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WO/2023/054488A1 |
This transfer film includes a base film and a transfer layer, wherein the transfer layer has a surface protection layer and an adhesive layer, the surface protection layer forms the surface layer of the transfer layer on the base film si...
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WO/2023/054677A1 |
Provided is a curable adhesive sheet having a curable adhesive layer capable of forming a cured product having a loss tangent of 0.01 or less at 23°C and 1 GHz, and a first release film and a second release film enclosing the two surfac...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/053538A1 |
Provided is a pressure-sensitive adhesive sheet used for temporarily fixing an electronic component to a support, the adhesive sheet exhibiting releasability from the support under laser light irradiation, and enabling the reduction in r...
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WO/2023/053566A1 |
Provided is a composition for an adhesive agent, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler material (D), wherein: the polyurethane resin (C) has a ta...
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WO/2023/053749A1 |
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...
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WO/2023/054218A1 |
Proposed is a new actinic-ray-curable pressure-sensitive adhesive sheet which can have both excellent flowability and storage stability and which can exhibit such reliable freedom from bubble inclusion that the adhesive sheet does not co...
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WO/2023/052196A1 |
Described is a pressure-sensitive adhesive composition in the form of an aqueous polymer dispersion comprising a dispersed pressure-sensitive adhesive polymer formed by emulsion polymerization of isobutyl acrylate, 2-ethylhexyl acrylate ...
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WO/2023/054318A1 |
The present invention relates to a method for producing a semiconductor device, the method using a double-sided adhesive sheet which has at least an adhesive layer (X1) that serves as the one surface-side outer layer and an adhesive laye...
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WO/2023/054028A1 |
An electromagnetic wave reflection sheet (1) comprises a substrate (2) and an electromagnetic wave reflection layer (3) sequentially toward one side in the thickness direction. The electromagnetic wave reflection sheet (1) has a transmit...
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WO/2023/053913A1 |
The purpose of the present invention is to provide a laminate, of a porous layer and an adhesive-bonding layer, in which the laminate exhibits adhesive force or bonding force, and an adhesive or a bonding agent does not easily infiltrate...
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WO/2023/047973A1 |
This adhesive resin composition includes a polyester resin (A), and is characterized by satisfying the following requirements: (i) the polyester resin (A) has an acid value of 100 eq/ton or greater; (ii) a polyol component used for const...
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WO/2023/048053A1 |
Provided is an adhesive tape with excellent heat resistance. The adhesive tape comprises a vinyl chloride resin-based base material (A) and an adhesive layer (B) laminated onto at least one side of the base material (A). The base mater...
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WO/2023/048013A1 |
The purpose of the present invention is to provide: an adhesive sheet that has a low dielectric loss tangent for high-frequency bands and does not readily generate bubbles at an interface with an adherend, even at high temperatures; a la...
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WO/2023/046090A1 |
The present application provides a double-sided adhesive tape and a lithium ion battery. The first aspect of the present application provides a double-sided adhesive tape, the double-sided adhesive tape comprising a first bonding layer, ...
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WO/2023/047971A1 |
This adhesive resin composition is characterized by containing a polyester resin (A) and satisfying the requirements: (i) the adhesive resin composition contains substantially no hardener and (ii) the adhesive resin composition, after ha...
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WO/2023/044987A1 |
A bonding structure for bonding a bottom plate and a rubber sheet of a table tennis bat. The bonding structure comprises: an adhesive layer (1); a first release layer (2), the first release layer (2) being arranged on one surface of the ...
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WO/2023/047386A1 |
The tape includes a backing and a pressure-sensitive adhesive applied from an aqueous dispersion on the backing. The pressure-sensitive adhesive includes an at least partially crosslinked elastomer, a tackifying resin, and sulfur. A proc...
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WO/2023/048069A1 |
According to the present invention, a polylactic acid film obtained by modifying an aqueous dispersion containing a polylactic acid as a dispersion and a polyvinyl alcohol as a dispersing agent achieves high heat sealability and water re...
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WO/2023/047917A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet. When the pressure-sensitive adhesive sheet (10) is applied to a glass plate and the laminate is thereafter subjected to a heating/pressing treat...
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WO/2023/047972A1 |
This adhesive resin composition contains a polyester resin (A) and is characterized by satisfying the following requirements: (i) the acid value of the polyester resin (A) is 100 eq/ton or more; (ii) the adhesive resin composition contai...
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WO/2023/047860A1 |
Provided is a pressure-sensitive adhesive composition containing: a (meth)acrylic ester polymer (A) including, as a monomer unit forming the polymer, an ethylene-carbonate-containing monomer having the ethylene carbonate structure repres...
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WO/2023/047872A1 |
Provided is a composition for adhesives which gives an adhesive with which a metal foil and a resinous film can be tenaciously bonded to each other even at high temperatures. The composition for adhesives comprises: an acid-modified poly...
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WO/2023/040386A1 |
Disclosed are a rework adhesive tape and a peeling method therefor. The rework adhesive tape comprises a base material layer, and a first rework adhesive layer and a second rework adhesive layer attached to two opposite sides of the base...
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WO/2023/042686A1 |
Provided is an adhesive composition capable of forming an adhesive that has a high refractive index, can lower the elastic modulus, and has improved adhesive strength. The adhesive composition includes an acrylic polymer containing an ar...
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WO/2023/042838A1 |
The present invention provides a temporary protective material having both a waterproof property with which it is possible to protect a component mounting surface during a mounting process of a semiconductor substrate, and deformability ...
