is useful as a contact-type of adhesive. The purpo...  
WO/2012/113589
The fastening means (2) according to the invention serves for fixing an object on a base (11). The fastening means (2) consists of an aerobic adhesive (3) and a free-flowing substance. The aerobic adhesive (3) is stored in a first recept...  
WO/2012/114613
A thermally conductive adhesive which contains: a thermosetting adhesive that contains a curable component and a curing agent for the curable component; and a metal filler that is dispersed in the thermosetting adhesive. The thermally co...  
WO/2012/111540
In a step for peeling a heat-resistant adhesive tape for a semiconductor device manufacturing (2) from a chip, light peeling is required after resin sealing and resin curing. As a result, regular pressure-sensitive adhesives that are hig...  
WO/2012/111507
The invention provides a hot-melt adhesive composition comprising a hot-melt adhesive, a ferromagnetic body, and a foaming agent that foams when heated, the hot-melt adhesive composition characterized in having a surface magnetism of 20 ...  
WO/2012/111365
This anisotropic electroconductive film in which a decrease in adhesiveness due to moisture is suppressed and which has excellent storage stability is an anisotropic conductive film in which electroconductive particles are dispersed in a...  
WO/2012/108458
The present invention addresses the problem of providing a moisture-curable heat conductive composition which has excellent curability and does not have a specific outgas component adhere to a light emitting point of a laser diode. The i...  
WO/2012/108348
Provided is an adhesive, which is capable of fixing adherends to each other instantaneously while also allowing re-positioning of the adherends with respect to each other, has superior processibility such as being capable of being cut in...  
WO/2012/105658
A manufacturing method for an adhered material in which a first adherend and a second adherend are bonded via an adhesive pattern, said manufacturing method comprising: a step in which an adhesive layer is provided on the first adherend;...  
WO/2012/105659
This adhesive tape has a structure in which an adhesive layer and a radiation-curable pressure-sensitive adhesive layer are layered, said radiation-curable pressure-sensitive adhesive layer being capable of pattern formation by exposure ...  
WO/2012/102587
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied in the gap in which fluid exists, and fills the gap by realizing a three-dimensional shape, and depending on the ...  
WO/2012/102587
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied in the gap in which fluid exists, and fills the gap by realizing a three-dimensional shape, and depending on the ...  
WO/2012/102588
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied into a gap in which fluid is present, and fills the gap by realizing a three-dimensional shape, and depending on ...  
WO/2012/102588
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied into a gap in which fluid is present, and fills the gap by realizing a three-dimensional shape, and depending on ...  
WO/2012/098929
This anisotropic conductive film wherein conductive particles are dispersed in an insulating adhesive uses conductive particles with a recovery rate of 10 - 46%. In addition, when lowest melt viscosity for the anisotropic conductive film...  
WO/2012/099121
The purpose of the present invention is to provide a double-sided adhesive tape or sheet: that can effectively maintain a state of being fixed to a pedestal; that can easily be peeled from the pedestal without damaging the adherend; and ...  
WO/2012/099122
The purpose of the present invention is to provide a double-sided adhesive tape or sheet: that can effectively maintain a state of being fixed to a pedestal, even if there is a warp in the adherend; that can prevent horizontal displaceme...  
WO/2012/091306
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...  
WO/2012/091306
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...  
WO/2012/086944
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...  
WO/2012/086588
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adh...  
WO/2012/086770
The purpose of the present invention is to prevent the occurrence of blocking in a reel body. A reel body comprises an anisotropic conductive film (3) which comprises a release base (31) and a resin film (32) formed on the release base (...  
WO/2012/086466
A process for producing an adhesive optical film, comprising a step of applying an anchor layer coating solution that comprises a mixed solvent containing water and an alcohol as the main components and a binder resin onto an optical fil...  
WO/2012/086554
An adhesive tape, characterized in that the initial wetting speed defined below is not less than 1 cm2/second, is provided. The initial wetting speed is the adhesion area per unit time (seconds) immediately after contact when the adhesiv...  
WO/2012/088541
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...  
WO/2012/086278
Provided is an anisotropic conductive adhesive film for anisotropic conductive connection of a terminal of a flexible substrate with a terminal of a rigid substrate, wherein conductive particles are employed having a particle size of at ...  
WO/2012/086944
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...  
WO/2012/088541
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...  
WO/2012/081608
The present invention provides a temporary fixative with which it is possible to finish a substrate with high precision while damage to the substrate is minimized, and with which the substrate can be easily removed from a support substra...  
WO/2012/077471
Provided is an auxiliary sheet for laser dicing, that is not fully cut and does not reduce workability even in dicing processes that use a short-wavelength laser. The auxiliary sheet for laser dicing includes: a base material comprising ...  
WO/2012/073702
Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar ...  
WO/2012/072502
The invention relates to a composition comprising (A) at least 5 wt % of an organic prepolymer P having at least two water-curable organosilicon terminal groups, (B) 0.01 to 3.0 wt % of boric acid and/or boric acid ester, and (C) 0.01 to...  
WO/2012/072504
In the case of a curable composition based on at least one silyl-terminated polymer, the aim is to improve the adhesion spectrum in the bonding of plastics, and the rate of development of the adhesion. This is accomplished by provision o...  

Matches 251 - 300 out of 10,440