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WO/2022/004238A1 |
A photocurable composition which contains a (meth)acryloyloxy group-containing polyurethane (A), an ethylenically unsaturated group-containing monomer (B), an antistatic agent (C) and a photopolymerization initiator (D), wherein: the (me...
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WO/2021/260160A1 |
Cyanoacrylate compositions are provided, which when cured provide improved hot strength performance without compromising thermal resistance performance.
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WO/2021/259594A1 |
The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt.% of a) at least one ethylenically unsaturated non-ionic monomer; f...
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WO/2021/253611A1 |
Provided are an adhesive film, a composition for forming same and an electronic device. The composition comprises: a thermoplastic polymeric resin and an antistatic agent, wherein the antistatic agent is an amide organic substance as rep...
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WO/2021/256406A1 |
[Problem] To provide an adhesive set, an adhesion method, and powder, whereby adhesive curing time can be shortened. [Solution] An adhesive set 1 having: an adhesive 10 that is provided to an adhesion section 50 for a first target object...
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WO/2021/246640A1 |
The present invention relates to a method for preparing an aqueous adhesive composition, and an aqueous adhesive composition prepared thereby. According to the present invention, provided are: an aqueous adhesive composition having excel...
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WO/2021/241074A1 |
Provided is an adhesive tape for an optical component, the adhesive tape including a release liner, an optical-component-protecting adhesive strip, and a carrier strip in that order, wherein: when the release liner is peeled off from the...
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WO/2021/235406A1 |
Provided is a temporary fixing composition containing (A) to (C). (A) A (meth) acrylate containing (A-1) and (A-2). (A-1) A monofunctional (meth) acrylate whereof a side chain is an alkyl group having 18 or more carbons, and whereof the ...
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WO/2021/230371A1 |
A photo/moisture-curable resin composition comprising a radically polymerizable compound (A), a moisture curable resin (B) and a photopolymerization initiator (C), the photo/moisture-curable resin composition having a gel swelling ratio ...
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WO/2021/230372A1 |
This photo/moisture curable resin composition contains (A) a radically polymerizable compound, (B) a moisture curable resin and (C) a photopolymerization initiator. If this photo/moisture curable resin composition is applied, in the form...
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WO/2021/230373A1 |
A photo/moisture-curable resin composition according to the present invention comprises a radically polymerizable compound (A), a moisture curable resin (B) and a photopolymerization initiator (C), and after being photocured by being irr...
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WO/2021/224098A1 |
An object of the present invention is to provide an adhesive composition having excellent adhesiveness and crack resistance. The present invention relates to a conductive adhesive composition comprising (a) a (meth)acrylic acid ester mon...
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WO/2021/225167A1 |
This easily disintegrable adhesive material contains a thermosetting hyperbranched polymer (P) and a disintegration-imparting agent (Q). The thermosetting hyperbranched polymer (P) is a dual curing type thermosetting hyperbranched polyme...
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WO/2021/225163A1 |
An objective of the present invention is to provide an adhesive composition that enables an adherend to be easily removed even after having spent an extended length of time at 250°C or higher, or having undergone a high-temperature mach...
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WO/2021/220098A1 |
Provided is a method of manufacturing an adhesive that has excellent adhesion and excellent heat resistance and can reduce the amount of a solvent used, a heat-resistant shrinkable adhesive film prepared using the adhesive, and an ionizi...
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WO/2021/220200A1 |
Hot melt processable composition mixtures include an acid-functional (meth)acrylate-based adhesive composition and a zinc di-(meth)acrylate salt. The adhesive composition has a hot melt processing temperature, and the zinc salt has a mel...
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WO/2021/222194A1 |
The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can cross...
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WO/2021/222652A1 |
A composition comprising the following: a) at least one ethylene/alpha-olefin multi-block interpolymer that comprises soft segments (SS) and hard segments (HS), and wherein the interpolymer comprises the following properties: i) a melt i...
