Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 251 - 300 out of 15,435

Document Document Title
WO/2013/005831A1
A circuit-connecting material which comprises an adhesive component, conductive particles, a silica filler having a mean particle diameter of 7 to 75nm and an organic filler having a mean particle diameter of 130 to 2000nm, and in which ...  
WO/2013/001992A1
A transfer tool (1), which is a coating product according to the present invention, is characterized by being provided with: an adhesive (55) that contains a photochromic compound that expresses a color if exposed to specific wavelengths...  
WO/2013/002288A1
An adhesive sheet having an adhesive layer, or alternatively an adhesive sheet having at least one adhesive layer, comprising an adhesive composition including 100 mass parts of a polyisobutylene-based resin (A) having a weight-average m...  
WO/2013/002001A1
The purpose of the present invention is to provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure ...  
WO/2012/176351A1
Provided is a wafer working tape wherein a support substrate, an adhesion layer, and a single binding layer are stacked in this order. The binding layer is used for pressure adhesion of a semiconductor element to either an external conta...  
WO/2012/172979A1
The purpose of the present invention is to provide a polymer composition which enables the steady and easy production of a temperature-responsive sheet. Provided is a polymer composition comprising a water-dispersible side-chain crystall...  
WO/2012/172709A1
An electroconductive tape (10) is characterized in that an adhesive film (3) composed of an adhesive is provided solely to the aperture portions of an electroconductive mesh fabric having a metal film on the surface, the metal film is no...  
WO/2012/173325A1
The present invention relates to an adhesive film for a semiconductor package. In the adhesive film, an adhesive layer (2) for dicing a wafer and an adhesive layer (3) for die bonding are successively stacked on a base film (1). The adhe...  
WO/2012/169478A1
The purpose of the present invention is to provide an aqueous emulsion which has excellent emulsifiability/dispersibility and stability. An aqueous emulsion which contains (A) two or more kinds of surfactants represented by formula (I), ...  
WO/2012/169535A1
Disclosed is a film-shaped circuit connecting material including: an adhesive component having an adhesive layer placed between opposing circuit electrodes and used in order to electrically connect the circuit electrodes, the adhesive la...  
WO/2012/165416A1
The present invention provides a semiconductor device which has good conductivity. A semiconductor device (10) according to the present invention is provided with a base material (2), a semiconductor element (3), and an adhesive layer (1...  
WO/2012/164957A1
Provided is an electronic component mounting method comprising the following steps: a step for preparing a first electronic component that has a primary surface whereon a plurality of bumps are provided; a step for preparing a substrate ...  
WO/2012/164925A1
Provided are: an electrically conductive sheet having good processability, whereby it becomes possible to minimize the leaching of an electrically conductive layer in a hot-pressing step for adhering the electrically conductive sheet ont...  
WO/2012/165375A1
The present invention provides a resin composition having excellent workability. This paste-state resin composition adheres together a semiconductor element and a base material, and comprises (A) thermosetting resin and (B) metal particl...  
WO/2012/162064A2
Transformable reinforced securing articles and methods are disclosed in which articles are transformable from a highly cinchable tape mode, such as duct tape, through easy physical transformations, to a highly elastic cord-like securing ...  
WO/2012/162064A3
Transformable reinforced securing articles and methods are disclosed in which articles are transformable from a highly cinchable tape mode, such as duct tape, through easy physical transformations, to a highly elastic cord-like securing ...  
WO/2012/157375A1
The present invention is a circuit connection material for electrically connecting opposing circuit electrodes, comprising an adhesive composition and conductive particles. The conductive particles are aggregated particles with an averag...  
WO/2012/157671A1
[PROBLEM] To prevent cutting off a laser dicing adhesive sheet by a laser beam, damage to a chuck table and fusing the laser dicing adhesive sheet to the chuck table during laser dicing, and to provide a film exhibiting good shape recove...  
WO/2012/153849A1
To improve connection strength and conduction reliability. This anisotropic conductive connection material is obtained by dispersing conductive particles (5) in an adhesive (4). The adhesive (4) contains a film-forming material, an acryl...  
WO/2012/147633A1
A method for producing an adhesive layer for an optical film, characterized by comprising a filtering step of filtering an adhesive coating liquid containing a water-dispersible adhesive at a differential pressure of more than 0 kPa and ...  
WO/2012/144351A1
Provided is a novel surface-protecting film that exhibits sufficiently high wettability even without the use of a plasticizer, prevents the formation of stop marks, and exhibits excellent reworkability. This surface-protecting film has a...  
WO/2012/144260A1
The present invention addresses the problem of providing: a cationic polymerizable adhesive having excellent adhesion strength to not only various protective films, but also specifically to an acrylic resin film; and a polarizing plate o...  
WO/2012/144349A1
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...  
WO/2012/144352A1
Provided is a novel surface-protecting film that exhibits sufficiently high antistatic performance even without the use of an antistatic agent, sufficiently high wettability even without the use of a plasticizer, and excellent reworkabil...  
WO/2012/144350A1
Provided is a novel surface-protecting film that exhibits excellent reworkability and, even without the use of a plasticizer, exhibits sufficiently high wettability. This surface-protecting film has a base layer and a pressure-sensitive ...  
