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Matches 1 - 50 out of 12,511

Document Document Title
WO/2018/066408A1
[Problem] To provide an adhesive tape for semiconductor processing which can suppress chip cracking even when used in DBG, particularly LDBG. [Solution] This adhesive tape for semiconductor processing comprises a substrate which has a Yo...  
WO/2018/066480A1
[Problem] To provide an adhesive tape for semiconductor processing which can suppress chip cracking even when used in DBG, particularly LDBG. [Solution] This adhesive tape for semiconductor processing comprises a substrate which has a Yo...  
WO/2018/066619A1
A composition which contains: (1) a polymerizable monomer containing (1-1) a tricyclic monofunctional (meth)acrylate that has three alicyclic rings, (1-2) a tricyclic bifunctional (meth)acrylate that has three alicyclic rings and (1-3) a...  
WO/2018/062524A1
Disclosed is an adhesive film 1 which is provided with an adhesive layer 12 that contains a cured product of a curable composition containing a radically polymerizable component. The radically polymerizable component contains (A1) a bifu...  
WO/2018/056458A1
The present invention relates to a multilayer film for fiber bonding and/or fiber sheet surface protection, which is obtained by laminating a layer (I) that is formed from a thermosetting composition (i) on a support film (II), and where...  
WO/2018/047776A1
[Problem] To provide a protective tape for wafers, which has excellent thermal dimensional stability and is able to be used at higher temperatures than conventional protective tapes. [Solution] A protective tape 10 which comprises: a res...  
WO/2018/047598A1
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the pr...  
WO/2018/047849A1
Provided is a light- and heat-curable resin composition that has high adhesive strength (especially high peel strength) after curing and that can also suppress reductions in adhesive strength after a post-curing moisture resistance test....  
WO/2018/049323A1
Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing ...  
WO/2018/047597A1
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...  
WO/2018/043296A1
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these chara...  
WO/2018/039325A1
Disclosed herein is a composition comprising a first low molecular weight molecule that is radically polymerizable; a second low molecular weight molecule that is ionically polymerizable; and an initiator package that comprises a free ra...  
WO/2018/038217A1
A curable resin composition for forming a light-shielding layer is provided which contains a photo radical polymerization initiator, a monomer component that includes a monofunctional monomer having one radical polymerizable group, and a...  
WO/2018/037518A1
A curable resin composition for forming a light-shielding layer is provided which contains a photo radical polymerization initiator, a monomer component that includes a monofunctional monomer having one radical polymerizable group, and a...  
WO/2018/034234A1
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least...  
WO/2018/030435A1
One purpose of the present invention is to provide an adhesive composition that exhibits superior adhesiveness and is easy to rework at low temperatures. Another purpose of the present invention is to provide a cured body of said adhesiv...  
WO/2018/027891A1
A method for making a water-based adhesive composition is disclosed. The method comprises dispersing at least one unsaturated monomer and at least one surfactant in an aqueous medium to form an emulsified mixture. The method further comp...  
WO/2018/030434A1
A purpose of the present invention is to provide an adhesive composition which has excellent adhesiveness and which facilitates low-temperature reworking. Another purpose of the present invention is to provide a cured object obtained fro...  
WO/2018/029938A1
The present invention is a two-liquid-mixing type adhesive comprising a first composition and a second composition, characterized in that the first composition comprises a complex derived from both an organoborane and a first compound, w...  
WO/2018/025715A1
[Problem] To provide a laminate film which can maintain a high degree of polarization even in a hot and humid environment. [Solution] This laminate film comprises: a polarizer layer in which a dichroic dye is oriented in a polyvinyl alco...  
WO/2018/016416A1
Provided is a pressure-sensitive adhesive which has sufficient adhesive force and is reduced in high-temperature strain. A pressure-sensitive adhesive tape including said pressure-sensitive adhesive is provided. A film substrate includin...  
WO/2018/016535A1
Provided is an adhesive composition having high adhesiveness to polyamides. The adhesive composition is for bonding adherends comprising a polyamide, and comprises the following components (1) to (4): (meth)acrylates (1) (not including a...  
WO/2018/012247A1
The present invention provides a cyclohexyl (meth)acrylate composition having high curing sensitivity by UV rays, and a UV-curable ink jet ink, a UV-curable pressure-sensitive adhesive, or a UV-curable adhesive containing the cyclohexyl ...  
WO/2018/008332A1
A radical-curable adhesive composition which comprises a rubber (a) having one or more (meth)acryloyl groups in the molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, an...  
WO/2018/008462A1
[Problem] To provide an adhesive composition having a long pot life, it being possible to cure said composition at a lower temperature than in precuring when used in the two stages of precuring and curing. [Solution] An adhesive composit...  
WO/2018/005585A1
Ionizing radiation crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers and having an acid content of no more than 3% by weight. The precursors can be exposed to a source of ionizing radiation, for examp...  
