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WO/2008/110394 |
The invention relates to a one-component structural adhesive, having a flow limit of at least 1500 Pa and initial adhesion of more than 30 g/cm2, comprising at least one thickening agent and/or at least one filler. The invention further ...
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WO/2008/102616 |
Disclosed are: a cleaning sheet excellent in both of conveyability in a substrate-processing apparatus and an ability of removing foreign matters adhered in the apparatus; a conveying member having a cleaning function, which employs the ...
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WO/2008/102907 |
A near-infrared shielding film composed of a substratum film having, superimposed on its one major surface, a hard coat layer produced from a hard coat layer forming material containing a near-infrared absorbent and an actinic energy rad...
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WO/2008/102618 |
This invention provides a pressure sensitive adhesive tape for fastening a rolled aluminum electrolytic capacitor, which, even when used in an aluminum electrolytic capacitor, does not cause any lowering in electrostatic capacitance caus...
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WO/2008/100801 |
The invention is a composition comprising a) one or more organotitanates having four ligands wherein the ligands are hydrocarbyl, optionally containing one or more functional groups having one or more heteroatoms selected from the group ...
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WO/2008/099925 |
Disclosed is a conductive adhesive composition which does not deteriorate the conductivity of a metal powder and is suppressed in decrease of conductivity due to rust of the metal powder even when stored or used for a long time under hig...
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WO/2008/099858 |
Disclosed is a curable composition which is commercially highly practical and exhibits excellent curability even when a filler and a non-organotin catalyst are used. Specifically disclosed is a curable composition obtained by mixing (A) ...
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WO/2008/096530 |
Disclosed is a low-cost adhesive resin composition which is applicable to a base not having sufficient adhesiveness. Specifically disclosed is an adhesive resin composition containing a polymer (A) having no radically polymerizable doubl...
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WO/2008/096756 |
Disclosed is an aqueous adhesive composition exhibiting excellent adhesive performance from the viewpoints of water resistance, heat resistance and durability. The aqueous adhesive composition contains a base material containing at least...
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WO/2008/093648 |
Disclosed is a resin composition suitable for bonding a base layer such as a polyolefin layer with a barrier resin layer such as an ethylene-vinyl alcohol copolymer layer. Specifically disclosed is a resin composition (A) containing a th...
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WO/2008/090791 |
This invention provides an anisotropic electroconductive film which, when has been subjected to anisotropic electroconductive connection under pressure bonding conditions of pressure bonding temperature 130ºC or below and pressure bondi...
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WO/2008/088523 |
A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)...
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WO/2008/084651 |
The invention aims at providing a curable composition which is free from organotin curing catalysts whose toxicity has been pointed out or from volatile compounds and which is excellent in curability, storage stability, and the strength ...
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WO/2008/084811 |
Disclosed is an adhesive for connection of circuit members, which is interposed between a semiconductor chip having a projected connection terminal and a substrate provided with a wiring pattern, and pressed and heated therebetween for e...
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WO/2008/082929 |
An adhesive composition including an etchant for a hard tissue surface, at least one multifunctional crosslinkable (meth)acrylate monomer with a functionality greater than 4, and water. The adhesive composition is a water-in-oil emulsion.
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WO/2008/078469 |
This invention provides an adhesive agent composition for temporal fixation, which can realize easy identification of a coated part in temporal fixation of an optical member and can easily distinguish the state of curing in a curing proc...
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WO/2008/078654 |
Disclosed is a curable composition having excellent curability and storage stability without containing a toxic organotin curing catalyst or a volatile compound. This curable composition enables to obtain a cured product having excellent...
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WO/2008/076184 |
A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R2 2Si02/2)b, (R2Si03/2)c , (SiO4/2)d, (R1 ')f, and (R2 3Si01/2)g, where each...
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WO/2008/075604 |
An organic damping material which by itself has excellent damping properties without being combined with other material(s), need not have a certain thickness or volume for ensuring sufficient damping performance, and is easy to process. ...
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WO/2008/075767 |
A pressure-sensitive adhesive sheet which comprises: a substrate having, on at least one side, recesses and protrusions in which any adjoining two recesses are interconnected to each other; and an air-impermeable pressure-sensitive adhes...
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WO/2008/072462 |
This invention provides a double-sided adhesive sheet (7) for fixing a liquid crystal display module unit (8) and a backlight unit (6) to each other in a liquid crystal display device. The double-sided adhesive sheet (7) comprises at lea...
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WO/2008/068996 |
[PROBLEMS] To provide: a thermosetting resin which can be used in the production of a laminate for use in an destiné à être employé dans un component, an electrical product or a fiber, particularly can be used in a multilayer circuit...
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WO/2008/069088 |
The present invention aims to prevent cutting of a dicing sheet, damage to a chuck table and fusion bonding of a dicing sheet to a chuck table by laser light during laser dicing. Specifically disclosed is a laser dicing sheet which is ch...
