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Matches 1 - 50 out of 19,094

Document Document Title
WO/2018/199639A1
The present invention relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conduct...  
WO/2018/199178A1
Provided is a multi-layered glass manufacturing method in which a plurality of glass plates are disposed facing each other with a spacer therebetween and a hollow layer is formed between the glass plates, the method including: a step for...  
WO/2018/194156A1
A method for manufacturing a semiconductor device, the method comprising: a step for temporarily crimping a first member having a connection part and a second member having a connection part, with an adhesive agent interposed therebetwee...  
WO/2018/193706A1
The present invention conveniently suppresses the formation of surface sink marks due to the bonding of a panel component using a mastic adhesive. A reinforcing component (1) and a rear surface (2a) of a panel component (2) comprising a ...  
WO/2018/194289A1
The present invention relates to a synthetic fletching in the form of a real-feather fletching and a method for manufacturing same and, more specifically, to a novel synthetic fletching in the form of a real-feather fletching and a metho...  
WO/2018/194133A1
The purpose of the present invention is to provide a semiconductor substrate manufacturing method, for example, which prevents detachment and the like of a semiconductor wafer being ground, and which prevents cracking or chipping in a se...  
WO/2018/190138A1
The problem to be solved by this invention is to provide an article production method with which, when affixing an adhesive sheet which does not contain toluene to a body to be covered at a predetermined position, it is possible to perfo...  
WO/2018/190137A1
The problem to be solved by this invention is to provide an article production method with which, when, affixing an adhesive sheet to a body to be covered at a predetermined position, it is possible to perform reaffixing work without cau...  
WO/2018/177483A1
The invention relates to the use of a ceramic powder based on zirconium (di)oxide, the ceramic powder containing a tetragonal and/or cubic zirconium (di)oxide which is at least partially stabilised by rare earth metal oxide, in a thermop...  
WO/2018/181511A1
The present invention pertains to an adhesive sheet 1 delamination method for delaminating the adhesive sheet 1 provided with at least an adhesive layer 2 and delaminating attaching bodies W, W' attached to the adhesive surface P of the ...  
WO/2018/181510A1
The present invention pertains to an adhesive sheet 1 delamination method for delaminating the adhesive sheet 1 provided with at least an adhesive layer 2 and delaminating attaching bodies W, W' attached to the adhesive surface P of the ...  
WO/2018/181767A1
Provided are: a semiconductor device production method that includes steps (1)-(4) indicated below and that is a method for producing a semiconductor device using an adhesive sheet comprising an adhesive layer and a non-adhesive substrat...  
WO/2018/177621A1
The invention relates to a method for producing a component assembly (2), comprising at least two components (4, 6), for a motor vehicle, said component assembly (2) having at least one first component (4), at least one multilayer second...  
WO/2018/173919A1
A curable resin composition for polarizing films, which contains (A) an active energy ray curable component and (B) a compound having a formyl group, and wherein the content of the compound (B) having a formyl group is 1-900 ppm. This cu...  
WO/2018/171962A1
The invention relates to a method for producing a composite component (2) for a motor vehicle, comprising at least two component parts (4, 6), said composite component comprising at least one first component part (4) and at least one fun...  
WO/2018/173898A1
According to the present invention, an adhesive sheet is sequentially provided with a first adhesive layer, a substrate sheet and a second adhesive layer. At least one of the first adhesive layer and the second adhesive layer is cured by...  
WO/2018/174177A1
Provided is an adhesive with which it is possible to suppress the infiltration of air bubbles and non-curing of the adhesive, said adhesive also being applicable the bonding of a member having low optical transparency. This adhesive comp...  
WO/2018/168476A1
This method for producing a bonded body comprises: a lamination step for forming a laminate wherein a first member (11) and second members (22, 23) are temporarily bonded to each other by arranging a temporary bonding material (40) that ...  
WO/2018/168115A1
The present invention is a method for producing a laminate, wherein a second substrate having an electrode pad is laminated on a first substrate having an electrode pad, with an underfill material being interposed therebetween. This meth...  
WO/2018/161368A1
It discloses a composition for adhering one or more polymers to a substrate. The composition comprises at least one first compound adapted to be coated on a surface of the substrate. The first compound comprises one or more first units e...  
WO/2018/159110A1
The purpose of the present invention is to achieve both high viscosity of dam material and low viscosity of fill material and make adhesion between members satisfactory even when a resin composition having the same components is used as ...  
WO/2018/160617A1
A magnetic clamping heat sink assembly is disclosed including a magnetic assembly with a carrier body including a magnet. A spring resiliently biases the carrier body. A base assembly includes a base plate. In a first operating condition...  
WO/2018/156689A1
Debondable adhesive compositions are provided comprising a polymeric adhesive matrix, and a carboxylic acid or a salt thereof like glucaric acid, tartaric acid or other diprotic carboxylic acid dispersed within the polymeric adhesive mat...  
WO/2018/153985A1
The invention relates to an adhesive film that can be wound and stamped, having an epoxy-based adhesive compound that can be activated by UV radiation, characterized in that the adhesive compound comprises: a) 2-40 wt% of film former, b)...  
