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Patent Searching and Data


Matches 251 - 300 out of 15,387

Document Document Title
WO/2013/011850A1
Provided is a simplified method for manufacturing a chip-like electronic component such as a semiconductor chip. This manufacturing method comprises: a step wherein an adhesive sheet, which has a base, a thermally expandable adhesive lay...  
WO/2013/011811A1
Provided is a novel sheet having a polarized light eliminating function, which is arranged on the viewing side of a polarizing film and has a function of eliminating the linearly polarized light that has been transmitted through the pola...  
WO/2013/011947A1
Provided is a shattering prevention member that has a transparent adhesive/bonding agent layer and that is capable of instantly affixing adherends together, is capable of re-adhering of adherends, has superior workability such as being a...  
WO/2013/011946A1
Provided is a transparent adhesive/bonding agent that can instantly affix adherends together, is capable of re-adhering of adherends, has superior workability such as being capable of being cut out into a sheet shape, does not peel from ...  
WO/2013/008638A1
The purpose of the present invention is to provide a composite film, which has excellent adhesion between a surface layer and a base layer, through solvent-free processes with high productivity, while reducing the burden on the environme...  
WO/2013/005368A1
A protection film (10) for wheels has a base material layer, and an adhesive layer that is provided on one surface of the base material layer. The protection film for wheels has one or more cut portions (18) at an outer end portion. Each...  
WO/2013/005831A1
A circuit-connecting material which comprises an adhesive component, conductive particles, a silica filler having a mean particle diameter of 7 to 75nm and an organic filler having a mean particle diameter of 130 to 2000nm, and in which ...  
WO/2013/001992A1
A transfer tool (1), which is a coating product according to the present invention, is characterized by being provided with: an adhesive (55) that contains a photochromic compound that expresses a color if exposed to specific wavelengths...  
WO/2013/002288A1
An adhesive sheet having an adhesive layer, or alternatively an adhesive sheet having at least one adhesive layer, comprising an adhesive composition including 100 mass parts of a polyisobutylene-based resin (A) having a weight-average m...  
WO/2013/002001A1
The purpose of the present invention is to provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure ...  
WO/2012/176351A1
Provided is a wafer working tape wherein a support substrate, an adhesion layer, and a single binding layer are stacked in this order. The binding layer is used for pressure adhesion of a semiconductor element to either an external conta...  
WO/2012/172979A1
The purpose of the present invention is to provide a polymer composition which enables the steady and easy production of a temperature-responsive sheet. Provided is a polymer composition comprising a water-dispersible side-chain crystall...  
WO/2012/172709A1
An electroconductive tape (10) is characterized in that an adhesive film (3) composed of an adhesive is provided solely to the aperture portions of an electroconductive mesh fabric having a metal film on the surface, the metal film is no...  
WO/2012/173325A1
The present invention relates to an adhesive film for a semiconductor package. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1). The adhe...  
WO/2012/169478A1
The purpose of the present invention is to provide an aqueous emulsion which has excellent emulsifiability/dispersibility and stability. An aqueous emulsion which contains (A) two or more kinds of surfactants represented by formula (I), ...  
WO/2012/169535A1
Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive la...  
WO/2012/165416A1
The present invention provides a semiconductor device which has good conductivity. A semiconductor device (10) according to the present invention is provided with a base material (2), a semiconductor element (3), and an adhesive layer (1...  
WO/2012/164957A1
Provided is an electronic component mounting method comprising the following steps: a step for preparing a first electronic component that has a primary surface whereon a plurality of bumps are provided; a step for preparing a substrate ...  
WO/2012/164925A1
Provided are: an electrically conductive sheet having good processability, whereby it becomes possible to minimize the leaching of an electrically conductive layer in a hot-pressing step for adhering the electrically conductive sheet ont...  
WO/2012/165375A1
The present invention provides a resin composition having excellent workability. This paste-state resin composition adheres together a semiconductor element and a base material, and comprises (A) thermosetting resin and (B) metal particl...  
WO/2012/162064A2
Transformable reinforced securing articles and methods are disclosed in which articles are transformable from a highly cinchable tape mode, such as duct tape, through easy physical transformations, to a highly elastic cord-like securing ...  
WO/2012/162064A3
Transformable reinforced securing articles and methods are disclosed in which articles are transformable from a highly cinchable tape mode, such as duct tape, through easy physical transformations, to a highly elastic cord-like securing ...  
WO/2012/157375A1
The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an averag...  
WO/2012/157671A1
