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Patent Searching and Data


Matches 401 - 450 out of 10,337

Document Document Title
WO/2011/001942
Provided is an alkali-developable photosensitive adhesive which excels sufficiently in applicability, pattern formation properties, thermocompression bondability, and high -temperature adhesiveness and which is thermocompression -bondabl...  
WO/2011/001713
Disclosed is a protection tape for plating, which is capable of preventing occurrence of plating failure and can be easily removed after being used. Specifically disclosed is a protection tape for plating, which is used for the purpose o...  
WO/2011/001760
Provided are a thermally conductive pressure-sensitive adhesive sheet which is flexible and has high thermal conductivity and flame retardancy, a thermally conductive pressure-sensitive adhesive composition which is a material for the th...  
WO/2011/000843
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...  
WO/2011/000843
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...  
WO/2010/150673
Provided are a novel, liquid, two-part, fast-curing, water-based adhesive of separate-application type which exhibits initial adhesion and adhesion properties for a wide variety of adherends, and a method for adhesive bonding. The novel,...  
WO/2010/147103
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...  
WO/2010/147102
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...  
WO/2010/144774
The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled witho...  
WO/2010/137445
An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, (E) organic microparticles, and (F) a powdery compound that has a solid form at room temperature ...  
WO/2010/137523
Disclosed is an adhesive material which has redetachability and also achieves the reliability of an adhesive surface with respect to detachment, the occurrence of foaming, etc. Specifically disclosed is an adhesive material to be used fo...  
WO/2010/137443
Disclosed is an adhesive sheet for connecting a circuit member, which comprises a supporting base and an adhesive layer that is provided on the supporting base and composed of an adhesive composition. The adhesive composition contains (A...  
WO/2010/137442
An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, and (E) organic microparticles.  
WO/2010/134341
A novel organosilicon compound represented by general formula (I) or (VI), which can reduce the hysteresis loss of a rubber composition to a great extent and can also improve abrasion resistance to a great extent; a rubber composition wh...  
WO/2010/134266
Disclosed are: an organosilicon compound having, in the molecule, a cyclic structure containing a nitrogen atom and a silicon atom and at least one sulfur atom, and also having a site in which at least one group having low steric hindran...  
WO/2010/131575
Disclosed is an adhesive composition which enables the formation of a film-like adhesive that has highly satisfactory adhesion to semiconductor wafers, wafer back grinding properties, and burying properties during flip chip bonding. Spec...  
WO/2010/131655
Disclosed is a bonding sheet which comprises an adhesive layer that is obtained by shaping an adhesive composition, which contains (A) a high molecular weight component and (B) a thermosetting component, into a sheet-like form. The bondi...  
WO/2010/125880
Disclosed is an adhesive resin composition which contains: an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer which is obtained by copolymerizing an epoxy-providing monomer and an ethylenically unsaturated monomer that ...  
WO/2010/126937
A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and...  
WO/2010/122863
Provided is a solar cell module wherein a plurality of solar cells are connected in series and the surface electrode of at least one solar cell is connected to a tab line. The surface electrode of the solar cell and the tab line are conn...  
WO/2010/119685
Disclosed are: an adhesive composition which can bond a film to an unvulcanized rubber strongly, and is flexible and rarely undergoes cracking under low temperature conditions; a method for bonding a film to an unvulcanized rubber using ...  
WO/2010/116891
Provided is a technique whereby, after forming a massive solid adhesive agent, a heat-conductive sheet having a thickness suitable for use can be prepared. By forming a heat-conductive solid adhesive agent (11) which is in the form of a ...  
WO/2010/116712
Disclosed is a novel organosilicon compound represented by general formula (I), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear resistance of the rubber compos...  
WO/2010/116713
Disclosed is a novel organosilicon compound represented by general formula (I) or a general formula (XIII), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear res...  
WO/2010/113813
Disclosed are: a base-generating agent which has a high sensitivity and a wide application range; and a photosensitive resin composition which has a wide range of application choices owing to the structure of a polymer precursor the reac...  
WO/2010/113759
Disclosed is a film (10) for a resin spacer, which is configured of an adhesive layer (12) that is composed of a resin composition and a cover film (14) that covers the surface of the adhesive layer (12). In the film (10) for a resin spa...  
