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Patent Searching and Data


Matches 1 - 50 out of 18,784

Document Document Title
WO/2017/069195A1
The purpose of the present invention is to provide a colored adhesive tape whereby there is no separation of a support layer and a coloration shielding layer and occurrence of ink peeling even during reworking or the like, and to provide...  
WO/2017/069050A1
Provided is an ultrasmall-sized securing tape that is suitable as a disposable tape for absorbent articles such as disposable diapers, sanitary napkins, and incontinence pads. This ultrasmall securing tape comprises an extending portion ...  
WO/2017/065072A1
The purpose of the present invention is to provide a tackifier which is superior in adhesiveness at high temperatures (high-temperature holding power) and adhesion to rough surfaces to conventional tackifiers produced using rosin acids h...  
WO/2017/065113A1
A semiconductor device 100 according to one embodiment of the present invention is provided with a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface that constitutes a circuit surfac...  
WO/2017/064925A1
This double-sided adhesive sheet has a multilayer structure including, for example, an electrolyte-containing adhesive layer (11), an adhesive layer (21), and a conducting substrate (30). This joined body comprising a double-sided adhesi...  
WO/2017/065188A1
A pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition, characterized in that the pressure-sensitive adhesive composition comprises an aliphatic polyca...  
WO/2017/065124A1
Provided is a tabbed pressure-sensitive adhesive product comprising a stretchable pressure-sensitive adhesive sheet and a tab affixed to the pressure-sensitive adhesive sheet. In this tabbed pressure-sensitive adhesive product, the tab c...  
WO/2017/065275A1
Provided is a separator-fitted adhesive tape such that a decrease in the protrusion height of weakly adhesive protruding portions provided in parts of the adhesive layer surface is suppressed sufficiently. The separator-fitted adhesive t...  
WO/2017/064918A1
Provided is an electrically peelable adhesive composition for forming an adhesive layer that has high adhesiveness and that can be easily peeled by applying voltage for a short time even when a low voltage is used. Also provided are: an ...  
WO/2017/061597A1
Provided is a metal-coated nonwoven fabric with an adhesive layer, the metal-coated nonwoven fabric being capable of attaining enhanced adhesiveness. The metal-coated nonwoven fabric with an adhesive layer according to the present invent...  
WO/2017/061416A1
Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or a...  
WO/2017/057404A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057410A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057408A1
Disclosed is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pr...  
WO/2017/057428A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the average are...  
WO/2017/057413A1
An adhesive sheet which has, on a substrate or a peel-off material, a resin layer containing a resin portion (X) including a carbon atom containing resin with, as main component, carbon atoms in the main chain of the structural unit, and...  
WO/2017/057405A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057412A1
Disclosed is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pr...  
WO/2017/057130A1
Provided are a thermal bonding sheet that prevents bonding irregularities by having a uniform thickness and can impart bonding reliability at high temperatures, and a thermal bonding sheet with dicing tape that is provided with said ther...  
WO/2017/057519A1
The purpose of the present invention is to provide an adhesive tape for an electronic component, the adhesive tape having excellent wire bonding properties and workability. Provided is an adhesive tape for an electronic component, charac...  
WO/2017/057354A1
Provided are: an easily peeled temporary adhesive which is not prone to film unevenness and in which voids are not prone to occur, while adhesive strength necessary for temporary bonding of a carrier substrate to a base material is maint...  
WO/2017/057357A1
The purpose of the present invention is to provide an adhesive layer-equipped polarizing film having, in order, a polarizer, an anchor coat layer containing a polyvinyl alcohol-based resin, and an adhesive layer, the anchor coat layer an...  
WO/2017/057407A1
An adhesive sheet having a resin layer including resin, upon a base material. At least the surface (α) of the resin layer on the opposite side to the base material side is adhesive. The bending stress coefficient k of the base material ...  
WO/2017/057429A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of...  
WO/2017/057406A1
Provided is an adhesive sheet comprising a resin layer that is a multi-layer structure in which at least a layer (Xβ), a layer (Y1), and a layer (Xα) are layered in this order, wherein a surface (α) of the layer (Xα) has adhesive pro...  
WO/2017/057409A1
Provided is an adhesive sheet having a resin layer including resin, upon a base material, and having a resin layer including: a resin section (X) including resin as the main component thereof; and a particle section (Y) comprising fine p...  
WO/2017/048890A1
Curable silicone pressure sensitive adhesive compositions and films suitable for sealing and adhering substrates for optically clear electronic devices are described. The curable silicone pressure sensitive adhesive compositions are suit...  
WO/2017/047600A1
The present invention is a film for plastic restoration with which a plastic that has deteriorated in transparency can be easily made to recover the transparency. The film for plastic restoration according to the present invention compri...  
WO/2017/047389A1
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An...  
WO/2017/047281A1
Provided are: a functional film; and an aircraft window structure. This functional film (100) is sequentially provided, on a first main surface of a transparent film base (10), with a functional thin film (20) that is composed of a lamin...  
WO/2017/046855A1
This adhesive tape for semiconductor wafer processing has a radiation curable adhesive agent layer above a base material film. This adhesive tape for semiconductor wafer processing is to be used in a step whereby a semiconductor wafer th...  
WO/2017/047452A1
Provided is an alumina-based heat conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while having good kneadability (miscibili...  
WO/2017/047183A1
The purpose of the present invention is to provide a protective film for a semiconductor, with which it is possible to prevent warpage of semiconductor wafers and semiconductor chips and to prevent chipping and reflow cracking from occur...  
WO/2017/043283A1
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...  
WO/2017/043256A1
Provided is a composition which includes: powdered silver in which grain distribution of primary particles has a first peak in a particle size range of 20 to 70 nm and a second peak in a particle size range of 200 to 500 nm, in which 50%...  
WO/2017/043173A1
The pressure-sensitive adhesive composition according to the present invention comprises (A) a polymer including a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth...  
WO/2017/038916A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising: a substrate (11) having a first surface (11a) and a second surface (11b) on the op...  
WO/2017/038913A1
Disclosed is an adhesive sheet (10) used in a semiconductor device production process involving: a step for attaching, to said adhesive sheet (10), a frame member (20) having a plurality of openings (21) formed therein, said adhesive she...  
WO/2017/037951A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...  
WO/2017/038922A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...  
WO/2017/038920A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. When...  
WO/2017/038921A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). The surface free energy of the a...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/038199A1
To provide: a rubber composition which enables the achievement of a cement having excellent solubility in a solvent and excellent tack properties, while having high adhesive power; a cement composition; and a hose for liquid transportati...  
WO/2017/038918A1
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12). A value found for the adhesive a...  
WO/2017/038530A1
A display sheet to be installed on a road surface, a floor surface or a wall surface, which sequentially comprises in the following order: an adhesive layer for installation having a thickness of 50 μm or more; a base that is obtained b...  
WO/2017/033935A1
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width...  
WO/2017/033933A1
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity c...  
WO/2017/033705A1
This one-surface-protected polarizing film comprises a polarizer and a protective film disposed over only one surface thereof, and has a transparent resin layer disposed on at least one surface of the polarizer. The protective film has b...  
WO/2017/033824A1
This adhesive water vapor barrier laminate comprises a base and an adhesive layer arranged on the base; and the adhesive layer is obtained from an adhesive composition that contains a component (A), a component (B) and a component (C).  

Matches 1 - 50 out of 18,784