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WO/2023/074556A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet including a base polymer and having photocurability. The base polymer is a photopolymerization product. The pressure-sensitive adhesive sheet (10...
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WO/2023/074169A1 |
A primer layer-forming composition for forming a primer layer having a cleavage structure in which chemical bonds are irreversibly cleaved in response to external stimuli, the composition containing a film-forming component and a solvent...
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WO/2023/074448A1 |
Provided is an adhesive sheet that exhibits both tack and holding power despite having a structure comprising a thin adhesive layer. Specifically provided is an adhesive sheet comprising an adhesive layer having a thickness of 10 µm or ...
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WO/2023/072119A1 |
Provided are a heat dissipation film and an electronic device. The heat dissipation film is used for the electronic device, the electronic device comprises a battery and a loudspeaker which are adjacently arranged, and the battery compri...
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WO/2023/074558A1 |
This adhesive sheet (10) contains a base polymer as a photopolymer and is photocurable. This adhesive sheet (10) has a gel fraction of at least 75% by mass after curing by a photocuring process under the condition of an irradiation integ...
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WO/2023/074447A1 |
Provided is a single-sided adhesive sheet that exhibits good usability when handled together with a back-surface support tape. Specifically provided is an adhesive sheet exhibiting adhesive properties on one surface thereof, said adhesiv...
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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/074557A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet containing a base polymer. This pressure-sensitive adhesive sheet (10) has a gel percentage G (%) of 90% or less, a shear storage modulus E (MPa)...
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WO/2023/074555A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet, wherein the ratio of a surface hardness H2 at 25°C, as measured by nano-indentation, at a location 100 μm away from a cut edge produced by laser...
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WO/2023/074554A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet that includes a base polymer serving as a photopolymer. After a photocurable adhesive sheet (S) is bonded to an alkali glass sheet manufactured acc...
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WO/2023/074536A1 |
Provided are: a laminate in which it is possible to peel the protective film from a protective film-equipped laminate of a heat-resistant polymer film and an inorganic substrate without peeling off the heat-resistant polymer film or inor...
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WO/2023/074037A1 |
Provided is a polarizing plate which has a retardation layer and in which glue overflow, glue shortage, glue displacement, and process contamination are inhibited, and cracks are prevented from occurring in a low-temperature environment....
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WO/2023/074468A1 |
Provided is an adhesive agent composition able to form an adhesive agent which is lightly releasable at a low peeling speed and can suppress an increase in peeling force at a high peeling speed. Also provided is an adhesive sheet which i...
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WO/2023/066944A1 |
The aim was to provide a tape-shaped adhesive system for assembly applications that can be applied easily and precisely in position and then quickly develops an adhesive force that is at least sufficient to fix the parts to be assembled....
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WO/2023/067480A1 |
An adhesive article attachable to a substrate may include an adhesive layer attachable to a major surface of a substrate and a releasable liner in contact with the adhesive layer. The releasable liner has a release layer and a biodegrada...
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WO/2023/068277A1 |
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization i...
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WO/2023/068559A1 |
An anisotropic conductive adhesive film according to the present invention minimizes the movement of conductive particles in a compression process by fixing the conductive particles with strong force through the high modulus of a polymer...
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WO/2023/068314A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape capable of favorably holding a chip component when receiving the chip component, and when re-transferring the chip component, capable of demonstrating ...
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WO/2023/068009A1 |
Provided is a pressure-sensitive adhesive material having excellent pressure-sensitive adhesiveness, excellent flexibility, and excellent restorability. The pressure-sensitive adhesive material is characterized by including a polymer (...
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WO/2023/068302A1 |
[Problem] The present invention addresses the problem of developing a chloroprene polymer latex adhesive composition that has excellent adhesiveness to soft polyvinyl chloride resins and also has excellent thermal creep resistance with a...
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WO/2023/068088A1 |
The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material ...
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WO/2023/067662A1 |
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; a finely particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic fi...
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WO/2023/068315A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that can have chip components preferably pasted thereto when receiving the chip components, that exhibits excellent detachment performance when re-tran...
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WO/2023/067910A1 |
Provided are an electroconductive composition from which a flexible cured product having excellent electroconductivity and adhesiveness can be formed at a low temperature, and an electronic device using said composition. The electrocon...
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WO/2023/063052A1 |
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. ...
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WO/2023/063382A1 |
A seal member (10) formed in a strip shape having one side as a long side in plan view, the seal member (10) comprising a substrate (11), a resin layer (12) provided to one surface of the substrate (11), and a release sheet (13) provided...
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WO/2023/062544A1 |
Heat-activatable, linerless labelstock constructions with a detack layer are disclosed. Methods of preparing the same are disclosed.
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WO/2023/063386A1 |
A purpose of the present invention is to provide an adhesive sheet having excellent insulation breakdown reliability and sheet life at room temperature while having high adhesiveness, high heat resistance, and high strength between a res...
