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Patent Searching and Data


Matches 1 - 50 out of 20,160

Document Document Title
WO/2018/008201A1
Provided is an adhesive cleaner that exhibits excellent workability when an adhesive surface is renewed, and is less likely to unroll. This adhesive cleaner comprises an adhesive tape having an adhesive surface on a first surface of a ba...  
WO/2018/008443A1
Provided is a polarizing film with an adhesive layer, which comprises a polarizing film that is obtained by arranging a transparent protection film on at least one surface of a polarizer, with an adhesive agent layer being interposed the...  
WO/2018/003565A1
The purpose of the present invention is to provide: a support for manufacturing semiconductor packages which exhibits superior durability in various processes such as polishing, heating, exposure/development, plating, and vacuum processi...  
WO/2018/005535A1
Embodiments of the present disclosure pertain to adhesive compositions that include a fluorinated molecule and a hydrogen-containing molecule that are non-covalently associated with one another. The molecules may be non-covalently associ...  
WO/2018/003312A1
A semiconductor processing sheet comprising at least a base material, wherein: the semiconductor processing sheet has a recovery rate of not less than 70% and not more than 100%; or the ratio of a 100% stress measured in an MD direction ...  
WO/2017/221885A1
Disclosed are: an acrylic resin composition that has improved adhesive protrusion preventing ability when being cured under heat and pressure, while maintaining excellent adhesiveness and post-curing flexibility, the acrylic resin compos...  
WO/2017/221625A1
In this invention, when a first laminating member and a second laminating member are laminating together under a vacuum atmosphere with a laminating resin material interposed therebetween to produce a joined body, the shifting of the lam...  
WO/2017/216446A1
The present invention relates to a cross-linkable adhesive composition comprising at least one cross-linkable silylated polymer and at least one cross-linking catalyst obtained by reacting a metal alkoxide and an oxime. The invention als...  
WO/2017/213248A1
The present disclosure relates to a thermosetting adhesive film. This adhesive film comprises (a) a polymer, (b) an epoxy resin that is in liquid form at 50°C, (c) a curing agent and/or a curing accelerator, and (d) a filler having a th...  
WO/2017/208884A1
Provided is a resin laminate that is provided with a transparent adhesive and that has durability against high temperature and high humidity. Disclosed is a resin laminate with a transparent adhesive, comprising: a resin laminate (A) inc...  
WO/2017/208838A1
[Problem] To provide a thermally expandable adhesive tape capable of preventing loosening of bonding between adherends, generation of abnormal noise due to vibrations thereof, and separation of the adherends from each other even if the a...  
WO/2017/209242A1
The present invention addresses the problem of providing a resin-bonded wire saw which achieves good cutting performance with little loss of abrasive grains and which suppresses the occurrence of wafer surface flaws during cutting. The r...  
WO/2017/208773A1
The heat-resistant composition according to the present invention is characterized by including one or more repeating units that each comprise both an (un)saturated hydrocarbon and an aliphatic hydrocarbon having ion pairs at both termin...  
WO/2017/204228A1
A laminate which comprises a resin film and a pressure-sensitive adhesive layer disposed on one surface of the resin film, wherein the surface of the laminated resin film on the reverse side from the surface having the pressure-sensitive...  
WO/2017/204145A1
Provided are: a composition for bonding which, after bonding, forms an adhesive layer that is less apt to deform and can retain high adhesive force even after a reliability test; and an optical adhesive and an adhesive for pressure senso...  
WO/2017/203883A1
Provided is a pressure-bonding pressure-sensitive adhesive member, the surface of which has an excellent position adjusting function with respect to an adherend composed primarily of a low-polarity plastic as represented by polypropylene...  
WO/2017/204048A1
The present invention addresses the problem of providing a deformation sensor unit that can measure with relative accuracy the movement of the human body and the like. This deformation sensor unit is provided with the following: a deform...  
WO/2017/199979A1
Disclosed is a laminated resin film having a second resin film laminated on at least one surface of a first resin film with an adhesive layer therebetween, the laminated resin film comprising a compound including a specific borate group ...  
WO/2017/199985A1
Provided is an adhesive having excellent adhesiveness with thermoplastic resins and ethylene-vinyl alcohol copolymers. Provided are an adhesive including a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or acr...  
WO/2017/199547A1
The present invention addresses the problem of realizing a thermoplastic adhesive product that can be automatically supplied continuously to a heating and melting tank and can be produced easily. Provided is a thermoplastic adhesive prod...  
WO/2017/200103A1
A demolding film comprising: a support comprising a substrate and an adhesive layer disposed upon the substrate; and an electromagnetic wave-shielding sheet disposed upon the adhesive layer of the support. The peel strength between the a...  
WO/2017/199978A1
Disclosed is a polarizing film having a transparent protection film laminated on at least one surface of a polarizer with an adhesive layer therebetween, the polarizing film including, on the lamination surface of the polarizer, an adhes...  
WO/2017/195811A1
The present invention relates to an aluminum alloy material that comprises: an aluminum alloy base material; a first coating film that is formed on at least one portion of the surface of the aluminum alloy base material and that comprise...  
