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WO/2023/188521A1 |
The present invention addresses the problem of providing a wafer production method that makes it possible to remove an adhesive material from a laminate that comprises a wafer and the adhesive material more simply and stably than convent...
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WO/2023/190264A1 |
The present invention addresses the problem of providing: a novel triazole compound; a method for synthesizing the triazole compound; and a coupling agent. A triazole compound according to the present invention is represented by chemical...
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WO/2023/192341A1 |
A composition includes particular amounts of a first solvent selected from benzaldehyde, 1,3-dioxolane, tetrahydropyran, 4-picoline, ethyl benzoate, methyl benzoate, or a combination thereof; a second solvent selected from cyclic ketones...
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WO/2023/191017A1 |
The present invention pertains to a sensor package that comprises a first substrate and an optical fiber having an FBG sensor unit disposed on the first substrate. The sensor package has a resin part located on the first substrate, a fir...
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WO/2023/182296A1 |
A method for producing a seamless garment according to the present disclosure comprises: a step for preparing a reactive hot melt adhesive containing a urethane polymer that has a polymer chain including a structural unit derived from a ...
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WO/2023/182285A1 |
The non-sewn clothing manufacturing method according to the present disclosure comprises a step of preparing a urethane prepolymer-containing reactive hot-melt adhesive, a step of forming an adhesive layer by melting the reactive hot-mel...
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WO/2023/178856A1 |
Disclosed herein is a method for efficiently producing formaldehyde-free veneer manufactured boards, comprising steps of: using wood or non-wood veneer as a raw material; controlling the moisture content of the veneer to within an approp...
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WO/2023/176768A1 |
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide comp...
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WO/2023/176964A1 |
This adhesion method is for adhering adherend 1 formed from resin (1) and adherend 2 formed from resin (2) different from the resin (1) to each other, the method having: a step for obtaining a laminate by laminating the adherend 1, a hot...
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WO/2023/176800A1 |
The present invention relates to: an easily dismantled adhesive sheet that has an adhesive layer containing an inorganic swelling agent and a resin, the adhesive force of the adhesive layer being 1.0 N/20 mm or more; a laminate that uses...
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WO/2023/171615A1 |
This aqueous dispersion contains a resin component, a wetting agent, and water. The resin component contains an ethylene-unsaturated carboxylic acid copolymer. The wetting agent contains a silicon-based wetting agent and an acetylene-bas...
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WO/2023/152209A1 |
The invention relates to a method for arranging a strand-like element (10) in a continuous recess (12) of a substrate (14), comprising the method steps of: a) producing or providing an adhesive element (16) comprising an adhesive layer (...
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WO/2023/153332A1 |
Provided are: a resin material for joining that can be suitably used to join resin materials together or a resin material and a metal material without using rivet fastening or other mechanical joining; a method for manufacturing the resi...
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WO/2023/153062A1 |
An adhesive structure in which at least a portion of the surface thereof comprises an inorganic material, the elastic modulus of the surface is in the range of 0.01 GPa to 50 GPa, and the adhesive force, when a nanoindenter is used to pr...
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WO/2023/153061A1 |
An adhesive structure (1) that is provided with a substrate (2) and triangular wave-shaped protrusions (3) provided to the surface of at least a portion of the substrate (2), and that comprises an inorganic material, wherein the average ...
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WO/2023/078744A9 |
The present invention relates to an insulation system (10), in particular for thermal insulation of buildings, comprising at least one insulation panel bonded to the substrate by means of an adhesive, wherein the at least one insulation ...
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WO/2023/145360A1 |
Provided is a peelable surface protective sheet which adheres well to an object to be treated when the object is treated, and allows for peeling without damaging or deforming an adherend when peeled off. Provided is a surface protective ...
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WO/2023/145504A1 |
A foaming adhesive sheet comprising a first adhesive layer that contains a curable adhesive and a foaming agent, and a second adhesive layer that is disposed on one surface of the first adhesive layer, contains a curable adhesive, and do...
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WO/2023/136045A1 |
In this adhesive bonding device, a mixing device mixes a main agent and a hardener agent using a stirring impeller to form an adhesive agent (530) inside a mixing container. A pressing device (200a) causes a first member (610) to which t...
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WO/2023/135855A1 |
The present invention provides a composition for thin layer glass temporary fixation with which it is possible to stably and temporarily fix pieces of thin layer glass to each other without reducing the absorption of hydrofluoric acid an...
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WO/2023/127667A1 |
Provided is a method for manufacturing a joined body by joining, in the following order, a base material A, a film containing, as a main component, an amorphous thermoplastic resin that is at least either a thermoplastic epoxy resin or a...
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WO/2023/127666A1 |
A method for producing a bonded body that is obtained by sequentially bonding a base material A, a solid bonding agent which is mainly composed of an amorphous thermoplastic resin that is composed of at least either a thermoplastic epoxy...
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WO/2023/127701A1 |
This vinyl alcohol copolymer includes vinyl alcohol structural units and olefin structural units. In the copolymer, the storage modulus at 140°C according to dynamic viscoelasticity measurement in conformance with JIS K7244-4:1999 is 3....
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WO/2023/127668A1 |
A method for manufacturing a joined body which is obtained by joining, in the following order, a resin A, a film that has as the main component thereof an amorphous thermoplastic resin which is at least one of a thermoplastic epoxy resin...
