Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 401 - 450 out of 10,388

Document Document Title
WO/2011/045962
Disclosed are light reflecting conductive particles for an anisotropic conductive adhesive to be used for the purpose of connecting a light emitting element to a wiring board by means of anisotropic conductive connection. Each of the lig...  
WO/2011/046176
Disclosed is a conductive adhesive which contains conductive particles including a metal, a thermosetting resin, a flux activator, and preferably, a rheology control agent. The melting point of the conductive particles is preferably 220...  
WO/2011/040498
Provided is a powdered thermosetting adhesive, the fluidity of which is so improved that a quantitative feeder or a conveyance passage can be prevented from being clogged with the powdered thermosetting adhesive. The powdered thermosetti...  
WO/2011/040442
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ...  
WO/2011/040438
Provided is an adhesive composition which can keep high bond strength even under solder reflow conditions or other high-temperature conditions. Further, the adhesive composition can be easily peeled off without doing damage to an adheren...  
WO/2011/038182
What is disclosed is a water-based adhesive composition that is an aqueous dispersion or emulsion of a polymer component having functional groups that are inactive in a reversible manner in the adhesive composition as prepared; and a wat...  
WO/2011/033743
Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 P...  
WO/2011/030621
Disclosed is a light-reflective anisotropic electroconductive adhesive agent which is intended to be used for the anisotropic electroconductive connection of a light-emitting element to a wiring board. The light-reflective anisotropic el...  
WO/2011/030876
Disclosed is an adhesive composition for slide rail, which exhibits a highly excellent workability in attaching a slide rail to a vehicle body and has a strong adhesive force after heating, the magnetic force of which can be lowered, whi...  
WO/2011/024788
Disclosed are: an intermediate film for laminated glass, which is capable of providing laminated glass that has excellent heat shielding properties, and which enables the laminated glass to maintain the excellent heat shielding propertie...  
WO/2011/024787
Disclosed is an intermediate film for laminated glass, which is capable of providing laminated glass that has high heat shielding properties and high visible light transmittance. Specifically disclosed is an intermediate film (2) for lam...  
WO/2011/016539
Provided are: a release agent which has release properties inherent in polyolefin and exhibits excellent tight adhesion to a substrate; a release material using the same; and a pressure -sensitive adhesive tape with the release material....  
WO/2011/010044
The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the sil...  
WO/2011/007646
Provided is a bonding structure excellent in conductivity and bonding property between a piezoelectric body and a metal plate. In the bonding structure in which a metal plate (1) and an electrode (3) of a piezoelectric body (2) are bonde...  
WO/2011/004710
Disclosed is a heat-curable adhesive tape or sheet provided with a heat-curable adhesive layer, which has a good storage stability at room temperature and can exert an excellent adhesiveness and a high heat resistance after a high temper...  
WO/2011/004658
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer...  
WO/2011/004657
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer...  
WO/2011/001942
Provided is an alkali-developable photosensitive adhesive which excels sufficiently in applicability, pattern formation properties, thermocompression bondability, and high -temperature adhesiveness and which is thermocompression -bondabl...  
WO/2011/001713
Disclosed is a protection tape for plating, which is capable of preventing occurrence of plating failure and can be easily removed after being used. Specifically disclosed is a protection tape for plating, which is used for the purpose o...  
WO/2011/001760
Provided are a thermally conductive pressure-sensitive adhesive sheet which is flexible and has high thermal conductivity and flame retardancy, a thermally conductive pressure-sensitive adhesive composition which is a material for the th...  
WO/2011/000843
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...  
WO/2011/000843
Aim of the invention is to implement low viscosity prior to curing along with good elasticity after curing and a broad adhesion spectrum in a solvent-free and water-free curable composition. This aim is achieved by using at least one pol...  
WO/2010/150673
Provided are a novel, liquid, two-part, fast-curing, water-based adhesive of separate-application type which exhibits initial adhesion and adhesion properties for a wide variety of adherends, and a method for adhesive bonding. The novel,...  
WO/2010/147103
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...  
WO/2010/147102
Disclosed are: a temporarily fixing agent for a semiconductor wafer, which can reduce the damage to the semiconductor wafer, enables the easy removal of the semiconductor wafer, and enables the reduction in time required for the thermal ...  
WO/2010/144774
The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled witho...  
WO/2010/144774
The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled witho...  
WO/2010/137445
An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, (E) organic microparticles, and (F) a powdery compound that has a solid form at room temperature ...  