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WO/2023/063457A1 |
This semiconductor light-emitting element includes an emission layer, a passivation layer on the emission layer, and a first adhesive layer on the passivation layer. The passivation layer may include a plurality of grooves, and the first...
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WO/2023/064745A1 |
Label constructions exhibiting improved ice bucket performance, wet and/or dry opacity, delta opacity, show through, adhesive strength, and/or channeling/label movement are described herein. In some embodiments, the construction has a de...
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WO/2023/062510A1 |
A decorative film for a vehicle interior of one embodiment includes a biaxially stretched polyethylene terephthalate film layer and a colored adhesive layer, in which the colored adhesive layer contains a carboxy group-containing (meth)a...
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WO/2023/058303A1 |
A thermosetting film containing a binder (a), an epoxy resin (b1), a thermosetting agent (b2), a curing accelerator (c), and a layered compound (z), wherein the curing accelerator (c) is supported on the layered compound (z), forming a c...
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WO/2023/058300A1 |
An optical adhesive sheet (1) for foldables has a shape which extends in a first direction that is perpendicular to the thickness direction. This optical adhesive sheet (1) for foldables has one end edge (11) and the other end edge (12) ...
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WO/2023/056549A1 |
A biodegradable display protector comprises a top layer; an antimicrobial (AF) layer beneath the top layer; a core layer formed of biodegradable material beneath the AF layer; an adhesive layer beneath the core layer; and a bottom releas...
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WO/2023/058481A1 |
Provided is a method for manufacturing an electronic component device, comprising: a step for overlapping a protection sheet on a circuit surface that is at least one side of a substrate and on which a circuit-constituting element is dis...
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WO/2023/058564A1 |
A pressure-sensitive adhesive composition comprising: a copolymer (A) comprising a structural unit derived from one or more monomers (a1), which are a monomer having an alkoxysilyl group and/or a monomer having an epoxy group, and a stru...
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WO/2023/058924A1 |
Embodiments of the present invention provide an adhesive sheet, an antenna structure comprising same, and an image display device. The adhesive sheet contains an adhesive layer of which a dielectric loss tangent at 28 GHz measured at a t...
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WO/2023/057987A1 |
The multilayer pressure sensitive adhesive assembly includes a polymeric foam layer and a first pressure sensitive adhesive layer. The polymeric foam includes a plurality of activated carbon particles. The first pressure sensitive adhesi...
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WO/2023/058577A1 |
This protective sheet is to be bonded to: a surface to be protected of an electronic component having the surface to be protected; one surface of a piece of glass constituting a display surface of a display device; or one surface of a gl...
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WO/2023/058408A1 |
Provided is a laminate equipped with a protective-film-release-assisting tape, the laminate being formed from a protective-film-equipped heat-resistant polymer film and an inorganic substrate (rigid temporary support body), and being suc...
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WO/2023/054478A1 |
The purpose of the present invention is to provide an adhesive composition that, even after storage in a high-temperature, high-humidity environment, still exhibits a satisfactory decline in adhesive strength due to the application of vo...
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WO/2023/054449A1 |
The present invention provides a sheet-like curable adhesive which is able to be suppressed in bleeding. The sheet-like curable adhesive is formed of an adhesive composition which contains (A) a phenoxy resin having a hydroxyl group and ...
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WO/2023/054086A1 |
The present invention provides a pressure-sensitive adhesive composition combining adhesive force with light-releasing properties so that the pressure-sensitive adhesive composition has excellent adhesive force in application to adherend...
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WO/2023/054483A1 |
The present invention provides: an adhesive tape in which anchoring fractures are suppressed; and a method for manufacturing the same. An adhesive tape according to an embodiment of the present invention includes, in the following order:...
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WO/2023/054316A1 |
Provided is a highly productive method for producing a connection film. An adhesive is printed, in a predetermined shape, on a mold release film to form a connection film in the predetermined shape on the mold release film. Moreover, a...
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WO/2023/054484A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when a voltage is not applied thereto, and the adhesive strength of which is sufficiently reduced by app...
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WO/2023/052251A1 |
The invention pertains to an adhesive tape, especially for the lengthwise jacketing of elongate items such as cable harnesses in a car, comprising a carrier having a top side and a bottom side, where the carrier relative to the crosswise...
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WO/2023/054482A1 |
The present invention provides: an adhesive composition which has sufficient initial adhesive force and is capable of achieving a good balance between resealability and easy openability; and an adhesive tape which uses this adhesive comp...
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WO/2023/054581A1 |
The present invention relates to the useful improvement of an adhesive composition that can be used for multistage curing and to the use thereof. The adhesive composition contains an acrylic resin (A) and a photoinitiator (B). The acry...
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WO/2023/054480A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when no voltage is applied and sufficiently reduces an adhesive force by applying voltage, can be formed...
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