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Matches 1 - 50 out of 22,057

Document Document Title
WO/2019/138799A1
This piezoelectric element unit 1 is provided with: a piezoelectric element 2 which has a function of converting a force into a voltage and a function of converting a voltage into a force; and a wiring board 3 which is electrically conne...  
WO/2019/138963A1
[Problem] Provided is a tape set capable of increasing the portion of base paper (share) used as tape, during tape molding. [Solution] This tape set 1 includes at least one each of a tape T1 and a tape T2 that extend in a longitudinal di...  
WO/2019/139171A1
A film for preventing adhesion of aquatic organisms, that is capable of: being pasted to locations where the prevention of adhesion of aquatic organisms is desired, as a result of an adhesive layer; and reducing the adhesion of aquatic o...  
WO/2018/143189A9
The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface...  
WO/2019/131923A1
One embodiment of the present invention provides an adhesive film comprising a first adhesive layer, a metal layer, and a second adhesive layer in said order, wherein the first adhesive layer and the second adhesive layer each contain fi...  
WO/2019/132369A1
Disclosed are: an adhesive sheet for effectively blocking light of an ultraviolet area without deteriorating adhesion and the transmittance of light in a visible light area; and an adhesive composition comprising a binder resin, and a li...  
WO/2019/131857A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131624A1
A polarizing plate 100 which sequentially comprises a polarizer 11, a first adhesive layer 12, a retardation layer 14, and a second adhesive layer 13 in this order, and which is configured such that if E1 (Pa) is the storage elastic modu...  
WO/2019/131852A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a linear transmit...  
WO/2019/130786A1
Provided is a dicing-tape-integrated semiconductor backing cling film that enables a semiconductor wafer to be diced without becoming chipped or peeling off of the backing cling film. This dicing-tape-integrated semiconductor backing cli...  
WO/2019/131854A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a total light tra...  
WO/2019/131904A1
One embodiment of the present invention is a method for producing a connection structure, which comprises a step wherein: an adhesive layer is arranged between a first electronic member which has a first substrate and a first electrode t...  
WO/2019/131888A1
An adhesive sheet (10) for processing an electronic component has a base material (11) and an adhesive layer (12), and the adhesive layer (12) contains a cured material formed by curing an energy ray curable component.  
WO/2019/131555A1
Provided is a method for manufacturing a stacked body including an adherend, and an adhesive piece which partially covers the adherend. The manufacturing method includes, in this order: an affixing step of affixing to the adherend an adh...  
WO/2019/131856A1
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention is closely adhered to...  
WO/2019/131218A1
The present invention provides a polarizing plate with an adhesive layer, which is thin and has extremely excellent moisture resistance. A polarizing plate with an adhesive layer according to the present invention comprises: a polarizer;...  
WO/2019/130539A1
An adhesive sheet (10) for affixing a semiconductor element when the semiconductor element is sealed. This adhesive sheet (10) comprises a base material (11) and an adhesive layer (12); and the adhesive layer (12) contains a cured produc...  
WO/2019/131850A1
Provided is a semiconductor back surface adhering film which has more excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a semiconductor back surface adhering layer ...  
WO/2019/131603A1
Provided is a radiation curable adhesive tape for dicing, which is capable of easily picking up even a semiconductor chip that is provided with a through electrode and the like in a pick-up step without leaving adhesive residue. A radiat...  
WO/2019/131572A1
The present invention provides a lens adhesive including a compound represented by general formula 1. In general formula 1, Ar is an aromatic ring group represented by general formula 2-2, and in the formulas, Z1 and Z2 represent hydroge...  
WO/2019/131167A1
The problem to be solved by the present invention is to provide an article manufacturing method which achieves a high degree of waterproofness by preventing wrinkles or gaps from occurring when attaching an adhesive tape to members of va...  
WO/2019/131625A1
A polarizing plate 100 which sequentially comprises a polarizer 11, a first adhesive layer 12, a retardation layer 14, and a second adhesive layer 13 in this order, and which is configured such that: the value obtained by dividing the su...  
WO/2019/131865A1
Provided is an adhesive tape or sheet with separator, comprising: an adhesive tape or sheet having a support layer and an adhesive layer laminated on top of the support layer; and a separator positioned above the adhesive layer. The sepa...  
WO/2019/131408A1
Provided is an adhesive layered body comprising: a thermally expandable adhesive sheet (I) that includes a substrate (Y1) and an adhesive layer (X1), either of which contains thermally expandable particles; and a resin film forming sheet...  
WO/2019/124494A1
The curable resin composition of this invention has, in predetermined adhesion testing, adhesive strength of at least 6 kgf/cm2 at 80°C, adhesive strength not exceeding 3.5 kgf/cm2 at 120°C, and the ratio of the volume at 120°C to the...  
WO/2019/123518A1
Disclosed is a method for manufacturing a semiconductor device, the method including: a step for pressure-bonding a first member having a connecting portion and a second member having a connecting portion at a temperature lower than the ...  
WO/2019/123943A1
The present invention provides a hydroxy compound A having a structure of general formula (1).(In formula (1), each Ar independently represents a structure having an aromatic ring having an unsubstituted or substituted group, R1 and R2 e...  
