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Patent Searching and Data


Matches 251 - 300 out of 18,673

Document Document Title
WO/2015/186704A1
Provided is a conductive paste which is capable of efficiently disposing solder particles on an electrode and enhancing conduction reliability between electrodes. A conductive paste according to the present invention contains a thermoset...  
WO/2015/186685A1
The problem to be solved by the present invention is to provide a protective adhesive film that can prevent damage to a polarized plate or the like caused by touch entry or the like even if disposed on the surface of the polarized plate ...  
WO/2015/182469A1
Provided are: a temporary bonding film which enables a stable temporary bonding of a device wafer when the device wafer is subjected to mechanical or chemical processing, and which also enables easy termination of the temporary bonding t...  
WO/2015/182351A1
 Provided is a polarizing plate provided with an adhesive, in which a decrease in optical performance of a polarizer layer is suppressed even when an adhesive composition for forming the adhesive layer contains an ionic compound. A pol...  
WO/2015/183896A1
An enhanced pressure sensitive adhesive film includes a filler dispersed within an acrylic polymer matrix. The filler has an average particle size less than the thickness of the pressure sensitive adhesive layer, and is selected from gra...  
WO/2015/178346A1
This composite sheet (3) for forming a protective film is provided with: a supporting sheet (4); and a protective film forming film (1) that is laminated on a first surface of the supporting sheet (4). A second surface of the supporting ...  
WO/2015/178416A1
[Problem] To provide a resin sheet having excellent thermoconductivity, electrical insulation, and adhesiveness. [Solution] A high-thermoconductivity insulated adhesive sheet in which a resin layer having a thermoconductive filler contai...  
WO/2015/174550A1
Provided is a transfer sheet comprising a support layer, a first layer, and a second layer. The second layer is a layer that is thermocompression bonded to an object to be transferred and is at least one type selected from the group cons...  
WO/2015/174184A1
Provided is a method for producing a semiconductor device, said method making it possible to suppress the occurrence of voids in an interface between an adherend and a sheet-like resin composition, and making it easy to predict an amount...  
WO/2015/174185A1
Provided are a sheet-like resin composition with which it possible to easily carry out alignment for mounting of a semiconductor element without changing an existing process, and a method for producing a semiconductor device using said s...  
WO/2015/174392A1
Provided is a novel double-sided adhesive sheet for image display devices that can adhere closely without gaps to an adherend surface even if the adherend surface to which the adhesive sheet is applied has level differences due to printi...  
WO/2015/174299A1
Provided is a conductive paste capable of improving coating properties, capable of efficiently arranging conductive particles upon electrodes, and capable of improving conduction reliability between electrodes. This conductive paste incl...  
WO/2015/174447A1
An anisotropic conductive film that, during anisotropic conductive connection of an electronic component such as a glass substrate, etc., and another electronic component such as a film substrate, etc., via an anisotropic conductive film...  
WO/2015/170678A1
The present invention provides an adhesive member (30) for bonding a liquid crystal panel and a protective panel formed by forming a window frame portion in a bonding surface, said adhesive member (30) being provided with an adhesive lay...  
WO/2015/170432A1
The present invention relates to a positive-type photosensitive adhesive composition comprising (A) an alkali-soluble resin, (B) a compound that generates an acid when exposed to light, (c) a thermo-crosslinking agent, and (D) a curing p...  
WO/2015/166796A1
Provided is a flat-cable reinforcing tape whereby adequate adhesive force can be maintained for a long period of time in a high-temperature, high-humidity environment, and a flat cable which uses the flat-cable reinforcing tape. The pres...  
WO/2015/163026A1
 The purpose of the present invention is to provide a technique whereby the occurrence of position shifting by a mirror subsequent to curing of an adhesive can be reduced. The component has a chassis (1) serving as a supporting member,...  
WO/2015/162931A1
Provided are metal-coated resin particles that comprise resin particles and a metal coating layer that covers at least some of the resin particles, wherein it is possible to obtain a high-reliability electrical connection after repeated ...  
WO/2015/158623A1
The invention relates to cross-linkable materials containing: A) 100 parts by weight of compounds of formula (I): Y- [ (CR1 2)b-SiRa(OR2))3-a]]x, B) at least 5 parts by weight of silicone resins containing units of formula (II): R3 c(R4O...  
WO/2015/159737A1
Provided are: an adhesive sheet having excellent shearing force during low-speed peeling and capable of suppressing curling of an adherend when pasted to the adherend; and an optical member having the adhesive sheet pasted thereto as sur...  
WO/2015/159739A1
Provided is an adhesive sheet that: is capable of keeping a low peeling electrostatic potential when peeling the adhesive sheet from an adherend, even when exposed to high temperatures when being processed (manufactured) or conveyed in a...  
WO/2015/159738A1
Provided is an adhesive sheet capable of preventing increase in adhesive force after a period at high temperature (i.e., having adhesive force increase prevention properties and adhesive force stability), having low adhesive force during...  
WO/2015/159733A1
[Problem] To provide a method for repairing or reinforcing a structure, which is reduced in work load even in cases where an adhesive sheet is cured by irradiation of ionizing radiation such as sunlight, and which is capable of maintaini...  
WO/2015/155355A1
The invention relates to the use of an adhesive, which comprises at least one silane-functional polymer P; at least one catalyst for crosslinking silane-functional polymers, said catalyst being selected from the group consisting of organ...  
WO/2015/156389A1
This base for back grind tapes is provided with: a base film having a Young's modulus of 600 MPa or more; and a buffer layer that is provided on one surface of the base film, is formed of an urethane-containing cured product, and has a t...  
