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Patent Searching and Data


Matches 251 - 300 out of 15,987

Document Document Title
WO/2013/172328A1
[Problem] To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconduct...  
WO/2013/168712A1
The purpose of the present invention is to provide an adhesive agent which has stronger adhesion force and can be adhered and detached reversibly by the irradiation with light. A light-responsive adhesive agent which can be adhered stron...  
WO/2013/164413A1
The invention relates to a moisture-curing two-component composition consisting of a component A which contains at least one polyoxyl alkylene, polyolefin, and/or polyacrylate prepolymer with at least one hydrolyzable silane group and wh...  
WO/2013/162059A1
The present invention provides a hot melt adhesive being highly environmentally-friendly, and as well having sufficient pressure-sensitive adhesiveness, adhesion, thermal stability and the like. The present invention relates to a hot mel...  
WO/2013/161713A1
A circuit connection material for electrically connecting two circuit members facing each other, which contains a thermoplastic resin, radically polymerizable compounds, a radical polymerization initiator and inorganic fine particles. Th...  
WO/2013/157436A1
Provided is an adhesive tape for preventing aquatic biofouling, which can prevent discoloration or degradation of an adherent, to which said adhesive tape for preventing aquatic biofouling is adhered, caused by exposure to ultraviolet ra...  
WO/2013/157378A1
Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer...  
WO/2013/157552A1
The present invention provides technology for anisotropic conductive adhesive that uses conductive particles with a silver based metal for a conductive layer, has high light reflectivity, and has superior migration resistance properties....  
WO/2013/153953A1
A device for applying an adhesive film, the device being provided with: a conveyance mechanism for conveying an adhesive film tape with a base film and an adhesive layer supported on the base film; a support section for supporting an app...  
WO/2013/150962A1
Provided is an adhesive sheet which reduces deficient adhesion to semiconductor wafers by effectively suppressing voids from occurring between an adhesive layer and an adhesive film. This adhesive sheet wound into a roll shape comprises ...  
WO/2013/150770A1
An adhesive composition includes: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0˚C; 0.05-3 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of 1000 or more bu...  
WO/2013/150769A1
An adhesive composition includes: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0˚C; 0.05-3 parts by mass of a (meth)acrylic polymer (B) which has a weight average molecular weight of 1000 or more...  
WO/2013/146617A1
The present invention is an easily removable adhesive film, the adhesive strength of which is reduced by exposure to ionizing radiation, and in which an under-layer and a easily removable adhesive layer are laminated, in this order, on a...  
WO/2013/147036A1
This metal sheet laminated with metal foil is formed by: placing, opposite each other, a thermosetting-adhesive-coated surface of each of a stainless steel foil having a thickness of 0.1 to 0.2 mm, to which a thermosetting adhesive has b...  
WO/2013/146801A1
To provide a curable resin composition for forming an adhesive layer, which is capable of reliably bonding a base that is called a slightly adhesive base. A curable resin composition for forming an adhesive layer, which contains a combin...  
WO/2013/147737A1
Adhesive copolymers and methods for preparing them are disclosed. An adhesive copolymer may be prepared from a reaction mixture containing monosaccharide monomers and dicarboxylic monomers. The monosaccharide monomers may include any of ...  
WO/2013/146604A1
The present invention provides a conductive material capable of reducing the connection resistance in a connecting structure obtained when an electrical connection is established between electrodes to yield the connecting structure. This...  
WO/2013/146984A1
[Problem] To provide: a stacked piezoelectric element which stably operates for a long period of time, and wherein the amount of displacement of a laminate does not easily fluctuate; an injection device which is provided with the stacked...  
WO/2013/146163A1
Provided is a polarizing plate fabrication method comprising the following steps: a coating step (A) in which the bonding surface of at least either a polarizing film or an optical film is coated with an ultraviolet curing-type adhesive ...  
WO/2013/141215A1
A film which is to be applied to a window and which bears a substrate, a pressure-sensitive adhesive layer and a separator in this order, wherein the pressure-sensitive adhesive layer exhibits a storage modulus of 4.5×104 to 2.0×105 Pa...  
WO/2013/138414A1
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or m...  
WO/2013/136108A1
The invention relates to the use of an adhesive composition comprising at least one silyl-containing polymer, at least one compatible tackifying resin and at least one catalyst,to make a breathable self-adhesive article. The invention al...  
WO/2013/136979A1
Provided is a circuit connection material having excellent shelf life. Also provided is a method for producing a mounted product using the same. The material comprises a first adhesive layer containing a silane coupling agent and conduct...  
WO/2013/133256A1
The present invention relates to a gas barrier film laminate that includes at least two sheets of gas barrier films, in which the two adjacent sheets of gas barrier films are laminated via an adhesive layer, and the adhesive layer has a ...  
WO/2013/133268A1
[Problem] To impart heat release properties to a resulting semiconductor device without increasing the number of semiconductor device production steps or subjecting the semiconductor wafer or chip to special treatment that will complicat...  