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WO/2021/219392A1 |
The present invention relates to free radical-curing (meth)acrylate resins comprising stabilizers and acidic adhesion promoters, the (meth)acrylate resins being characterized by particularly high storage stability, even at relatively hig...
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WO/2021/209698A1 |
The invention relates to a two-component composition comprising a first portion (A) comprising a borane BH3-amine complex and an alkene compound, and a second portion (B) comprising at least one radically polymerizable compound comprisin...
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WO/2021/207421A1 |
Disclosed herein is a ferrule assembly. The ferrule assembly comprises a ferrule having an inner diameter surface. The ferrule assembly also comprises an adhesion promotor coating composition comprising an amine functionality, a glycidyl...
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WO/2021/206411A1 |
Provided are: an adhesive composition comprising (i) (meth)acrylic prepolymer having a hydroxyl group and an alkyl group, and (ii) at least one of an aromatic group-containing (meth)acrylate, an alicyclic group-containing (meth)acrylate,...
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WO/2021/203234A1 |
Provided is a cyanoacrylate composition comprising at least one rubber toughening compound; and at least one β-alkoxyalkyl cyanoacrylate. The rubber toughening compound and β-alkoxyalky cyanoacrylate are well compatible with each other...
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WO/2020/167713A9 |
Two-part cyanoacrylate/free radically curable adhesive systems demonstrating improved toughness are provided. Two-part cyanoacrylate/free radically curable adhesive systems demonstrating improved toughness are provided.
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WO/2021/200404A1 |
The present invention pertains to a pressure-sensitive adhesive composition that comprises a copolymer, said copolymer having been obtained by polymerizing (A) at least one of unsaturated compounds represented by formula (1) and (B) at l...
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WO/2021/201208A1 |
The present invention addresses the problem of providing an adhesive composition which exhibits excellent adhesiveness and adhesion to various plastics such as polypropylene, polyethylene, and cycloolefin resin. The adhesive composition ...
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WO/2021/200733A1 |
The purpose of the present invention is to attain reductions in the number of steps and in necessary members in steps for producing self-luminescent display devices, such as mini/micro light emitting diode (LED) display devices, having a...
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WO/2021/198754A1 |
Pressure-sensitive adhesive compositions that contain polymer microspheres with an average particle size of 20 μm to 100 μm, the polymer microspheres synthesized using the disclosed suspension polymerization techniques and include at l...
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WO/2021/202138A1 |
In an aspect, a curable composition comprises an acid catalyzed urethane (meth) acrylate oligomer comprising an acid catalyst; a cyanoacrylate monomer; a metallocene compound; a free radical polymerization inhibitor; and an acidic anioni...
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WO/2021/200089A1 |
This ultraviolet-curable silicone adhesive composition comprises: (A) an organopolysiloxane having two specific (meth)acryloyloxy-containing groups in one molecule; (B) an organopolysiloxane resin having a specific (meth)acryloyloxy-cont...
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WO/2021/201207A1 |
The purpose of the present invention is to provide a two-component adhesive composition with which it is possible to bond a low-surface-energy resin such as polyethylene (PE), polypropylene (PP), or polytetrafluoroethylene (PTFE) in a we...
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WO/2021/191755A1 |
Crosslinked (meth)acrylate-based pressure sensitive adhesives are capable of attachment to mammalian skin for at least 10 days. The crosslinked adhesive composition includes a crosslinked (meth)acrylate-based copolymer free from polar gr...
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WO/2021/193960A1 |
A two-liquid curable adhesive composition comprising: a main agent (A) that comprises a urethane prepolymer (a1) and a (meth)acrylic compound (a2) having at least two aromatic rings in a molecule; and a curing agent (B) that comprises a ...
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WO/2021/193746A1 |
The purpose of the present invention is to provide: a method for manufacturing an adhesive sheet that can easily be designed without a decrease in productivity due to a deterioration in curability and without any changes in physical prop...