WO/2018/147351A1
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...  
WO/2018/145981A1
The invention relates to a bonding agent composition, which eliminates the use of toxic heavy metals and additionally has a larger application window for an adhesion functioning in the composition. The bonding agent composition according...  
WO/2018/147352A1
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic ...  
WO/2018/138546A1
The present invention relates to an article comprising a batteryless light source and a photocurable composition. It relates also to methods for applying that article, and to replacement components of that article. The photocurable compo...  
WO/2018/136679A1
The present disclosure provides a hot melt adhesive which includes at least the following components: (1) from about 10 to about 20 weight percent of a lactic acid oligomer or polymer having a weight average molecular weight from about 1...  
WO/2018/134476A1
In a manufacturing method of a laminate structure according to the invention, a manufacturing apparatus (100) of the laminate structure is used, which apparatus comprises material containers (10, 11,12) for the glue paste components, a s...  
WO/2018/130496A1
The invention relates to a method for adhering profiles (1) to LSE substrate surfaces (7), wherein a profile surface (2) and a first adhesive side (3) of an adhesive mass layer - containing a) 40 - 70 wt.% of at least one poly(meth)acryl...  
WO/2018/125978A1
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water- based dispersion containing water, one or more epoxy resins, at leas...  
WO/2018/117607A1
The present invention relates to an adhesive composition having excellent heat resistance and a flexible flat cable using the same, and the adhesive composition comprises: (a) a urethane modified polyester resin having a carboxyl group a...  
WO/2018/117670A9
An embodiment of the present invention provides: an adhesive coating composition capable of attaching (coupling) an electrical steel sheet without using an existing coupling method, such as welding, clamping, or interlocking; an electric...  
WO/2018/117670A3
An embodiment of the present invention provides: an adhesive coating composition capable of attaching (coupling) an electrical steel sheet without using an existing coupling method, such as welding, clamping, or interlocking; an electric...  
WO/2018/117750A1
An embodiment of the present invention provides: an adhesive coating composition capable of adhering (coupling) non-oriented electrical steel sheets without using a conventional coupling method such as welding, clamping, and interlocking...  
WO/2018/117670A2
An embodiment of the present invention provides: an adhesive coating composition capable of attaching (coupling) an electrical steel sheet without using an existing coupling method, such as welding, clamping, or interlocking; an electric...  
WO/2018/109322A1
The invention relates to a method for bonding two parts (10, 20) using a heat activated glue, in which, after the parts (10, 20) have been assembled, at least part of the glue (30) is heated, generating a current in a resistive coating (...  
WO/2018/108387A1
The invention relates to a method for producing an adhesive bond between an adhesive compound layer containing: a) 40-70 wt%, in relation to the total weight of the adhesive compound, of at least one poly(meth)acrylate; b) 15-50 wt%, in ...  
WO/2018/111005A1
Disclosed is a fingerprint recognition sensor. The fingerprint recognition sensor may comprise: a substrate portion comprising at least one selected from a fingerprint recognition portion of a portable mobile communication terminal and a...  
WO/2018/110106A1
The present invention provides a synthetic leather which is characterized by having a layer that is formed from a moisture-curable polyurethane hot melt resin composition which contains (i) a hot melt urethane prepolymer that is a reacti...  
WO/2018/109045A1
The present application is directed at a an assembly comprising a Substrate 1, a Substrate 2 and heat curable adhesive, which is positioned between the Substrates 1 and 2, wherein the heat curable adhesive is cured only in a portion of l...  
WO/2018/110801A1
Provided are an adhesive composition for a polarizing plate, a polarizing plate, and an optical display device, the adhesive composition comprising an epoxy-based compound, a (meth)acrylate-based compound, a photo-acid generator, and an ...  
WO/2018/110551A1
Provided is a thermal transfer sheet for producing a fiber structure that enables the continuously achievement of excellent cold sensation during the water absorption. A thermal transfer sheet 1 which is provided with: a base sheet 4 tha...  
WO/2018/104053A1
The present invention relates to a reactive adhesives film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin and (c) a reagent selected from an initiator, in particular a free-radical in...  
WO/2018/105745A1
This composition includes: metal particles which are capable of being transient liquid phase sintered; and a thermoplastic resin having a softening point lower than the liquid phase transition temperature of the metal particles.  
WO/2018/105887A1
The present invention relates to a decorative sheet comprising: a colored substrate layer comprising a first polyolefin-based resin; a printed layer provided on the colored substrate layer; a first adhesive layer provided on the printed ...  
WO/2018/105901A1
Disclosed are a substrate bonding method in which inter-substrate bonding can be achieved by light irradiation and photocuring even when an opaque substrate is used, and a display substrate manufactured through the same method. The subst...  
WO/2018/105127A1
This method for producing a joined body is provided with: a step in which a transient liquid phase sintering composition is applied to a part of a first member to be joined to a second member and/or a part of the second member to be join...  
WO/2018/105746A1
This method for producing a joined body is provided with: a step in which a transient liquid phase sintering composition is applied to a part of a first member to be joined to a second member and/or a part of the second member to be join...  

Matches 1 - 50 out of 19,094