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Patent Searching and Data


Matches 351 - 400 out of 17,116

Document Document Title
WO/2014/088095A1
Provided is a conductive material which forms a connection part that is not susceptible to voids in cases where electrodes of members to be connected are electrically connected with each other, and which is capable of increasing the conn...  
WO/2014/084069A1
An adhesive which contains a product of condensation of a cellulose derivative with a polysiloxane having at least one kind of substituent selected from the group consisting of hydroxyl group and alkoxyl groups.  
WO/2014/083875A1
The present invention relates to an electroconductive film (including electromagnetic wave shielding films) and provides a novel electroconductive film that not only has excellent conductivity but also is capable of increased adhesivenes...  
WO/2014/084173A1
Provided is a conductive particle with insulating particles, which is able to be efficiently arranged on an electrode. A conductive particle (1) with insulating particles according to the present invention is provided with: a conductive ...  
WO/2014/084357A1
[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an...  
WO/2014/083872A1
[Problem] To provide a sheet having excellent bondability, which is capable of imparting a semiconductor device that is obtained using the sheet with heat dissipation characteristics without having a semiconductor wafer or chip subjected...  
WO/2014/080954A1
To provide: an adhesive composition for skin whereby an adhesive for skin can be obtained that can be readily coated and which has good aggregability; an adhesive for skin obtained using said adhesive composition for skin; and an adhesiv...  
WO/2014/077115A1
The present invention addresses the problem of providing an easily peelable adhesive agent which is adhesive at high temperatures and non-adhesive at low temperatures, and an easily peelable adhesive material using this adhesive agent. T...  
WO/2014/078071A1
A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow mic...  
WO/2014/073316A1
Provided is a new double-sided adhesive sheet for an image display device which can be firmly laminated onto a surface without a gap even when the surface on which the adhesive sheet is to be laminated has a step difference due to printi...  
WO/2014/069542A1
A laminated body with good reworkability is provided. The laminated body is bonded to an adherend and used. The laminated body comprises, in order from an adherend side, a first adhesive layer, a first substrate layer, a second adhesive ...  
WO/2014/069353A1
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a su...  
WO/2014/065247A1
A production method for a transparent surface material having an adhesive layer, comprising: a step in which a frame-shaped film is laminated upon the upper surface of each of a plurality of transparent surface materials as same are bein...  
WO/2014/065350A1
The purpose of the present invention is to provide an active energy ray-curable adhesive composition which exhibits excellent heat resistance, film hardness and adhesion after being irradiated with an active energy ray. An active energy ...  
WO/2014/054618A1
The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D50) of the copper powder...  
WO/2014/054409A1
Provided is a thermally restorable article, which has good embeddability during heat-shrinking and is capable of improving adhesion to the substrate being processed, and which is capable of reducing variations in the thickness of the adh...  
WO/2014/053271A1
The invention relates to an aqueous composition comprising (A) a water-soluble or water-dispersible binder, or a water-soluble or water-dispersible constituent comprising carboxyl groups, and (B) at least one cyclic hydroxyalkyl amide.  
WO/2014/054701A1
 Provided is a self-adhesive surface protection film which exhibits strong adhesion to a body to be covered, with which the adhesive film is stored in a rolled state while being usable with various bodies to be covered, which is not su...  
WO/2014/050455A1
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound having a thermal decomposition temperature of at least 250°C, and (B) a radical polymerizable monomer; an adhesive substrate tha...  
WO/2014/050156A1
The present invention relates to a conductive composition containing a conductive metal powder and a resin component, wherein the conductive metal powder contains metal flakes and metal nanoparticles, and the resin component contains an ...  
WO/2014/051142A1
The purpose of the present invention is to provide an intermediate film for a laminated glass, the intermediate film being extremely transparent, wherein it is possible to prevent the occurrence of pests. Another purpose of the present i...  
WO/2014/050538A1
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound that is substantially insoluble in an alkaline solution, and has a radical polymerizable group in a side chain, (B) a radical pol...  
WO/2014/050664A1
The present invention relates to a method for producing a laminated member formed by laminating multiple articles including at least one article having a heating allowable temperature of 80˚C or lower on each other, said method comprisi...  
WO/2014/051106A1
An adhesive sheet in which a support substrate, an adhesive layer (X), a continuous-void-containing layer comprising a composition containing an adhesive and silica particles, and an adhesive layer (Y) are laminated in this order, swelli...  
WO/2014/050763A1