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WO/2021/181732A1 |
A curable adhesive sheet for a device, having an adhesive layer containing component (A) and component (B). The curable adhesive sheet for a device has an adhesive sheet provides a cured material having excellent low-dielectric character...
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WO/2021/182851A1 |
The present invention provides a photo-curable adhesive composition, a laminate comprising a cured layer thereof, and a substrate manufacturing method, wherein the photo-curable adhesive composition comprises: a monofunctional component ...
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WO/2021/177316A1 |
A purpose of the present invention is to provide a curable resin composition which exhibits excellent visible light curability and adhesiveness, while having excellently low liquid crystal contamination possibility if used in a sealing a...
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WO/2021/167091A1 |
An adhesive composition layer constituted of an adhesive composition which comprises a curable resin and one or more polymers comprising a copolymer of at least one (meth)acrylate monomer with at least one monomer having a copolymerizabl...
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WO/2021/168301A1 |
Water-based and solvent-based polyester-(meth)acrylate hybrid polymers that may be utilized as compostable pressure-sensitive adhesives are provided. The aqueous dispersions exhibit an improved shelf-life and provide an improvement in ha...
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WO/2021/164578A1 |
A protective film, used for protecting a screen of an electronic device, and comprising a polyurethane base film layer (11) and an adhesive layer (12), wherein the Shore hardness of the polyurethane base film layer (11) is 45-75 D, the g...
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WO/2021/162939A1 |
The invention relates to on-demand debondable pressure sensitive adhesive and laminating adhesive compositions and uses thereof. The debondable pressure sensitive adhesives and laminating adhesives are applied onto a substrate to form a ...
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WO/2021/157624A1 |
A photo/moisture curable resin composition according to the present invention contains a radically polymerizable compound, a moisture curable urethane resin and a photopolymerization initiator; the moisture curable urethane resin contain...
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WO/2021/153787A1 |
The present invention achieves a good balance between working life and adhesion. A composition which contains (1) a (meth)acrylic monomer, (2) an elastomer which does not have a (meth)acrylic group, while having a carbon-carbon double bo...
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WO/2021/152890A1 |
Provided is a double-sided adhesive tape having excellent pull-removability. A double-sided adhesive tape according to an embodiment of the present invention is composed of an acrylic adhesive, wherein the acrylic adhesive is formed fr...
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WO/2021/153405A1 |
This paste-like resin composition contains: (A) a (meth)acryloyl group-containing compound that is bifunctional or higher and has two or more linear or branched oxyalkylene group repeating units; and (B) metal-containing particles that i...
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WO/2021/150819A1 |
A curable composition including a reactive monomer or oligomer with acrylate functionality, an amine, and an alkyl peroxide. The alkyl peroxide is free or substantially free of phenyl rings. The alkyl peroxide can be dilauroyl peroxide (...
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WO/2021/148931A1 |
The present invention provides a pressure-sensitive adhesive composition, including: an acrylic copolymer and a crosslinking agent. The acrylic copolymer is a reaction product of a mixture of the following monomers: a first alkyl (meth)a...
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WO/2021/149653A1 |
The present invention addresses the problem of forming, from an active energy radiation-curable adhesive composition, an adhesive sheet that exhibits an excellent yellowing resistance. The present invention pertains to an active energy r...
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WO/2021/142751A1 |
The present invention relates to the technical field of semiconductor materials. Disclosed is an acrylic conductive adhesive, comprising the following components on the basis of 100 parts by weight: 30-84 parts of conductive particles, 1...
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WO/2021/142748A1 |
Disclosed is an epoxy-resin-based conductive adhesive, comprising the following raw materials in 100 parts by mass: 30.0-90.0 parts of conductive particles, 8.0-30.0 parts of an epoxy resin, 0.2-3 parts of an acrylate resin, 1.0-15 parts...
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