Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 401 - 450 out of 10,223

Document Document Title
WO/2010/116891
Provided is a technique whereby, after forming a massive solid adhesive agent, a heat-conductive sheet having a thickness suitable for use can be prepared. By forming a heat-conductive solid adhesive agent (11) which is in the form of a ...  
WO/2010/116712
Disclosed is a novel organosilicon compound represented by general formula (I), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear resistance of the rubber compos...  
WO/2010/116713
Disclosed is a novel organosilicon compound represented by general formula (I) or a general formula (XIII), which is capable of significantly decreasing the hysteresis loss of a rubber composition and significantly improving the wear res...  
WO/2010/113813
Disclosed are: a base-generating agent which has a high sensitivity and a wide application range; and a photosensitive resin composition which has a wide range of application choices owing to the structure of a polymer precursor the reac...  
WO/2010/113759
Disclosed is a film (10) for a resin spacer, which is configured of an adhesive layer (12) that is composed of a resin composition and a cover film (14) that covers the surface of the adhesive layer (12). In the film (10) for a resin spa...  
WO/2010/113883
Disclosed is an adhesive composition for labels, which can be relatively easily applied at low temperatures, while having good die cutting properties that contribute to improvement in the productivity of labels. The adhesive composition ...  
WO/2010/104055
Disclosed is a (meth)acrylate polymer, which has a volume average primary particle diameter of 0.520 to 3.00 μm, a tan δ peak temperature in the range from –100 to 0˚C determined by dynamic viscoelasticity measurement of -40˚C or l...  
WO/2010/104144
Disclosed is a modifier for resins, which contains a hydrogenated rosin ester as the active component. In the methylation product of hydrolyzate of the hydrogenated rosin ester, the component having a molecular weight of 320 accounts for...  
WO/2010/102691
The invention relates to a mounting means for fixing two objects (1, 2) and comprises a single-component aerobic adhesive (3). Moisture can be added to the adhesive (3) by metering before the objects (1, 2) are fixed by the same. The adh...  
WO/2010/098431
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained ...  
WO/2010/098155
Provided are adhesive compositions that are halogen-free and have satisfactory flame resistance without loss of adhesiveness or solder heat resistance, and laminates and flexible printed wiring boards using same. The adhesive resin compo...  
WO/2010/098431
A microencapsulated hardener for epoxy resins which comprises cores comprising an epoxy-resin hardener and shells covering the cores, characterized in that the epoxy-resin hardener comprises as a major component an amine adduct obtained ...  
WO/2010/062624  
WO/2010/092831
Disclosed is a hydrogen energy storage system (30) which comprises a power generation unit for generating electrical power using hydrogen and an oxidant gas, and an electrolysis unit (electrical energy/hydrogen conversion device (11)) fo...  
WO/2010/093035
A conductive resin composition with which high conduction reliability can be ensured, a process for producing, using the composition, an electronic part having high connection reliability, a connecting method by which works to be connect...  
WO/2010/092906
The disclosed heat-sensitive adhesive comprises a side chain crystalline polymer and exhibits adhesive strength at temperatures above the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed...  
WO/2010/087079
Disclosed is an adhesive product in which the dot diameter of an adhesive is reduced and the thickness of an adhesive layer is reduced while ensuring a necessary and sufficient adhesive force. Specifically disclosed is an adhesive produ...  
WO/2010/086932
Disclosed is a one-pack type cyanate-epoxy composite resin composition, containing (A) a cyanate resin, (B) an epoxy resin, and (C) a latent curing agent. The latent curing agent (C) contains (a) a modified amine having at least one ami...  
WO/2010/082488
A curable composition that has excellent curability without using an organotin-based curing catalyst, the toxicity of which has been pointed out, and that gives a cured object suffering no surface discoloration even through long-term exp...  
WO/2010/074135
An adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-h...  
WO/2010/067745
Disclosed is an adhesive sheet comprising a substrate and an adhesive layer formed from an adhesive composition containing a polyrotaxane (A) for which a linear molecule penetrates the aperture parts of at least two cyclic molecules, one...  
WO/2010/067744
Disclosed is an adhesive composition that includes: a (meth)acrylic acid ester copolymer (A) obtained by copolymerizing (meth)acrylic acid ester and a monomer containing a reactive group such that the ratio of the monomer (the constituen...  
WO/2010/064358
A double-faced pressure-sensitive adhesive tape for solar cell modules which has excellent applicability and attains excellent working efficiency. The double-faced pressure-sensitive adhesive tape for solar cell modules is a double-faced...  
WO/2010/062624
An adhesive composition is disclosed that includes an inorganic material and an adhesion promoting material where the weight ratio of the adhesion promoting material to the inorganic material is sufficient to permit adhesion of the adhes...  
WO/2010/057946
The present invention relates to compositions comprising a) 0.001–10 wt % of a hydrophobin (H), b) an adhesive (K), c) optionally a solvent and/or dispersant (L) and d) optionally other additives (Z), and to a corresponding method for ...  
WO/2010/046996
Disclosed is an adhesive composition for semiconductors, which contains a thermosetting resin (A) and a compound (B) having a sulfide bond represented by the formula (1) below and an alkoxysilyl group. -(S)n- (1) (In the formula (1), n r...  
