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Patent Searching and Data


Matches 401 - 450 out of 19,741

Document Document Title
WO/2015/146936A1
Provided are: a protection membrane forming film (1), which is a filler-containing protection membrane forming film (1), wherein the average particle size of the filler is 0.4 μm or smaller; a protection membrane forming utilization she...  
WO/2015/146856A1
Provided is an adhesive tape (10) for semiconductor wafer processing stuck to the front surface of a semiconductor wafer having convexities and concavities equal to or higher than 80 µm, and used in a step of grinding the rear surface o...  
WO/2015/146434A1
 Electroconductive particles provided with a core particle (10), a second metal layer (12) that covers the core particle (10), microparticles (13) disposed on the second metal layer (12), and a first metal layer (11) that covers both t...  
WO/2015/146254A1
The present invention makes it possible to provide a laminate for a resin film formation sheet with which it is easy to dispense the resin film formation sheet from the release sheet and application on a workpiece can be performed stably...  
WO/2015/146410A1
This temperature-sensitive adhesive contains a first side-chain crystalline polymer, has an adhesive strength that decreases at temperatures less than the melting point of the first side-chain crystalline polymer, and further contains a ...  
WO/2015/146297A1
Provided are a conductive adhesive tape having excellent application workability and conductivity and a method for producing the conductive adhesive tape. This conductive adhesive tape includes: a metal layer (2); a conductive fabric (4)...  
WO/2015/146349A1
Provided is a method for producing a heat conductive sheet having excellent tack properties. This method for producing a heat conductive sheet comprises: a first step for forming a coating layer (20) by applying a heat conductive resin c...  
WO/2015/146305A1
An organic electronic device includes, in this order: a curable adhesive having a polymerizable compound, an organometallic compound, and a silane coupling agent; a board; an organic electronic element; and a sealing member. The organic ...  
WO/2015/146596A1
A base film (2) for dicing sheets which comprises a cutting debris inhibition layer (A) and an expandable layer (B) superposed on one main surface of the cutting debris inhibition layer (A), the expandable layer (B) having a multilayer s...  
WO/2015/141342A1
Provided is an anisotropic conductive adhesive agent with which it is possible to obtain high heat-dissipation properties. The present invention contains: conductive particles (31) in which a conductive metal layer is formed on the surfa...  
WO/2015/141289A1
This anisotropic conductive film includes conductive particles and a spacer. The spacer is arranged in a central part of the film in the width direction. The central part of the film in the width direction is 20-80% of the total width of...  
WO/2015/141156A1
The present invention is a temporary bonding material for wafer processing, which is used for the purpose of temporarily bonding a wafer having a front surface serving as a circuit surface and a back surface to be processed to a supporti...  
WO/2015/141343A1
Provided is an anisotropic conductive adhesive which enables the achievement of excellent optical characteristics and excellent heat dissipation characteristics. This anisotropic conductive adhesive contains: conductive particles (31), e...  
WO/2015/141979A1
According to one aspect of the present invention, a radiation-curable resin composition is provided which comprises: (A) a macromolecular resin; (B) a refractive index adjusting unsaturated compound; (C) a hydrogen donor containing photo...  
WO/2015/137033A1
An anisotropic conductive film for connecting a terminal of a first electronic component and a terminal of a second electronic component to one another in an anisotropic conductive manner, having an adhesive-layer-forming component and a...  
WO/2015/137008A1
An electronic component is connected at a low temperature and connection failure of the electronic component is improved by using a photocurable adhesive. An anisotropic conductive adhesive which comprises a binder resin layer supported ...  
WO/2015/137403A1
 Provided is a pressure-sensitive adhesive which is effectively odorless, has outstanding hue, has excellent adhesive properties and tack at low-temperatures of around 5°C, and minimal deterioration over time due to heat and/or light....  
WO/2015/133485A1
 Provided are a polarizing plate composition containing a compound represented by the following general formula (I); a polarizing plate protective film; a polarizer; a polarizing plate; a liquid crystal display device; and a compound. ...  
WO/2015/133564A1
 Provided is a curable composition that includes an organic polymer having a reactive silicon group that can be used as a sealing material or an adhesive having excellent tensile properties, curing delay after being stored, and depth o...  
WO/2015/133420A1
Provided is a sheet for semiconductor-related-member processing which can more stably have enhanced releasability and by which members equipped with chips produced from a semiconductor-related member using the sheet for semiconductor-rel...  
WO/2015/132888A1
Provided are: an adhesive agent to be used between two transparent conductive films or between a transparent conductive film and a covering material in a capacitive touch panel, the adhesive agent having a refractive index of 1.45 to 1.5...  
WO/2015/133486A1
 Provided are a polarizing plate composition containing a compound represented by the following general formula (I); a polarizing plate protective film; a polarizer; a polarizing plate; and a liquid crystal display device. In general f...  
WO/2015/133497A1
This double-sided black adhesive tape having a hollow particle-containing adhesive agent layer is characterised in that the surfaces of the hollow particles are subjected to black pigment adhesion processing.  
WO/2015/127562A1
A polymer modified asphalt composition has asphalt, an oil, tackifying resin, a polymer additive and an ionomer. The composition is suitable for use in construction materials for waterproofing, sealing and/or otherwise covering construct...  
WO/2015/129903A1
A granular adhesive containing a core and a shell, wherein the core contains an adhesive composition and the shell is formed from a solid particle; and a method for producing the same. The solid particle preferably contains microparticle...  