WO/2015/156193A1
A composition which includes: a polythiol compound; a compound having a carbon-carbon double bond at a terminal thereof; a photo radical generator; and a thermal radical generator. The ratio (Ene/SH) of the total number of moles (Ene) of...  
WO/2015/152006A1
A side chain crystalline polymer according to the present invention comprises a crystalline macromonomer and a graft copolymer of a non-crystalline monomer. A thermosensitive adhesive agent according to the present invention contains an ...  
WO/2015/152356A1
 Provided is an adhesive sheet having, on a substrate or a release material, a resin layer which is adhesive on at least the surface (α) thereof that is on the opposite side to the side on which the substrate or release material is pr...  
WO/2015/151674A1
 Provided is an electroconductive shielding tape which does not become tacky, and in which a metal thin film does not shred. This electroconductive shielding tape (1) is configured so that an electroconductive adhesive layer (2) is dis...  
WO/2015/152365A1
Provided is an adhesive sheet that has upon a peel-off material (R1) a resin layer that includes a resin portion (X) and a particle portion (Y), and has a substrate or a peel-off material (R2). At least a surface (1) of the resin layer t...  
WO/2015/152345A1
The present invention relates to an adhesive sheet wherein a support substrate, an adhesive agent layer (X), an intercommunicating-pore-containing layer that comprises a composition that contains fine particles (excluding silica), and an...  
WO/2015/152346A1
This adhesive sheet results from a support substrate, an adhesive layer (X), a continuous-void-containing layer comprising a composition containing silica particles, and an adhesive layer (Y) being laminated in the given sequence, and th...  
WO/2015/152350A1
 Provided is an adhesive sheet having, on a substrate or a release material, a resin layer that includes: a resin part (X) containing, as the main component, a hydrocarbon resin having a carbon atom in the main chain of the structural ...  
WO/2015/152349A1
 Provided is an adhesive sheet having, on a substrate or a release material, a resin layer that includes: a resin part (X) containing a resin as the main component; and a particle part (Y) comprising fine particles. At least the surfac...  
WO/2015/152355A1
 Provided is an adhesive sheet having, on a substrate or a release material, a resin layer which is adhesive on at least the surface (α) thereof that is on the opposite side to the side on which the substrate or release material is pr...  
WO/2015/145635A1
An adhesive layer (12) for an adhesive scattering prevention sheet (1) which is bonded to at least one surface of a cover glass used in a capacitive touch panel. This adhesive layer (12) is formed of an adhesive composition containing an...  
WO/2015/146936A1
Provided are: a protection membrane forming film (1), which is a filler-containing protection membrane forming film (1), wherein the average particle size of the filler is 0.4 μm or smaller; a protection membrane forming utilization she...  
WO/2015/146856A1
Provided is an adhesive tape (10) for semiconductor wafer processing stuck to the front surface of a semiconductor wafer having convexities and concavities equal to or higher than 80 µm, and used in a step of grinding the rear surface o...  
WO/2015/146434A1
 Electroconductive particles provided with a core particle (10), a second metal layer (12) that covers the core particle (10), microparticles (13) disposed on the second metal layer (12), and a first metal layer (11) that covers both t...  
WO/2015/146254A1
The present invention makes it possible to provide a laminate for a resin film formation sheet with which it is easy to dispense the resin film formation sheet from the release sheet and application on a workpiece can be performed stably...  
WO/2015/146410A1
This temperature-sensitive adhesive contains a first side-chain crystalline polymer, has an adhesive strength that decreases at temperatures less than the melting point of the first side-chain crystalline polymer, and further contains a ...  
WO/2015/146297A1
Provided are a conductive adhesive tape having excellent application workability and conductivity and a method for producing the conductive adhesive tape. This conductive adhesive tape includes: a metal layer (2); a conductive fabric (4)...  
WO/2015/146349A1
Provided is a method for producing a heat conductive sheet having excellent tack properties. This method for producing a heat conductive sheet comprises: a first step for forming a coating layer (20) by applying a heat conductive resin c...  
WO/2015/146305A1
An organic electronic device includes, in this order: a curable adhesive having a polymerizable compound, an organometallic compound, and a silane coupling agent; a board; an organic electronic element; and a sealing member. The organic ...  
WO/2015/146596A1
A base film (2) for dicing sheets which comprises a cutting debris inhibition layer (A) and an expandable layer (B) superposed on one main surface of the cutting debris inhibition layer (A), the expandable layer (B) having a multilayer s...  
WO/2015/141342A1
Provided is an anisotropic conductive adhesive agent with which it is possible to obtain high heat-dissipation properties. The present invention contains: conductive particles (31) in which a conductive metal layer is formed on the surfa...  
WO/2015/141289A1
This anisotropic conductive film includes conductive particles and a spacer. The spacer is arranged in a central part of the film in the width direction. The central part of the film in the width direction is 20-80% of the total width of...  
WO/2015/141156A1
The present invention is a temporary bonding material for wafer processing, which is used for the purpose of temporarily bonding a wafer having a front surface serving as a circuit surface and a back surface to be processed to a supporti...  
WO/2015/141343A1
Provided is an anisotropic conductive adhesive which enables the achievement of excellent optical characteristics and excellent heat dissipation characteristics. This anisotropic conductive adhesive contains: conductive particles (31), e...  
WO/2015/141979A1
According to one aspect of the present invention, a radiation-curable resin composition is provided which comprises: (A) a macromolecular resin; (B) a refractive index adjusting unsaturated compound; (C) a hydrogen donor containing photo...  

Matches 251 - 300 out of 18,673