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Patent Searching and Data


Matches 251 - 300 out of 15,970

Document Document Title
WO/2013/146984A1
[Problem] To provide: a stacked piezoelectric element which stably operates for a long period of time, and wherein the amount of displacement of a laminate does not easily fluctuate; an injection device which is provided with the stacked...  
WO/2013/146163A1
Provided is a polarizing plate fabrication method comprising the following steps: a coating step (A) in which the bonding surface of at least either a polarizing film or an optical film is coated with an ultraviolet curing-type adhesive ...  
WO/2013/141215A1
A film which is to be applied to a window and which bears a substrate, a pressure-sensitive adhesive layer and a separator in this order, wherein the pressure-sensitive adhesive layer exhibits a storage modulus of 4.5×104 to 2.0×105 Pa...  
WO/2013/138414A1
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or m...  
WO/2013/136108A1
The invention relates to the use of an adhesive composition comprising at least one silyl-containing polymer, at least one compatible tackifying resin and at least one catalyst,to make a breathable self-adhesive article. The invention al...  
WO/2013/136979A1
Provided is a circuit connection material having excellent shelf life. Also provided is a method for producing a mounted product using the same. The material comprises a first adhesive layer containing a silane coupling agent and conduct...  
WO/2013/133256A1
The present invention relates to a gas barrier film laminate that includes at least two sheets of gas barrier films, in which the two adjacent sheets of gas barrier films are laminated via an adhesive layer, and the adhesive layer has a ...  
WO/2013/133268A1
[Problem] To impart heat release properties to a resulting semiconductor device without increasing the number of semiconductor device production steps or subjecting the semiconductor wafer or chip to special treatment that will complicat...  
WO/2013/132932A1
A thermally conductive adhesive sheet is provided with an adhesive layer. The adhesive layer contains thermally conductive particles, the push-out adhesion strength for a stainless steel plate is 5 N/cm2 or higher, the elongation measure...  
WO/2013/132933A1
An adhesive raw material contains a monomer and/or polymer and 55 mass% or more thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size based on the volume of...  
WO/2013/133275A1
This adhesive sheet is formed of a resin composition that contains (A) a high molecular weight component, (B1) a thermosetting component that has a softening point of less than 50°C, (B2) a thermosetting component that has a softening p...  
WO/2013/129463A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments. An adhesive tape in which a pressure-sensitive-adhesive layer is formed on o...  
WO/2013/129438A1
Provided are a circuit connection material having excellent blocking resistance and excellent connection reliability, and a method for producing a mounted unit using the same. Elastic particles having a compression recovery rate of 50% o...  
WO/2013/129164A3
[Purpose] To provide a sheet-like vibration damper that has damping properties and chip resistance, and can be adhered by means of self-adhesion or thermal fusion via an adhesive layer comprising an adhesive or a hot melt adhesive, even ...  
WO/2013/129437A1
Through the present invention, conductivity is ensured even to an electrode terminal on which an oxide film is formed on the surface thereof, and insulation properties between adjacent wires are also provided. A method for manufacturing ...  
WO/2013/129096A1
Provided are an energy ray curable hydrophilic adhesive composition and an adhesive sheet suitable for producing, by three-dimensional molding, microstructures that are suitable for applications requiring hydrophilicity, such as microrea...  
WO/2013/129462A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments, and minimizing fouling of that to which the tape is adhered. An adhesive tap...  
WO/2013/129078A1
Provided is an adhesive tape film comprising a non-adhesive layer provided on a substrate film. This adhesive tape film effectively prevents over-adhesion due to heat of a fixing base (when performing dicing by attachment to the base by ...  
WO/2013/125695A1
In the whole anisotropic conductive member (105), a plurality of substantially spherical conductive bodies (106) are dispersively contained, each of said conductive bodies having a diameter larger than a step between a protection film (1...  
WO/2013/125684A1
Provided is a production method for a semiconductor device in which the respective connecting sections of a semiconductor chip and a wiring circuit board are electrically connected to each other, or for a semiconductor device in which th...  
WO/2013/125388A1
Provided is a manufacturing method for a connection structure in which an anisotropic conductive connection layer is interposed between a terminal provided to a flexible display and a terminal of an electronic component, and the flexible...  
WO/2013/121854A1
Provided is an adhesive tape formed integrally by co-extruding a base layer, a rear treatment layer formed on one surface of the base layer, and an adhesive layer formed on the other surface of the base layer, said adhesive tape having e...  
WO/2013/122060A1
A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10μm or more, the surface free energy (γs) of the surface of the adhe...  
WO/2013/122117A1
 A thermoconductive adhesive sheet, wherein the quantity of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at ...  
WO/2013/121796A1
Provided is a multilayer porous sheet for suction applications that has a non-conventional structure and is located on the suction surface of a suction unit, thereby preventing contact between said suction surface and an object to which ...  
WO/2013/118562A1
An adhesive agent for a laminate is prepared from: an aqueous resin produced by reacting an isocyanate-group-terminal prepolymer having an anionic group with a chain extender; a wettable inorganic layered compound; and a water-dispersibl...  
