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Patent Searching and Data


Matches 251 - 300 out of 15,424

Document Document Title
WO/2013/066597A1
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacry...  
WO/2013/065482A1
The sheet manufacturing device comprises a feeding means (10) for feeding a base sheet (BS), a first laminating means (20A) for laminating a first adhesive layer (AD1) on one surface of the base sheet (BS), and a second laminating means ...  
WO/2013/061925A1
The purpose of the present invention is to provide an adhesive tape whereby dicing can be performed by preventing cut dust from adhering to semiconductor devices without implementing extra improvement of equipment and introducing extra c...  
WO/2013/058526A2
The present invention relates to a self-adhesive protection film having improved release, and a product having the film attached thereto. In more detail, a carrier layer includes a monodispersive bead, or an embossed pattern is formed on...  
WO/2013/059549A1
Articles with thin caliper melt coatings of high molecular weight, high viscosity materials and methods of making such coatings.  
WO/2013/058168A1
A conductive adhesive for connecting an electrode of a solar cell and a tab wire, which contains a curable resin, conductive particles, a curing agent and a black coloring agent that is formed only of titanium black.  
WO/2013/058290A1
An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer...  
WO/2013/058380A1
An adhesive composition of the present invention contains a resin composition and a plurality of conductive particles, and when the maximum diameter in the particle size distribution of the conductive particles is represented by a and th...  
WO/2013/058526A3
The present invention relates to a self-adhesive protection film having improved release, and a product having the film attached thereto. In more detail, a carrier layer includes a monodispersive bead, or an embossed pattern is formed on...  
WO/2013/055733A1
The present invention relates to a B-stageable silicone adhesive having microencapsulation. The encapsulated B-stageable silicone adhesive allows lengthening the assembly time between applying the adhesive and lamination. Although exempl...  
WO/2013/051396A1
A double-faced pressure-sensitive adhesive tape (12) which includes a first pressure-sensitive adhesive layer (12B) formed from any of pressure-sensitive adhesive samples 2 to 7. Due to this configuration, the first pressure-sensitive ad...  
WO/2013/051712A1
Provided is a substrate-less, double-sided, pressure-sensitive adhesive sheet which minimizes the flaw resulting from foreign matter(such as oligomer) generated in a manufacturing step and thus exhibits excellent optical inspectability a...  
WO/2013/051708A1
The present invention provides technology for an anisotropic conductive adhesive which uses conductive particles that use a silver-based metal as a conducting layer, and has high light reflectance and excellent migration resistance. This...  
WO/2013/047674A1
[Problem] To provide a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformity and excellent printing accuracy, and th...  
WO/2013/047046A1
The present invention provides an adhesive, which has good adhesive strength during operation and high reliability in terms of heat resistance, moisture resistance, and the like, and with which during disassembly disassembly can be easil...  
WO/2013/042718A1
This heat ray shielding material is characterized by having a metal-particle-containing layer that contains at least one type of metal particle, the thickness of the metal-particle-containing layer being 10-80 nm, the metal particles hav...  
WO/2013/042203A1
An adhesive composition for adhering a first circuit member, in which a first circuit electrode is formed on the main surface of a first circuit board, to a second circuit member, in which a second circuit electrode is formed on the main...  
WO/2013/042724A1
An adhesive composition for adhering together a first circuit member where a first circuit electrode is formed atop the primary surface of a first circuit board and a second circuit member where a second circuit electrode is formed atop ...  
WO/2013/042698A1
The present invention makes it possible to prevent the appearance of protrusions caused by heat-expandable microspheres atop a heat-releasable adhesive agent layer, using an energy ray-curable elastic layer and the heat-releasable adhesi...  
WO/2013/039225A1
[Problem] To provide a unit for an image display device, the unit exhibiting high durability. [Solution] The present invention provides a unit for an image display device, wherein an optical film laminate and a panel for an image display...  
WO/2013/039039A1
[Problem] The present invention relates to: a heat ray shielding adhesive which is used in bonding to a windowpane and the like and shields heat rays; a heat ray shielding transparent adhesive sheet; and a method for producing the heat r...  
WO/2013/036230A1
The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding process using a patterned adhesive tape tha...  
WO/2013/031678A1
Provided is a curable resin composition exhibiting high adhesion durability. The curable resin composition contains: a (meth)acrylate oligomer (A) selected from the group consisting of urethane-based (meth)acrylate oligomers, polyester-b...  
WO/2013/027733A1
Provided is a method for easily manufacturing a substrate transport carrier, with which a substrate having different thicknesses at different areas can be transported without becoming detached, and with which warping of the substrate aft...  
WO/2013/024544A1
This adhesive material reel is provided with: a core; a pair of side sheets provided to both sides of the core in a manner so as to face each other; and an adhesive material tape wound to the core and having a tape-shaped base material a...  
