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Patent Searching and Data


Matches 251 - 300 out of 10,223

Document Document Title
WO/2012/077471
Provided is an auxiliary sheet for laser dicing, that is not fully cut and does not reduce workability even in dicing processes that use a short-wavelength laser. The auxiliary sheet for laser dicing includes: a base material comprising ...  
WO/2012/073702
Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar ...  
WO/2012/072502
The invention relates to a composition comprising (A) at least 5 wt % of an organic prepolymer P having at least two water-curable organosilicon terminal groups, (B) 0.01 to 3.0 wt % of boric acid and/or boric acid ester, and (C) 0.01 to...  
WO/2012/072504
In the case of a curable composition based on at least one silyl-terminated polymer, the aim is to improve the adhesion spectrum in the bonding of plastics, and the rate of development of the adhesion. This is accomplished by provision o...  
WO/2012/070476
The objective of the present invention is to provide a curable composition having high hardness, which can be used as an adhesive or a coating agent. The objective can be achieved by a curable composition which contains (A) 100 parts by ...  
WO/2012/068573
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...  
WO/2012/066805
The present invention is a method for producing a molded fiber-reinforced plastic involving, in the following order: a laminate formation step for forming a preform laminate (5b) secured to a molding die (6), the preform laminate (5b) be...  
WO/2012/065716
The invention relates to a curable compound, which can be obtained as a mixture of at least two components to be stored separately, of which one component comprises a silane-modified polymer and said component or a second component compr...  
WO/2012/066777
A protective film (10) provided with a base layer (12), a pressure-sensitive adhesive layer (14), and a removable liner (16). The base layer (12) takes the form of a circular sheet, and a typical implementation thereof is a polyethylene ...  
WO/2012/068573
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...  
WO/2012/066897
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a...  
WO/2012/067145
The purpose of the present invention is to improve adhesion failure associated with "a bubble formation phenomenon" that may occur in an adhesive layer when the thickness of an adhesive agent is increased and "the formation of fisheyes" ...  
WO/2012/067232
Provided is a method for detaching a light-transmitting rigid substrate laminate without adhesive deposits. This method for detaching a light-transmitting rigid substrate laminate comprises: a step (1) for preparing a light-transmitting ...  
WO/2012/064133
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063810
This oil-resistant, heat-resistant adhesive sheet is provided with: a substrate containing a fluororesin; and an adhesive layer that is layered on at least one surface of the substrate. One surface of the substrate is subjected to roughe...  
WO/2012/064081
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/064133
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063811
A water-dispersible oil-resistant adhesive agent composition comprises a water-dispersible polymer and inorganic particles, wherein the content of the inorganic particles is 3-90 parts by mass relative to 100 parts by mass of the water-d...  
WO/2012/064081
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/063554
An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comp...  
WO/2012/056511
Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to ...  
WO/2012/051687
A concentrated gel for use in a compound mixture for promoting the waterproofing, adherence and fastening power between various elements and substrates. Said compound mixture is a concentrated mixture which is novel and functional, and d...  
WO/2012/053478
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...  
WO/2012/053589
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...  
WO/2012/053373
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...  
WO/2012/046710
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...  
WO/2012/045566
The invention relates to a curable composition comprising at least one polymer having at least one end group of the general formula (I) comprising -An-R-SiXYZ (I), where A is a double-bonded bond group comprising at least one heteroatom,...  
WO/2012/046695
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...  
WO/2012/043652
This resin film with an adhesive layer laminates a first transparent resin film, an oligomer prevention layer, and an adhesive layer in the given order; the oligomer prevention layer is a cured layer formed by curing a composition contai...  
WO/2012/042869
The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials,...  
WO/2012/043657
The present invention addresses the problem of further improving bonding reliability of an object in which a metal plate and a porous material are attached together, in a history of harsh environments and high load conditions. The presen...  
WO/2012/043472
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...  
WO/2012/039323
This adhesive layer for an optical film is formed by applying and then drying a water-dispersible adhesive containing emulsion particles in the presence of a surfactant. The state of the adhesive layer is such that when the adhesive laye...  
WO/2012/037509
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/036209
The purpose of the present invention is the provision of: a pressure-sensitive adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed by the application of light even after...  
WO/2012/036109
The present invention addresses the problem of providing a fast-curing curable composition able to be used as a sealing material or an adhesive material, etc., and which can provide a cured product that is flexible and tough. The problem...  
WO/2012/037509
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/033626
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/033626
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/032958
Provided is an adhesive film with a dicing sheet (1), wherein the adhesive film (12) is laminated on top of a dicing film (11), which has excellent reliability and is readily capable of tip protrusion (tongue protrusion) of a cover film ...  
WO/2012/033030
Provided is a moisture-curable reactive hot-melt adhesive agent composition which does not contain any vinyl chloride resin, has excellent adhesion to a steel sheet having an oily surface or an electrodeposited steel sheet, can exhibit s...  
WO/2012/031824
The present invention relates to new types of materials which are reversibly crosslinkable by means of a thermoreversible mechanism or whose viscosity can be set reversibly. The use of bishydrazones or conjugated bis-Schiff bases as dien...  
WO/2012/029536
Adhesive particles (2) comprising inorganic particles (21) and a polymer (22) are mixed with a binder (3) and form an adhesive sheet (1). The inorganic particles (21) and the polymer (22) are chemically bonded. Some of the adhesive parti...  
WO/2012/030717
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/030717
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/026118
An acrylic adhesive composition contains: 100 parts by mass of an acrylic polymer (A); 1-70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of at least 1,000 and less than 30,000; and 1-50 parts by m...  
WO/2012/026203
Disclosed is an aggregate of fibrous columnar structures with a high shear bonding strength. Further disclosed is an adhesive member using such an aggregate of fibrous columnar structures. The disclosed aggregate of fibrous columnar stru...  
WO/2012/022494
The present invention relates to a silane-modified, one-component, water-, solvent- and phthalate-free parquet adhesive and also to its use for the highly dimensionally stable bonding of parquet, wood floor coverings and wood-based mater...  
WO/2012/022493
The present invention relates to a one-component, silane-modified, water-, solvent- and plasticizer-free parquet adhesive and also to its use for the bonding of parquet, wood floor coverings and wood-based material boards to all, includi...  
WO/2012/017955
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a se...  

Matches 251 - 300 out of 10,223