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Matches 1 - 50 out of 21,330

Document Document Title
WO/2018/221635A1
The present invention addresses the problem of providing a double-sided adhesive sheet with which the occurrence of peeling, air bubbles and/or floating is suppressed, even under high-temperature conditions after adhesion. The present in...  
WO/2018/221490A1
The present invention addresses the problem of providing a surface protection film which provides an excellent writing sensation when a stylus pen is used thereon and excellent scratch resistance against a stylus pen. As a solution, prov...  
WO/2018/221405A1
[Problem] To provide a layered film that is suitable for use as a PPF material. [Solution] A layered film in which the following are disposed in contact in the order given: a coating layer comprising a cured product of a photopolymerizab...  
WO/2018/221093A1
Provided is a heat ray shielding material comprising, on a substrate, a particle-containing layer that includes metal flat particles, and an adjacent layer disposed adjacent to the particle-containing layer, the adjacent layer including ...  
WO/2018/221217A1
The purpose of the present invention is to provide a curable resin composition which exhibits excellent fluidity prior to curing, and excellent adhesive properties, heat resistance and flexing resistance following curing. In addition, th...  
WO/2018/221675A1
This tape for semiconductor processing includes a substrate layer, an adhesive layer, and a thermosetting adhesive layer, layered in this order. After being subjected to a curing treatment for 1 hour at 130°C, the shrinkage rate of the ...  
WO/2018/216645A1
An adhesive composition containing a siloxane compound (A), said siloxane compound (A) being a hydrolysis condensate (a) of a hydrolytically condensable silane compound represented by formula (a1) [wherein: B represents an alkanediyl gro...  
WO/2018/216621A1
An expand tape 1 for use in a semiconductor device manufacturing method provided with a tape expand step in which the expand tape 1 is heated and expanded to increase the interval of individualized semiconductor chips 2, fixed on the exp...  
WO/2018/212154A1
Provided is a tackifier resin comprising a reaction product of a rosin and an alcohol, wherein the rosin includes a Pinus palustris-derived rosin.  
WO/2018/211887A1
This conductive adhesive contains: an acrylic resin having a weight-average molecular weight of 500,000-1,000,000 and an epoxy group; a thermosetting resin having a glass transition temperature of 0-50ºC; a number-average molecular weig...  
WO/2018/211586A1
The present invention provides an adhesive film having both weather resistance and bend resistance. The present invention provides the adhesive film constituted by having at least: a first layer having a storage elastic modulus of 108 to...  
WO/2018/212064A1
Provided are: a low-viscosity solvent composition which comprises organic solvents and core/shell polymer particles stably dispersed therein in a high concentration; and a method for producing the solvent composition. The solvent composi...  
WO/2018/207793A1
The purpose of the present invention is to provide a component manufacturing tool and a component manufacturing method with which suction-attachment onto a chuck table can be achieved even under a heated environment. A component manufact...  
WO/2018/207579A1
Provided are a composite member and a touch panel, which have excellent bending resistance. The composite member is formed by laminating at least two layers of laminate constituent bodies, and each laminate constituent body comprises one...  
WO/2018/207563A1
The present invention addresses the problem of providing: a light-reflecting film which exhibits excellent flatness, adhesiveness and light-reflecting properties, while having excellent durability; and a method for producing this light-r...  
WO/2018/203537A1
A purpose of the present invention is to provide an impact absorption sheet that has high impact resistance and also exhibits excellent resistance to sebum. Another purpose of the present invention is to provide a double-sided pressure-s...  
WO/2018/204466A1
A silane modified copolymer that is the reaction product of an aminosilane and an isocyanate functional copolymer, wherein the isocyanate functional copolymer is the reaction product of a polyether polyol having a molecular weight greate...  
WO/2018/203527A1
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more a...  
WO/2018/198961A1
This particulate adhesive includes a core comprising an adhesive composition and a shell comprising solid particles. In the particulate adhesive, a constant A represented by formula (I) and indicating the state in which the core is coate...  
WO/2018/199117A1
Provided is a substrate laminate comprising a first substrate, an adhesive layer, and a second substrate that are laminated in this order, the adhesive layer containing a reaction product of a compound (A) having a cationic functional gr...  
WO/2018/198962A1
This particulate adhesive includes a core and a shell coating the core. The core includes an adhesive composition, and the shell includes solid particles. The loss factor tanδ of the adhesive composition is in the range of 0.32 to 0.6.  
WO/2018/199329A1
An aspect of the present invention relates to an adhesive composition which comprises an adhesive component and electroconductive particles, wherein the electroconductive particles each comprise a plastic particle and a metal layer cover...  
WO/2018/199032A1
Provided are: a structure-FRP material bond construction, which is a structure for bonding FRP material to structures and is characterized by a bonding layer formed from a resin and a fiber substrate being interposed between the structur...  
WO/2018/194156A1
A method for manufacturing a semiconductor device, the method comprising: a step for temporarily crimping a first member having a connection part and a second member having a connection part, with an adhesive agent interposed therebetwee...  
WO/2018/193706A1
The present invention conveniently suppresses the formation of surface sink marks due to the bonding of a panel component using a mastic adhesive. A reinforcing component (1) and a rear surface (2a) of a panel component (2) comprising a ...  
WO/2018/194099A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; and (D) a magnetic filler, wherein the modulus of elasticity of a cured product at 23°C is 7-18 GPa, the cured product being obta...  