WO/2013/021937A1
This adhesive tape or sheet has an adhesive layer on one surface of a base and is characterized in that the base is a silicone resin sheet which has a tensile stress at a strain of 10% at 100˚C of 0.1-3 MPa. The silicone resin sheet may...  
WO/2013/021895A1
Provided are a conductive material with which it is possible to improve conduction reliability and insulation reliability of a connection structure obtained in a case where electrodes of members to be connected are electrically connected...  
WO/2013/021838A1
Provided is a novel surface protection film, which is capable of achieving sufficiently high antistatic characteristics and wettability, and furthermore, has excellent reworkability (peelability). This surface protection film having a ba...  
WO/2013/018152A1
The present invention provides an adhesive composition comprising (A) an organic aluminum complex, (B) a silane coupling agent, and (C) a curing component.  
WO/2013/018602A1
The present invention is a gas barrier adhesive sheet having at least one gas barrier layer and at lest one adhesive layer, said gas barrier adhesive sheet being characterized in that the adhesive layer has a storage modulus at 23˚C wit...  
WO/2013/018777A1
The present invention provides a composition set comprising a conductor layer forming composition containing inorganic particles including a dispersion medium and a metal oxide, and an electroconductive binding material composition conta...  
WO/2013/015469A1
A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Pref...  
WO/2013/011850A1
Provided is a simplified method for manufacturing a chip-like electronic component such as a semiconductor chip. This manufacturing method comprises: a step wherein an adhesive sheet, which has a base, a thermally expandable adhesive lay...  
WO/2013/011811A1
Provided is a novel sheet having a polarized light eliminating function, which is arranged on the viewing side of a polarizing film and has a function of eliminating the linearly polarized light that has been transmitted through the pola...  
WO/2013/011947A1
Provided is a shattering prevention member that has a transparent adhesive/bonding agent layer and that is capable of instantly affixing adherends together, is capable of re-adhering of adherends, has superior workability such as being a...  
WO/2013/011946A1
Provided is a transparent adhesive/bonding agent that can instantly affix adherends together, is capable of re-adhering of adherends, has superior workability such as being capable of being cut out into a sheet shape, does not peel from ...  
WO/2013/008638A1
The purpose of the present invention is to provide a composite film, which has excellent adhesion between a surface layer and a base layer, through solvent-free processes with high productivity, while reducing the burden on the environme...  
WO/2013/005368A1
A protection film (10) for wheels has a base material layer, and an adhesive layer that is provided on one surface of the base material layer. The protection film for wheels has one or more cut portions (18) at an outer end portion. Each...  
WO/2013/005831A1
A circuit-connecting material which comprises an adhesive component, conductive particles, a silica filler having a mean particle diameter of 7 to 75nm and an organic filler having a mean particle diameter of 130 to 2000nm, and in which ...  
WO/2013/001992A1
A transfer tool (1), which is a coating product according to the present invention, is characterized by being provided with: an adhesive (55) that contains a photochromic compound that expresses a color if exposed to specific wavelengths...  
WO/2013/002288A1
An adhesive sheet having an adhesive layer, or alternatively an adhesive sheet having at least one adhesive layer, comprising an adhesive composition including 100 mass parts of a polyisobutylene-based resin (A) having a weight-average m...  
WO/2013/002001A1
The purpose of the present invention is to provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure ...  
WO/2012/176351A1
Provided is a wafer working tape wherein a support substrate, an adhesion layer, and a single binding layer are stacked in this order. The binding layer is used for pressure adhesion of a semiconductor element to either an external conta...  
WO/2012/172979A1
The purpose of the present invention is to provide a polymer composition which enables the steady and easy production of a temperature-responsive sheet. Provided is a polymer composition comprising a water-dispersible side-chain crystall...  
WO/2012/172709A1
An electroconductive tape (10) is characterized in that an adhesive film (3) composed of an adhesive is provided solely to the aperture portions of an electroconductive mesh fabric having a metal film on the surface, the metal film is no...  
WO/2012/173325A1
The present invention relates to an adhesive film for a semiconductor package. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1). The adhe...  
WO/2012/169478A1
The purpose of the present invention is to provide an aqueous emulsion which has excellent emulsifiability/dispersibility and stability. An aqueous emulsion which contains (A) two or more kinds of surfactants represented by formula (I), ...  
WO/2012/169535A1
Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive la...  
WO/2012/165416A1
The present invention provides a semiconductor device which has good conductivity. A semiconductor device (10) according to the present invention is provided with a base material (2), a semiconductor element (3), and an adhesive layer (1...  
WO/2012/164957A1
Provided is an electronic component mounting method comprising the following steps: a step for preparing a first electronic component that has a primary surface whereon a plurality of bumps are provided; a step for preparing a substrate ...  

Matches 251 - 300 out of 15,424