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Patent Searching and Data


Matches 1 - 50 out of 19,815

Document Document Title
WO/2017/179579A1
This granular adhesive contains an adhesive particle. The adhesive particle comprises a core containing an adhesive composition, a shell covering the core, and an encapsulated gas. The shell comprises a solid particle.  
WO/2017/175480A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/175481A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/170021A1
A semiconductor processing sheet comprises an adhesive agent layer on a base material, and has the following characteristics: when the adhesive agent layer has a thickness of 200 μm, the adhesive agent layer with the thickness of 200 μ...  
WO/2017/169451A1
Provided is a surface protection film that comprises an adhesive layer, a middle layer, and a back surface layer, and that is characterized in that the back surface layer comprises a polyolefin resin composition containing 0.3-10 wt% of ...  
WO/2017/171025A1
The main objective of the present invention is to provide a modified hydrocarbon resin that imparts a hot-melt adhesive composition which is low-odor, has excellent thermal stability, and has high adhesive performance. The present invent...  
WO/2017/170413A1
[Problem] To provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesiv...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/169672A1
[Problem] To provide a radio wave absorbing material having increased reflective attenuation. [Solution] A radio wave absorbing adhesive sheet is characterized in that two or more sets of laminates are stacked, the laminates comprising a...  
WO/2017/169388A1
Reinforcing adhesive (41) is applied by bringing an application surface (25) at the tip of application material (22) impregnated with the adhesive (41) using capillary action into contact with sewn parts (76) wherein airbag base material...  
WO/2017/170955A1
Provided is a composition which exhibits sufficient adhesive strength even after a high-temperature treatment. The composition comprises (1) polymerizable monomers comprising an ingredient (1-1) which is a monofunctional polymerizable mo...  
WO/2017/169387A1
A film adhesive (13) according to the present invention is a curable film adhesive. A single layer of the film adhesive (13) that has a thickness of 60 µm and that is uncured, or a laminate formed by stacking two or more layers of the f...  
WO/2017/170375A1
Provided are: a novel cyanic acid ester compound which has excellent solubility in solvents and makes it possible to produce a cured article having a low thermal expansion coefficient and excellent flame retardancy and heat resistance; a...  
WO/2017/169747A1
[Problem] To provide a film for manufacture of a semiconductor component and a film for manufacture of an electronic component which, even when used in an environment with a changing temperature, can be easily removed from a table surfac...  
WO/2017/170492A1
Provided is an inductor adhesive with which it is possible to increase humidity resistance and to suppress reduction in adhesion even when exposed to high humidity. An inductor adhesive according to the present invention includes a therm...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/170452A1
This adhesive film (50), for use in semiconductor device manufacturing, is used for temporarily fixing an electronic component (70) when sealing the electronic component (70) by means of a sealing member (60) in a semiconductor device ma...  
WO/2017/162690A1
The invention relates to a method for producing an adhesive based on a silane-modified polymer, containing at least one silyl-containing polymer, at least one compatible tacky resin and at least one catalyst. According to the invention, ...  
WO/2017/164088A1
The purpose of the present invention is to provide a display in which an adhesive having zero temperature-dependent birefringence is used to join together a glass sheet and an optical film, whereby the display does not exhibit warping or...  
WO/2017/163971A1
This supporting sheet comprises a base and an adhesive layer that is laminated on the base. The surface roughness (Ra) of the adhesive layer-side surface of the base is 0.4 μm or less; and the surface roughness (Ra) of another surface o...  
WO/2017/163721A1
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arrang...  
WO/2017/163605A1
The carbon fiber sheet (1) for reinforcement of the present invention includes carbon fiber filaments (2) arranged in parallel along one direction and a thermoplastic adhesive (4) present in at least some of each cross-section along a di...  
WO/2017/164318A1
The present invention provides an anisotropic conductive adhesive which allows for flip chip mounting of a light emission element, such as an LED chip having fine-pitch wiring, and is capable of imparting high optical characteristics, hi...  
WO/2017/159789A1
The purpose of the present invention is to provide an adhesive sheet which is formed from a dual curing adhesive composition and which has sufficiently low relative dielectric constant and excellent durability. The present invention rela...  
WO/2017/159349A1
This adhesive sheet for a molding stage is an adhesive sheet (X1) which has a layered structure comprising a substrate (11) and an adhesive agent layer (12), for example. The adhesive sheet (X1) has a piercing strength of 3.3 to 12 N as ...  
WO/2017/159343A1
