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WO/2017/021085A1 |
The invention relates to a reactive adhesive film system comprising a first reactive adhesive film (A) and a second reactive adhesive film (B); the use of the reactive adhesive film system described herein to glue together materials havi...
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WO/2017/022285A1 |
Provided is a method for manufacturing an optical member with which it is possible to improve the fit between a first member and a second member that are optically transparent. The present invention comprises: a temporary-curing step for...
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WO/2017/019622A1 |
An apparatus (100) comprising: first and second structural parts (102, 104) that are formed of a rigid material or a semi-rigid material; and a bond comprising a first adhesive (304) and at least one conductive member (502) disposed in a...
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WO/2017/016694A1 |
The invention relates to a textile protective material, in particular providing protection against radioactive harmful and/or toxic substances and/or against biological harmful and/or toxic substances and/or against chemical harmful and/...
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WO/2017/013914A1 |
Provided is an adhesion technique for delaminating a material of interest while satisfying the requirements for the reliability assurance temperature for the material, with a view to reproduce the material. A double-sided adhesive tape c...
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WO/2017/006854A1 |
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...
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WO/2017/002315A1 |
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material...
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WO/2017/001592A1 |
The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adh...
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WO/2016/207702A1 |
A method for bonding, and bonded assembly thereof, a cover layer to a display layer using a bonding material, comprising placing a peripheral spacer dam for confining the bonding material, wherein said dam has a substantially rectangular...
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WO/2016/204034A1 |
Provided is a film application method which can prevent the intrusion of foreign bodies and air bubbles onto an adhering surface even when the film is applied in a general environment where foreign bodies such as dust are present. This f...
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WO/2016/198319A1 |
The invention relates to a method for connecting sealing strips, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealin...
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WO/2016/186837A1 |
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a...
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WO/2016/182655A1 |
The present invention relates to isocyanate free, moisture curable hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.
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WO/2016/179010A1 |
Films comprising a resin matrix, an entanglement polymer, and a latent curative, wherein the resin has a functionality of at least 2.0 and a viscosity of at least 0.1 Pascal-seconds, and the film is dimensionally stable at 25°C. The fil...
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WO/2016/177726A1 |
A method for structuring a layer is provided in various exemplary embodiments. The method for structuring a layer comprises forming (001) an adhesive layer (104) on a first substrate (102) in such a way that the first substrate (102) has...
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WO/2016/174122A1 |
The invention relates to a method for sealing oxide protective layers on metal substrates using aqueous compositions containing a copolymer or a copolymer mixture of at least one aliphatic and acyclic alkene with at least one α,β-unsat...
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WO/2016/171939A1 |
The present invention is a layered optically clear adhesive including a first pressure-sensitive optically clear adhesive, a second pressure-sensitive optically clear adhesive, and a flowable optically clear adhesive positioned between t...
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WO/2016/170776A1 |
In the present invention, an adhesive is molded in elongated fashion, and an adhesion-preventive treatment is then performed on the surface of the adhesive. The adhesive subjected to the adhesion-preventive treatment is wound and stored ...
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WO/2016/171170A1 |
In the present invention, a manufacturing method for a sealed semiconductor element comprises the following: a sealing step in which, a semiconductor element, which has been subjected to pressure-sensitive adhesion to a pressure-sensitiv...
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WO/2016/165691A1 |
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...
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WO/2016/167133A1 |
This adhesive sheet (X1) has an adhesive-agent layer (1) curable by radiation exposure and including an acrylic copolymer, a basic monomer, and a photopolymerization initiator. The acrylic copolymer in the adhesive-agent layer (1) includ...
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WO/2016/165230A1 |
Disclosed are a temporary bonding glue for wafer backgrinding, a preparation method of the temporary bonding glue and bonding and de-bonding methods. The temporary bonding glue comprises a base resin for producing an adhesive effect, whe...
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WO/2016/167931A1 |
The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functional wax, functional olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in di...
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WO/2016/167303A1 |
Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable composit...
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WO/2016/163514A1 |
Disclosed is an adhesive sheet comprising a base member 1 and an expansive adhesive agent layer 2 formed on one surface or both surfaces of the base member 1, wherein the expansive adhesive agent layer 2 comprises: an epoxy resin that co...
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WO/2016/162394A1 |
The present invention relates to a method for adhesively bonding substrates, said method comprising the following steps: • I) at least one adhesive component (a) and at least one isocyanate component (b) are applied between at least tw...
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WO/2016/155886A1 |
The invention relates to a component with a thermosetting matrix network which is expanded and functionalized by a chemical substitution reaction in the application area of a first product, for example a reagent, the matrix network havin...