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WO/2023/042726A1 |
The reinforcing film (10) is equipped with a film base material and an adhesive layer (2) fixedly laminated on one principal surface of the film base material. The adhesive layer is composed of a photocurable composition. The photocurabl...
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WO/2023/042676A1 |
An adhesive sheet (X) serving as a variable-color adhesive sheet of the present invention includes: a base polymer; a chromogenic compound which can reversibly change between a colored state created through a reaction with acid and a non...
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WO/2023/042409A1 |
The purpose of the present invention is to provide an adhesive sheet having an adhesive agent layer that has an adhesive surface having a wettability unlikely to change even when being exposed in an air environment and that is unlikely t...
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WO/2023/042518A1 |
Provided is an optical layered body in which it is possible to suppress a change in reflected hue according to the usage environment thereof. This optical layered body comprises a polarizing plate including a polarizer, and a phase diffe...
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WO/2023/042745A1 |
[Problem] To provide: an organopolysiloxane composition which can undergo a curing reaction, which forms a slightly-adhesive adhesive agent layer having excellent transparency, and from which it is possible to design a heat-curable/light...
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WO/2023/042735A1 |
Provided is a two-pack curable adhesive agent having a rapid PAA reduction rate and excellent storage stability. The two-pack curable adhesive agent comprises: an isocyanate composition (X) which comprises a urethane prepolymer that is...
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WO/2023/042840A1 |
The present invention provides a temporary protective material that has excellent hot water removing properties and has water resistance and adhesion that make it possible to protect a component mounting surface in a step for mounting a ...
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WO/2023/042734A1 |
The present invention provides a urethane prepolymer for a two-component curable adhesive which has a fast PAA decrease rate and excellent storage stability. Provided is a method for producing a urethane prepolymer for a two-component ...
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WO/2023/042789A1 |
Provided are: an adhesive composition which is agingless, has good adhesive properties and excellent storage stability, and can be used reliably for a long time even after the addition of a curing agent; and an adhesive sheet. An adhesiv...
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WO/2023/042744A1 |
[Problem] To provide a curable reactive organopolysiloxane composition that can be made heat curable/light curable, enables design of a composition coatable even at a low solvent content and has sufficient adhesive strength, a cured prod...
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WO/2023/042839A1 |
The present invention provides a temporary protective material which has water resistance and which can protect a component mounting surface, in a semiconductor substrate mounting step. This temporary protective material is used as a pro...
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WO/2023/042811A1 |
Provided are: a method for cleaning a semiconductor substrate by which it is possible to remove (clean), in a shorter time and more cleanly by a simple operation, an adhesive layer obtained by using, for example, a siloxane-based adhesiv...
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WO/2023/039820A1 |
The present application provides an adhesive paper, an electrochemical device comprising said adhesive paper, and an electronic device. The adhesive paper comprises a bonding layer, an insulating heat-resistant layer, and an expansion la...
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WO/2023/042813A1 |
Provided are: a method for cleaning a semiconductor substrate having an adhesive layer on the surface thereof, in which removal (cleaning) can be performed in a shorter period of time and more thoroughly via a simple operation; a method ...
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WO/2023/035217A1 |
Embodiments of the present application provide a battery, an electrical device, and a method and apparatus for manufacturing the battery. The battery comprises: battery cells; and a first component, a first surface of the first component...
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WO/2023/037185A1 |
Curable and cured compositions as well as articles that contain the curable or cured compositions are provided. The curable composition comprises (a) a (meth)acrylic-based multiblock copolymer, (b) a random (meth)acylate copolymer compri...
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WO/2023/038147A1 |
Provided is an adhesive sheet that achieves, at a high level, both conformance to three-dimensional geometry during bonding and shape-retention ability during non-bonding and that has excellent flexibility particularly in a low-temperatu...
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WO/2023/035561A1 |
The present invention relates to an anti-birdstrike flexible film and a preparation method therefor and an application thereof. Specifically, disclosed in the present invention is the anti-birdstrike flexible film; the film has excellent...
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WO/2023/038123A1 |
Provided is an adhesive-layer-equipped substrate having a substrate and an adhesive layer disposed on the substrate, wherein: the adhesive layer contains polymer particles (A), an inorganic oxide (B), and a light-shielding agent (D); the...
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WO/2023/038140A1 |
The objective is to provide a pellicle which less likely generates outgas. A pellicle (10) of the present disclosure comprises a pellicle frame (14), a pellicle film (12) supported on one end face of the pellicle frame (14), and an adh...
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WO/2023/037636A1 |
Provided is an adhesive sheet which is suitable for temporarily fixing an electronic component, includes an adhesive layer containing an acrylic adhesive, and has excellent characteristics at a high temperature. An adhesive sheet for t...
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WO/2023/037914A1 |
Provided is an adhesive composition suitable for a heat-peelable adhesive sheet that has sufficiently high peel strength from an adherend, can be peeled easily from the adherend through heating after process completion, and does not cont...
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WO/2023/033176A1 |
The purpose of the present invention is to provide an adhesive tape for semiconductor device manufacturing, which is excellent in chip component delamination performance, and which is capable of preventing adhesive residue from remaining...
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WO/2023/032790A1 |
Provided is an adhesive sheet that has excellent flexibility at low temperatures and also has excellent resilience. According to the present invention, an adhesive sheet is formed from an adhesive composition [I] that contains an acryl...
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