Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 18,357

Document Document Title
WO/2017/006799A1
[Problem] To provide an adhesive composition that is flexible and that realizes exceptional adhesion durability. [Means for solving problem] Provided is an adhesive composition containing (a) a 2-cyanoacrylic acid ester, (b) a polymer ha...  
WO/2017/006549A1
The purpose of the present invention is to provide a semiconductor wafer surface protection film that can be affixed so as to conform satisfactorily with irregularities on the circuit formation surface of a semiconductor wafer and inhibi...  
WO/2017/006460A1
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...  
WO/2017/002741A1
The present invention provides a film bonding device that enables a film bonding method by which intrusion of foreign matter and air bubbles in a bonding surface can be prevented even in a case where the bonding process is performed in a...  
WO/2017/002610A1
The present invention provides a film for manufacturing semiconductor parts, a method of manufacturing semiconductor parts, semiconductor parts, and an evaluation method in which an evaluation step accompanied with a temperature change, ...  
WO/2016/208617A1
Provided are: a bonding agent for bonding a film containing a PVA-based polymer and a protective film, which is an active energy ray curable bonding agent comprising a PVA-based polymer (A), a cationic polymerizable compound (B) and a ca...  
WO/2016/208243A1
The present invention addresses the problem of suppressing an increase in contact point resistance caused when a contact point is removed. One aspect of the present invention is a conductive material comprising a liquid conductive resin ...  
WO/2016/203305A1
The present invention provides a decorative laminate that simultaneously exhibits shaping properties capable of conforming to a complex shape and physical properties such as sufficient hardness and superior chemical resistance. More spec...  
WO/2016/204162A1
Provided are: an electrically conductive adhesive agent which does not undergo the deterioration in electric conductivity and the fluctuations in resistivity; an electrically conductive structure; and an electronic part. The electrically...  
WO/2016/204065A1
Provided are: a two-part curable composition which can exhibit curability at the same level as those achieved by the conventional two-part curable compositions even when the equivalent ratio of a reactive group in a second preparation to...  
WO/2016/203621A1
Provided is an antifouling composition with which it is possible to effectively prevent the adhesion of molds and algae. Also provided is an antifouling layer comprising such an antifouling composition. Additionally provided are an antif...  
WO/2016/204115A1
Provided is a cured object which is excellent in terms of heat resistance, crack resistance (or thermal shock resistance), adhesiveness to adherends, and adhesive property. The cured object according to the present invention is obtained ...  
WO/2016/203669A1
Provided is an adhesive film having few fish eyes, excellent mechanical strength and heat resistance, and good adhesive characteristics, the adhesive film being used in various types of surface protection films or the like. This adhesive...  
WO/2016/200337A1
Described herein are coatings and formulations thereof for coating a substrate for use in producing a lubricious coating on a substrate surface that is to be inserted into the body lumen of a subject. Said coatings all contain an adhesio...  
WO/2016/199252A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) one or more radical-polymerizable compounds, and (c) a free-radical polymerization initiator, wherein the radical-polymerizable compo...  
WO/2016/199717A1
This curable resin composition includes: a resin component having ethylenically unsaturated groups; and crosslinkable particles obtained by bonding, to surfaces of base particles, polymer graft chains having ethylenically unsaturated gro...  
WO/2016/199819A1
The present invention provides: an electronic-device-protecting film used when semiconductor devices separated into independent segments are to be sealed in the form of an array using a sealant after the semiconductor devices are redispo...  
WO/2016/199715A1
This curable resin composition includes: a resin component having at least one type of reactive functional group (ii) selected from the group consisting of a hydroxyl group, a carboxyl group, an isocyanate group, an epoxy group, an alkox...  
WO/2016/194952A1
An adhesive composition which can have excellent life performance and can have a wide margin for mounting, the composition comprising a cationically polymerizable compound, a hardening catalyst based on both an aluminum chelate and a sil...  
WO/2016/194891A1
This aqueous emulsion is obtained using a production method that includes the following steps and that satisfies the following conditions: (I) A step in which a first polymerizable component is emulsion polymerized in the presence of an ...  
WO/2016/194093A1
Disclosed is an adhesive sheet 1 for use in a battery, the adhesive sheet 1 comprising: a base material 11; a hard coat layer 12 provided on one surface side of the base material 11; and an adhesive agent layer 13 provided on a surface o...  
WO/2016/194094A1
This adhesive sheet 1A, 1B, 1C comprises: an insulating base material 11; an inorganic-filler-containing resin layer 12 that is provided on at least one surface side of the base material 11 and includes an insulating inorganic filler; an...  
WO/2016/185956A1
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin ...  
WO/2016/186017A1
Provided is a water-activated double-sided adhesive tape or sheet, wherein a water-absorbing adhesive layer 2 is provided on one surface of a water permeable substrate 1, and a water-activated adhesive layer 3 which is made slippery by a...  
