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Matches 1 - 50 out of 22,281

Document Document Title
WO/2019/172434A1
A petroleum resin having a content of volatile organic compound ingredients of less than 100 wt ppm; and a hydrogenated petroleum resin having a content of volatile organic compound ingredients of less than 100 wt ppm.  
WO/2019/172303A1
The purpose of the first embodiment of the present invention is to provide an electrically peelable adhesive sheet that can suppress incorporation of air bubbles during adhesion, that easily prevents surface unevenness or the like, and t...  
WO/2019/171467A1
A semiconductor device according to the present disclosure is provided with: a substrate having a recess; a first semiconductor element disposed in the recess; a first sealing layer disposed so as to cover a region of the substrate that ...  
WO/2019/172439A1
Provided is a protective film-forming composite sheet, comprising: a supporting sheet comprising a substrate; and a thermosetting protective film-forming film disposed on the supporting sheet, the substrate having a loss tangent (tan δ)...  
WO/2019/171504A1
Disclosed is a temporary protective film for electronic components, which is used for the purpose of protecting a connection surface and an external connection terminal of an electronic component during the time when an electromagnetic s...  
WO/2019/171544A1
This method for producing a semiconductor device comprises: a first wire bonding step wherein a first semiconductor element is electrically connected onto a substrate by means of a first wire; a pressure bonding step wherein a second sem...  
WO/2019/172304A1
The present invention provides an electrically peelable adhesive sheet that makes it possible to produce a joined body that makes it possible to stably apply voltage to an electrically peelable adhesive layer. The electrically peelable a...  
WO/2019/167824A1
A paste adhesive composition which contains silver particles and a monomer, and forms a silver particle-linking structure in which the interfaces between the silver particles have been eliminated by a heat treatment, wherein: the silver ...  
WO/2019/167922A1
The present invention addresses the problem of providing a pressure-sensitive adhesive tape that has excellent adhesiveness and followability with respect to an adherend, particularly, to a hard adherend, that, when the pressure-sensitiv...  
WO/2019/167799A1
This pseudo-adhesive laminate is provided with a substrate and a pseudo-adhesive layer laminated on one surface of the substrate, wherein the pseudo-adhesive layer contains a thermoplastic resin, an emulsifier having a melting point of a...  
WO/2019/167819A1
A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity pro...  
WO/2019/167544A1
The purpose of the present invention is to provide a battery that is capable of suppressing melting or decomposition of a tab tape for covering an electrode tab even in the case when the temperature of the electrode tab rises to a high l...  
WO/2019/167287A1
Provided is a method for manufacturing a lead frame with a heat dissipation sheet comprising a step of bonding the heat dissipation sheet including at least an adhesive layer and an insulating layer to a lead frame on which a chip is mou...  
WO/2019/167286A1
This heat dissipation sheet for a lead frame is provided with an adhesive layer and an insulation layer, the insulation layer being in an A-stage or B-stage state.  
WO/2019/163804A1
Provided are: a curable composition giving a cured object which has high strength, high rigidity, and flexibility; and the cured object obtained by curing the curable composition. The curable composition is a multi-pack type curable comp...  
WO/2019/163788A1
Provided is a pressure-sensitive adhesive article which needs no separators and exhibits sufficient adhesive force without the need of an operation for causing the adhesive article to exhibit the adhesive force and in which the pressure-...  
WO/2019/160033A1
The present invention address the problem of providing an image display device and a photosensitive adhesive-attached circularly polarizing plate, wherein destruction of an image display panel due to the static electricity of a phase dif...  
WO/2019/159695A1
An electroconductive pressure-sensitive adhesive gel sheet which comprises: a continuous phase comprising a hydrophilic crosslinked polymer and an electrolytic solution; and hydrophobic crosslinked-polymer particles having a particle dia...  
WO/2019/155791A1
Provided is a polarizing plate which is not susceptible to the occurrence of streak unevenness even in cases where the polarizing plate has been exposed to a high-temperature high-humidity environment for a long period of time, and which...  
WO/2019/155896A1
The problem to be solved by the present invention is to provide an adhesive tape that has adhesiveness at normal temperature, is capable of actualizing excellent adhesive strength even after thermal expansion, and incurs little manufactu...  
WO/2019/155970A1
Provided is adhesive tape for semiconductor fabrication constituted by adhesive tape comprising a substrate and an adhesive layer provided on one side of the substrate, the adhesive tape being characterized in that, before energy irradia...  
WO/2019/151192A1
Provided is a method for peeling an adhesive sheet adhered to a polarization plate. The adhesive sheet is provided with an adhesive layer, wherein the adhesive layer includes a layer A that constitutes at least one surface of the adhesiv...  
WO/2019/151188A1
Provided is a conductive adhesive composition that is capable of being worked at no more than 120°C and has both isotropic conductivity and excellent adhesion properties. The conductive adhesive composition contains 50–300 parts by ma...  
