Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 12,628

Document Document Title
WO/2018/127332A1
The present invention relates to a composition useful for manufacturing pressure sensitive adhesives, "PSAs", and the use of said PSAs, especially in the medical field. The invention also relates to a method for manufacturing adhesive ar...  
WO/2018/119625A1
A strong adhesive is prepared by using the following raw materials in parts by weight: 3.6 to 5.8 parts of ethylene glycol, 5.6 to 7.4 parts of styrene, 2.5 to 4.6 parts of tetrahydrofuran, 5.6 to 8.3 parts of butyl acrylate, 4.1 to 6.3 ...  
WO/2018/119849A1
Photo-curable adhesive composition and the cured product thereof are described herein. The photo-curable adhesive composition comprises hydrophobic urethane (meth) acrylate polymers, a (meth) acrylate monomer or (meth) acrylamide monomer...  
WO/2018/118905A1
Crosslinkable compositions are provided that contain a) a polymeric material having at least two terminal dithiocarbamate groups or two terminal dithiocarbonate groups and b) a monomer composition that includes at least a crosslinking mo...  
WO/2018/118767A1
Pressure sensitive adhesives which can be converted to form structural adhesives are described. The pressure sensitive adhesives include a blend of acrylic PSA resins in combination with one or more particular urethane (meth)acrylate oli...  
WO/2018/119040A1
A fastener sealing material for application to miniature and sub-miniature fasteners is formulated from a liquid applied acrylate material. The liquid applied acrylate material is cured using an ultraviolet or LED light source, without t...  
WO/2018/110666A1
Provided is a composition having a low curing shrinkage, which contains the components (A)-(D) described below. (A) 100 parts by mass of an oligomer which has a (meth)acryloyl group, while having a diene skeleton or a hydrogenated diene ...  
WO/2018/110705A1
Provided is a composition having exceptional adhesiveness to difficult adherends such as polyolefins. The means of solution is a composition containing (1) and (2) below, where the content ratio of (1-1), (1-2), and (1-3) is (1-1):(1-2):...  
WO/2018/104053A1
The present invention relates to a reactive adhesives film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin and (c) a reagent selected from an initiator, in particular a free-radical in...  
WO/2018/102267A1
Cationic or zwitterionic polymer adhesives, adhesive articles, aqueous polymerizable pre-adhesive reaction mixtures, and methods of preparation that include internal incorporation of a hydrocarbon tackifier. An aqueous polymerizable pre-...  
WO/2018/101421A1
The present invention relates to an adhesive composition for affixing a protrusion surface of a substrate sheet [I] having a protrusion surface having a surface roughness Ra of 0.1-100 µm, and a flat surface of a substrate sheet [II] ha...  
WO/2018/102179A1
The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt% C1-C9 alkyl(meth)acrylate, about 40 to about 99 wt% C10-C24 (meth)acrylate, about 0 to a...  
WO/2018/101252A1
The present invention provides a novel photocurable composition that, when heated to a hot-meltable temperature, is capable of conforming to, and filling every corner of uneven portions of a bonding surface, and after being photo-cured, ...  
WO/2018/095823A1
Useful articles, such as coatings, adhesives, printed graphics, 3D printed articles and molded articles are prepared by curing compositions containing one or more salts of ethylenically unsaturated carboxylic acids comprising six or more...  
WO/2018/087743A1
[Problem] To provide a moisture-curable resin composition which highly rapidly cures with moisture and to provide an assembled component including a cured object obtained from the moisture-curable resin composition. [Solution] A moisture...  
WO/2018/089494A1
A one part curable adhesive composition that includes a multifunctional (meth)acrylate oligomer the homopolymer of which has a glass transition temperature (Tg) of at least 100 °C, and a first (meth)acrylate monomer exhibiting a viscosi...  
WO/2018/086285A1
A photo-thermal dual-curing optical adhesive for gluing of capacitive touch screens, consisting of the following components in percentage by weight: 30%-50% of a main resin, 30%-50% of a plasticizing resin, 10%-35% of an active monomer, ...  
WO/2018/084308A1
Provided is an adhesive composition which is cured by an active energy ray, while having excellent adhesive force. This adhesive composition contains the following components (A) to (C). (A) 100 parts by weight of a (meth)acrylic polymer...  
WO/2018/079634A1
The present invention provides a liquid dispersion that contains water as a dispersion medium, chlorinated rubber as a dispersed material, and a compound having a polymerizable group, wherein: the sum amount of the chlorinated rubber and...  
WO/2018/066408A1
[Problem] To provide an adhesive tape for semiconductor processing which can suppress chip cracking even when used in DBG, particularly LDBG. [Solution] This adhesive tape for semiconductor processing comprises a substrate which has a Yo...  
WO/2018/066480A1
[Problem] To provide an adhesive tape for semiconductor processing which can suppress chip cracking even when used in DBG, particularly LDBG. [Solution] This adhesive tape for semiconductor processing comprises a substrate which has a Yo...  
WO/2018/066619A1
A composition which contains: (1) a polymerizable monomer containing (1-1) a tricyclic monofunctional (meth)acrylate that has three alicyclic rings, (1-2) a tricyclic bifunctional (meth)acrylate that has three alicyclic rings and (1-3) a...  
