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Patent Searching and Data


Matches 401 - 450 out of 15,387

Document Document Title
WO/2011/132578A1
Disclosed is an anisotropic conductive film which contains conductive particles, film-forming resin, a radical-polymerizable compound, a curing agent which generates free radicals, and an amine salt obtained from phosphoric acid (meth)ac...  
WO/2011/132749A1
Provided is an adhesive laminate with high-speed peeling properties that change little over time. The adhesive laminate has a backing layer and an adhesive layer, and the adhesive laminate is characterized by the adhesive layer being a l...  
WO/2011/129373A1
Disclosed is a light emitting device and a light-reflective anisotropic conductive adhesive agent capable of maintaining the light emitting efficiency of a light emitting element, preventing the generation of cracks, and achieving high c...  
WO/2011/129372A1
Disclosed is a curable resin composition which exhibits high adhesion, high conduction reliability, excellent crack resistance and increased resistance to thermal shock or similar in high-temperature high-humidity environments. The curab...  
WO/2011/125778A1
Disclosed is an adhesive composition which contains (A) a thermoplastic resin that has a weight average molecular weight of 10,000-150,000 and a viscosity at 25˚C of 5-300 poises as dissolved in N-methyl-2-pyrrolidone such that the resi...  
WO/2011/125683A1
Even when using a device that bonds a dicing sheet directly to the underside of a wafer, the disclosed adhesive sheet for semiconductor wafer processing can be easily peeled off after a dicing step is finished and can drastically reduce ...  
WO/2011/125088A1
Disclosed is a bonding material for bonding together the layers of a fuel cell, said bonding material containing an adhesive resin, conductive particles, and a conductive resin.  
WO/2011/125711A1
Disclosed is a sheet for forming a resin film for a chip, with which a semiconductor device provided with a gettering function is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a peelin...  
WO/2011/118488A1
Provided is an adhesive composition which has high adhesiveness but also good detachability, and which has excellent heat resistance. The adhesive composition contains an adhesive component, and a carboxylic compound represented by formu...  
WO/2011/118719A1
Disclosed is an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first cir...  
WO/2011/118506A1
Disclosed are an adhesive composition having high bond strength as well as being easily detachable and having superior heat resistance, adhesive tape using that adhesive composition as well as a semiconductor wafer treatment method using...  
WO/2011/118367A1
Disclosed is a laminated body that comprises an anti-reflection film on the surface of which a protective film is bonded, said protective film exhibiting excellent temporary adhesion and not easily leaving an adhesive residue after being...  
WO/2011/114993A1
Disclosed is a cross-linked polymer particle that can be obtained by a production method provided with a step (a) in which a mother particle formed from a cross-linked polymer having functional groups is brought into contact with an amin...  
WO/2011/114871A1
Disclosed is a polarizing plate in which a protective film is bonded to one surface of a polarizing film with an aqueous adhesive for the purpose of suppressing unevenness over the entire surface of the polarizing plate, said polarizing ...  
WO/2011/110384A1
The present invention relates to curable compositions comprising a) at least one organic polymer selected from polyurethanes, polyesters and polyethers, having at least one end group of the general formula (I) -An-R-SiXYZ (I), in which A...  
WO/2011/111784A1
Disclosed is an adhesive reel which is provided with: a winding core; a pair of side plates provided on both the sides of the winding core so as to face each other; and an adhesive tape, which has a tape-like base material, and an adhesi...  
WO/2011/110305A1
The invention relates to combined radiation- and moisture-curing compounds, which are characterised in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the...  
WO/2011/108442A1
A pressure-sensitive adhesive sheet (1) which is provided with a substrate (11) and a pressure-sensitive adhesive layer (12) and in which multiple through holes (2) that extend from one surface of the sheet (1) to the other surface there...  
WO/2011/108490A1
Disclosed is an electrically conductive adhesive tape which can exhibit steady electrical conductivity even when used for a long period or when used under severe environmental conditions. The electrically conductive tape has an adhesive ...  
WO/2011/105211A1
In order for the disclosed laminated glass lens for glasses to have excellent glare-prevention characteristics, a tetraazaporphyrin compound is combined at a required concentration with an extremely thin adhesive agent layer and is moreo...  
WO/2011/102170A1
Disclosed are a thermally conductive pressure-sensitive adhesive sheet which has a high thermal conductivity, a good flame retardancy and a high electric breakdown strength in a well-balanced manner, a thermally conductive pressure-sensi...  
WO/2011/090046A1
Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures. Specifically disclosed is a curable resin composition which c...  
WO/2011/087741A3
The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanat...  
WO/2011/083809A1
Disclosed are: a TAC base for cycloolefin polymer bonding, which has extremely excellent air release during the bonding, excellent transparency and excellent bonding workability, while being capable of enhancing the bonding strength with...  
WO/2011/083824A1
Provided is a circuit connecting adhesion film having at least an adhesive layer (A) and an adhesive layer (B), wherein the adhesive layer (A) is an anisotropic conductive layer (11) containing a prescribed adhesive ingredient (3a) and c...  
WO/2011/082327A1
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight p...  