WO/2013/132932A1
A thermally conductive adhesive sheet is provided with an adhesive layer. The adhesive layer contains thermally conductive particles, the push-out adhesion strength for a stainless steel plate is 5 N/cm2 or higher, the elongation measure...  
WO/2013/132933A1
An adhesive raw material contains a monomer and/or polymer and 55 mass% or more thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size based on the volume of...  
WO/2013/133275A1
This adhesive sheet is formed of a resin composition that contains (A) a high molecular weight component, (B1) a thermosetting component that has a softening point of less than 50°C, (B2) a thermosetting component that has a softening p...  
WO/2013/129463A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments. An adhesive tape in which a pressure-sensitive-adhesive layer is formed on o...  
WO/2013/129438A1
Provided are a circuit connection material having excellent blocking resistance and excellent connection reliability, and a method for producing a mounted unit using the same. Elastic particles having a compression recovery rate of 50% o...  
WO/2013/129164A3
[Purpose] To provide a sheet-like vibration damper that has damping properties and chip resistance, and can be adhered by means of self-adhesion or thermal fusion via an adhesive layer comprising an adhesive or a hot melt adhesive, even ...  
WO/2013/129437A1
Through the present invention, conductivity is ensured even to an electrode terminal on which an oxide film is formed on the surface thereof, and insulation properties between adjacent wires are also provided. A method for manufacturing ...  
WO/2013/129096A1
Provided are an energy ray curable hydrophilic adhesive composition and an adhesive sheet suitable for producing, by three-dimensional molding, microstructures that are suitable for applications requiring hydrophilicity, such as microrea...  
WO/2013/129462A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments, and minimizing fouling of that to which the tape is adhered. An adhesive tap...  
WO/2013/129078A1
Provided is an adhesive tape film comprising a non-adhesive layer provided on a substrate film. This adhesive tape film effectively prevents over-adhesion due to heat of a fixing base (when performing dicing by attachment to the base by ...  
WO/2013/125695A1
In the whole anisotropic conductive member (105), a plurality of substantially spherical conductive bodies (106) are dispersively contained, each of said conductive bodies having a diameter larger than a step between a protection film (1...  
WO/2013/125684A1
Provided is a production method for a semiconductor device in which the respective connecting sections of a semiconductor chip and a wiring circuit board are electrically connected to each other, or for a semiconductor device in which th...  
WO/2013/125388A1
Provided is a manufacturing method for a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided to a flexible display and a terminal of an electronic component, and the flexible...  
WO/2013/121854A1
Provided is an adhesive tape formed integrally by co-extruding a base layer, a rear treatment layer formed on one surface of the base layer, and an adhesive layer formed on the other surface of the base layer, said adhesive tape having e...  
WO/2013/122060A1
A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10μm or more, the surface free energy (γs) of the surface of the adhe...  
WO/2013/122117A1
 A thermoconductive adhesive sheet, wherein the quantity of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at ...  
WO/2013/121796A1
Provided is a multilayer porous sheet for suction applications that has a non-conventional structure and is located on the suction surface of a suction unit, thereby preventing contact between said suction surface and an object to which ...  
WO/2013/118562A1
An adhesive agent for a laminate is prepared from: an aqueous resin produced by reacting an isocyanate-group-terminal prepolymer having an anionic group with a chain extender; a wettable inorganic layered compound; and a water-dispersibl...  
WO/2013/118747A1
This solar cell module is provided with: a solar cell element; a protective member which is arranged on one side of the solar cell element in the thickness direction; an adhesive layer which is interposed between the solar cell element a...  
WO/2013/115116A1
Provided is a surface-protective film which exhibits excellent heat-resistance, is capable of ensuring visibility in an optical inspection test, and is unlikely to be scratched. This surface-protective film has an adhesive layer and a su...  
WO/2013/115338A1
A flame-retardant heat-conductive adhesive sheet having: a base material; and a flame-retardant heat-conductive adhesive layer provided on at least one surface of the base material. The base material comprises a polyester film, the ratio...  
WO/2013/114956A1
Provided is a stretchable thermal-release adhesive sheet which: exhibits excellent heat-resistance and stretchability; can accommodate setting the processing temperature and thermal-release temperature to a high temperature when cutting ...  
WO/2013/114955A1
Provided is a thermally releasable protective tape for sliding, which: exhibits excellent sliding properties without detaching during use from that to which the tape is adhered; and is capable of being easily removed from that to which t...  
WO/2013/115132A1
The purpose of the present invention is provide a slidable adhesive tape that allows the amount of outgassing, particularly of siloxane gas, to be greatly reduced. A slidable adhesive tape (6) comprises an adhesive layer (2) and a peelab...  
WO/2013/111883A1
Provided is a resin acid ester-type of adhesiveness-imparting agent which has good compatibility with synthetic rubber elastomers, can have a decreased melt viscosity, and can impart excellent adhesion/cohesion properties. As the adhesiv...  

Matches 251 - 300 out of 15,987