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Patent Searching and Data


Matches 401 - 450 out of 16,991

Document Document Title
WO/2013/191046A1
A thermally conductive adhesive composition containing an adhesive component and thermally conductive particles. The adhesive component contains high polymers and low polymers. The low polymer content is 1%-38% by mass relative to the to...  
WO/2013/191045A1
A thermally conductive adhesive composition comprising: an adhesive component containing high polymers and low polymers; and thermally conductive particles. The gel fraction measured in the adhesive component is 28%-59% by mass and the t...  
WO/2013/187190A1
Provided are: a temporary adhesive for semiconductor-device production that is capable of definitively and simply supporting a member to be treated, when performing a mechanical or chemical treatment on a member (semiconductor wafer or t...  
WO/2013/187244A1
Provided are: a temporary adhesive for semiconductor device production, which is capable of temporarily supporting a member to be processed (such as a semiconductor wafer) easily and reliably when the member to be processed is mechanical...  
WO/2013/186349A1
The invention relates to compounds containing silane groups, in particular in the form of polymers that contain silane groups, have low viscosity, and are suitable for elastic adhesives and sealants. The compounds can be obtained by reac...  
WO/2013/183375A1
The purpose of the present invention is to provide an adhesive layer which exhibits excellent adhesion to a non-polar object to be adhered such as a polyethylene or a polypropylene and is not be deteriorated in characteristics even at lo...  
WO/2013/180133A1
Provided is an adhesive showing excellent adhesiveness even when the adherend is glass or a thermoplastic resin. This adhesive is for resin layer adherends containing glass and/or a thermoplastic resin (A), and contains a thermoplastic r...  
WO/2013/180196A1
A peelable adhesive comprising a main chain of liquid crystal polymer having a plurality of liquid crystal mesogenic groups on a side chain, and a cross-linking group for cross-linking main chains, wherein the mesogenic groups receive en...  
WO/2013/180134A1
Provided is an adhesive having excellent solvent resistance and showing excellent adhesiveness even when the adherend is glass or a thermoplastic resin. This adhesive is for resin layer adherends containing glass and/or a thermoplastic r...  
WO/2013/174940A3
The invention relates to a composition, comprising a) at least one silane-functional polymer P having alkoxy end groups, which are not methoxy groups; b) at least one catalyst for the cross-linking of silane-functional polymers, selected...  
WO/2013/174892A1
The invention relates to low-viscosity polymers containing silane groups, said polymers curing rapidly under the effect of moisture to form an elastic material with good heat resistance and being in particular suitable for elastic adhesi...  
WO/2013/174940A2
The invention relates to a composition, comprising a) at least one silane-functional polymer P having alkoxy end groups, which are not methoxy groups; b) at least one catalyst for the cross-linking of silane-functional polymers, selected...  
WO/2013/176031A1
An adhesive tape which has an adhesive layer on at least one surface of a foam base. The foam base has a thickness of 300 μm or less and an interlaminar strength of 6-50 N/cm. The adhesive layer has a thickness of 50 μm or less, while ...  
WO/2013/176990A1
Biomimetic adhesive compositions can be used in various aspects of subterranean treatment operations. Methods for treating a subterranean formation can comprise: providing an adhesive composition that comprises a first polymer comprising...  
WO/2013/172328A1
[Problem] To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconduct...  
WO/2013/168712A1
The purpose of the present invention is to provide an adhesive agent which has stronger adhesion force and can be adhered and detached reversibly by the irradiation with light. A light-responsive adhesive agent which can be adhered stron...  
WO/2013/164413A1
The invention relates to a moisture-curing two-component composition consisting of a component A which contains at least one polyoxyl alkylene, polyolefin, and/or polyacrylate prepolymer with at least one hydrolyzable silane group and wh...  
WO/2013/161713A1
A circuit connection material for electrically connecting two circuit members facing each other, which contains a thermoplastic resin, radically polymerizable compounds, a radical polymerization initiator and inorganic fine particles. Th...  
WO/2013/162059A1
The present invention provides a hot melt adhesive being highly environmentally-friendly, and as well having sufficient pressure-sensitive adhesiveness, adhesion, thermal stability and the like. The present invention relates to a hot mel...  
WO/2013/157436A1
Provided is an adhesive tape for preventing aquatic biofouling, which can prevent discoloration or degradation of an adherent, to which said adhesive tape for preventing aquatic biofouling is adhered, caused by exposure to ultraviolet ra...  
WO/2013/157378A1
Provided are a circuit connection material, which has a superior low temperature curability, and a manufacturing method for an assembly using same. The circuit connection material has a two-layer structure in which a first adhesive layer...  
WO/2013/157552A1
The present invention provides technology for anisotropic conductive adhesive that uses conductive particles with a silver based metal for a conductive layer, has high light reflectivity, and has superior migration resistance properties....  
WO/2013/153953A1
A device for applying an adhesive film, the device being provided with: a conveyance mechanism for conveying an adhesive film tape with a base film and an adhesive layer supported on the base film; a support section for supporting an app...  
WO/2013/150770A1
An adhesive composition includes: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0˚C; 0.05-3 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of 1000 or more bu...  
WO/2013/150962A1