WO/2016/186099A1
Provided is an electroconductive pressure-sensitive adhesive material which can have a sufficiently heightened electromagnetic-wave-shielding function even when the adherend has a rugged surface. The electroconductive pressure-sensitive ...  
WO/2016/181877A1
These flat elliptical polymer particles have a front view, a planar view, and a side view in a projection diagram based on third-angle projection which are all elliptical. The flat elliptical polymer particles satisfy (1)-(4): (1) the av...  
WO/2016/181741A1
A surface protective film 10 affixed to an optical member or an electronic member and used for protecting the surface thereof, the surface protective film being provided with a flat annular first film substrate 11, a first adhesive layer...  
WO/2016/181678A1
Provided is a silane coupling agent comprising a silane compound that has, as a basic skeleton, a fused ring that is formed by combining at least two of any single ring in formulas (1)-(3) or of one or more of formulas (1)-(4), and has a...  
WO/2016/178396A1
This adhesive composition (12) contains a coupling agent including a compound having a first functional group that reacts with an inorganic material and a second functional group that reacts with an organic material, and a cross-linking ...  
WO/2016/175611A1
The present invention relates to a resin composition for bonding semiconductors, an adhesive film for semiconductors comprising the resin composition for bonding semiconductors, a dicing die bonding film comprising an adhesion layer comp...  
WO/2016/175612A1
The present invention relates to an adhesive film, for semiconductors, having a particular property capable of improving reliability and efficiency of a semiconductor packaging process, the adhesive film better facilitating embedding une...  
WO/2016/171253A1
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...  
WO/2016/171170A1
In the present invention, a manufacturing method for a sealed semiconductor element comprises the following: a sealing step in which, a semiconductor element, which has been subjected to pressure-sensitive adhesion to a pressure-sensitiv...  
WO/2016/169190A1
Embodiments of the present invention relate to the technical field of display. Provided are a conductive adhesive composition and a preparation method therefor, a frame sealing adhesive and a display panel. The dispersion uniformity of c...  
WO/2016/171269A1
Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pr...  
WO/2016/167305A1
One objective of the present invention is to provide a cured body having excellent flexibility and reliability. A further objective of the present invention is to provide an electronic component and display element formed using said cure...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/167303A1
 Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable compo...  
WO/2016/163360A1
Provided is an adhesive tape for preventing adhesion of aquatic organisms, which sequentially comprises an antifouling layer, a base layer and an adhesive layer in this order, and wherein: the base layer is formed of a low-cost material;...  
WO/2016/158760A1
By providing an adhesive sheet that has a low water vapor permeability and a high elasticity before thermosetting, the reliabilities such as dielectric breakdown test results of an electronic equipment are improved and a method, whereby ...  
WO/2016/158412A1
The provided adhesive tape roll comprises an adhesive tape which comprises a polyvinyl chloride (PVC) film and an adhesive layer arranged on one surface of said PVC film, and which is wound in the longitudinal direction. In this adhesive...  
WO/2016/158604A1
The objective of the present invention is to provide: a near-infrared shielding film which has low initial haze and is suppressed in increase of the haze in a weather resistance test; a method for producing this near-infrared shielding f...  
WO/2016/157631A1
The purpose of the present invention is to improve the adhesiveness and tight adhesion of a composite material to substrates such as copper, silver, aluminum, silicon, and ferrite by compositing a low-melting-point glass which is used fo...  
WO/2016/158727A1
The present invention provides: a sheet for forming a resin film, which has excellent reworkability and is bonded to a silicon wafer to form a resin film on the silicon wafer, and wherein a surface (α) of the sheet, said surface being b...  
WO/2016/158411A1
A polyvinyl chloride (PVC) adhesive tape is provided which is not prone to cracking at low temperatures even when the PVC film is thin. This adhesive tape includes a PVC film and an adhesive layer arranged on at least one surface of said...  
WO/2016/158268A1
An adhesive composition sheet which comprises organic compounds and inorganic particles, the adhesive composition sheet comprising a structure obtained by superposing at least one layer A comprising an organic compound and at least one l...  
WO/2016/157594A1
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...  
WO/2016/157644A1
[Problem] To provide a means for preventing blocking in adhesive resin pellets, which are used in adhesives. Further, to provide a means for preventing blocking in adhesive resin pellets which are more adhesive and are used in adhesive t...  
WO/2016/152385A1
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...  
WO/2016/152919A1
[Problem] To provide a semiconductor processing tape which has excellent pick-up properties and in which the thermal shrinkage rate in a tape shrinkage process is low, wrinkles do not occur, and kerf width extends sufficiently without di...  

Matches 1 - 50 out of 18,357