WO/2011/078313A1
Disclosed are: an intermediate film for laminated glass, which is capable of providing laminated glass that has excellent sound insulation properties and is capable of suppressing generation and growth of foam; and a multilayer intermedi...  
WO/2011/077922A1
Conventionally, it was difficult to sufficiently affix an adherend when polishing, and to easily peel off the adherend. Disclosed is a non-reactive temporarily fixing composition for plane polishing, wherein the shear strength is 0.05MPa...  
WO/2011/074619A1
Provided is a near-infrared absorptive coloring matter that enables the production of a near-infrared blocking filter having excellent transparency, heat resistance and moist heat resistance. The near-infrared absorptive coloring matter ...  
WO/2011/074414A1
Disclosed is an aqueous dispersion adhesive composition containing an aqueous dispersion polymer and alkali disilicate, wherein the proportion of the alkali disilicate is 0.01 to 10 parts by weight in relation to 100 parts by weight of t...  
WO/2011/072056A3
A method for modifying cure speed of a condensation reaction curable involves converting the higher alkoxy groups on ingredient (A) to lower alkoxy groups (such as methoxy groups) using ingredients (B) and (C). Ingredient (A) is a substr...  
WO/2011/071036A1
Disclosed are an adhesion method for firmly bonding a member and an adhesion layer, an ultra-thin adhesion layer in which adhesion and removal can be performed repeatedly without adhesion layer remnants or adhesive residue and without da...  
WO/2011/065341A1
Disclosed is a double-sided pressure-sensitive adhesive sheet for optical use, which has high corrosion resistance and high adhesion reliability at the same time. Specifically disclosed is a double-sided pressure-sensitive adhesive sheet...  
WO/2011/059994A3
Described herein is a mixture comprising: a non-self-crosslinking polymer; and a modifying compound comprising at least two different functional groups. The first functional group of the modifying compound is capable of reacting with the...  
WO/2011/057896A1
The present invention relates to a multi-component, in particular two-component adhesive and sealant system based on at least one component substantially free of volatile organic compounds (VOC), wherein a first and/or a second component...  
WO/2011/055580A1
Disclosed are an adhesive composition containing a resin having piperazine skeletons, a circuit connecting structure, a semiconductor device, and an adhesion improvement agent for glass.  
WO/2011/055784A1
A thermopolymerization initiator system which comprises (A) a iodonium salt represented by general formula (I) and (B) a radical polymerization initiator. In general formula (I), R1 and R2 are each independently substituted or unsubstitu...  
WO/2011/052730A1
Disclosed is a film for protecting a coated surface, with which discoloration of a coated surface due to moisture can be effectively prevented, and also an attachment operation to the coated surface can be facilitated. The film for prote...  
WO/2011/051056A1
The invention relates to a one-component, moisture-curable adhesive comprising at least one polyoxyalkylene and/or poly(methyl)acrylate pre-polymer having at least one hydrolyzable silane group, at least one filler material and auxiliary...  
WO/2011/048874A1
Disclosed is a pressure-sensitive adhesive layer for optical films which is formed by applying an aqueous dispersion type pressure-sensitive adhesive comprising an aqueous dispersion that comprises water and, dispersed therein, a polymer...  
WO/2011/047131A2
A primer composition including a toughening agent can be applied to a surface to be bonded using a separate curable adhesive composition. The primer composition toughens cured reaction products of the adhesive composition. In some embodi...  
WO/2011/047131A3
A primer composition including a toughening agent can be applied to a surface to be bonded using a separate curable adhesive composition. The primer composition toughens cured reaction products of the adhesive composition. In some embodi...  
WO/2011/045962A1
Disclosed are light reflecting conductive particles for an anisotropic conductive adhesive to be used for the purpose of connecting a light emitting element to a wiring board by means of anisotropic conductive connection. Each of the lig...  
WO/2011/046176A1
Disclosed is a conductive adhesive which contains conductive particles including a metal, a thermosetting resin, a flux activator, and preferably, a rheology control agent. The melting point of the conductive particles is preferably 220...  
WO/2011/040498A1
Provided is a powdered thermosetting adhesive, the fluidity of which is so improved that a quantitative feeder or a conveyance passage can be prevented from being clogged with the powdered thermosetting adhesive. The powdered thermosetti...  
WO/2011/040442A1
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ...  
WO/2011/040438A1
Provided is an adhesive composition which can keep high bond strength even under solder reflow conditions or other high-temperature conditions. Further, the adhesive composition can be easily peeled off without doing damage to an adheren...  
WO/2011/038182A1
What is disclosed is a water-based adhesive composition that is an aqueous dispersion or emulsion of a polymer component having functional groups that are inactive in a reversible manner in the adhesive composition as prepared; and a wat...  
WO/2011/033743A1
Disclosed is an adhesive film having a composition containing (A) a thermosetting resin, (B) a hardening agent, (C) a flux activation compound, and (D) a film forming resin. The adhesive film has a minimum melt viscosity of 0.01-10,000 P...  
WO/2011/030621A1
Disclosed is a light-reflective anisotropic electroconductive adhesive agent which is intended to be used for the anisotropic electroconductive connection of a light-emitting element to a wiring board. The light-reflective anisotropic el...  

Matches 401 - 450 out of 15,387