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WO/2008/064724 |
There are disclosed aqueous dispersions suitable for preparing pressure sensitive adhesive (PSA) comprising (a) monomer composition of (i) at least one hydrophobic monomer (Component I), (ii) at least one hydrophilic monomer (Component I...
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WO/2008/061828 |
The invention relates to a two-component binder system, consisting of a component A and a component B, wherein A) contains at least one polymer having at least two Michael acceptor groups, B) contains at least one polymer or oligomer hav...
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WO/2008/061827 |
The invention relates to a two-component binder system, consisting of a component A and a component B, containing A) at least one polymer that has at least one Michael acceptor group and additionally at least one Michael donor group, B) ...
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WO/2008/062866 |
Disclosed is a curable composition which exhibits good curability by using a non-organotin catalyst. Specifically disclosed is a curable composition containing an organic polymer (A) having a silicon-containing group which can be crossli...
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WO/2008/053713 |
A heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently separated and recovered therefrom without breaking. The heat-peelable p...
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WO/2008/053694 |
[PROBLEMS] To provide a crystalline lamellar zirconium phosphate which is ion exchanger particles excellent in heat resistance and chemical resistance and utilizable as a trapping agent for impurity ions in electronic materials or as a r...
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WO/2008/050725 |
Disclosed is a near infrared ray-absorbable dye composition which can absorb near infrared ray with efficiency, has a high visible light transmittance, has excellent light resistance, heat resistance and wet heat resistance, is hardly de...
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WO/2008/047915 |
Disclosed is a film base material which shows good balance among flexibility, workability on film cutting, heat resistance, abrasion resistance, flame retardancy, and a property of hardly causing bleed-out when a bromine flame retardant ...
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WO/2008/047610 |
Disclosed is a film for semiconductor wherein an adhesive layer, a first cohesive layer and a second cohesive layer are bonded together in this order and the peripheral portion of the second cohesive layer extends beyond the peripheral p...
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WO/2008/044330 |
Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy ...
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WO/2008/044266 |
A superstrong adhesive tape that in a strongly viscous structure simultaneously having an adhesive function and an adsorptive function, realizes an enhanced bonding strength. There is provided a superstrong adhesive tape comprising plast...
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WO/2008/038565 |
An anisotropic conductive adhesive composition is provided for connecting a first circuit member, which has a first circuit electrode on the main surface of a first substrate, and a second circuit member, which has a second circuit elect...
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WO/2008/035791 |
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer,...
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WO/2008/035709 |
Disclosed is a solvent-type removable adhesive composition which comprises a high-Tg polymer (A) having a glass transition temperature (Tg) of 0˚C or higher, a low-Tg polymer (B) having a Tg lower than that of the high-Tg polymer and al...
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WO/2008/035825 |
Disclosed is an adhesive sheet for marking, which comprises an adhesive layer on one surface of a non-vinyl-chloride-based resin base material and a crosslinked acryl urethane coating layer on the other surface of the base material, wher...
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WO/2008/031537 |
The invention relates to an adhesive composition which is in one embodiment a free flowing, water-redispersible powder adhesive, comprising about 30 to 99.9 wt.-% of at least one water-insoluble, film-forming polymer and/ or at least one...
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WO/2008/032539 |
Disclosed are a moisture-curable polymer having excellent curability, and a curable composition. Specifically disclosed is a polymer having a silicon group represented by the following general formula: -SiFaR1 bZc (wherein R1 represents ...
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WO/2008/029580 |
An anisotropic conductive tape (1) for electrically connecting opposed circuit electrodes to each other comprises a tape-like base (20) and adhesive agent layers (11b, 12b) arranged parallel with each other on the major surface of the ba...
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WO/2008/026517 |
A conductive bonding material which comprises: a thermosetting resin (7); low-melting metal particles (8) which melt at a temperature not higher than the thermosetting temperature of the thermosetting resin (7); high-melting metal partic...
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WO/2008/023565 |
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of s...
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WO/2008/023452 |
Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The sold...
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WO/2008/020768 |
A process for manufacturing a water resistant board from wood fibre involves the use of a liquid binder system using waste powder coating powder (either a thermosetting resin such as polyester or epoxy or a thermoplastic powder) together...
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WO/2008/021923 |
To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for...
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WO/2008/013661 |
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...
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WO/2008/013661 |
The invention is an adhesive composition comprising one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more hydrophobic silanes having one or more hydrocarbyloxy groups and one or ...
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WO/2008/004287 |
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive ...
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WO/2008/004399 |
The invention aims at providing a technique which brings about a remarkable improvement in the close adhesion of a fluororesin substrate and a non-coarsened metal foil through easier means and enables the formation of fine-pitch circuits...
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