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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/074557A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet containing a base polymer. This pressure-sensitive adhesive sheet (10) has a gel percentage G (%) of 90% or less, a shear storage modulus E (MPa)...
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WO/2023/074555A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet, wherein the ratio of a surface hardness H2 at 25°C, as measured by nano-indentation, at a location 100 μm away from a cut edge produced by laser...
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WO/2023/074554A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet that includes a base polymer serving as a photopolymer. After a photocurable adhesive sheet (S) is bonded to an alkali glass sheet manufactured acc...
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WO/2023/062938A1 |
A method for ejecting a resin composition is provided in which the resin composition can be effectively inhibited from curing inside a jet dispenser. This ejection method comprises using a jet dispenser 50 to eject a resin composition 20...
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WO/2023/058924A1 |
Embodiments of the present invention provide an adhesive sheet, an antenna structure comprising same, and an image display device. The adhesive sheet contains an adhesive layer of which a dielectric loss tangent at 28 GHz measured at a t...
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WO/2023/026956A9 |
When a photocurable material for forming a transparent resin layer is used as a damming agent or a filling agent in the production of an image display device in which an image display panel and a front panel are laminated with a transpar...
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WO/2023/058605A1 |
Provided are: a curable resin composition that, as the cured product, exhibits an excellent transparency to ultraviolet radiation, a high light resistance versus ultraviolet radiation, and heat resistance; and a cured product from this c...
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WO/2023/058604A1 |
Provided are: a curable resin composition giving cured objects which have excellent transparency to ultraviolet light and can have high ultraviolet light resistance and heat resistance; and a cured object obtained from the curable resin ...
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WO/2023/050111A1 |
The present invention provides a (meth) acrylate-based two-part adhesive composition, comprising: a first part comprising: at least one amine-aldehyde condensation compound, and a second part comprising: at least one organic transitional...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/054218A1 |
Proposed is a new actinic-ray-curable pressure-sensitive adhesive sheet which can have both excellent flowability and storage stability and which can exhibit such reliable freedom from bubble inclusion that the adhesive sheet does not co...
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WO/2023/047579A1 |
One aspect of the present disclosure pertains to a one component adhesive that contains a (meth)acrylate compound, an epoxy compound, and a curing agent having a secondary or tertiary amino group.
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WO/2023/042726A1 |
The reinforcing film (10) is equipped with a film base material and an adhesive layer (2) fixedly laminated on one principal surface of the film base material. The adhesive layer is composed of a photocurable composition. The photocurabl...
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WO/2023/042599A1 |
Provided is a resin composition for jet dispensing having excellent jet dispensability and curability. The resin composition includes (A) a methacrylate compound, (B) a polyfunctional thiol compound, and (C) a radical polymerization init...
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WO/2023/042745A1 |
[Problem] To provide: an organopolysiloxane composition which can undergo a curing reaction, which forms a slightly-adhesive adhesive agent layer having excellent transparency, and from which it is possible to design a heat-curable/light...
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WO/2023/042600A1 |
Provided is a resin composition having exceptional workability and stability. This resin composition includes (A) a methacrylate compound, (C) a polyfunctional thiol compound, (D) a radical polymerization initiator, and (E) an anionic po...
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WO/2023/042744A1 |
[Problem] To provide a curable reactive organopolysiloxane composition that can be made heat curable/light curable, enables design of a composition coatable even at a low solvent content and has sufficient adhesive strength, a cured prod...
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WO/2023/037185A1 |
Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer compri...
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WO/2023/038001A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/038003A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/037914A1 |
Provided is an adhesive composition suitable for a heat-peelable adhesive sheet that has sufficiently high peel strength from an adherend, can be peeled easily from the adherend through heating after process completion, and does not cont...
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WO/2023/032700A1 |
The present disclosure provides a curable composition that contains an -ene compound and a thiol compound, a resulting cured product of which can be highly flexible, and is less likely to lose preservation stability. A curable compositio...
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WO/2023/030454A1 |
The present invention provides a thermosetting resin composition, comprising an epoxy curing agent, an epoxy resin component, a free radical initiator, a reactive diluent, a toughening agent, and a polyurethane compound. The epoxy resin ...
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WO/2023/032666A1 |
The present invention addresses the problem of providing: a multilayer body of vulcanized rubbers, the multilayer body exhibiting excellent adhesion stability; a method for producing this multilayer body; and a tire which comprises this ...
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WO/2023/023966A1 |
A UV adhesive for packaging, and a preparation therefor. The UV adhesive for packaging at least comprises, in percentages by weight: 5%-26% of a modified bisphenol A epoxy resin, 16%-42% of an acrylate prepolymer and 6%-10% of inorganic ...