WO/2010/137523
Disclosed is an adhesive material which has redetachability and also achieves the reliability of an adhesive surface with respect to detachment, the occurrence of foaming, etc. Specifically disclosed is an adhesive material to be used fo...  
WO/2010/137443
Disclosed is an adhesive sheet for connecting a circuit member, which comprises a supporting base and an adhesive layer that is provided on the supporting base and composed of an adhesive composition. The adhesive composition contains (A...  
WO/2010/137442
An adhesive composition comprising (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, and (E) organic microparticles.  
WO/2010/134341
A novel organosilicon compound represented by general formula (I) or (VI), which can reduce the hysteresis loss of a rubber composition to a great extent and can also improve abrasion resistance to a great extent; a rubber composition wh...  
WO/2010/134266
Disclosed are: an organosilicon compound having, in the molecule, a cyclic structure containing a nitrogen atom and a silicon atom and at least one sulfur atom, and also having a site in which at least one group having low steric hindran...  
WO/2010/131575
Disclosed is an adhesive composition which enables the formation of a film-like adhesive that has highly satisfactory adhesion to semiconductor wafers, wafer back grinding properties, and burying properties during flip chip bonding. Spec...  
WO/2010/131655
Disclosed is a bonding sheet which comprises an adhesive layer that is obtained by shaping an adhesive composition, which contains (A) a high molecular weight component and (B) a thermosetting component, into a sheet-like form. The bondi...  
WO/2010/125880
Disclosed is an adhesive resin composition which contains: an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer which is obtained by copolymerizing an epoxy-providing monomer and an ethylenically unsaturated monomer that ...  
WO/2010/126937
A moisture-curable resin composition comprising (a) a moisture-curable polymer having at least one hydrolysable silyl group; (b) a reactive modifier; (c) a catalyst for catalyzing the reaction between the moisture-curable polymer (a) and...  
WO/2010/122863
Provided is a solar cell module wherein a plurality of solar cells are connected in series and the surface electrode of at least one solar cell is connected to a tab line. The surface electrode of the solar cell and the tab line are conn...  
WO/2010/119685
Disclosed are: an adhesive composition which can bond a film to an unvulcanized rubber strongly, and is flexible and rarely undergoes cracking under low temperature conditions; a method for bonding a film to an unvulcanized rubber using ...  
WO/2010/116891
Provided is a technique whereby, after forming a massive solid adhesive agent, a heat-conductive sheet having a thickness suitable for use can be prepared. By forming a heat-conductive solid adhesive agent (11) which is in the form of a ...  
WO/2010/116712
Disclosed is a novel organosilicon compound represented by general formula (I), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear resistance of the rubber compos...  
WO/2010/116713
Disclosed is a novel organosilicon compound represented by general formula (I) or a general formula (XIII), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear res...  
WO/2010/113813
Disclosed are: a base-generating agent which has a high sensitivity and a wide application range; and a photosensitive resin composition which has a wide range of application choices owing to the structure of a polymer precursor the reac...  
WO/2010/113759
Disclosed is a film (10) for a resin spacer, which is configured of an adhesive layer (12) that is composed of a resin composition and a cover film (14) that covers the surface of the adhesive layer (12). In the film (10) for a resin spa...  
WO/2010/113883
Disclosed is an adhesive composition for labels, which can be relatively easily applied at low temperatures, while having good die cutting properties that contribute to improvement in the productivity of labels. The adhesive composition ...  
WO/2010/104055
Disclosed is a (meth)acrylate polymer, which has a volume average primary particle diameter of 0.520 to 3.00 μm, a tan δ peak temperature in the range from –100 to 0˚C determined by dynamic viscoelasticity measurement of -40˚C or l...  
WO/2010/104144
Disclosed is a modifier for resins, which contains a hydrogenated rosin ester as the active component. In the methylation product of hydrolyzate of the hydrogenated rosin ester, the component having a molecular weight of 320 accounts for...  
WO/2010/102691
The invention relates to a mounting means for fixing two objects (1, 2) and comprises a single-component aerobic adhesive (3). Moisture can be added to the adhesive (3) by metering before the objects (1, 2) are fixed by the same. The adh...  
WO/2010/098431
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained ...  
WO/2010/098155
Provided are adhesive compositions that are halogen-free and have satisfactory flame resistance without loss of adhesiveness or solder heat resistance, and laminates and flexible printed wiring boards using same. The adhesive resin compo...  

Matches 401 - 450 out of 10,388