WO/2010/113883
Disclosed is an adhesive composition for labels, which can be relatively easily applied at low temperatures, while having good die cutting properties that contribute to improvement in the productivity of labels. The adhesive composition ...  
WO/2010/104055
Disclosed is a (meth)acrylate polymer, which has a volume average primary particle diameter of 0.520 to 3.00 μm, a tan δ peak temperature in the range from –100 to 0˚C determined by dynamic viscoelasticity measurement of -40˚C or l...  
WO/2010/104144
Disclosed is a modifier for resins, which contains a hydrogenated rosin ester as the active component. In the methylation product of hydrolyzate of the hydrogenated rosin ester, the component having a molecular weight of 320 accounts for...  
WO/2010/102691
The invention relates to a mounting means for fixing two objects (1, 2) and comprises a single-component aerobic adhesive (3). Moisture can be added to the adhesive (3) by metering before the objects (1, 2) are fixed by the same. The adh...  
WO/2010/098431
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained ...  
WO/2010/098155
Provided are adhesive compositions that are halogen-free and have satisfactory flame resistance without loss of adhesiveness or solder heat resistance, and laminates and flexible printed wiring boards using same. The adhesive resin compo...  
WO/2010/098431
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained ...  
WO/2010/062624  
WO/2010/092831
Disclosed is a hydrogen energy storage system (30) which comprises a power generation unit for generating electrical power using hydrogen and an oxidant gas, and an electrolysis unit (electrical energy/hydrogen conversion device (11)) fo...  
WO/2010/093035
A conductive resin composition with which high conduction reliability can be ensured, a process for producing, using the composition, an electronic part having high connection reliability, a connecting method by which works to be connect...  
WO/2010/092906
The disclosed heat-sensitive adhesive comprises a side chain crystalline polymer and exhibits adhesive strength at temperatures above the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed...  
WO/2010/087079
Disclosed is an adhesive product in which the dot diameter of an adhesive is reduced and the thickness of an adhesive layer is reduced while ensuring a necessary and sufficient adhesive force. Specifically disclosed is an adhesive produ...  
WO/2010/086932
Disclosed is a one-pack type cyanate-epoxy composite resin composition, containing (A) a cyanate resin, (B) an epoxy resin, and (C) a latent curing agent. The latent curing agent (C) contains (a) a modified amine having at least one ami...  
WO/2010/082488
A curable composition that has excellent curability without using an organotin-based curing catalyst, the toxicity of which has been pointed out, and that gives a cured object suffering no surface discoloration even through long-term exp...  
WO/2010/074135
An adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-h...  
WO/2010/067745
Disclosed is an adhesive sheet comprising a substrate and an adhesive layer formed from an adhesive composition containing a polyrotaxane (A) for which a linear molecule penetrates the aperture parts of at least two cyclic molecules, one...  
WO/2010/067744
Disclosed is an adhesive composition that includes: a (meth)acrylic acid ester copolymer (A) obtained by copolymerizing (meth)acrylic acid ester and a monomer containing a reactive group such that the ratio of the monomer (the constituen...  
WO/2010/064358
A double-faced pressure-sensitive adhesive tape for solar cell modules which has excellent applicability and attains excellent working efficiency. The double-faced pressure-sensitive adhesive tape for solar cell modules is a double-faced...  
WO/2010/062624
An adhesive composition is disclosed that includes an inorganic material and an adhesion promoting material where the weight ratio of the adhesion promoting material to the inorganic material is sufficient to permit adhesion of the adhes...  
WO/2010/057946
The present invention relates to compositions comprising a) 0.001–10 wt % of a hydrophobin (H), b) an adhesive (K), c) optionally a solvent and/or dispersant (L) and d) optionally other additives (Z), and to a corresponding method for ...  
WO/2010/046996
Disclosed is an adhesive composition for semiconductors, which contains a thermosetting resin (A) and a compound (B) having a sulfide bond represented by the formula (1) below and an alkoxysilyl group. -(S)n- (1) (In the formula (1), n r...  
WO/2010/047374
Adhesive film formed from an adhesive which can be obtained by mixing a curable resin composition and two or more types of insulating organic particles differing in mean particle size, wherein the average particle size of the insulating ...  
WO/2010/041667
Provided are adhesive laminates with which there is no adhesive residue even when polyester backing layers are used. The adhesive laminates comprise a polyester backing layer and an adhesive layer. One surface of the polyester backing la...  
WO/2010/038753
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...  

Matches 401 - 450 out of 10,337