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Matches 1 - 50 out of 18,940

Document Document Title
WO/2017/104479A1
The problem to be solved by the present invention relates to a thermosetting adhesive sheet that, even without using a metal reinforcing plate considered to be a cause of increasing the thickness of electronic devices and the like, has g...  
WO/2017/104478A1
[Problem] The present invention addresses the problem of providing an easily peelable adhesive tape which has excellent adhesive strength against peeling when the tape is attached to an object to which the tape is to be attached, and mea...  
WO/2017/104834A1
The method for forming an antireflection optical body (16a) pertaining to the present invention comprises: a coating step for coating an adhesive (12), excluding an epoxy adhesive, on an adherend (11); a securing step in which a substrat...  
WO/2017/104665A1
Provided is a conductive adhesive tape which can have improved adhesiveness while maintaining electrical characteristics, and is less likely to lift or peel even when being exposed to high temperature or high humidity after being attache...  
WO/2017/098972A1
Provided are: a photocurable adhesive which is able to be applied to objects to be bonded having various shapes, while having excellent surface curability and quickly exhibiting adhesiveness after light irradiation; a product which conta...  
WO/2017/098889A1
One aspect of the present invention is a hot melt composition that includes: a modified thermoplastic polymer that has an alkoxysilyl group in the molecule thereof; a softener; and a catalyst.  
WO/2017/098890A1
One aspect of the present invention is a hot melt composition that includes a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst. A compound (an elimination compound) generated by hydrolyzing the silane coupling a...  
WO/2017/098778A1
The main purpose of the present invention is to provide an adhesive composition from which an adhesive layer having adhesion stability and oxygen-absorbing properties and reduced in odor emission can be easily formed. The present inventi...  
WO/2017/094250A1
Provided is a composition for an adhesive layer of a non-aqueous secondary battery, with which an adhesive layer, that exhibits good adhesive properties even if heated at a lower temperature and treated for a shorter time, can be obtaine...  
WO/2017/094831A1
The purpose of the present invention is to provide a light/moisture curable resin composition having excellent moist-heat resistance. The purpose of the present invention is also to provide an adhesive agent for electronic parts and an a...  
WO/2017/094252A1
Provided are: a composition for a non-aqueous secondary cell adhesive layer whereby an adhesive layer can be obtained in which degradation of adhesive properties through extended exposure to high temperatures is suppressed; a non-aqueous...  
WO/2017/094372A1
A tackifier resin which is a product obtained by reaction from a rosin (A), a ring-structure-containing compound (B) capable of reacting with the rosin, and an alcohol (C).  
WO/2017/090242A1
This composition for nonaqueous secondary battery adhesive layers contains organic particles and a water-soluble polymer; and a 1% aqueous solution of the water-soluble polymer has a viscosity of from 500 mPa·s to 9,000 mPa·s (inclusiv...  
WO/2017/090637A1
Provided is an adhesive composition which has excellent adhesive force, is suitable for laminating a polarizing element to various protective films for polarizing plates, and is excellent in terms of water resistance and resistance to co...  
WO/2017/090369A1
The present invention directly applies a resin G having pressure-sensitive adhesiveness, in a given width, to a stacking portion of a work W placed and held on a holding table 1, from a die coater 10 which is a coating member, while movi...  
WO/2017/090693A1
This adhesive composition contains (a) a thermoplastic resin, (b) a silane compound having a urethane bond and an alkoxysilyl group in one molecule, (c) a radical-polymerizable compound, and (d) a radical-polymerization initiator, and, a...  
WO/2017/086455A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load. These particles are particles used to obtain a connecting material for forming...  
WO/2017/086454A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking and peeling during a hot-cold cycle. These particles are particles used to obtain a connecting mater...  
WO/2017/086453A1
A connecting material is provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load, can further suppress thickness variation in the connection part to ...  
WO/2017/086452A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking and peeling during a hot-cold cycle, can further suppress thickness variation in the connection port...  
WO/2017/082269A1
Provided are: a method for manufacturing a laminate in which a carrier substrate can be mechanically delaminated at room temperature, voids are reduced, and an excellent peeling force stability is obtained; a method for manufacturing a s...  
WO/2017/082210A1
A method for manufacturing a semiconductor chip, said method including the following steps (a) through (d): (a) a step in which, while a mask-integrated surface protection tape is affixed to a pattern surface side of a semiconductor wafe...  
WO/2017/081716A1
This adhesive sheet is used for the purpose of bonding an unvulcanized rubber to a metal, and is provided with: a base fabric layer that is impregnated with a solvent dispersion type vulcanization adhesive which is reactive with the unvu...  
WO/2017/082418A1
Provided is an adhesive tape to be used for securing an electrode and a separator when producing a secondary cell, it being possible with the adhesive tape to secure the separator and electrode to an excellent degree while maintaining th...  
