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Patent Searching and Data


Matches 1 - 50 out of 23,528

Document Document Title
WO/2020/184310A1
The present invention makes it possible to provide an adhesive composition capable of suppressing adhesion enhancement even when subjected to a high-temperature heat treatment step while having high adhesive strength at the time of appli...  
WO/2020/184585A1
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest ...  
WO/2020/184584A1
A circuit-connecting adhesive film 1 comprising a first adhesive layer 2 and a second adhesive layer 3 layered upon the first adhesive layer 2, wherein the first adhesive layer 2 is formed from a cured product of a photosetting compositi...  
WO/2020/184583A1
An adhesive film 1 for circuit connection comprises a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the first adhesive layer 2 is composed of a photocured product of a photocurable ...  
WO/2020/184594A1
The present invention provides an adhesive sheet that uses an adhesive layer, to which a conductive organic polymer compound is added, and still enhances the production efficiency of a product that uses this adhesive layer. According t...  
WO/2020/184636A1
An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive laye...  
WO/2020/184155A1
Provided is a pressure-sensitive adhesive sheet which need not be photocured after application to adherends and which can combine irregularity-absorbing properties with dimensional stability. The pressure-sensitive adhesive sheet (5) is ...  
WO/2020/184161A1
Provided are: a pressure-sensitive adhesive composition capable of suppressing temporal change in the adhesive power of a pressure-sensitive adhesive and having excellent performance stability; and a lamination film that uses said compos...  
WO/2020/184657A1
Provided are: an adhesive with which it is possible to produce a polarizing plate in which it is possible to adequately suppress a reduction in light transmittance in a high temperature endurance test; and a polarizing plate obtained usi...  
WO/2020/179465A1
The purpose of the present invention is to provide a lamination film capable of preventing tearing, even when an adhesive tape oriented at a certain angle with respect to an affixed surface is to be peeled, by reducing the stress on the ...  
WO/2020/179464A1
The purpose of the present invention is to provide an adhesive tape on which it is possible to reduce a load on the adhesive tape and to prevent tearing even when peeling the adhesive tape at an angle from an adhered-to surface. The ad...  
WO/2020/179899A1
The present invention provides a die bonding sheet (101) that is provided with a base material (11) and comprises an adhesive layer (12), an intermediate layer (13), and a film-form adhesive (14) layered in the stated order on the base m...  
WO/2020/179897A1
This die-bonding sheet (101) comprises: a substrate (11); and a pressure-sensitive adhesive layer (12), an intermediate layer (13), and a film-like adhesive (14), which are laminated in this order on the substrate (11), wherein the value...  
WO/2020/179179A1
The present invention provides a conductive adhesive composition which has both isotropic electrical conduction and excellent adhesiveness, while being processable at 120°C or less. A conductive adhesive composition which contains 50-...  
WO/2020/175421A1
A thermosetting resin film according to the embodiments is a thermosetting resin film that is adhered to a workpiece surface that has protruding electrodes and is heat cured to form a first protective film on the surface, said thermosett...  
WO/2020/175187A1
An aspect of the present invention pertains to a method for producing a hot melt adhesive, the method being characterized by including: introducing, during or after kneading a liquid hot melt adhesive material, a fluid into a heating-kne...  
WO/2020/175055A1
The present invention addresses the problem of providing a conductive composition and a conductive adhesive agent that have high fluidity and conductivity. The present invention provides a conductive composition containing (A) conductive...  
WO/2020/175364A1
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sh...  
WO/2020/175958A1
The present application pertains to an encapsulation film and an organic electronic device comprising same, and provides an encapsulation film which not only has excellent moisture-blocking properties, but is also flexible and rollable, ...  
WO/2020/175493A1
[Problem] To provide: a sulfur-containing silane compound for obtaining a crosslinked product exhibiting excellent viscoelastic properties or adhesive properties without causing poor dispersion or poor mixing between an organic polymeric...  
WO/2020/175423A1
A thermosetting resin film according to the embodiments is a thermosetting resin film that is adhered to a workpiece surface that has protruding electrodes and is heat cured to form a first protective film on the surface, wherein a singl...  
WO/2020/175363A1
Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconduct...  
WO/2020/175056A1
Provided is an electroconductive adhesive having high flowability and electrical conductivity. The electroconductive adhesive comprises (A) electroconductive particles, (B) a solvent, (C) a thermosetting resin, and (D) silica particles...  
WO/2020/170908A1
A multiple package-type curable composition which comprises: an agent A that contains (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylic acid ester polymer having a reactive silicon group, and (D) an epoxy...  
WO/2020/170817A1
The present invention provides a multilayer body which is obtained by superposing a surface protective film or a reinforcing film on a carrier sheet, and which is capable of exhibiting high positioning accuracy and high inspection perfor...  
WO/2020/170977A1
The present invention pertains to: a laminate of a substrate, an adhesive sheet having an adhesive agent layer in which the adhesive force decreases due to ultraviolet rays or heat, and a two-dimensional material, wherein the adhesive fo...  
