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Patent Searching and Data


Matches 351 - 400 out of 15,395

Document Document Title
WO/2012/064133A2
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063810A1
This oil-resistant, heat-resistant adhesive sheet is provided with: a substrate containing a fluororesin; and an adhesive layer that is layered on at least one surface of the substrate. One surface of the substrate is subjected to roughe...  
WO/2012/064081A2
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/064133A3
The present invention relates to a conductive transparent adhesive composition and to a conductive transparent adhesive produced by same. The conductive transparent adhesive composition comprises: a conductive mesoporous filler selected ...  
WO/2012/063811A1
A water-dispersible oil-resistant adhesive agent composition comprises a water-dispersible polymer and inorganic particles, wherein the content of the inorganic particles is 3-90 parts by mass relative to 100 parts by mass of the water-d...  
WO/2012/064081A3
The present invention relates to an underwater antifouling coating sheet for preventing a ship or an underwater structure from being contaminated by marine life and an underwater antifouling coating method using the same. The underwater ...  
WO/2012/063554A1
An anisotropic conductive film obtained by laminating an insulating adhesive layer that comprises a polymerizable acrylic compound, a film-forming resin and a polymerization initiator with a conductive-particle-containing layer that comp...  
WO/2012/056511A1
Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to ...  
WO/2012/051687A1
A concentrated gel for use in a compound mixture for promoting the waterproofing, adherence and fastening power between various elements and substrates. Said compound mixture is a concentrated mixture which is novel and functional, and d...  
WO/2012/053478A1
Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temper...  
WO/2012/053589A1
The present invention relates to an adhesive composition that seals connection parts in a semiconductor device in which the connection part of a semiconductor chip and the connection part of a wiring circuit board are electrically connec...  
WO/2012/053373A1
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...  
WO/2012/046710A1
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...  
WO/2012/045566A1
The invention relates to a curable composition comprising at least one polymer having at least one end group of the general formula (I) comprising -An-R-SiXYZ (I), where A is a double-bonded bond group comprising at least one heteroatom,...  
WO/2012/046695A1
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contain...  
WO/2012/043652A1
This resin film with an adhesive layer laminates a first transparent resin film, an oligomer prevention layer, and an adhesive layer in the given order; the oligomer prevention layer is a cured layer formed by curing a composition contai...  
WO/2012/042869A1
The present invention addresses the problem of obtaining an olefinic expandable base material that has low contamination, has a high degree of expandability, which has been insufficient in conventional olefinic expandable base materials,...  
WO/2012/043657A1
The present invention addresses the problem of further improving bonding reliability of an object in which a metal plate and a porous material are attached together, in a history of harsh environments and high load conditions. The presen...  
WO/2012/043472A1
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...  
WO/2012/039323A1
This adhesive layer for an optical film is formed by applying and then drying a water-dispersible adhesive containing emulsion particles in the presence of a surfactant. The state of the adhesive layer is such that when the adhesive laye...  
WO/2012/037509A2
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/036209A1
The purpose of the present invention is the provision of: a pressure-sensitive adhesive compound that exhibits high initial adhesion, can securely fix an adherend in place, and can be easily removed by the application of light even after...  
WO/2012/036109A1
The present invention addresses the problem of providing a fast-curing curable composition able to be used as a sealing material or an adhesive material, etc., and which can provide a cured product that is flexible and tough. The problem...  
WO/2012/037509A3
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...  
WO/2012/033626A2
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/033626A3
A multilayer construct includes a fluoropolymer first layer; a UV resistant fluoropolymer adhesive layer, and a third layer, wherein the fluoropolymer adhesive layer is between the first and third layers. The adhesive layer can optionall...  
WO/2012/032958A1
Provided is an adhesive film with a dicing sheet (1), wherein the adhesive film (12) is laminated on top of a dicing film (11), which has excellent reliability and is readily capable of tip protrusion (tongue protrusion) of a cover film ...  
WO/2012/033030A1
Provided is a moisture-curable reactive hot-melt adhesive agent composition which does not contain any vinyl chloride resin, has excellent adhesion to a steel sheet having an oily surface or an electrodeposited steel sheet, can exhibit s...  
WO/2012/031824A1
The present invention relates to new types of materials which are reversibly crosslinkable by means of a thermoreversible mechanism or whose viscosity can be set reversibly. The use of bishydrazones or conjugated bis-Schiff bases as dien...  
WO/2012/029536A1
Adhesive particles (2) comprising inorganic particles (21) and a polymer (22) are mixed with a binder (3) and form an adhesive sheet (1). The inorganic particles (21) and the polymer (22) are chemically bonded. Some of the adhesive parti...  
WO/2012/030717A2
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/030717A3
The invention is directed to a bed bug monitoring device comprising a bed bug attractant element and a harborage section comprising a support member having a traversable surface and one or more protuberances depending therefrom. The harb...  
WO/2012/026118A1
An acrylic adhesive composition contains: 100 parts by mass of an acrylic polymer (A); 1-70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of at least 1,000 and less than 30,000; and 1-50 parts by m...  
WO/2012/026203A1
Disclosed is an aggregate of fibrous columnar structures with a high shear bonding strength. Further disclosed is an adhesive member using such an aggregate of fibrous columnar structures. The disclosed aggregate of fibrous columnar stru...  
WO/2012/022494A1
The present invention relates to a silane-modified, one-component, water-, solvent- and phthalate-free parquet adhesive and also to its use for the highly dimensionally stable bonding of parquet, wood floor coverings and wood-based mater...  
WO/2012/022493A3
The present invention relates to a one-component, silane-modified, water-, solvent- and plasticizer-free parquet adhesive and also to its use for the bonding of parquet, wood floor coverings and wood-based material boards to all, includi...  
WO/2012/017955A1
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a se...  
WO/2012/018232A3
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/018123A1
An anisotropic conductive adhesive film which comprises: an organic binder that contains a cationically polymerizable substance; 0.01 to 15 parts by mass of a cation generator represented by general formula (1) per 100 parts by mass of t...  
WO/2012/018720A3
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/018720A2
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/017568A1
Provided are a pressure-sensitive film and tape for semiconductor wafer processing, which are capable of reducing the occurrence of reflow cracks in packages, even if a package is picked up in a state in which a pressure-sensitive adhesi...  
WO/2012/018232A2
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/014562A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first...  
WO/2012/014563A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adh...  
WO/2012/011457A1
An anisotropic conductive film comprises an insulating adhesive agent composition comprising a (meth)acrylate monomer composition, a radical polymerization initiator and a film-forming resin and electrically conductive particles disperse...  
WO/2012/005144A1
Disclosed is an anisotropic conductive adhesive in which the conductive particles thereof exist in an insulating adhesive composition without aggregating in cases where magnetic powder particles, such as nickel-coated resin particles, ar...  
WO/2012/001900A1
A wheel protection film (30) is provided with a base material layer (32), and an adhesive layer (34) which is disposed on one surface of the base material layer (32). The adhesive layer (34) comprises a moisture dispersion type adhesive ...  
WO/2011/162191A1
It is possible to obtain an adhesive layer by coating and drying an aqueous dispersion adhesive composition. The surface of the adhesive layer has 5 or less per 1 m2 of concave sections having a depth in the thickness direction of 0.2 to...  
WO/2011/162125A1
Provided are a display panel equipped with a front plate and a display device in which the problem of striped irregularities around a display area is satisfactorily resolved. A display panel (100) equipped with a front plate has a front ...  

Matches 351 - 400 out of 15,395