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Patent Searching and Data


Matches 1 - 50 out of 18,262

Document Document Title
WO/2017/063081A1
There are provided a holding strap, methods of making the same, and methods using such holding strap for tying down objects on a flatbed of a vehicle, retaining underground tanks, or lifting electrodes out of an electrolytic cell. The ho...  
WO/2017/066363A1
The present disclosure relates to a method of adhering a first part to a second part, wherein the first part and the second part are used for outdoor applications and comprise a thermoplastic or a thermosetting organic polymer. The prese...  
WO/2017/061625A1
Provided are: an adhesive-sheet set comprising a pair of adhesive sheets respectively including adhesive layers which, upon contact with each other, can cure and bond together; and a process for producing an article using the adhesive-sh...  
WO/2017/062202A1
A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or ...  
WO/2017/061416A1
Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or a...  
WO/2017/062088A1
A process for preparing a waterborne heat seal coating composition comprising the steps of: a) melt blending ethylene vinyl acetate copolymer, at least one tackifier, and optionally a surfactant in a mixing and conveying zone to form a m...  
WO/2017/059057A1
A compound for self-assembly onto a mineral and/or metal oxides substrate, the compound comprising a catechol group attached to an end group through a spacer group. The compound include a structure of Formula (I): Formula (I)  
WO/2017/054169A1
An electrically conductive film (10) comprises: a resin layer (11); and multiple electrically conductive particles (13) distributed in the resin layer (11). The electrically conductive film (10) comprises a first surface (111) and a seco...  
WO/2017/043283A1
A metal panel reinforcement material that comprises a resin composition, said resin composition at least comprising a plastic component for a curable crosslinked polymer matrix, a curing agent for the plastic component, a curing accelera...  
WO/2017/037170A1
The present patent application relates to a method for gluing two adjacent substrates together by using a radiation curable adhesive composition and a use of a radiation curable adhesive composition for gluing. In particular, the method ...  
WO/2017/032600A1
The invention relates to a method for attaching a body (1) having a planar base (2) onto a surface (6) by means of a double-sided self-adhesive adhesive strip (3), comprising the steps: orienting the body (1) and placing an edge (7) of t...  
WO/2017/033980A1
Provided is a method for treating a surface of a molded resin object or molded rubber object, the method necessitating no installation of large equipment, not requiring much labor for the surface treatment, being capable of attaining ene...  
WO/2017/033545A1
The purpose of the present invention is to provide a method for bonding two substrates and a device for bonding two substrates, enabling a first substrate and a second substrate to bond via a functional film so as not to make direct cont...  
WO/2017/029345A1
The invention relates to a solution in particular for the pre-treatment of a surface, containing, preferably consisting of: I) at least one first silane of formula (I) with R1, R2, R3 independently selected from the groups methyl, ethyl,...  
WO/2017/021436A1
The present invention relates to an emulsion for producing a microcellular emulsion foam in film form, and a method for producing said microcellular emulsion foam in film form. The emulsion comprises: a) a polymer solution, comprising a ...  
WO/2017/022500A1
This method for adhesion-fixing an optical assembly comprises forming an optical assembly by adhesion-fixing a plurality of assembly constituent components including an assembly constituent component having an optical component, the meth...  
WO/2017/021152A1
The invention relates to a method for producing a stacked-plate cooler (1), which has a first component (2) and at least a second component (3), wherein the first component (2) and the second component (3) each have at least one connecti...  
WO/2017/021085A1
The invention relates to a reactive adhesive film system comprising a first reactive adhesive film (A) and a second reactive adhesive film (B); the use of the reactive adhesive film system described herein to glue together materials havi...  
WO/2017/022285A1
Provided is a method for manufacturing an optical member with which it is possible to improve the fit between a first member and a second member that are optically transparent. The present invention comprises: a temporary-curing step for...  
WO/2017/019622A1
An apparatus (100) comprising: first and second structural parts (102, 104) that are formed of a rigid material or a semi-rigid material; and a bond comprising a first adhesive (304) and at least one conductive member (502) disposed in a...  
WO/2017/016694A1
The invention relates to a textile protective material, in particular providing protection against radioactive harmful and/or toxic substances and/or against biological harmful and/or toxic substances and/or against chemical harmful and/...  
WO/2017/013914A1
Provided is an adhesion technique for delaminating a material of interest while satisfying the requirements for the reliability assurance temperature for the material, with a view to reproduce the material. A double-sided adhesive tape c...  
WO/2017/006854A1
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...  
WO/2017/002315A1
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material...  
WO/2017/001592A1
The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adh...  