WO/2015/125432A1
Provided are: a sealing tape that is capable of preventing misalignment of tape width, inclusion of bubbles, and creases even when the tape is applied in a folded state; a phosphor sheet using the same; lighting equipment; a liquid cryst...  
WO/2015/125546A1
One aspect of the present invention is a hot melt adhesive characterized by containing a thermoplastic polymer and a tackifier and characterized in that the tackifier contains an acid-modified tackifier that is modified by at least one o...  
WO/2015/122220A1
A pressure-sensitive adhesive microcapsule having a radiation-curable adhesive encased by a membrane and having an average particle diameter of less than 500 µm. A pressure-sensitive adhesive microcapsule-containing fluid including the ...  
WO/2015/119095A1
This anisotropic conductive film that has a multilayer structure having conductive particles arranged in a single layer has a first connecting layer and a second connecting layer that is formed on one side thereof. The first connecting l...  
WO/2015/119136A1
 This anisotropic conductive film includes a first connection layer, and a second connection layer formed on one surface thereof. The first connection layer is a photopolymerized resin layer, and the second connection layer is a heat- ...  
WO/2015/119236A1
The present invention addresses the problem of providing a wafer processing method wherein a wafer is processed while the wafer is fixed to a support plate by means of an adhesive composition and wherein sufficient adhesive force is main...  
WO/2015/119090A1
An anisotropic conductive film that has a first connective layer and a second connective layer that is formed on one surface of the first connective layer. The first connective layer is a photopolymer resin layer, and the second connecti...  
WO/2015/119098A1
This anisotropic conductive film has a first connecting layer and a second connecting layer that is formed on one side thereof. The first connecting layer is a photopolymerizable resin layer, and the second connecting layer is a thermo- ...  
WO/2015/119221A1
The purpose of the present invention is to provide an electrically conductive adhesive tape provided with both excellent adhesiveness and electroconductivity. The present invention provides an electrically conductive adhesive tape having...  
WO/2015/119131A1
 A first anisotropic conductive film (1A) has a first insulating resin layer (2) and a second insulating resin layer (3). The first insulating resin layer (2) is formed from a photopolymerizable resin, and the second insulating resin l...  
WO/2015/119160A1
Provided are: a dermatological adhesive agent that causes dampness through perspiration or the like, which may lead to irritation or itch, to a reduced extent even when a radiation-curable resin is used as a resin component constituting ...  
WO/2015/118975A1
Provided is a polarizing plate containing a polarizer and a first protecting film that is laminated to one surface of the polarizer with a first adhesive layer therebetween, the transmittance rate of the cumulative luminous energy at a w...  
WO/2015/115161A1
The purpose of the invention is to ensure that there is conductivity between an electronic component and a circuit substrate when the wiring pitch of the circuit substrate or the electrode terminals of the electronic component are given ...  
WO/2015/115781A1
The present invention relates to a conductive adhesive comprising a conductive polymer and, more particularly, to a conducive adhesive comprising metal powder, a conductive polymer, and a polymer binder and an adhesive film. A conducive ...  
WO/2015/115501A1
A laminate which is provided with an optical film (A) that contains an alicyclic structure-containing polymer and an adhesive layer (B), and which has a critical stress change ratio as calculated by formula (1) of 40% or less.  
WO/2015/111632A1
Provided is a sheet (2) for forming a protective membrane, said sheet comprising: a protective-membrane-forming film (1) characterized in that the light transmittance thereof at a wavelength of 1600nm of 72% or more, and the light transm...  
WO/2015/111577A1
 The present invention pertains to a curable composition containing an organic polymer (A) containing reactive silicon groups and a conjugate (B) of kaolinite and quartz. This curable composition has high environmental compatibility an...  
WO/2015/111436A1
The purpose of the present invention is to provide an adhesive sheet capable of being affixed such that no air bubbles are easily formed in a bonding interface with an adherend. In the adhesive sheet (AS) which has one surface, another s...  
WO/2015/111599A1
Provided are a connection body production method and an electronic component connection method such that electronic components are connected at a low temperature using a photo-curing adhesive and poor electronic component connections are...  
WO/2015/111738A1
Provided are: a film-shaped adhesive whereby a semiconductor element can easily be sealed by affixing the film-shaped adhesive to the semiconductor element, and whereby the semiconductor element can be sealed by a cured product having ex...  
WO/2015/108160A1
Provided is an adhesive agent sheet which can be produced readily at low cost, and which contains an adhesive agent layer that can effectively prevent the occurrence of internal reflection when used for the bonding of optical member lami...  
WO/2015/108063A1
 Provided is an activation energy beam-curable adhesive having improved water resistance. The adhesive includes an activation energy beam-curable component, and a polyrotaxane, the polyrotaxane having an activation energy beam-polymeri...  
WO/2015/104987A1
Disclosed is a film-like conductive adhesive to be used in a semiconductor device manufacturing method that includes: a step for die-bonding, via the film-like conductive adhesive, a semiconductor chip on a body on which the semiconducto...  
WO/2015/104988A1
Provided are: a conductive film-like adhesive which is capable of suppressing migration and enables the production of a highly reliable semiconductor device; and a dicing tape with a film-like adhesive. The present invention is a conduct...  
WO/2015/104986A1
Provided are: a film-like adhesive having excellent conductivity; and a dicing tape with a film-like adhesive. The present invention relates to a film-like adhesive which contains conductive particles having a specific shape. Examples of...  

Matches 401 - 450 out of 19,741