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WO/2016/158268A1 |
An adhesive composition sheet which comprises organic compounds and inorganic particles, the adhesive composition sheet comprising a structure obtained by superposing at least one layer A comprising an organic compound and at least one l...
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WO/2016/153663A1 |
The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable ...
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WO/2016/152598A1 |
A kit which can suppress residue from a temporary adhesive in semiconductor manufacturing, and a laminate body are provided. This kit for semiconductor device manufacture is provided with a composition containing a solvent A, a compositi...
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WO/2016/148110A1 |
The present invention provides an adhesive tape for semiconductor processing, which does not leave adhesive residue when the adhesive tape for semiconductor processing is removed from a wafer surface after back polishing, especially in a...
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WO/2016/146511A1 |
The invention relates to a method of welding of at least two metal-based materials (5, 7), non-weldable directly to each other with resistance welding. At least one spacer (6) is joined by welding on at least one of the two surfaces of a...
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WO/2016/146498A1 |
The invention relates to a method for bonding a substrate surface (2) of a substrate to an adhesive substance surface (4) of an adhesive substance (3), by generating a low-temperature plasma in a low-temperature plasma generator, activat...
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WO/2016/148004A1 |
According to the present invention, a light emitting device is manufactured by bonding an LED element 52 on a wiring substrate 51 with an anisotropic conductive adhesive 50 being interposed therebetween. During the production of this dev...
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WO/2016/143360A1 |
The purpose of the present invention is to provide a cationically photopolymerizable composition which is capable of ensuring a sufficient working life, while being capable of reducing the curing completion time required after the elapse...
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WO/2016/142966A1 |
This adhesive sheet is an adhesive sheet for bonding an unvulcanized rubber to a metal, and is provided with: a mold release film which is composed of a first film layer formed from a polypropylene and a second film layer formed from a p...
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WO/2016/139278A1 |
The invention relates to a method for sealing a substrate having one or a number of electrically conductive surface regions, comprising the (i) arranging of a sealing membrane, having a plastic layer and an outer adhesive layer made of a...
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WO/2016/126949A1 |
The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27 % by weight of a tackifying agent and a wax.
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WO/2016/121815A1 |
A composition for forming easy-to-detach thin resin films, characterized by comprising a urethane (meth)acrylate compound and either a first polymerizable composition comprising a free-radical polymerization initiator and an ethylenic mo...
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WO/2016/123011A1 |
The invention provides anaerobic curable compositions comprising a (meth)acrylate component, at least a portion which comprises a (meth)acrylate-functionalized bio-renewable oleaginous polyurethane polymer, and methods of their productio...
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WO/2016/121651A1 |
Provided is a material capable of being repeatedly used as an adhesive. This photosensitive composite material contains a polymer compound, a liquid crystal compound, and a photosensitive compound. The molecular shape of the photosensiti...
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WO/2016/117613A1 |
To connect an electronic component at low temperatures by using a photocurable adhesive and to prevent alignment deviation of the electronic component. A method for producing a connected body, which comprises: an adhesive arrangement ste...
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WO/2016/117045A1 |
Disclosed are: a pressure-sensitive adhesive sheet which includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is a layer formed by curing a solvent-free curable resin composition by irradiation with...
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WO/2016/117605A1 |
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can increase adhesiveness, moisture-resistant adhesion reliability, and...
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WO/2016/117526A1 |
A method for producing an image display device having a protective plate adhered to a liquid crystal display unit equipped with a liquid crystal display cell, a polarizing plate, and a sealed body or a housing, the method involving: (A) ...
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WO/2016/117350A1 |
Provided is an anisotropic conductive film with superior insulation between neighboring terminals and superior conductivity for long periods between connected terminals, even when connected to substrates that have been anti-corrosion tre...
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WO/2016/117606A1 |
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can reduce outgassing upon exposure to high temperatures and can increa...
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WO/2016/114194A1 |
The purpose of the present invention is to provide a bonded structure wherein whether members are suitably bonded to each other can be determined, a method for manufacturing the bonded structure, and a bonding state detection method. A b...
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WO/2016/111108A1 |
Provided is a structure surface antifouling method capable of decreasing work load, increasing work accuracy and reducing contamination during work, and whereby an excellent antifouling property can be exerted. Also provided is a sealing...
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WO/2016/104977A1 |
Provided are an adhesive bonding composition for optical use and a multistage curing method, the composition comprising a methacrylate-based monomer and an acrylate-based monomer, wherein a weight ratio of the methacrylate-based monomer ...
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