WO/2018/193983A1
A purpose of the present invention is to provide an imide oligomer which is able to be used for a cured product that has excellent long-term heat resistance. Another purpose of the present invention is to provide: a curing agent which is...  
WO/2018/194100A1
This resin composition contains: (A) a thermosetting resin; (B) a curing agent; (C) a thermoplastic resin; (D) a magnetic filler; and (E) an inorganic filler other than the magnetic filler, wherein, when a content mass of component (D) i...  
WO/2018/190085A1
This adhesive sheet 10 for wafer processing has a multilayer structure which comprises a substrate 11 that is composed of a polyolefin substrate containing a plasticizer and an adhesive layer 12 that contains a plasticizer. The content o...  
WO/2018/190138A1
The problem to be solved by this invention is to provide an article production method with which, when affixing an adhesive sheet which does not contain toluene to a body to be covered at a predetermined position, it is possible to perfo...  
WO/2018/186355A1
[Problem] To provide a film and a heat-resistant adhesive tape comprising the same, the film having excellent film moldability as well as excellent heat resistance and transparency, and a small shrinkage factor and a small thermal weight...  
WO/2018/186383A1
A hardener for two-pack type adhesives which comprises a reaction product (B-1) obtained by reacting a polyol with one or more isocyanate compounds comprising 4,4'-diphenylmethane diisocyanate and at least one isocyanate compound (B-2) s...  
WO/2018/186463A1
Provided is an adhesive protective film that can be placed at a prescribed location with high precision. With regard to this adhesive protective film, the average light transmittance (T400-800) of light is 25 to 90% as measured by a spec...  
WO/2018/186271A1
The present invention relates to a metal-resin composite member for a tire, the metal-resin composite member comprising a plurality of metal cords arranged in parallel, an adhesive layer provided on the metal cords, and a resin layer pro...  
WO/2018/186297A1
Provided are: a high-frequency dielectric heating adhesive sheet in which it is possible to dispense with a peeling sheet despite having a comparatively large area, said high-frequency dielectric heating adhesive sheet being easy to hand...  
WO/2018/180594A1
Provided is a film-like adhesive composite sheet in which a curable film-like adhesive is provided on a support sheet, wherein the support sheet has a base material, the curable film-like adhesive has a thickness of 1-60 μm, and the pro...  
WO/2018/181625A1
The present invention addresses the problem of providing an electrically conductive adhesive composition comprising a thermoplastic resin and having a high heat dissipation ability, wherein a bleed out phenomenon, i.e., exudation of a no...  
WO/2018/181192A1
The present invention relates to: an adhesive composition which contains a rubber-based resin (component (A)), a curable resin (component (C)) and an allophanate-based crosslinking agent (component (D)); a sealing sheet which comprises a...  
WO/2018/181454A1
The present invention provides an adhesive laminated film (50) for protecting the surface of an indium tin oxide (ITO) film, said adhesive laminated film (50) comprising a base layer (10), and an adhesive resin layer (20) that is dispose...  
WO/2018/181768A1
Provided is an adhesive sheet comprising a layered body in which an adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly layered in this order. The layered body is formed by directly layering, in this or...  
WO/2018/181517A1
The present invention pertains to: an adhesive sheet obtained by directly laminating a resin layer including a resin (S), a molecular adhesive layer, and a protective film in the stated order, said molecular adhesive layer having at leas...  
WO/2018/181453A1
This adhesive laminated film (50) protects the surface of an indium tin oxide (ITO) film, wherein the adhesive laminated film (50) is provided with a base material layer (10) and an adhesive resin layer (20) provided on one surface of th...  
WO/2018/181108A1
The present invention relates to: a pressure-sensitive adhesive sheet for printing which includes a layered object comprising a pressure-sensitive adhesive layer (X), a base layer (Y), and a printing layer (Z) that have been superposed i...  
WO/2018/181769A1
Provided is an adhesive sheet comprising a layered body in which an adhesive layer (X1) and a non-adhesive thermally expandable substrate (Y) are directly layered in this order. The layered body is formed by directly layering, in this or...  
WO/2018/181518A1
The present invention pertains to: an adhesive sheet obtained by directly laminating a resin layer including a resin (S), a molecular adhesive layer, and a protective film in the stated order, said molecular adhesive layer including a mo...  
WO/2018/181694A1
The present invention provides conductive particles that are capable of effectively enhancing conduction reliability. The conductive particles according to the present invention each have: a first configuration wherein the ratio of 20% K...  
WO/2018/181766A1
Provided are: a semiconductor device production method that includes steps (1)-(4) indicated below and that is a method for producing a semiconductor device using a double-sided adhesive sheet comprising, in this order, a first adhesive ...  
WO/2018/181240A1
This adhesive tape for semiconductor wafer surface protection is used heat bonded, under conditions of 40°C to 90°C, onto the surface of the semiconductor wafer having a depression-to-protrusion height difference of greater than or equ...  
WO/2018/181519A1
The present invention pertains to: an adhesive sheet obtained by directly laminating a molecular adhesive-containing molecular adhesive layer on a pressure-sensitive adhesive layer which contains a pressure-sensitive adhesive resin (P), ...  
WO/2018/179475A1
Provided is a protection film-forming composite sheet comprising a base material on which an adhesive agent layer and a protection film-forming film are laminated in this order, the protection film-forming composite sheet providing excel...  

Matches 1 - 50 out of 21,330