WO/2013/118747A1
This solar cell module is provided with: a solar cell element; a protective member which is arranged on one side of the solar cell element in the thickness direction; an adhesive layer which is interposed between the solar cell element a...  
WO/2013/115116A1
Provided is a surface-protective film which exhibits excellent heat-resistance, is capable of ensuring visibility in an optical inspection test, and is unlikely to be scratched. This surface-protective film has an adhesive layer and a su...  
WO/2013/115338A1
A flame-retardant heat-conductive adhesive sheet having: a base material; and a flame-retardant heat-conductive adhesive layer provided on at least one surface of the base material. The base material comprises a polyester film, the ratio...  
WO/2013/114956A1
Provided is a stretchable thermal-release adhesive sheet which: exhibits excellent heat-resistance and stretchability; can accommodate setting the processing temperature and thermal-release temperature to a high temperature when cutting ...  
WO/2013/114955A1
Provided is a thermally releasable protective tape for sliding, which: exhibits excellent sliding properties without detaching during use from that to which the tape is adhered; and is capable of being easily removed from that to which t...  
WO/2013/115132A1
The purpose of the present invention is provide a slidable adhesive tape that allows the amount of outgassing, particularly of siloxane gas, to be greatly reduced. A slidable adhesive tape (6) comprises an adhesive layer (2) and a peelab...  
WO/2013/111883A1
Provided is a resin acid ester-type of adhesiveness-imparting agent which has good compatibility with synthetic rubber elastomers, can have a decreased melt viscosity, and can impart excellent adhesion/cohesion properties. As the adhesiv...  
WO/2013/111688A1
Provided are heat-expandable microspheres which contains a blowing agent encapsulated in high yield and which have excellent heat expandability, a process for producing the heat-expandable microspheres with satisfactory reproducibility, ...  
WO/2013/111634A1
The present invention provides a method for preventing the fouling of a structure. The method for preventing the fouling of a structure comprises step (1) and steps (2a-1) to (2a-2) or step (2b): (step 1) providing an anti-fouling adhesi...  
WO/2013/108740A1
Provided are conductive particles which are capable of lowering the connection resistance between electrodes in cases where the conductive particles are used for the connection between the electrodes. A conductive particle (21) of the pr...  
WO/2013/108843A1
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...  
WO/2013/108842A1
Provided are conductive particles which are capable of effectively lowering the connection resistance in cases where the conductive particles are used for the electrical connection between electrodes. A conductive particle (1) of the pre...  
WO/2013/105377A1
Provided is a surface protection film which can have a balanced combination of satisfactory conformability to the surface irregularities of an adherend with the ability to be removed lightly. This surface protection film comprises a base...  
WO/2013/105582A1
The purpose of the present invention is to provide: an adhesive composition having excellent heat resistance, which has high adhesive power and can still be easily released; an adhesive tape which uses the adhesive composition; and a met...  
WO/2013/103092A1
Provided is an adhesive tape for preventing aquatic biofouling, which has excellent impact resistance and can prevent damage to or loss of an antifouling layer due to a colliding object. This adhesive tape for preventing aquatic biofouli...  
WO/2013/103282A1
The present application relates to an encapsulation film, an electronic device, and a manufacturing method therefor. The present application can provide an encapsulation film having excellent moisture barrier properties, handling propert...  
WO/2013/103091A1
Provided is an adhesive tape for preventing aquatic biofouling, which can be readily attached with favorable workability even to sites other than a flat surface, such as a curved surface or an acutely angled surface, and is less suscepti...  
WO/2013/103116A1
The purpose of the present invention is to provide a wafer-processing tape that does not result in displacement at the interface between the adhesive layer and the sticky agent layer due to expansion, that has uniform expansion propertie...  
WO/2013/103065A1
Provided is an adhesive composition, adapted for use in seawater, which is able to offer a favorable balance between the property of less readily peeling away from an adherend during use in seawater and the property of being more readily...  
WO/2013/100301A1
In one embodiment of the present invention, a starch-based hot-melt adhesive is provided which consists of a composition comprising starch, a thermoplastic polymer, a tackifying agent, a plasticizer and an adhesion promoter. The hot-melt...  
WO/2013/099800A1
The purpose of the present invention is to fabricate a laminated structure with excellent adhesiveness. The present invention is a fabrication method for a laminated structure in which a first base material, an adhesive layer, and a seco...  
WO/2013/099755A1
Favorable conformity to the adherend and excellent impact resistance can be achieved with a pressure sensitive adhesive tape using a specific foam base material wherein: the mean bubble diameter in the flow direction (MD) and the transve...  
WO/2013/094564A1
Provided is a mounting table (70) which is capable of preventing deterioration of an adhesive used in adhesive bonding of an electrostatic chuck, and a plasma processing apparatus (10) which comprises the mounting table (70). The mountin...  
WO/2013/093652A1
A pressure-sensitive adhesive material including a visco-elastic layer and an elastic layer is provided. In some embodiments, a reusable pressure-sensitive adhesive material exhibiting high adhesive strength after repeated cycles of adhe...  

Matches 251 - 300 out of 15,970