Provided is an adhesive sheet which reduces deficient adhesion to semiconductor wafers by effectively suppressing voids from occurring between an adhesive layer and an adhesive film. This adhesive sheet wound into a roll shape comprises ...  
WO/2013/150769A1
An adhesive composition includes: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0˚C; 0.05-3 parts by mass of a (meth)acrylic polymer (B) which has a weight average molecular weight of 1000 or more...  
WO/2013/146604A1
The present invention provides a conductive material capable of reducing the connection resistance in a connecting structure obtained when an electrical connection is established between electrodes to yield the connecting structure. This...  
WO/2013/146617A1
The present invention is an easily removable adhesive film, the adhesive strength of which is reduced by exposure to ionizing radiation, and in which an under-layer and a easily removable adhesive layer are laminated, in this order, on a...  
WO/2013/146801A1
To provide a curable resin composition for forming an adhesive layer, which is capable of reliably bonding a base that is called a slightly adhesive base. A curable resin composition for forming an adhesive layer, which contains a combin...  
WO/2013/147036A1
This metal sheet laminated with metal foil is formed by: placing, opposite each other, a thermosetting-adhesive-coated surface of each of a stainless steel foil having a thickness of 0.1 to 0.2 mm, to which a thermosetting adhesive has b...  
WO/2013/146163A1
Provided is a polarizing plate fabrication method comprising the following steps: a coating step (A) in which the bonding surface of at least either a polarizing film or an optical film is coated with an ultraviolet curing-type adhesive ...  
WO/2013/147737A1
Adhesive copolymers and methods for preparing them are disclosed. An adhesive copolymer may be prepared from a reaction mixture containing monosaccharide monomers and dicarboxylic monomers. The monosaccharide monomers may include any of ...  
WO/2013/146984A1
[Problem] To provide: a stacked piezoelectric element which stably operates for a long period of time, and wherein the amount of displacement of a laminate does not easily fluctuate; an injection device which is provided with the stacked...  
WO/2013/141215A1
A film which is to be applied to a window and which bears a substrate, a pressure-sensitive adhesive layer and a separator in this order, wherein the pressure-sensitive adhesive layer exhibits a storage modulus of 4.5×104 to 2.0×105 Pa...  
WO/2013/138414A1
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or m...  
WO/2013/136108A1
The invention relates to the use of an adhesive composition comprising at least one silyl-containing polymer, at least one compatible tackifying resin and at least one catalyst,to make a breathable self-adhesive article. The invention al...  
WO/2013/136979A1
Provided is a circuit connection material having excellent shelf life. Also provided is a method for producing a mounted product using the same. The material comprises a first adhesive layer containing a silane coupling agent and conduct...  
WO/2013/132933A1
An adhesive raw material contains a monomer and/or polymer and 55 mass% or more thermally conductive particles. The thermally conductive particles contain first thermally conductive particles having a particle size based on the volume of...  
WO/2013/133256A1
The present invention relates to a gas barrier film laminate that includes at least two sheets of gas barrier films, in which the two adjacent sheets of gas barrier films are laminated via an adhesive layer, and the adhesive layer has a ...  
WO/2013/133268A1
[Problem] To impart heat release properties to a resulting semiconductor device without increasing the number of semiconductor device production steps or subjecting the semiconductor wafer or chip to special treatment that will complicat...  
WO/2013/132932A1
A thermally conductive adhesive sheet is provided with an adhesive layer. The adhesive layer contains thermally conductive particles, the push-out adhesion strength for a stainless steel plate is 5 N/cm2 or higher, the elongation measure...  
WO/2013/133275A1
This adhesive sheet is formed of a resin composition that contains (A) a high molecular weight component, (B1) a thermosetting component that has a softening point of less than 50°C, (B2) a thermosetting component that has a softening p...  
WO/2013/129462A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments, and minimizing fouling of that to which the tape is adhered. An adhesive tap...  
WO/2013/129096A1
Provided are an energy ray curable hydrophilic adhesive composition and an adhesive sheet suitable for producing, by three-dimensional molding, microstructures that are suitable for applications requiring hydrophilicity, such as microrea...  
WO/2013/129164A3
[Purpose] To provide a sheet-like vibration damper that has damping properties and chip resistance, and can be adhered by means of self-adhesion or thermal fusion via an adhesive layer comprising an adhesive or a hot melt adhesive, even ...  
WO/2013/129438A1
Provided are a circuit connection material having excellent blocking resistance and excellent connection reliability, and a method for producing a mounted unit using the same. Elastic particles having a compression recovery rate of 50% o...  
WO/2013/129437A1
Through the present invention, conductivity is ensured even to an electrode terminal on which an oxide film is formed on the surface thereof, and insulation properties between adjacent wires are also provided. A method for manufacturing ...  
WO/2013/129078A1
Provided is an adhesive tape film comprising a non-adhesive layer provided on a substrate film. This adhesive tape film effectively prevents over-adhesion due to heat of a fixing base (when performing dicing by attachment to the base by ...  
WO/2013/129463A1
The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments. An adhesive tape in which a pressure-sensitive-adhesive layer is formed on o...  
WO/2013/125695A1
In the whole anisotropic conductive member (105), a plurality of substantially spherical conductive bodies (106) are dispersively contained, each of said conductive bodies having a diameter larger than a step between a protection film (1...  

Matches 401 - 450 out of 16,991