Provided is a radiation-curing adhesive tape for dicing capable of easy pickup without any residual adhesive in the pickup step even for, e.g., a semiconductor chip on which a through electrode is provided. This radiation-curing adhesive...  
WO/2014/051043A1
The present invention is characterized by containing conductive carbon, a water-soluble polymer, a particulate binder, and a dispersing medium, the water-soluble polymer being partially hydrolyzed and being an isobutylene-maleic anhydrid...  
WO/2014/046128A1
The aim of the present invention is to provide an adhesive for electronic components, which is easy to apply, maintains shape well after application, and with which voids can be minimized. Another aim of the present invention is to provi...  
WO/2014/046093A1
Provided is an anisotropic conductive adhesive which is capable of achieving high heat dissipation performance. Conductive particles (31) and solder particles (32) are dispersed in a binder. In an LED package which is obtained by thermal...  
WO/2014/045931A1
An anisotropic conductive film in which a terminal of first electronic component and a terminal of second electronic component are connected in an anisotropically conductive manner; wherein the anisotropic conductive film contains a crys...  
WO/2014/046082A1
The purpose of the present invention is to reduce the occurrence of substrate warping after being connected in a connection using an anisotropic conductive film. An anisotropic conductive film (23) has a first insulating adhesive agent l...  
WO/2014/046053A1
An anisotropic conductive film produced by the anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, said anisotropic conductive film comprising a conductive...  
WO/2014/046102A1
This conductive sheet has a structure wherein a conductive adhesive layer is laminated on one surface of a base substrate and a light-blocking insulating layer is laminated on the other surface of the base substrate. A substrate which ha...  
WO/2014/041904A1
A method for manufacturing a laminate in which a transfer layer having an uneven shape is laminated on a transferred object, the method for manufacturing a laminate provided with an uneven shape including: a first step for obtaining a tr...  
WO/2014/038477A1
The present invention provides an anti-fouling treatment method for an underwater structure by using an anti-fouling adhesive tape, whereby it is possible to prevent peeling of the anti-fouling adhesive tape, the progression of the peeli...  
WO/2014/038366A1
A flame-retardant laminate (10) having a base material (11) and a print receptive layer (12) laminated therein. The base material (11) has flame retardation equivalent to VTM-0. The print receptive layer (12) includes a resin and titaniu...  
WO/2014/033770A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/034100A1
Provided is an adhesive composition characterized in that: when the temperature of the adhesive composition is 25 °C, the 180° peel adhesion strength from a stainless steel plate is 20 N/25 mm or higher and failure of the adhesive comp...  
WO/2014/026906A1
The invention relates to multicomponent crosslinkable compositions (K) comprising at least one component (K1) and a component (K2), characterized in that component (K1) contains 100 parts by weight of compounds (A) of the formula: Y-[(CR...  
WO/2014/024829A1
The purpose of the present invention is to provide a processing method for a wafer that processes the wafer in a state in which the wafer is affixed to a support plate via an adhesive composition, and that achieves higher production effi...  
WO/2014/024678A1
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...  
WO/2014/020867A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020868A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; 0.05-3 parts by mass of a (meth)acrylate polymer (B) having a weight average molecular ...  
WO/2014/020878A1
One embodiment of the adhesive layer of the present invention contains a (meth)acrylate polymer having a weight average molecular weight of at least 1000 and less than 30,000, has an adhesive strength when 30 minutes have elapsed after p...  
WO/2014/021450A1
This film-like adhesive contains a binder resin (A), epoxy resin (B), hardener (C), and filler (D), wherein the total light transmittance in a D65 standard light source is 70% or higher and the haze value is 50% or lower. Provided are a ...  
WO/2014/021687A1
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for e...  
WO/2014/020821A1
This adhesive composition is characterized by containing: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0°C; and 0.05-20 parts by mass of a (meth)acrylate polymer (B) having a weight average molec...  
WO/2014/021696A1
The present invention relates to an adhesive film and a product for encapsulating an organic electronic device using the same. The present invention maintains a moisture blocking capability by preventing moisture within a matrix resin fr...  
WO/2014/016969A1
Provided is an adhesive capable of instantaneously fixing adherends together, capable of re-adhering adherends together, having excellent workability such as being capable of having sheet-shaped cut outs being made therefrom, does not pe...  
WO/2014/017473A1
[Problem] To provide: a protective film-forming layer which exhibits excellent bonding strength to a chip even after exposure to severe wet heat conditions and a reflow process after storage of a certain period of time; a sheet for formi...  
WO/2014/014011A1
Provided is a surface-treated heavy calcium carbonate useful for a film precisely controlling pore diameters or a polyester-based resin, etc., that is readily hydrolyzed; or a heavy calcium carbonate that is adequate with no preliminary ...  

Matches 351 - 400 out of 17,116