WO/2019/150956A1
Provided is a semiconductor back surface contact film capable of rendering wrinkling thereof difficult when peeled off from a separator. This semiconductor back surface contact film has a planar projection area of 22500 mm2 or more, and ...  
WO/2019/151822A1
The present application provides: an adhesive composition for a foldable display, the adhesive composition comprising a thermosetting resin, an ionic salt, and a crosslinking agent and having a storage modulus of 104 Pa to 106 Pa at -30...  
WO/2019/151187A1
Provided is a conductive adhesive composition that is capable of being worked at no more than 120°C and has both isotropic conductivity and excellent adhesion properties. The conductive adhesive composition contains 50–300 parts by ma...  
WO/2019/151824A1
The present application provides an adhesive composition for a foldable display, an adhesive film using same, and a foldable display comprising same, the adhesive composition comprising a thermosetting resin and a crosslinking agent, whe...  
WO/2019/151194A1
Provided is an adhesive sheet having an adhesive layer. The adhesive layer includes a layer A that constitutes at least one surface of the adhesive layer. The adhesive sheet has: an adhesiveness N0 of at least 2.0 N/10 mm of an alkali gl...  
WO/2019/146872A1
Various embodiments of the present invention relate to a secondary battery and a manufacturing method therefor, and the objective of the present invention is to provide a secondary battery having improved safety and a manufacturing metho...  
WO/2019/146599A1
The purpose of the present invention is to provide an electroconductive adhesive composition that does not readily peel from an adherend material even when subjected to repeated temperature changes, and that furthermore has excellent the...  
WO/2019/146192A1
Provided is an adhesive tape that is not likely to become translucent even under tensile stress. This adhesive tape has an adhesive layer on at least one side of a substrate layer, and has a total light transmittance T1 at 0% elongation ...  
WO/2019/146761A1
The present invention provides an adhesion improving agent including a spider silk fibroin.  
WO/2019/146553A1
A surface protection film (10) comprises an adhesive layer (2) affixed to and laminated on a main surface of a film substrate (1). The haze of the surface protection film is 2% or lower. The adhesive strength of the surface protection fi...  
WO/2019/142791A1
One embodiment of the present invention provides an adhesive composition which contains conductive particles and a compound having a nitrogen-containing aromatic heterocycle.  
WO/2019/138799A1
This piezoelectric element unit 1 is provided with: a piezoelectric element 2 which has a function of converting a force into a voltage and a function of converting a voltage into a force; and a wiring board 3 which is electrically conne...  
WO/2019/138963A1
[Problem] Provided is a tape set capable of increasing the portion of base paper (share) used as tape, during tape molding. [Solution] This tape set 1 includes at least one each of a tape T1 and a tape T2 that extend in a longitudinal di...  
WO/2019/139171A1
A film for preventing adhesion of aquatic organisms, that is capable of: being pasted to locations where the prevention of adhesion of aquatic organisms is desired, as a result of an adhesive layer; and reducing the adhesion of aquatic o...  
WO/2018/143189A9
The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface...  
WO/2019/131923A1
One embodiment of the present invention provides an adhesive film comprising a first adhesive layer, a metal layer, and a second adhesive layer in said order, wherein the first adhesive layer and the second adhesive layer each contain fi...  
WO/2019/132369A1
Disclosed are: an adhesive sheet for effectively blocking light of an ultraviolet area without deteriorating adhesion and the transmittance of light in a visible light area; and an adhesive composition comprising a binder resin, and a li...  
WO/2019/131857A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131624A1
A polarizing plate 100 which sequentially comprises a polarizer 11, a first adhesive layer 12, a retardation layer 14, and a second adhesive layer 13 in this order, and which is configured such that if E1 (Pa) is the storage elastic modu...  
WO/2019/131852A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a linear transmit...  
WO/2019/130786A1
Provided is a dicing-tape-integrated semiconductor backing cling film that enables a semiconductor wafer to be diced without becoming chipped or peeling off of the backing cling film. This dicing-tape-integrated semiconductor backing cli...  
WO/2019/131854A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a total light tra...  
WO/2019/131904A1
One embodiment of the present invention is a method for producing a connection structure, which comprises a step wherein: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode t...  
WO/2019/131888A1
An adhesive sheet (10) for processing an electronic component has a base material (11) and an adhesive layer (12), and the adhesive layer (12) contains a cured material formed by curing an energy ray curable component.  
WO/2019/131555A1
Provided is a method for manufacturing a stacked body including an adherend, and an adhesive piece which partially covers the adherend. The manufacturing method includes, in this order: an affixing step of affixing to the adherend an adh...  
WO/2019/131856A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131218A1
The present invention provides a polarizing plate with an adhesive layer, which is thin and has extremely excellent moisture resistance. A polarizing plate with an adhesive layer according to the present invention comprises: a polarizer;...  

Matches 1 - 50 out of 22,281