WO/2012/141027A1
An anisotropic conductive film comprising a heat-curable epoxy resin composition and conductive particles dispersed in the heat-curable epoxy resin composition, wherein the heat-curable epoxy resin composition comprises an epoxy resin, a...  
WO/2012/141271A1
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...  
WO/2012/140955A1
A flame-retardant heat-conductive adhesive sheet comprises a base and a flame-retardant heat-conductive adhesive agent layer arranged on at least one surface of the base. The base comprises a polyester film, wherein the polyester film ha...  
WO/2012/141051A1
The invention addresses the problem of providing a hard coating resin composition which has excellent abrasion resistance and chemical resistance, and with which there is no cracking at molded-article curved surface parts and it is possi...  
WO/2012/141266A1
This adhesive comprises a condensed resin having a structural unit obtained by condensation polymerization of polymerizable monomers, which include a monomer (A) having at least two carboxyl groups and a monomer (B) having at least two a...  
WO/2012/141267A1
A pressure-sensitive adhesive that satisfies at least one of the belowmentioned conditions (1 and/or 2) and contains a condensation resin that has a structural unit obtained by condensation-polymerizing polymerizable monomers including t...  
WO/2012/137858A1
Provided are: a method for efficiently producing a polarizing plate which is free from entrance of air bubbles, which are large enough to deteriorate the quality of the polarizing plate, into an adhesive layer; a polarizing plate that is...  
WO/2012/132520A1
The present invention relates to a pressure sensitive adhesive sheet having a pressure sensitive adhesive layer on at least one surface of a backing, wherein: the pressure sensitive adhesive layer has a two-layer configuration of a first...  
WO/2012/132500A1
Provided is a heat-shielding material comprising a metal particulate-containing layer containing at least one type of metal particulate, and an overcoat layer disposed in close contact with at least one surface of the metal particulate-c...  
WO/2012/133418A1
The issue of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like, with which a quantity of an adhesive left on the surface of a material that has had a tape adhered thereon can be suffici...  
WO/2012/134034A2
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/134034A3
The present invention relates to a resin composition for an adhesive film and to an adhesive film using same. The resin composition for an adhesive film of the present invention comprises a thermoplastic resin, a thermosetting resin, a p...  
WO/2012/127777A1
Provided is a zeolite-free adhesive for inorganic fibers that contains SiO2, CaO, and Al2O3 within a range excluding range I enclosed by the following point A, point 8, point 18, point 19, and point 20 in the phase diagram of SiO2-Al2O3-...  
WO/2012/127978A1
A light-reflective anisotropic conductive adhesive for use in anisotropically electrically connecting a light-emitting element to a wiring board, the adhesive comprising a thermosetting resin composition, electroconductive particles, and...  
WO/2012/124670A1
Provided are: a pressure-sensitive adhesive composition for optical members having excellent durability, adhesiveness (adhesion), and removability; a pressure-sensitive adhesive layer for optical members that uses the pressure-sensitive ...  
WO/2012/124389A1
An adhesive sheet (1A) comprising a release sheet (12), an adhesive agent layer (11) laminated on a release surface of the release sheet (12), and a base (13) laminated on the adhesive agent layer (11), wherein the adhesive agent layer (...  
WO/2012/124519A1
Provided is an adhesive tape which has unevenness followability capable of sufficiently filling unevenness of an adherend and can hold a state in which unevenness is sufficiently filled over time. The adhesive tape includes an adhesive a...  
WO/2012/121155A1
The purpose of the invention is to provide, substantially without using any phthalate plasticizers such as DOP or DBP, a polyvinyl chloride adhesive tape or sheet that has properties equaling or exceeding adhesive tapes or sheets that us...  
WO/2012/121374A1
Provided is a shatterproofing member with a hardenable pressure-sensitive adhesive layer, wherein the member: has excellent workability such as being capable of instantaneously fixing adherends to each other while also allowing mutual re...  
WO/2012/121336A1
One purpose of the present invention is to provide an adhesive for electronic components that suppresses the formation of voids and is not susceptible to piling up on a semiconductor chip surface. Furthermore, another purpose of the pres...  
WO/2012/118152A1
When a heat-peelable adhesive sheet is to be used, the heat-peelable adhesive sheet intended for a different work piece, a different step, or the like may be mistakenly used on occasion. For this reason, it is necessary to clearly confir...  
WO/2012/117902A1
The purpose of the present invention is to provide a curable composition with which initial adhesion is realized early, adhesive strength is high, and adhesion is long-lasting, and which is useful as a contact-type of adhesive. The purpo...  
WO/2012/113589A3
The fastening means (2) according to the invention serves for fixing an object on a base (11). The fastening means (2) consists of an aerobic adhesive (3) and a free-flowing substance. The aerobic adhesive (3) is stored in a first recept...  
WO/2012/114613A1
A thermally conductive adhesive which contains: a thermosetting adhesive that contains a curable component and a curing agent for the curable component; and a metal filler that is dispersed in the thermosetting adhesive. The thermally co...  
WO/2012/111540A1
In a step for peeling a heat-resistant adhesive tape for a semiconductor device manufacturing (2) from a chip, light peeling is required after resin sealing and resin curing. As a result, regular pressure-sensitive adhesives that are hig...  

Matches 251 - 300 out of 15,435