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Patent Searching and Data


Matches 351 - 400 out of 16,991

Document Document Title
WO/2014/069353A1
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a su...  
WO/2014/065247A1
A production method for a transparent surface material having an adhesive layer, comprising: a step in which a frame-shaped film is laminated upon the upper surface of each of a plurality of transparent surface materials as same are bein...  
WO/2014/065350A1
The purpose of the present invention is to provide an active energy ray-curable adhesive composition which exhibits excellent heat resistance, film hardness and adhesion after being irradiated with an active energy ray. An active energy ...  
WO/2014/054618A1
The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D50) of the copper powder...  
WO/2014/054409A1
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...  
WO/2014/053271A1
The invention relates to an aqueous composition comprising (A) a water-soluble or water-dispersible binder, or a water-soluble or water-dispersible constituent comprising carboxyl groups, and (B) at least one cyclic hydroxyalkyl amide.  
WO/2014/054701A1
 Provided is a self-adhesive surface protection film which exhibits strong adhesion to a body to be covered, with which the adhesive film is stored in a rolled state while being usable with various bodies to be covered, which is not su...  
WO/2014/050455A1
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound having a thermal decomposition temperature of at least 250°C, and (B) a radical polymerizable monomer; an adhesive substrate tha...  
WO/2014/050156A1
The present invention relates to a conductive composition containing a conductive metal powder and a resin component, wherein the conductive metal powder contains metal flakes and metal nanoparticles, and the resin component contains an ...  
WO/2014/051142A1
The purpose of the present invention is to provide an intermediate film for a laminated glass, the intermediate film being extremely transparent, wherein it is possible to prevent the occurrence of pests. Another purpose of the present i...  
WO/2014/050538A1
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound that is substantially insoluble in an alkaline solution, and has a radical polymerizable group in a side chain, (B) a radical pol...  
WO/2014/050664A1
The present invention relates to a method for producing a laminated member formed by laminating multiple articles including at least one article having a heating allowable temperature of 80˚C or lower on each other, said method comprisi...  
WO/2014/051106A1
An adhesive sheet in which a support substrate, an adhesive layer (X), a continuous-void-containing layer comprising a composition containing an adhesive and silica particles, and an adhesive layer (Y) are laminated in this order, swelli...  
WO/2014/050763A1
Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive...  
WO/2014/051043A1
The present invention is characterized by containing conductive carbon, a water-soluble polymer, a particulate binder, and a dispersing medium, the water-soluble polymer being partially hydrolyzed and being an isobutylene-maleic anhydrid...  
WO/2014/046128A1
The aim of the present invention is to provide an adhesive for electronic components, which is easy to apply, maintains shape well after application, and with which voids can be minimized. Another aim of the present invention is to provi...  
WO/2014/046093A1
Provided is an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance. Conductive particles (31) and solder particles (32) are dispersed in a binder. In an LED package which is obtained by thermal...  
WO/2014/045931A1
An anisotropic conductive film in which a terminal of first electronic component and a terminal of second electronic component are connected in an anisotropically conductive manner; wherein the anisotropic conductive film contains a crys...  
WO/2014/046082A1
The purpose of the present invention is to reduce the occurrence of substrate warping after being connected in a connection using an anisotropic conductive film. An anisotropic conductive film (23) has a first insulating adhesive agent l...  
WO/2014/046053A1
An anisotropic conductive film produced by the anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, said anisotropic conductive film comprising a conductive...  
WO/2014/046102A1
This conductive sheet has a structure wherein a conductive adhesive layer is laminated on one surface of a base substrate and a light-blocking insulating layer is laminated on the other surface of the base substrate. A substrate which ha...  
WO/2014/041904A1
A method for manufacturing a laminate in which a transfer layer having an uneven shape is laminated on a transferred object, the method for manufacturing a laminate provided with an uneven shape including: a first step for obtaining a tr...  
WO/2014/038477A1
The present invention provides an anti-fouling treatment method for an underwater structure by using an anti-fouling adhesive tape, whereby it is possible to prevent peeling of the anti-fouling adhesive tape, the progression of the peeli...  
WO/2014/038366A1
A flame-retardant laminate (10) having a base material (11) and a print receptive layer (12) laminated therein. The base material (11) has flame retardation equivalent to VTM-0. The print receptive layer (12) includes a resin and titaniu...  