WO/2017/195899A1
Provided is a heat-peelable pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer which, even when heated under severe conditions (for example, 100°C, 3 hours), can retain the expanded state without shrinking and ...  
WO/2017/195806A1
This aluminum alloy material production method is provided with: an oxide film-forming step for forming an oxide film, which contains 0.1 atom% to less than 30 atom% of Mg and in which Cu is restricted to less than 0.6 atom%, on at least...  
WO/2017/195400A1
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...  
WO/2017/195517A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...  
WO/2017/191812A1
A method for modifying a carbon nanotube sheet, in which a structure has a mounting part for mounting a carbon nanotube sheet, and the mounting part has non-contacting sections that do not contact the carbon nanotube sheet, and contactin...  
WO/2017/191815A1
This resin film for temporary fixation is equipped with a first layer including a first thermoplastic resin having a glass transition temperature of -50 to 50°C and a second layer including a second thermoplastic resin having a glass tr...  
WO/2017/191827A1
The present invention provides a degradable polyrotaxane compound that is easily produced and has large changes in physical properties during degradation. More specifically, said polyrotaxane compound is provided as a result of synthesiz...  
WO/2017/191836A1
This adhesive sheet has a configuration in which a substrate and an adhesive layer formed from an adhesive composition are layered in this order, and an electroconductive layer which is formed from a material including carbon nanotubes a...  
WO/2017/188411A1
Disclosed are a sulfur-containing silane compound that is a product of a reaction between a compound expressed by general formula (1) and a compound expressed by general formula (2), and a synthesis method therefor, as well as a rubber c...  
WO/2017/188223A1
The present invention addresses the problem of providing a two-sided adhesive sheet provided with both contour conforming properties and outgas resistance. The present invention is the two-sided adhesive sheet comprising: a base material...  
WO/2017/188205A1
The present invention provides an energy ray-curable film for forming a protective film. The film for forming the protective film is capable of forming the protective film on the rear surface of a semiconductor wafer or a semiconductor c...  
WO/2017/188231A1
An energy ray-curable film for forming a protective coat, wherein said film for forming a protective coat has a characteristic in which, when said film for forming a protective coat has been irradiated with energy rays and made into a pr...  
WO/2017/188198A1
This composite sheet for forming a protective coating includes a support sheet, and also includes, upon the support sheet, an energy-ray-curable film for forming a protective coating. When the film for forming a protective coating is irr...  
WO/2017/188199A1
Provided are a film for forming a protective coating and a composite sheet for forming a protective coating, both of which can prevent curing defects even in the presence of oxygen. Said film for forming a protective coating can be cured...  
WO/2017/188211A1
This film for forming a protective coating can be cured by energy rays, and when irradiated with energy rays to obtain the protective coating, the tensile elasticity of the protective coating is at least 1×108Pa. This composite sheet fo...  
WO/2017/188203A1
The present invention relates to a method for producing a semiconductor chip 19 equipped with a protective film, wherein a semiconductor wafer 18 in a laminate provided with a support sheet 10, an energy ray-curable film 13 for forming t...  
WO/2017/188200A1
This film for forming a protective film is energy ray curable. When the film for forming the protective film is irradiated with energy rays to form the protective film, the maximum cross-sectional height (Rt) of at least one surface (β'...  
WO/2017/188229A1
This film for forming a protective coating satisfies both condition (1): the transmittance therethrough of laser light having a 1342-nm wavelength is 45% or more, and condition (2): the transmittance therethrough of laser light having a ...  
WO/2017/183310A1
The purpose of the present invention is to provide an adhesive-film-integrated pressure-sensitive adhesive tape which has satisfactory conformability to wafers that have bumps and in which the pressure-sensitive adhesive tape combines ad...  
WO/2017/179579A1
This granular adhesive contains an adhesive particle. The adhesive particle comprises a core containing an adhesive composition, a shell covering the core, and an encapsulated gas. The shell comprises a solid particle.  
WO/2017/175480A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/175481A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/170021A1
A semiconductor processing sheet comprises an adhesive agent layer on a base material, and has the following characteristics: when the adhesive agent layer has a thickness of 200 μm, the adhesive agent layer with the thickness of 200 μ...  
WO/2017/169451A1
Provided is a surface protection film that comprises an adhesive layer, a middle layer, and a back surface layer, and that is characterized in that the back surface layer comprises a polyolefin resin composition containing 0.3-10 wt% of ...  
WO/2017/171025A1
The main objective of the present invention is to provide a modified hydrocarbon resin that imparts a hot-melt adhesive composition which is low-odor, has excellent thermal stability, and has high adhesive performance. The present invent...  
WO/2017/170413A1
[Problem] To provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesiv...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  

Matches 1 - 50 out of 20,160