WO/2018/003682A1
Provided is a 2-cyanoacrylate adhesive composition having excellent storage stability together with actualizing an excellent adhesion rate to metals and low-polarity thermoplastic elastomers. A 2-cyanoacrylate adhesive composition contai...  
WO/2018/003511A1
The silicone rubber composition of the present invention comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl ...  
WO/2018/003704A1
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...  
WO/2018/003893A1
This adhesive film (100) for semiconductor wafer processing is sequentially provided with a base layer (10), an antistatic layer (30) and an adhesive resin layer (40) in this order, and is used for the purpose of protecting the surface o...  
WO/2018/003981A1
A composition having heat resistance, adhesiveness, and strippability is provided. The composition comprises the following components (A) to (E): component (A) is a monofunctional (meth)acrylate having a number-average molecular weight l...  
WO/2017/221694A1
The purpose of the present invention is to provide an adhesive composition which is excellent in terms of adhesiveness to low-surface-energy materials such as polyolefins and adhesiveness for bonding between materials of different kinds ...  
WO/2017/221517A1
Provided are: a photocurable resin composition having excellent moist-heat resistance and high heat resistance; and a pressure-sensitive adhesive or an adhesive each comprising the photocurable resin composition. The photocurable resin c...  
WO/2017/216108A1
The present invention is directed to a pressure sensitive adhesive comprising A) a polymer synthesized from a) 96 to 99.85% by weight, based on the total amount of monomers for the synthesis of polymer A), of two or more monoethylenicall...  
WO/2017/217749A1
The present invention relates to a binder composition for bonding, at room temperature, a soft or hard polymer thermoplastic resin material and a thermoplastic resin material having a molecular structure having the same or different phys...  
WO/2017/216913A1
This ultraviolet-curable acrylic adhesive composition, which is for forming an adhesive layer positioned between a polarization film and a cover glass or a cover plastic in an image display device, is characterized by including: a monome...  
WO/2017/213025A1
Provided is a photo-curable resin composition which comprises a radically polymerizable group-containing compound, a cationically polymerizable group-containing compound, a photoradical initiator, and a photoacid generator, wherein: the ...  
WO/2017/211044A1
Disclosed is a drainage structure with integrated waterproofing and drainage, comprising a water filtering layer and a drainage board. One side of the drainage board is provided with several drainage grooves arranged at intervals. The dr...  
WO/2017/209257A1
A purpose of the present invention is to provide a pressure-sensitive-adhesive precursor composition capable of providing a pressure-sensitive adhesive sheet which satisfies all of transparency, conformability to rugged portions, and uns...  
WO/2017/209013A1
Provided is a photocurable resin composition for an interlayer film of laminated glass which includes a (meth)acrylic polymer, a (meth)acrylic monomer, and a photoinitiator. The photocurable resin composition may further include a plasti...  
WO/2017/202698A1
Two-part cyanoacrylate compositions, methods for making same, and uses therefor are described. The compositions can be used to bond a variety of substrates including plastics and metals. The compositions remain effective after thermal ag...  
WO/2017/205445A1
Provided herein are adhesive compositions comprising a polyurea-poly(meth)acrylate interpenetrating polymer network. Further provided are two-part curable adhesive compositions comprising a Part A initiator composition and a Part B activ...  
WO/2017/203783A1
The present invention pertains to a curable composition which simultaneously ensures adhesive strength to an inorganic substrate and an organic substrate, and which is characterized by containing a (meth)acrylic oligomer (component A) ha...  
WO/2017/196765A1
The present invention provides adhesive compositions, sometimes in a two part configuration which includes a first part containing a (meth)acrylic component, an organic peroxide and a silsesquioxane and a second part containing a (meth)a...  
WO/2017/195711A1
An adhesive tape 100 for processing semiconductor substrates according to the present invention is characterized by comprising a base material 4 and an adhesion layer 2 stacked on one surface of the base material 4, wherein the base mate...  
WO/2017/196804A1
An adhesive is provided that has superior bonding strength and that can be beneficially used as a structural adhesive and, when formed into a sheet shape, has superior shape retention. The adhesive includes an acrylic polymer; an epoxy r...  
WO/2017/195517A1
Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connect...  
WO/2017/191835A1
Provided is an adhesive sheet having good adhesion in a normal state, excellent release properties when releasing from an adherend, and excellent nonflammability. This adhesive sheet is provided with an adhesive layer having a surface A ...  
WO/2017/184986A1
The present teachings contemplate a method comprising coating an polymeric material with a composition including a dicarbonyl compound and having a viscosity of from about 50 cps to about 500 cps, wherein the coating initiates either: (i...  
WO/2017/183333A1
Disclosed is an active-energy-ray-curable adhesive composition comprising at least a radical-polymerizable compound, the active-energy-ray-curable adhesive composition being characterized in that the radical-polymerizable compound includ...  

Matches 1 - 50 out of 12,511