WO/2018/062524A1
Disclosed is an adhesive film 1 which is provided with an adhesive layer 12 that contains a cured product of a curable composition containing a radically polymerizable component. The radically polymerizable component contains (A1) a bifu...  
WO/2018/056458A1
The present invention relates to a multilayer film for fiber bonding and/or fiber sheet surface protection, which is obtained by laminating a layer (I) that is formed from a thermosetting composition (i) on a support film (II), and where...  
WO/2018/047776A1
[Problem] To provide a protective tape for wafers, which has excellent thermal dimensional stability and is able to be used at higher temperatures than conventional protective tapes. [Solution] A protective tape 10 which comprises: a res...  
WO/2018/047598A1
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the pr...  
WO/2018/047849A1
Provided is a light- and heat-curable resin composition that has high adhesive strength (especially high peel strength) after curing and that can also suppress reductions in adhesive strength after a post-curing moisture resistance test....  
WO/2018/049323A1
Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing ...  
WO/2018/047597A1
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...  
WO/2018/043296A1
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these chara...  
WO/2018/039325A1
Disclosed herein is a composition comprising a first low molecular weight molecule that is radically polymerizable; a second low molecular weight molecule that is ionically polymerizable; and an initiator package that comprises a free ra...  
WO/2018/038217A1
A curable resin composition for forming a light-shielding layer is provided which contains a photo radical polymerization initiator, a monomer component that includes a monofunctional monomer having one radical polymerizable group, and a...  
WO/2018/037518A1
A curable resin composition for forming a light-shielding layer is provided which contains a photo radical polymerization initiator, a monomer component that includes a monofunctional monomer having one radical polymerizable group, and a...  
WO/2018/034234A1
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least...  
WO/2018/030435A1
One purpose of the present invention is to provide an adhesive composition that exhibits superior adhesiveness and is easy to rework at low temperatures. Another purpose of the present invention is to provide a cured body of said adhesiv...  
WO/2018/027891A1
A method for making a water-based adhesive composition is disclosed. The method comprises dispersing at least one unsaturated monomer and at least one surfactant in an aqueous medium to form an emulsified mixture. The method further comp...  
WO/2018/030434A1
A purpose of the present invention is to provide an adhesive composition which has excellent adhesiveness and which facilitates low-temperature reworking. Another purpose of the present invention is to provide a cured object obtained fro...  
WO/2018/029938A1
The present invention is a two-liquid-mixing type adhesive comprising a first composition and a second composition, characterized in that the first composition comprises a complex derived from both an organoborane and a first compound, w...  
WO/2018/025715A1
[Problem] To provide a laminate film which can maintain a high degree of polarization even in a hot and humid environment. [Solution] This laminate film comprises: a polarizer layer in which a dichroic dye is oriented in a polyvinyl alco...  
WO/2018/016416A1
Provided is a pressure-sensitive adhesive which has sufficient adhesive force and is reduced in high-temperature strain. A pressure-sensitive adhesive tape including said pressure-sensitive adhesive is provided. A film substrate includin...  
WO/2018/016535A1
Provided is an adhesive composition having high adhesiveness to polyamides. The adhesive composition is for bonding adherends comprising a polyamide, and comprises the following components (1) to (4): (meth)acrylates (1) (not including a...  
WO/2018/012247A1
The present invention provides a cyclohexyl (meth)acrylate composition having high curing sensitivity by UV rays, and a UV-curable ink jet ink, a UV-curable pressure-sensitive adhesive, or a UV-curable adhesive containing the cyclohexyl ...  
WO/2018/008332A1
A radical-curable adhesive composition which comprises a rubber (a) having one or more (meth)acryloyl groups in the molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, an...  
WO/2018/008462A1
[Problem] To provide an adhesive composition having a long pot life, it being possible to cure said composition at a lower temperature than in precuring when used in the two stages of precuring and curing. [Solution] An adhesive composit...  
WO/2018/005585A1
Ionizing radiation crosslinkable pressure sensitive adhesive precursors containing hydrocarbon tackifiers and having an acid content of no more than 3% by weight. The precursors can be exposed to a source of ionizing radiation, for examp...  
WO/2018/003682A1
Provided is a 2-cyanoacrylate adhesive composition having excellent storage stability together with actualizing an excellent adhesion rate to metals and low-polarity thermoplastic elastomers. A 2-cyanoacrylate adhesive composition contai...  
WO/2018/003511A1
The silicone rubber composition of the present invention comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl ...  
WO/2018/003704A1
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...  
WO/2018/003893A1
This adhesive film (100) for semiconductor wafer processing is sequentially provided with a base layer (10), an antistatic layer (30) and an adhesive resin layer (40) in this order, and is used for the purpose of protecting the surface o...  
WO/2018/003981A1
A composition having heat resistance, adhesiveness, and strippability is provided. The composition comprises the following components (A) to (E): component (A) is a monofunctional (meth)acrylate having a number-average molecular weight l...  

Matches 1 - 50 out of 12,628