WO/2016/207702A1
A method for bonding, and bonded assembly thereof, a cover layer to a display layer using a bonding material, comprising placing a peripheral spacer dam for confining the bonding material, wherein said dam has a substantially rectangular...  
WO/2016/204034A1
Provided is a film application method which can prevent the intrusion of foreign bodies and air bubbles onto an adhering surface even when the film is applied in a general environment where foreign bodies such as dust are present. This f...  
WO/2016/198319A1
The invention relates to a method for connecting sealing strips, comprising applying a composition, which comprises at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealin...  
WO/2016/186837A1
The manufacturing of articles relies on the bonding of two or more components to form some forms of the articles, such as a shoe sole bonded with a shoe upper. The bonding may be achieved with an adhesive particulate that is applied to a...  
WO/2016/182655A1
The present invention relates to isocyanate free, moisture curable hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.  
WO/2016/179010A1
Films comprising a resin matrix, an entanglement polymer, and a latent curative, wherein the resin has a functionality of at least 2.0 and a viscosity of at least 0.1 Pascal-seconds, and the film is dimensionally stable at 25°C. The fil...  
WO/2016/177726A1
A method for structuring a layer is provided in various exemplary embodiments. The method for structuring a layer comprises forming (001) an adhesive layer (104) on a first substrate (102) in such a way that the first substrate (102) has...  
WO/2016/174122A1
The invention relates to a method for sealing oxide protective layers on metal substrates using aqueous compositions containing a copolymer or a copolymer mixture of at least one aliphatic and acyclic alkene with at least one α,β-unsat...  
WO/2016/171939A1
The present invention is a layered optically clear adhesive including a first pressure-sensitive optically clear adhesive, a second pressure-sensitive optically clear adhesive, and a flowable optically clear adhesive positioned between t...  
WO/2016/170776A1
In the present invention, an adhesive is molded in elongated fashion, and an adhesion-preventive treatment is then performed on the surface of the adhesive. The adhesive subjected to the adhesion-preventive treatment is wound and stored ...  
WO/2016/171170A1
In the present invention, a manufacturing method for a sealed semiconductor element comprises the following: a sealing step in which, a semiconductor element, which has been subjected to pressure-sensitive adhesion to a pressure-sensitiv...  
WO/2016/165691A1
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/165691A4
The aim of the invention is to provide an improved solution for an adhesive connection for the planar adhesion of components, in which the adhesive connection has a non-uniform stress distribution in different regions of the adhesive sur...  
WO/2016/167133A1
This adhesive sheet (X1) has an adhesive-agent layer (1) curable by radiation exposure and including an acrylic copolymer, a basic monomer, and a photopolymerization initiator. The acrylic copolymer in the adhesive-agent layer (1) includ...  
WO/2016/165230A1
Disclosed are a temporary bonding glue for wafer backgrinding, a preparation method of the temporary bonding glue and bonding and de-bonding methods. The temporary bonding glue comprises a base resin for producing an adhesive effect, whe...  
WO/2016/167931A1
The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functional wax, functional olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in di...  
WO/2016/167303A1
 Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable compo...  
WO/2016/163514A1
Disclosed is an adhesive sheet comprising a base member 1 and an expansive adhesive agent layer 2 formed on one surface or both surfaces of the base member 1, wherein the expansive adhesive agent layer 2 comprises: an epoxy resin that co...  
WO/2016/162394A1
The present invention relates to a method for adhesively bonding substrates, said method comprising the following steps: • I) at least one adhesive component (a) and at least one isocyanate component (b) are applied between at least tw...  
WO/2016/155886A1
The invention relates to a component with a thermosetting matrix network which is expanded and functionalized by a chemical substitution reaction in the application area of a first product, for example a reagent, the matrix network havin...  
WO/2016/158268A1
An adhesive composition sheet which comprises organic compounds and inorganic particles, the adhesive composition sheet comprising a structure obtained by superposing at least one layer A comprising an organic compound and at least one l...  
WO/2016/153663A1
The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable ...  
WO/2016/152598A1
A kit which can suppress residue from a temporary adhesive in semiconductor manufacturing, and a laminate body are provided. This kit for semiconductor device manufacture is provided with a composition containing a solvent A, a compositi...  
WO/2016/148110A1
The present invention provides an adhesive tape for semiconductor processing, which does not leave adhesive residue when the adhesive tape for semiconductor processing is removed from a wafer surface after back polishing, especially in a...  
WO/2016/146511A1
The invention relates to a method of welding of at least two metal-based materials (5, 7), non-weldable directly to each other with resistance welding. At least one spacer (6) is joined by welding on at least one of the two surfaces of a...  

Matches 1 - 50 out of 18,262