An adhesive tape for semiconductor wafer processing, which comprises an adhesive layer on at least one surface of a base film, and which is characterized in that the adhesive in the adhesive layer is a radiation curable adhesive and comp...  
WO/2017/154726A1
[Problem] To provide a stretchable conductor sheet which is useful as a material for electrical wiring lines and electrodes for wearable electronic devices, said material having excellent durability in terms of washing and durability in ...  
WO/2017/154525A1
This stereoscopic display object includes a display layer having a convex portion, a filled layer, and a base material layer containing an adhesive. An edge portion that includes the display layer and the base material layer is formed ar...  
WO/2017/154734A1
The present invention comprises: a superheated steam chamber (10) for manufacturing automotive glass with a member (20) by using a superheated steam generation device (1) to cure an adhesive agent for adhering an adherend (21) having a U...  
WO/2017/155266A1
The present application relates to a display apparatus. The present application can provide a display apparatus having an improved contrast range by reducing the reflection due to external light. Such a display apparatus can be used as a...  
WO/2017/154226A1
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...  
WO/2017/150320A1
Provided are: a temporary adhesive composition which temporarily fixes substrates that can subsequently be appropriately peeled off, and which is capable of providing a laminate in which the surface condition of a substrate following pro...  
WO/2017/150203A1
The livestock papillary foramen protective patch according to the present invention is characterized by being applied to a part, of livestock, including a papillary foramen, and by comprising a layered body 1 formed of an elastic sheet 2...  
WO/2017/150330A1
Provided is a wafer processing tape that is capable of excellently delivering a label part from a rolled state by suppressing blocking of the label part with the back surface of the wafer processing tape when the wafer processing tape th...  
WO/2017/150018A1
Provided is a semiconductor processing sheet provided with a base film and a pressure-sensitive adhesive layer laminated on at least one side of the base film, the semiconductor processing sheet being characterized in that the base film ...  
WO/2017/149925A1
This semiconductor processing sheet 1 comprises at least a substrate 10, a semiconductor bonding layer 80, and a peeling film 30, wherein: a first surface 101 of the substrate 10 has an arithmetic mean roughness Ra from 0.01 to 0.8 µm; ...  
WO/2017/150675A1
This adhesive tape for semiconductor processing is used by attaching said adhesive tape to the surface of a semiconductor wafer in a step in which the rear surface of a semiconductor wafer having a groove or a modified area formed on the...  
WO/2017/150145A1
This protective film-forming composite sheet is provided with a protective film-forming film on one surface of a support sheet, and is provided with a coating layer on the surface of the support sheet on the side opposite of where the pr...  
WO/2017/145979A1
This film-shaped adhesive composite sheet is equipped, on a support sheet having a substrate, with a curable film-shaped adhesive having a thickness of 1-50 µm, and satisfies formula (1) where the adhesion strength of the film-shaped ad...  
WO/2017/145938A1
Provided is a protective film formation sheet in which: a protective film formation layer is provided on a support sheet; a peeling film is provided on the protective film formation layer; the surface roughness of the surface of the supp...  
WO/2017/145773A1
[Problem] To provide a thin pressure-sensitive adhesive tape which allows air bubbles to quickly escape from the interface with an adherend so as to suppress remaining of air bubbles at the interface, has a high adhesiveness and causes n...  
WO/2017/146103A1
Disclosed are a silane compound represented by general formula (1), and a rubber composition, a sealing agent composition, an adhesive agent composition, and a tire which contain the silane compound. The silane compound represented by ge...  
WO/2017/141621A1
An encased adhesive tape (50) which comprises: an adhesive-tape structure (60) comprising a plurality of adhesive tapes (61) that each comprise a strip-shaped base film (62) and an adhesive layer (63) disposed thereon and that have been ...  
WO/2017/141863A1
An anisotropic conductive film (10) has a structure in which an insulating resin layer (1) and a conductive-particle-containing layer (4) that has a plurality of conductive particles (3) existing therein are layered. The insulating resin...  
WO/2017/138254A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138255A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138567A1
[Problem] To improve long-term storage stability of a polymerizable composition containing an organoborane and a polymerizable monomer. [Solution] Provided is a polymerizable composition which contains an organoborane (A), a polymerizabl...  
WO/2017/138256A1
Provided are: an electroconductive adhesive composition which is suitable for use as an electroconductive bonding material for bonding, for example, a semiconductor chip (in particular, a power device) to the surface of an element-suppor...  
WO/2017/138310A1
Provided is an adhesive sheet which is able to be suppressed in changes of the characteristics of a bonding film X due to migration of an additive in the bonding film X to an adhesive tape in the adhesive sheet. The present invention pro...  

Matches 1 - 50 out of 19,815