WO/2017/078055A1
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to the surface and being cured. The haze (h1) of the surface when the curable resin film is cured by being h...  
WO/2017/078157A1
This adhesive composition comprises a silane compound having a structure represented by general formula (I). (In the formula, X represents an organic group, R1 and R2 each independently represent an alkyl group, m represents an integer f...  
WO/2017/078056A1
This curable resin film is for forming a first protective film on the bump-equipped surface of a semiconductor wafer by adhering to said surface and being cured. The yellow index (YI1) when the curable resin film is cured by being heated...  
WO/2017/077809A1
This method for manufacturing a semiconductor device is characterized by including: a step in which an energy ray-curable resin layer (12) of a first protective film forming sheet (1), which comprises a first support sheet (11) and the e...  
WO/2017/078047A1
The present invention pertains to a first protective film forming sheet obtained by laminating a first adhesive layer on a first substrate and laminating a curable resin layer on the first adhesive layer. The first protective film formin...  
WO/2017/077912A1
Provided is a laminate that exhibits good adhesion properties with respect to not only conventional polyimide and polyester films but also to metal substrates and low polarity resin substrates, such as LCP, and that can attain high solde...  
WO/2017/073630A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip, a substrate and/or another semiconductor chip, and an adhesive layer interposed therebetween. This method comprises: a step for sandwichin...  
WO/2017/073671A1
The present invention provides a light emitting body protective film which is provided with a first optical film and an adhesive layer having barrier properties, and wherein the first optical film is an optical barrier film that comprise...  
WO/2017/073691A1
Provided is an adhesive layer containing composite tungsten oxide particles and/or tungsten oxide particles, a dispersant, a metal coupling agent having an amino group, an adhesive, and a crosslinking agent.  
WO/2017/073091A1
Provided is a pressure-sensitive adhesive film which is for use as various surface-protective films, etc., has few fish-eyes, is excellent in terms of mechanical strength and heat resistance, and has satisfactory pressure-sensitive adhes...  
WO/2017/069195A1
The purpose of the present invention is to provide a colored adhesive tape whereby there is no separation of a support layer and a coloration shielding layer and occurrence of ink peeling even during reworking or the like, and to provide...  
WO/2017/069050A1
Provided is an ultrasmall-sized securing tape that is suitable as a disposable tape for absorbent articles such as disposable diapers, sanitary napkins, and incontinence pads. This ultrasmall securing tape comprises an extending portion ...  
WO/2017/065072A1
The purpose of the present invention is to provide a tackifier which is superior in adhesiveness at high temperatures (high-temperature holding power) and adhesion to rough surfaces to conventional tackifiers produced using rosin acids h...  
WO/2017/065113A1
A semiconductor device 100 according to one embodiment of the present invention is provided with a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface that constitutes a circuit surfac...  
WO/2017/064925A1
This double-sided adhesive sheet has a multilayer structure including, for example, an electrolyte-containing adhesive layer (11), an adhesive layer (21), and a conducting substrate (30). This joined body comprising a double-sided adhesi...  
WO/2017/065188A1
A pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition, characterized in that the pressure-sensitive adhesive composition comprises an aliphatic polyca...  
WO/2017/065124A1
Provided is a tabbed pressure-sensitive adhesive product comprising a stretchable pressure-sensitive adhesive sheet and a tab affixed to the pressure-sensitive adhesive sheet. In this tabbed pressure-sensitive adhesive product, the tab c...  
WO/2017/065275A1
Provided is a separator-fitted adhesive tape such that a decrease in the protrusion height of weakly adhesive protruding portions provided in parts of the adhesive layer surface is suppressed sufficiently. The separator-fitted adhesive t...  
WO/2017/064918A1
Provided is an electrically peelable adhesive composition for forming an adhesive layer that has high adhesiveness and that can be easily peeled by applying voltage for a short time even when a low voltage is used. Also provided are: an ...  
WO/2017/061597A1
Provided is a metal-coated nonwoven fabric with an adhesive layer, the metal-coated nonwoven fabric being capable of attaining enhanced adhesiveness. The metal-coated nonwoven fabric with an adhesive layer according to the present invent...  
WO/2017/061416A1
Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or a...  
WO/2017/057404A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057410A1
Provided is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pro...  
WO/2017/057408A1
Disclosed is an adhesive sheet comprising a resin layer on a base material or a release material, wherein at least a surface (α) of the resin layer on the opposite side from the side where the base material or the release material is pr...  
WO/2017/057428A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the average are...  
WO/2017/057413A1
An adhesive sheet which has, on a substrate or a peel-off material, a resin layer containing a resin portion (X) including a carbon atom containing resin with, as main component, carbon atoms in the main chain of the structural unit, and...  

Matches 1 - 50 out of 18,940