WO/2020/170820A1
Provided is a protection sheet for a Low-E glass plate that is easily discriminated on an adherend. Provided is a protection sheet for a Low-E glass plate. The protection sheet has a width of 1.5 m or more. Further, the protection sheet ...  
WO/2020/170638A1
An adhesive composition for forming an adhesive layer on the surface of a metal for adhesion with a resin that is a thermosetting resin. This composition is an aqueous solution which contains a low-molecular-weight organic compound that ...  
WO/2020/166400A1
The reinforcement film (5) comprises a photo-curing adhesive layer (2) that has been fixed and layered on one of the main surfaces of a film base material (11). Provided on the back surface of the film base material is an anti-static lay...  
WO/2020/166399A1
Provided is a reinforcement film in which reworking is easily performed immediately after bonding to an adherend, firm adhesion to the adherend is possible, and the time taken to enhance the adhesive force after bonding to the adherend c...  
WO/2020/162677A1
The present application relates to a radical-based adhesive composition, an adhesive layer, a polarizing plate, and an image display device.  
WO/2020/161355A1
A process for preparing a for preparing a prepolymer comprising a urethane group and a curable silicon-functional group and a prepolymer of formula (IV), wherein the variables are defined as in the claims, are provided. The prepolymer ma...  
WO/2020/162231A1
Provided is a novel adhesive sheet suitably used for simultaneous batch inspection of a plurality of electrically-conductive small pieces. This adhesive sheet comprises an adhesive agent layer. The adhesive agent layer has a surface resi...  
WO/2020/158351A1
This pressure-sensitive adhesive sheet 1 comprises: a substrate 2; and a pressure-sensitive adhesive layer 3 positioned on one surface of the substrate 2. The pressure-sensitive adhesive layer 3 comprises a polymerizable composition cont...  
WO/2020/158770A1
An expansion method wherein: a first adhesive sheet (10) having a first adhesive layer (12) and a first substrate (11) is adhered to a second wafer surface of a wafer having a first wafer surface and a second wafer surface, with the firs...  
WO/2020/158397A1
Provided is a polarizing plate with an adhesive layer having a novel configuration. This laminate has a polarizing plate including an ultraviolet absorber, and an adhesive layer on at least one surface of the polarizing plate, wherein ...  
WO/2020/158252A1
The present invention is a viscosity regulator for curable compositions, which contains: a diamide compound (A) that is obtained by a condensation reaction of a diamine component (A1) and a monocarboxylic acid component (A2) and/or a har...  
WO/2020/158517A1
This optical layered film having an adhesive layer includes a protective film, an optical film, an adhesive layer, and a separator layered in the given order, wherein: the optical film has a thickness of 80µm or less; the protective fil...  
WO/2020/158767A1
An expansion method comprising: adhering a first adhesive sheet (10) having a first adhesive layer (12) and a first substrate (11) to a first wafer surface (W1) of a wafer (W) having a first wafer surface (W1) and a second wafer surface ...  
WO/2020/157828A1
A resin composition comprising (a) a high-molecular-weight component having a weight average molecular weight of 10000 or more, (b) a heat-curable resin having a weight average molecular weight of less than 10000, (c) a curing agent and ...  
WO/2020/158769A1
An expansion method comprising: interposing, between a second wafer surface of a wafer having a first wafer surface and a second wafer surface and a first adhesive sheet (10) having a first adhesive layer (12) and a first substrate (11),...  
WO/2020/158414A1
Provided is a surface protective film which has high adhesive strength and high light peeling resistance, and with which it is possible to curb the occurrence of air bubbles when subjected to high-temperature high-pressure treatment by a...  
WO/2020/158766A1
An expansion method comprising a step for stretching a first sheet (10) to which a plurality of semiconductor devices (CP) are bonded and widening the interval between the plurality of semiconductor devices (CP), wherein each of the plur...  
WO/2020/158349A1
An intermediate laminate 1 comprises a pressure-sensitive adhesive sheet 4 provided with a base material 2 and a pressure-sensitive adhesive layer 3 disposed on one surface of the base material 2, and an adherend 5 disposed on one surfac...  
WO/2020/158176A1
Provided is a layered body having a surface protective film or a reinforcing film layered on a carrier sheet, wherein the base material surface of the surface protective film or the reinforcing film does not lift readily from the adhesiv...  
WO/2020/158490A1
The present invention discloses a filmy adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The filmy adhesive contains a heat-curable resin component and a labelling agent.  
WO/2020/158175A1
Provided is a layered body having a surface protective film or a reinforcing film layered on a carrier sheet, wherein the base material surface of the surface protective film or the reinforcing film does not lift readily from the adhesiv...  
WO/2020/158768A1
An expansion method comprising: adhering a first adhesive sheet (10) having a first adhesive layer (12) and a first substrate (11) to a second wafer surface of a wafer having a first wafer surface and a second wafer surface on the revers...  
WO/2020/157616A1
The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt% of a thermoplastic polymer containing carboxylic groups and epoxy...  
WO/2020/092515A3
The invention is related to high bio-based content pressure sensitive hot melt adhesive composition and use thereof. The high bio-based content pressure sensitive hot melt adhesive compositions are based on plasticizers made from renewab...  

Matches 1 - 50 out of 23,528