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WO/2023/119029A1 |
Thermally de-bondable adhesives are formed from curable compositions that have a two-stage curing mechanism. The first stage of curing forms a pressure sensitive adhesive and the second stage of curing, reduces the adhesion of the adhesi...
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WO/2023/110513A1 |
The present invention relates to a curable two-step and two-part adhesive composition comprising a first part comprising: at least one (meth)acrylate monomer comprising OH-group; an urethane (meth)acrylate oligomer; a rubber; an adhesion...
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WO/2023/111839A2 |
The present disclosure provides inventive apparatus for dispensing adhesive. In one embodiment, the apparatus comprises: a housing body including a cavity and an aperture, wherein the housing body includes an angled internal surface; an ...
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WO/2023/111958A1 |
An adhesive system comprising a tape and an activator, wherein the activator includes an oxidizing agent and is a liquid at normal temperature and pressure; and wherein the tape includes a curable adhesive free-standing film adjacent to ...
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WO/2023/111849A2 |
The present disclosure provides inventive nozzles and applicators for dispensing adhesive. These nozzle comprise: a main body cavity and a cap releasably attached to the main body cavity; wherein the cap includes spaced orifices for disp...
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WO/2023/104669A1 |
A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising: (a) applying to the bonding surface of at least the first substrate a redox-active metal c...
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WO/2023/106239A1 |
This adhesive configuration includes multiple adhesive regions (AR) in which an adhesive agent (3) has different thicknesses depending on multiple required adhesion performances for an adhesive section.
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WO/2023/100461A1 |
The present invention addresses the problem of making it possible to reliably achieve strong adhesion between a substrate and a print layer during use, to make it easier to remove/separate a print layer from a resin substrate and a seala...
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WO/2023/100863A1 |
Provided is a pressure-sensitive adhesive layer and/or an adhesive layer which, before application to members, has excellent handleability and which, after application to the members, has excellent flexibility. The pressure-sensitive a...
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WO/2023/100861A1 |
The present invention provides a pressure-sensitive adhesive and/or an adhesive which can be more flexibly changed by an external stimulus at an arbitrary timing. Provided is a release liner-equipped pressure-sensitive adhesive sheet and...
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WO/2023/101160A1 |
The present invention relates to a method for manufacturing a graphite crucible using a graphite sheet, the method being characterized by comprising the steps of: cutting a graphite sheet; applying a foamed adhesive to the surfaces of gr...
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WO/2023/100864A1 |
The present invention provides an adhesive layer and/or a bonding agent layer, which exhibits excellent handling properties before adhesion or bonding to a member, while exhibiting excellent flexibility after adhesion or bonding to the m...
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WO/2023/099973A1 |
Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is de...
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WO/2023/083685A1 |
The invention relates to a method for bonding at least one sheet-metal part having a zinc-based corrosion-protection coating, with a further sheet metal or sheet-metal part, an epoxy adhesive being used for bonding. A silicon-containing ...
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WO/2023/074169A1 |
A primer layer-forming composition for forming a primer layer having a cleavage structure in which chemical bonds are irreversibly cleaved in response to external stimuli, the composition containing a film-forming component and a solvent...
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WO/2023/062296A1 |
The invention relates to a method for joining two sheet-metal parts (2, 3) together by adhesive bonding and welding along a join line (4), comprising the following successive steps: - partially inserting at least one self-piercing rivet ...
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WO/2023/063211A1 |
A bonding method according to the present invention is for bonding a bush to a bonding member and comprises: an adhesive applying step of applying an adhesive to the portion of a cushioning member to be bonded to the bonding member; a fi...
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WO/2023/062544A1 |
Heat-activatable, linerless labelstock constructions with a detack layer are disclosed. Methods of preparing the same are disclosed.
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WO/2023/057065A1 |
The basis for the invention is an asymmetric adhesive bonding means (10) for joining two different adherends, having a first layer (12) of adhesive and, disposed opposite the first layer (12) of adhesive, a second layer (14) of adhesive....
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WO/2023/054086A1 |
The present invention provides a pressure-sensitive adhesive composition combining adhesive force with light-releasing properties so that the pressure-sensitive adhesive composition has excellent adhesive force in application to adherend...
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WO/2023/054418A1 |
The present invention addresses the problem of making it possible to bond a print layer to a base material securely when the invention is used, and also makes it possible, after the invention is used, to more easily separate/detach the p...
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WO/2023/054211A1 |
A bonding kit that comprises: a pressure-sensitive adhesive layer (1) comprising an epoxy resin and an elastomer; and a liquid hardener composition (3) which, when brought into contact with the pressure-sensitive adhesive layer (1), can ...
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WO/2023/054302A1 |
Provided is a press-bonded sheet manufacturing method by which a product created by a press-bonding process is peeled smoothly and with the appropriate force, and it is possible to inhibit a drop in adhesive force caused by deformation o...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/046812A1 |
The invention relates to an adhesion-promoter formulation for forming a polyurethane-based adhesion-promoter film, wherein the formulation comprises as components: 20 to 30 mass percent of an aromatic isocyanate; 10 to 20 mass percent of...
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WO/2023/040386A1 |
Disclosed are a rework adhesive tape and a peeling method therefor. The rework adhesive tape comprises a base material layer, and a first rework adhesive layer and a second rework adhesive layer attached to two opposite sides of the base...
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