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Patent Searching and Data


Matches 251 - 300 out of 10,336

Document Document Title
WO/2012/108348
Provided is an adhesive, which is capable of fixing adherends to each other instantaneously while also allowing re-positioning of the adherends with respect to each other, has superior processibility such as being capable of being cut in...  
WO/2012/105658
A manufacturing method for an adhered material in which a first adherend and a second adherend are bonded via an adhesive pattern, said manufacturing method comprising: a step in which an adhesive layer is provided on the first adherend;...  
WO/2012/105659
This adhesive tape has a structure in which an adhesive layer and a radiation-curable pressure-sensitive adhesive layer are layered, said radiation-curable pressure-sensitive adhesive layer being capable of pattern formation by exposure ...  
WO/2012/102587
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied in the gap in which fluid exists, and fills the gap by realizing a three-dimensional shape, and depending on the ...  
WO/2012/102587
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied in the gap in which fluid exists, and fills the gap by realizing a three-dimensional shape, and depending on the ...  
WO/2012/102588
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied into a gap in which fluid is present, and fills the gap by realizing a three-dimensional shape, and depending on ...  
WO/2012/102588
The present invention relates to a swelling tape and a method for filling a gap. The swelling tape, for example, is applied into a gap in which fluid is present, and fills the gap by realizing a three-dimensional shape, and depending on ...  
WO/2012/098929
This anisotropic conductive film wherein conductive particles are dispersed in an insulating adhesive uses conductive particles with a recovery rate of 10 - 46%. In addition, when lowest melt viscosity for the anisotropic conductive film...  
WO/2012/099121
The purpose of the present invention is to provide a double-sided adhesive tape or sheet: that can effectively maintain a state of being fixed to a pedestal; that can easily be peeled from the pedestal without damaging the adherend; and ...  
WO/2012/099122
The purpose of the present invention is to provide a double-sided adhesive tape or sheet: that can effectively maintain a state of being fixed to a pedestal, even if there is a warp in the adherend; that can prevent horizontal displaceme...  
WO/2012/091306
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...  
WO/2012/091306
The adhesive composition for semiconductors of the present invention is characterized in that two exothermic peaks appear at 65-350°C, of which a first exothermic peak appears at 65-185°C and a second exothermic peak appears at 155-350...  
WO/2012/086944
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...  
WO/2012/086588
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adh...  
WO/2012/086770
The purpose of the present invention is to prevent the occurrence of blocking in a reel body. A reel body comprises an anisotropic conductive film (3) which comprises a release base (31) and a resin film (32) formed on the release base (...  
WO/2012/086466
A process for producing an adhesive optical film, comprising a step of applying an anchor layer coating solution that comprises a mixed solvent containing water and an alcohol as the main components and a binder resin onto an optical fil...  
WO/2012/086554
An adhesive tape, characterized in that the initial wetting speed defined below is not less than 1 cm2/second, is provided. The initial wetting speed is the adhesion area per unit time (seconds) immediately after contact when the adhesiv...  
WO/2012/088541
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...  
WO/2012/086278
Provided is an anisotropic conductive adhesive film for anisotropic conductive connection of a terminal of a flexible substrate with a terminal of a rigid substrate, wherein conductive particles are employed having a particle size of at ...  
WO/2012/086944
The present invention relates to an adhesive resin composition for a decorative film, and to a decorative film including same. In the present invention, an amine-based (including N) accelerator having a functional group which can react w...  
WO/2012/088541
A method of preparing a window module includes providing a metal frame having a first major surface, applying a structural glazing tape to the first major surface of the metal frame, and positioning a glass panel overtop the structural g...  
WO/2012/081608
The present invention provides a temporary fixative with which it is possible to finish a substrate with high precision while damage to the substrate is minimized, and with which the substrate can be easily removed from a support substra...  
WO/2012/077471
Provided is an auxiliary sheet for laser dicing, that is not fully cut and does not reduce workability even in dicing processes that use a short-wavelength laser. The auxiliary sheet for laser dicing includes: a base material comprising ...  
WO/2012/073702
Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar ...  
WO/2012/072502
The invention relates to a composition comprising (A) at least 5 wt % of an organic prepolymer P having at least two water-curable organosilicon terminal groups, (B) 0.01 to 3.0 wt % of boric acid and/or boric acid ester, and (C) 0.01 to...  
WO/2012/072504
In the case of a curable composition based on at least one silyl-terminated polymer, the aim is to improve the adhesion spectrum in the bonding of plastics, and the rate of development of the adhesion. This is accomplished by provision o...  
WO/2012/070476
The objective of the present invention is to provide a curable composition having high hardness, which can be used as an adhesive or a coating agent. The objective can be achieved by a curable composition which contains (A) 100 parts by ...  
WO/2012/068573
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...  
WO/2012/066805
The present invention is a method for producing a molded fiber-reinforced plastic involving, in the following order: a laminate formation step for forming a preform laminate (5b) secured to a molding die (6), the preform laminate (5b) be...  
WO/2012/065716
The invention relates to a curable compound, which can be obtained as a mixture of at least two components to be stored separately, of which one component comprises a silane-modified polymer and said component or a second component compr...  
WO/2012/066777
A protective film (10) provided with a base layer (12), a pressure-sensitive adhesive layer (14), and a removable liner (16). The base layer (12) takes the form of a circular sheet, and a typical implementation thereof is a polyethylene ...  
WO/2012/068573
The invention provides hot melt adhesives that comprise a templating agent, a polymer and a wax. It has been discovered that hot melt adhesives with an effective amount of templating agent have improved heat resistance than adhesives. Th...  
WO/2012/066897
An anisotropic conductive film for electrically connecting a first circuit member to a second circuit member, the first circuit member having an insulating film formed in at least part thereof. The anisotropic conductive film comprises a...  
WO/2012/067145
The purpose of the present invention is to improve adhesion failure associated with "a bubble formation phenomenon" that may occur in an adhesive layer when the thickness of an adhesive agent is increased and "the formation of fisheyes" ...  
WO/2012/067232
Provided is a method for detaching a light-transmitting rigid substrate laminate without adhesive deposits. This method for detaching a light-transmitting rigid substrate laminate comprises: a step (1) for preparing a light-transmitting ...  
WO/2012/064133
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063810
This oil-resistant, heat-resistant adhesive sheet is provided with: a substrate containing a fluororesin; and an adhesive layer that is layered on at least one surface of the substrate. One surface of the substrate is subjected to roughe...  
WO/2012/064081
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/064133
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063811
A water-dispersible oil-resistant adhesive agent composition comprises a water-dispersible polymer and inorganic particles, wherein the content of the inorganic particles is 3-90 parts by mass relative to 100 parts by mass of the water-d...  
WO/2012/064081
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/063554
An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comp...  
WO/2012/056511
Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to ...  
WO/2012/051687
A concentrated gel for use in a compound mixture for promoting the waterproofing, adherence and fastening power between various elements and substrates. Said compound mixture is a concentrated mixture which is novel and functional, and d...  
WO/2012/053478
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...  
WO/2012/053589
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...  
WO/2012/053373
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...  
WO/2012/046710
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...  
WO/2012/045566
The invention relates to a curable composition comprising at least one polymer having at least one end group of the general formula (I) comprising -An-R-SiXYZ (I), where A is a double-bonded bond group comprising at least one heteroatom,...  
WO/2012/046695
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...  

Matches 251 - 300 out of 10,336