Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 351 - 400 out of 15,386

Document Document Title
WO/2012/056511A1
Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to ...  
WO/2012/051687A1
A concentrated gel for use in a compound mixture for promoting the waterproofing, adherence and fastening power between various elements and substrates. Said compound mixture is a concentrated mixture which is novel and functional, and d...  
WO/2012/053478A1
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...  
WO/2012/053589A1
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...  
WO/2012/053373A1
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...  
WO/2012/046710A1
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...  
WO/2012/045566A1
The invention relates to a curable composition comprising at least one polymer having at least one end group of the general formula (I) comprising -An-R-SiXYZ (I), where A is a double-bonded bond group comprising at least one heteroatom,...  
WO/2012/046695A1
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...  
WO/2012/043652A1
This resin film with an adhesive layer laminates a first transparent resin film, an oligomer prevention layer, and an adhesive layer in the given order; the oligomer prevention layer is a cured layer formed by curing a composition contai...  
WO/2012/042869A1
The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials,...  
WO/2012/043657A1
The present invention addresses the problem of further improving bonding reliability of an object in which a metal plate and a porous material are attached together, in a history of harsh environments and high load conditions. The presen...  
WO/2012/043472A1
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...  
WO/2012/039323A1
This adhesive layer for an optical film is formed by applying and then drying a water-dispersible adhesive containing emulsion particles in the presence of a surfactant. The state of the adhesive layer is such that when the adhesive laye...  
WO/2012/037509A2
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/036209A1
The purpose of the present invention is the provision of: a pressure-sensitive adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed by the application of light even after...  
WO/2012/036109A1
The present invention addresses the problem of providing a fast-curing curable composition able to be used as a sealing material or an adhesive material, etc., and which can provide a cured product that is flexible and tough. The problem...  
WO/2012/037509A3
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/033626A2
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/033626A3
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/032958A1
Provided is an adhesive film with a dicing sheet (1), wherein the adhesive film (12) is laminated on top of a dicing film (11), which has excellent reliability and is readily capable of tip protrusion (tongue protrusion) of a cover film ...  
WO/2012/033030A1
Provided is a moisture-curable reactive hot-melt adhesive agent composition which does not contain any vinyl chloride resin, has excellent adhesion to a steel sheet having an oily surface or an electrodeposited steel sheet, can exhibit s...  
WO/2012/031824A1
The present invention relates to new types of materials which are reversibly crosslinkable by means of a thermoreversible mechanism or whose viscosity can be set reversibly. The use of bishydrazones or conjugated bis-Schiff bases as dien...  
WO/2012/029536A1
Adhesive particles (2) comprising inorganic particles (21) and a polymer (22) are mixed with a binder (3) and form an adhesive sheet (1). The inorganic particles (21) and the polymer (22) are chemically bonded. Some of the adhesive parti...  
WO/2012/030717A2
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/030717A3
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/026118A1
An acrylic adhesive composition contains: 100 parts by mass of an acrylic polymer (A); 1-70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of at least 1,000 and less than 30,000; and 1-50 parts by m...  
WO/2012/026203A1
Disclosed is an aggregate of fibrous columnar structures with a high shear bonding strength. Further disclosed is an adhesive member using such an aggregate of fibrous columnar structures. The disclosed aggregate of fibrous columnar stru...  
WO/2012/022494A1
The present invention relates to a silane-modified, one-component, water-, solvent- and phthalate-free parquet adhesive and also to its use for the highly dimensionally stable bonding of parquet, wood floor coverings and wood-based mater...  
WO/2012/022493A3
The present invention relates to a one-component, silane-modified, water-, solvent- and plasticizer-free parquet adhesive and also to its use for the bonding of parquet, wood floor coverings and wood-based material boards to all, includi...  
WO/2012/017955A1
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a se...  
WO/2012/018232A3
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/018123A1
An anisotropic conductive adhesive film which comprises: an organic binder that contains a cationically polymerizable substance; 0.01 to 15 parts by mass of a cation generator represented by general formula (1) per 100 parts by mass of t...  
WO/2012/018720A3
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/018720A2
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/017568A1
Provided are a pressure-sensitive film and tape for semiconductor wafer processing, which are capable of reducing the occurrence of reflow cracks in packages, even if a package is picked up in a state in which a pressure-sensitive adhesi...  
WO/2012/018232A2
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/014562A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first...  
WO/2012/014563A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adh...  
WO/2012/011457A1
An anisotropic conductive film comprises an insulating adhesive agent composition comprising a (meth)acrylate monomer composition, a radical polymerization initiator and a film-forming resin and electrically conductive particles disperse...  
WO/2012/005144A1
Disclosed is an anisotropic conductive adhesive in which the conductive particles thereof exist in an insulating adhesive composition without aggregating in cases where magnetic powder particles, such as nickel-coated resin particles, ar...  
WO/2012/001900A1
A wheel protection film (30) is provided with a base material layer (32), and an adhesive layer (34) which is disposed on one surface of the base material layer (32). The adhesive layer (34) comprises a moisture dispersion type adhesive ...  
WO/2011/162191A1
It is possible to obtain an adhesive layer by coating and drying an aqueous dispersion adhesive composition. The surface of the adhesive layer has 5 or less per 1 m2 of concave sections having a depth in the thickness direction of 0.2 to...  
WO/2011/162125A1
Provided are a display panel equipped with a front plate and a display device in which the problem of striped irregularities around a display area is satisfactorily resolved. A display panel (100) equipped with a front plate has a front ...  
WO/2011/162256A1
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...  
WO/2011/152002A1
Provided is a curable composition that uses a polymer having reactive silicon groups of low toxicity, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high...  
WO/2011/148586A1
The disclosed terminally unsaturated polyolefin fulfills (1) to (4) below. (1) The meso pentad fraction [mmmm] of propylene chain units or butene-1 chain units is 20-80%. (2) The number of terminal vinylidene groups per molecule is 1.3-2...  
WO/2011/148917A1
Disclosed is a pressure-sensitive adhesive sheet which comprises an adhesive composition containing a carboxyl group-containing polymer containing a carboxyl group, a plasticizer, and a metal oxide-containing component containing a metal...  
WO/2011/142043A1
A laminated composition includes a first polymer layer having a first surface and a second surface; a second polymer layer having a first surface and a second surface; and an adhesive layer joining the second surface of the first polymer...  
WO/2011/142325A1
Provided is method for evaluating the birefringence of a novel adhesive, also provided are a method for designing and a method for producing an adhesive using the evaluation method, additionally provided is an adhesive obtained by the pr...  
WO/2011/132578A1
Disclosed is an anisotropic conductive film which contains conductive particles, film-forming resin, a radical-polymerizable compound, a curing agent which generates free radicals, and an amine salt obtained from phosphoric acid (meth)ac...  

Matches 351 - 400 out of 15,386