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WO/2023/020763A1 |
An object of the present invention is to provide an acrylic resin-containing adhesive composition having high EMI shielding performance, wherein the composition provides an EMI shielding cured product that has high impact resistant and i...
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WO/2023/017787A1 |
[Problem] To achieve an anaerobic adhesive composition with which the occurrence of coating failures during application can be suppressed. [Solution] This anaerobic adhesive composition contains a (meth)acrylic monomer, an organic peroxi...
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WO/2023/017788A1 |
[Problem] To provide an anaerobic adhesive composition containing a novel component that functions as an anaerobic curing accelerator in the anaerobic adhesive composition. [Solution] This anaerobic adhesive composition contains a (meth)...
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WO/2023/017752A1 |
The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that ar...
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WO/2023/017777A1 |
The purpose of the present invention is to provide a (meth)acrylic adhesive composition, a laminate, and a tire, in each case for which the vulcanized rubber-to-vulcanized rubber adhesiveness is excellent. The present invention is a two-...
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WO/2023/013367A1 |
This elevator floor structure has a plate, a reinforcing member arranged on one main surface side of the plate, and an adhesive layer for bonding the plate and the reinforcing member, wherein: the adhesive layer has a configuration in wh...
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WO/2023/013387A1 |
A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and compone...
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WO/2023/011938A1 |
The present invention relates to specific bismaleimide compounds, curable compositions comprising at least one of these bismaleimides and at least one specific polyimide. Furthermore, the present invention refers to a process for the man...
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WO/2023/012542A1 |
A reactive primer compound is provided that can be used as an adhesion promoter on various substrates, particularly metal-containing substrates. The reactive primer compound has a diketone group that can form chelates with various metals...
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WO/2023/008020A1 |
Provided is a dispersion composition of a chlorinated polyolefin resin, the dispersion composition being obtained using an ultraviolet-curable compound as a dispersion medium and being excellent in terms of adhesiveness and long-term sta...
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WO/2023/007401A1 |
The composition includes an acrylic monomer having a carboxylic acid group, an acrylic monomer having a hydroxyl group, at least one of an alkyl acrylate or alkyl methacrylate, and from 15 to 22 percent by weight of a compound composed o...
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WO/2023/008751A1 |
A lamination film according to one implemented embodiment comprises: a base film; an elastic layer comprising polyether-block-amide; and a primer layer interposed between the base film and the elastic layer, and thus not only has flexibi...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/001806A1 |
The invention relates to the use of a curable adhesive comprising (i) a (meth)acrylic acid, (ii) a C1 -6- alkyl (meth)acrylate, (iii) optionally, a hydroxy-C1-6-alkyl (meth)acrylate, (iv) optionally, a cycloalkyl (meth)acrylate; (v) opti...
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WO/2023/286709A1 |
A 2-cyanoacrylate adhesive composition comprising a 2-cyanoacrylate compound and a polyfunctional cyanoacrylate compound, wherein the storage modulus at 25°C of a cured product obtained by homopolymerization of the 2-cyanoacrylate compo...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/286710A1 |
A 2-cyanoacrylate adhesive composition comprising a 2-cyanoacrylate compound and a polyfunctional cyanoacrylate compound, wherein the storage modulus at 25°C of a cured product obtained by homopolymerization of the 2-cyanoacrylate compo...
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WO/2023/285760A1 |
The present invention relates to a crosslinkable two-component composition comprising: - a component A comprising: - an iodonium salt having one of the formulae (I-A), (I-B) or (I-C); - at least one (meth)acrylate monomer M1, - an organi...
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WO/2023/285759A1 |
The present invention relates to a crosslinkable two-component composition comprising: - a component A comprising: - an iodonium salt having one of the formulae (I-A), (I-B) or (I-C); - at least one (meth)acrylate monomer M1 having one o...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/282117A1 |
The present invention provides: a photocurable resin composition having a low viscosity before curing, having an excellent low-temperature storability, and producing, after curing, a film that has excellent water resistance, bending resi...
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WO/2023/276773A1 |
The present invention addresses the problem of providing a resin composition and an adhesive that have a high moisture resistance after heat curing. The present invention provides a resin composition including (A) a (meth)acrylate compou...
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WO/2023/276944A1 |
Provided is a pressure-sensitive adhesive composition which can give cured objects inhibited from changing in gel content even under high-temperature high-humidity conditions. This pressure-sensitive adhesive composition comprises a uret...
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