[PROBLEM] To prevent cutting off a laser dicing adhesive sheet by a laser beam, damage to a chuck table and fusing the laser dicing adhesive sheet to the chuck table during laser dicing, and to provide a film exhibiting good shape recove...  
WO/2012/153849A1
To improve connection strength and conduction reliability. This anisotropic conductive connection material is obtained by dispersing conductive particles (5) in an adhesive (4). The adhesive (4) contains a film-forming material, an acryl...  
WO/2012/147633A1
A method for producing an adhesive layer for an optical film, characterized by comprising a filtering step of filtering an adhesive coating liquid containing a water-dispersible adhesive at a differential pressure of more than 0 kPa and ...  
WO/2012/144351A1
Provided is a novel surface-protecting film that exhibits sufficiently high wettability even without the use of a plasticizer, prevents the formation of stop marks, and exhibits excellent reworkability. This surface-protecting film has a...  
WO/2012/144260A1
The present invention addresses the problem of providing: a cationic polymerizable adhesive having excellent adhesion strength to not only various protective films, but also specifically to an acrylic resin film; and a polarizing plate o...  
WO/2012/144349A1
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...  
WO/2012/144352A1
Provided is a novel surface-protecting film that exhibits sufficiently high antistatic performance even without the use of an antistatic agent, sufficiently high wettability even without the use of a plasticizer, and excellent reworkabil...  
WO/2012/144350A1
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...  
WO/2012/141027A1
An anisotropic conductive film comprising a heat-curable epoxy resin composition and conductive particles dispersed in the heat-curable epoxy resin composition, wherein the heat-curable epoxy resin composition comprises an epoxy resin, a...  
WO/2012/141271A1
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...  
WO/2012/140955A1
A flame-retardant heat-conductive adhesive sheet comprises a base and a flame-retardant heat-conductive adhesive agent layer arranged on at least one surface of the base. The base comprises a polyester film, wherein the polyester film ha...  
WO/2012/141051A1
The invention addresses the problem of providing a hard coating resin composition which has excellent abrasion resistance and chemical resistance, and with which there is no cracking at molded-article curved surface parts and it is possi...  
WO/2012/141266A1
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...  
WO/2012/141267A1
A pressure-sensitive adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including t...  
WO/2012/137858A1
Provided are: a method for efficiently producing a polarizing plate which is free from entrance of air bubbles, which are large enough to deteriorate the quality of the polarizing plate, into an adhesive layer; a polarizing plate that is...  
WO/2012/132520A1
The present invention relates to a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer on at least one surface of a backing, wherein: the pressure sensitive adhesive layer has a two-layer configuration of a first...  
WO/2012/132500A1
Provided is a heat-shielding material comprising a metal particulate-containing layer containing at least one type of metal particulate, and an overcoat layer disposed in close contact with at least one surface of the metal particulate-c...  
WO/2012/133418A1
The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be suffici...  
WO/2012/134034A2
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/134034A3
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/127777A1
Provided is a zeolite-free adhesive for inorganic fibers that contains SiO2, CaO, and Al2O3 within a range excluding range I enclosed by the following point A, point 8, point 18, point 19, and point 20 in the phase diagram of SiO2-Al2O3-...  
WO/2012/127978A1
A light-reflective anisotropic conductive adhesive for use in anisotropically electrically connecting a light-emitting element to a wiring board, the adhesive comprising a thermosetting resin composition, electroconductive particles, and...  
WO/2012/124670A1
Provided are: a pressure-sensitive adhesive composition for optical members having excellent durability, adhesiveness (adhesion), and removability; a pressure-sensitive adhesive layer for optical members that uses the pressure-sensitive ...  
WO/2012/124389A1
An adhesive sheet (1A) comprising a release sheet (12), an adhesive agent layer (11) laminated on a release surface of the release sheet (12), and a base (13) laminated on the adhesive agent layer (11), wherein the adhesive agent layer (...  
WO/2012/124519A1
Provided is an adhesive tape which has unevenness followability capable of sufficiently filling unevenness of an adherend and can hold a state in which unevenness is sufficiently filled over time. The adhesive tape includes an adhesive a...  
WO/2012/121155A1
The purpose of the invention is to provide, substantially without using any phthalate plasticizers such as DOP or DBP, a polyvinyl chloride adhesive tape or sheet that has properties equaling or exceeding adhesive tapes or sheets that us...  
WO/2012/121374A1
Provided is a shatterproofing member with a hardenable pressure-sensitive adhesive layer, wherein the member: has excellent workability such as being capable of instantaneously fixing adherends to each other while also allowing mutual re...  

Matches 251 - 300 out of 15,387