WO/2014/033770A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/034100A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/026906A1
The invention relates to multicomponent crosslinkable compositions (K) comprising at least one component (K1) and a component (K2), characterized in that component (K1) contains 100 parts by weight of compounds (A) of the formula: Y-[(CR...  
WO/2014/024829A1
The purpose of the present invention is to provide a processing method for a wafer that processes the wafer in a state in which the wafer is affixed to a support plate via an adhesive composition, and that achieves higher production effi...  
WO/2014/024678A1
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...  
WO/2014/020867A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020868A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020878A1
One embodiment of the adhesive layer of the present invention contains a (meth)acrylate polymer having a weight average molecular weight of at least 1000 and less than 30,000, has an adhesive strength when 30 minutes have elapsed after p...  
WO/2014/021450A1
This film-like adhesive contains a binder resin (A), epoxy resin (B), hardener (C), and filler (D), wherein the total light transmittance in a D65 standard light source is 70% or higher and the haze value is 50% or lower. Provided are a ...  
WO/2014/021687A1
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for e...  
WO/2014/020821A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; and 0.05-20 parts by mass of a (meth)acrylate polymer (B) having a weight average molec...  
WO/2014/021696A1
The present invention relates to an adhesive film and a product for encapsulating an organic electronic device using the same. The present invention maintains a moisture blocking capability by preventing moisture within a matrix resin fr...  
WO/2014/016969A1
Provided is an adhesive capable of instantaneously fixing adherends together, capable of re-adhering adherends together, having excellent workability such as being capable of having sheet-shaped cut outs being made therefrom, does not pe...  
WO/2014/017473A1
[Problem] To provide: a protective film-forming layer which exhibits excellent bonding strength to a chip even after exposure to severe wet heat conditions and a reflow process after storage of a certain period of time; a sheet for formi...  
WO/2014/014011A1
Provided is a surface-treated heavy calcium carbonate useful for a film precisely controlling pore diameters or a polyester-based resin, etc., that is readily hydrolyzed; or a heavy calcium carbonate that is adequate with no preliminary ...  
WO/2014/013791A1
Provided is a surface protection sheet which has a balance between reworkability and protection function at high levels. A surface protection sheet (10) comprises a supporting base (1) and an adhesive layer (2) that is arranged on the su...  
WO/2014/014881A1
A composition and method of using the composition are described. The composition is useful for quickly bonding chlorinated polyvinylchloride during installation and repair operations. Embodiments of the composition include at least one v...  
WO/2014/010627A1
Provided is a novel active energy ray-polymerizable resin composition which has excellent thermal resistance, wet heat resistance, thermal dimensional stability, weather resistance, and the like, can be favorably used in optical uses, co...  
WO/2014/010511A1
Provided is a manufacturing method for a polarizing plate in which a transparent film is laminated to one of both surfaces of a polarizing film. The method includes: an adhesive coating step in which an active energy ray-curable adhesive...  
WO/2014/011970A1
In one embodiment, a selectively-releasable adhesive includes a base adhesive compound and a releasing compound that is blended with the base adhesive compound, the releasing compound being capable of decreasing the adhesive strength of ...  
WO/2014/007238A1
Provided are conductive particles with insulating particles, which are capable of increasing insulation reliability in cases where electrodes are connected with each other using the conductive particles with insulating particles. Each co...  
WO/2014/007237A1
Provided are conductive particles with insulating particles, which are capable of increasing both conduction reliability and insulation reliability in cases where electrodes are connected with each other using the conductive particles wi...  
WO/2014/006189A1
The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.  
WO/2014/007334A1
Provided is a conductive particle whereby, when electrically connecting electrodes with the conductive particle, connection resistance is lowered, and it is possible to increase connection reliability. A conductive particle according to ...  
WO/2013/191106A1
This adhesive tape comprises an adhesive layer on a foam substrate, the foam substrate having a thickness of 250 μm or less and an interlayer strength of 10 to 18 N/cm, and the adhesive layer having a thickness of 40 μm or less. The ad...  
WO/2013/191075A1
The purpose of the present invention is to provide: an amorphous inorganic anion exchanger that has excellent anion exchanging performance and rarely causes metals to corrode; and a production method which enables the production of an am...  

Matches 351 - 400 out of 16,991