WO/2019/124268A1
Provided are a method for manufacturing a processing circuit board, and a film with an adhesive layer. Provided is a method for manufacturing a processing circuit board by subjecting the surface of a conductor circuit side of a circuit b...  
WO/2019/123886A1
An array including a plurality of tubes disposed in contact such that the axial directions thereof are parallel to each other and a test substance disposed inside at least one of the plurality of tubes; the plurality of tubes is made of ...  
WO/2019/124624A1
The present invention relates to an electromagnetic wave shielding film, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film. The electromagnetic wave shielding film a...  
WO/2019/116968A1
Provided are: a curable composition containing an oxazoline group-containing polymer (A), a zinc compound (B), and at least one compound selected from the group consisting of a compound (C) having a carboxyl group and acid anhydrides of ...  
WO/2019/116969A1
Provided are: a curable composition including an oxazoline group-containing polymer (A) and an iodine compound (B); an optical laminate including an optical film and a first cured product layer composed of a cured product formed from sai...  
WO/2019/117302A1
The present invention provides: a water-based temporary adhesive agent which comprises a thermoplastic resin having at least (A) a hydroxyl group and has both excellent temporary adhesion performance, excellent application performance, a...  
WO/2019/112033A1
This adhesive laminate is provided with: a thermally-expandable adhesive sheet (I) which has a substrate (Y1) and an adhesive-agent layer (X1) and in which any one layer contains thermally expandable particles having an expansion initiat...  
WO/2019/109328A1
Disclosed is a moisture curable hot-melt adhesive composition, comprising a silane modified polymer, a ethylenically unsaturated carboxylic acid graft modified polymer, and a tackifying agent. The moisture curable hot-melt adhesive compo...  
WO/2019/107271A1
[Problem] To provide: a resin composition in which plasma resistance is considerably enhanced regardless of the type of a matrix resin; and an electrostatic chucking device employing the same. [Solution] The present invention provides: a...  
WO/2019/107508A1
Disclosed is a semiconductor device manufacturing method comprising: a preparation step for preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorption of light, and a ...  
WO/2019/107198A1
The present invention provides: an adhesive film (1) for a semiconductor, the adhesive film (1) containing a thermosetting adhesive and 15-70% by mass of a titanium oxide filler; and an adhesive sheet (2) for a semiconductor, the adhesiv...  
WO/2019/106835A1
Provided is a resin composition containing 40-60 vol% of an inorganic filler, wherein (1) the resin composition has a thixotropic index of 1.2-10 at 25°C, has a viscosity of 3.5-50 Pa・s as measured under the conditions of 25°C and 5 ...  
WO/2019/107447A1
Provided are an adhesive agent composition that is capable of imparting high adhesive strength to a wet surface and also ensures the storage stability of a moisture-curable component, an adhesive agent layer comprising the adhesive agent...  
WO/2019/098335A1
This interlayer film for glass lamination comprises a mixture of: a component (A) which is at least one type of polymer selected from an ionomer, polybutyral, polyethylene vinyl acetate, modified polycarbonate, cellulose acetate, polygly...  
WO/2019/097367A1
The present disclosure relates to a color-changing composition comprising: a) a dye selected from the group consisting of metal complexes, wherein the metal complexes comprise: i. a central ion of a metal selected from the group consisti...  
WO/2019/093338A1
A surface S side is irradiated with an SF6 gas plasma to etch a semiconductor wafer 1 which has been peeled off in street portions, and divide the semiconductor wafer into a plurality of individual semiconductor chips. A removing agent 1...  
WO/2019/092960A1
This composition for sinter bonding includes sintered particles that contain an electrically conductive metal. The average grain size of the sintered particles is 2 μm or less, and the ratio of particles having a grain size of 100 nm or...  
WO/2019/088149A1
[Problem] To provide: a stick-on label and an adhering method for same which enable the process of adhering a holed label to a workpiece to be performed smoothly and precisely by an automated machine or the like; and a method and a facil...  
WO/2019/082966A1
The present invention pertains to a film 13 for forming a protective coating having energy-ray-curing properties. The rate of decrease (G1 - G2)/G1 × 100 of a gross value (G2) measured after the film 13 for forming a protective coating ...  
WO/2019/050195A3
The present invention relates to a method of deriving significant factors of rheological properties, which influence folding stability for developing an adhesive with excellent folding stability, and predicting folding stability through ...  
WO/2019/082974A1
This film for forming a protective coating contains an ultraviolet-curable component, the light transmittance at a wavelength of 350 nm being 20% or less, the light transmittance at a wavelength of 550 nm being 25% or less, and the light...  
WO/2019/082963A1
Provided is a film (13) for forming a protective film, wherein the film (13) for forming a protective film is an energy ray-curable film; an adhesive strength between a silicon wafer and the film (13) for forming a protective film is at ...  
WO/2019/082977A1
This film (13) for forming a protective coating is an energy ray-curable film (13) for forming a protective coating, the film (13) for forming a protective coating comprising an energy ray-curable component, and a polymer having no energ...  

Matches 1 - 50 out of 22,057