WO/2010/047374
Adhesive film formed from an adhesive which can be obtained by mixing a curable resin composition and two or more types of insulating organic particles differing in mean particle size, wherein the average particle size of the insulating ...  
WO/2010/041667
Provided are adhesive laminates with which there is no adhesive residue even when polyester backing layers are used. The adhesive laminates comprise a polyester backing layer and an adhesive layer. One surface of the polyester backing la...  
WO/2010/038753
Disclosed is an anisotropic electroconductive adhesive that, even when a heating tool is contacted and pressed at a slow speed, can realize high electrical connection reliability. The anisotropic electroconductive adhesive comprises an...  
WO/2010/038484
Provided is a heat-resistant and highly heat-conductive adhesive agent which has excellent mechanical strength, heat-resistance and heat-conductivity. A heat-resistant and highly heat-conductive adhesive agent comprising (a) a first com...  
WO/2010/037139
A method is disclosed for making a soft adhesive tape. The method comprises providing a soft adhesive, rolling a gravure cylinder on the soft adhesive to meter the soft adhesive, depositing the metered soft adhesive from the gravure cyli...  
WO/2010/035906
Disclosed is a method for manufacturing a composite polarizing plate, comprising the step of laminating a transparent protective film onto one side surface of a polarizing film, laminating a releasable adhesive film on the opposite side ...  
WO/2010/037139
A method is disclosed for making a soft adhesive tape. The method comprises providing a soft adhesive, rolling a gravure cylinder on the soft adhesive to meter the soft adhesive, depositing the metered soft adhesive from the gravure cyli...  
WO/2010/035820
Disclosed is a curable composition which exhibits excellent curability without using a toxic organotin curing catalyst and provides a cured product which does not suffer from discoloration or cracks in the surface even after being expose...  
WO/2010/035614
Disclosed is a thermally conductive pressure-sensitive adhesive sheet which can be produced easily and can be peeled off easily. Also disclosed is a thermally conductive pressure-sensitive adhesive composition which serves as a raw mate...  
WO/2010/035821
A curable composition which contains an organic polymer having a reactive silicon group as a main component. The curable composition is environmentally friendly since the composition does not contain a toxic organotin catalyst, and main...  
WO/2010/032583
A surface-protective film comprising a substrate and a pressure-sensitive adhesive layer formed on one side thereof, wherein the pressure-sensitive adhesive layer is such that the difference between storage modulus at 150°C and that at ...  
WO/2010/033382
Articles prepared with a pressure sensitive adhesive prepared by combining an acrylic polymer and a silane-functional polymer, such as glass and plastic laminates, show improved impact resistance.  
WO/2010/032529
Disclosed is a semiconductor device having excellent heat resistance, wherein a semiconductor element and an object to be bonded are bonded together through a patterned film-like photosensitive adhesive by means of thermal compression bo...  
WO/2010/027017
Disclosed is an electroconductive connecting material that electrically connects terminals for respective electronic members to each other. The electroconductive connecting material has a laminate structure comprising a curable resin co...  
WO/2010/024087
A photosensitive adhesive composition having a minimum melt viscosity of not more than 30000 Pa·s as measured at 20 to 200°C after pattern formation.  
WO/2010/022585
A back sheet of solar cell with high adhesion property comprises a substrate (3) and a fluorine-based film (2). A layer of fluoro-siloxane film (1) or silicon-titanium compound film (4) exists between the substrate (3) and the fluorine-b...  
WO/2010/024295
A photosensitive adhesive composition that can form adhesive patterns by forming an adhesive layer on an adherend and performing a radiation exposure and development by a developing solution. The photosensitive adhesive composition has s...  
WO/2010/021201
A sheet (1) for manufacturing an optical disc is provided with an adhesive layer (11) having loss tangent peak temperature of -10°C or below and a surface energy polar component (γPs) of 2.0 mJ/m2 or more, and a protecting sheet (12), ...  
WO/2010/018712
Disclosed is a conductive adhesive mainly composed of a conductive filler, a binder resin and a solvent. The conductive filler is mainly composed of a metal powder having an average particle diameter of 2-30 μm, while containing ultraf...  
WO/2010/016305
Disclosed is an adhesive composition containing (A) a thermoplastic resin having a Tg of not more than 100˚C and (B) a thermosetting component. The thermosetting component (B) contains (B1) a compound having an allyl group and (B2) a c...  
WO/2010/016503
A seamless can or the like which is important as a container for beverages or foods is increased in commercial value by imparting a shining decoration having an excellent specular gloss to the outer surface of the barrel of the can body....  
WO/2010/013653
Disclosed is an adhesive material that has low viscosity, has good coatability, can be rendered solventless, has low adhesive strength while causing little increase in adhesive strength with the elapse of time, has good adhesion to an ad...  
WO/2010/013664
Provided is a light-diffusing adhesive sheet comprising: a transparent plastic film; a light-diffusing adhesive layer which includes an aqueous emulsion containing polymer particles (A-1) comprising acrylic copolymer (A), fine organic pa...  
WO/2010/010900
Provided is a method of provisional fixing which is remarkably effective in the dimensional accuracy of processed members. The method of provisional fixing comprises: a coating step in which a fixing member is coated with an adhesive for...  

Matches 401 - 450 out of 10,223