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Patent Searching and Data


Matches 1 - 50 out of 66,004

Document Document Title
WO/2020/185810A1
This disclosure describes devices, systems, and methods related to a compound film. An exemplary compound film includes a first layer including a first polymer composition including polyurethane and a second layer including a second poly...  
WO/2020/184310A1
The present invention makes it possible to provide an adhesive composition capable of suppressing adhesion enhancement even when subjected to a high-temperature heat treatment step while having high adhesive strength at the time of appli...  
WO/2020/184585A1
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest ...  
WO/2020/184584A1
A circuit-connecting adhesive film 1 comprising a first adhesive layer 2 and a second adhesive layer 3 layered upon the first adhesive layer 2, wherein the first adhesive layer 2 is formed from a cured product of a photosetting compositi...  
WO/2020/184583A1
An adhesive film 1 for circuit connection comprises a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the first adhesive layer 2 is composed of a photocured product of a photocurable ...  
WO/2020/184594A1
The present invention provides an adhesive sheet that uses an adhesive layer, to which a conductive organic polymer compound is added, and still enhances the production efficiency of a product that uses this adhesive layer. According t...  
WO/2020/183370A1
Systems and methods for indicating an effect onset period of a cannabis product including an effect onset device having a timing mechanism to track the effect onset period. The effect onset device including a processor having an activati...  
WO/2020/184201A1
This electronic device production method at least comprises a preparation step for preparing a structure (100), and a sealing step for sealing an electronic component (70) using a sealing material (60). The structure (100) includes: an a...  
WO/2020/184636A1
An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive laye...  
WO/2020/184199A1
An electronic device manufacturing method comprising at least: a preparation step for preparing a structure (100) comprising an adhesive film (50) that is provided with a base layer (10), an adhesive resin layer (A) provided to a first s...  
WO/2020/182972A1
The invention relates to a surface protection film having a film-type substrate to one side of which an adhesive compound, in particular a self-adhesive compound is applied, the film-type substrate having a layer that consists of at leas...  
WO/2020/183581A1
Disclosed are: an adhesive agent composition containing a thermosetting resin, an elastomer, and a curing agent that contains a phenol resin having an alicyclic ring; a film-like adhesive agent using such an adhesive agent composition; a...  
WO/2020/184311A1
The purpose of the present invention is to provide an adhesive tape that has high initial adhesive strength, and can have an increase in adhesiveness suppressed even when subjected to a high-temperature thermal treatment step. This adhes...  
WO/2020/181627A1
Provided is a toughened film (1) for electronic apparatus with an ultrasonic fingerprint recognition device, wherein the toughened film (1) includes a first release film, a second release film, and a toughened film body (2) disposed betw...  
WO/2020/184155A1
Provided is a pressure-sensitive adhesive sheet which need not be photocured after application to adherends and which can combine irregularity-absorbing properties with dimensional stability. The pressure-sensitive adhesive sheet (5) is ...  
WO/2020/184418A1
The purpose of the present invention is to provide a release film which does not contaminate a substrate when used in a process for producing a flexible circuit board. The present invention is a release film having a release layer that c...  
WO/2020/184161A1
Provided are: a pressure-sensitive adhesive composition capable of suppressing temporal change in the adhesive power of a pressure-sensitive adhesive and having excellent performance stability; and a lamination film that uses said compos...  
WO/2020/182523A1
The invention relates to a method for producing fibrous material objects, wherein the fibrous material object is stabilised in at least one of the production steps by an adhesive film, wherein the adhesive film comprises a layer of an ad...  
WO/2020/179392A1
Provided is an adhesive sheet including a fiber sheet and an adhesive agent layer layered on the fiber sheet. The adhesive agent layer contains a base polymer and a tackifying resin. The base polymer is a block copolymer of a monovinyl s...  
WO/2020/179465A1
The purpose of the present invention is to provide a lamination film capable of preventing tearing, even when an adhesive tape oriented at a certain angle with respect to an affixed surface is to be peeled, by reducing the stress on the ...  
WO/2020/179372A1
The purpose of the present invention is to provide: a circularly polarizing plate having good optical characteristics even after a wet heat test; and a circularly polarizing plate with a glass plate. This circularly polarizing plate has ...  
WO/2020/179509A1
Provided is a polarizing film with a conductive layer. The polarizing film maintains stable conductivity so as to not, for example, cause malfunction of a touch sensor, even after exposure to wet heat. The polarizing film with a conducti...  
WO/2020/179591A1
This invention addresses the problem of providing a double-sided adhesive sheet for decorative molding and a laminating adhesive sheet for decorative molding which exhibit excellent adhesion to an adherend that contains a polyolefin resi...  
WO/2020/179464A1
The purpose of the present invention is to provide an adhesive tape on which it is possible to reduce a load on the adhesive tape and to prevent tearing even when peeling the adhesive tape at an angle from an adhered-to surface. The ad...  
WO/2020/179899A1
The present invention provides a die bonding sheet (101) that is provided with a base material (11) and comprises an adhesive layer (12), an intermediate layer (13), and a film-form adhesive (14) layered in the stated order on the base m...  
WO/2020/181070A1
A pre-cut piece of kinesiology tape is provided, the pre-cut piece of kinesiology tape having a shape that facilitates a predetermined purpose (such as pain relief, inflammation reduction, muscle inhibition, etc.). The pre-cut piece of k...  
WO/2020/179393A1
Provided is an adhesive sheet including a fiber sheet and an adhesive agent layer layered on the fiber sheet. The adhesive agent layer contains a base polymer and a tackifying resin. The base polymer is a block copolymer of a monovinyl s...  
WO/2020/179897A1
This die-bonding sheet (101) comprises: a substrate (11); and a pressure-sensitive adhesive layer (12), an intermediate layer (13), and a film-like adhesive (14), which are laminated in this order on the substrate (11), wherein the value...  
WO/2020/180602A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/175091A1
The purpose of the present invention is to provide a laminate which has excellent adhesion and in which the occurrence of air bubbles is suppressed even when the laminate is repeatedly flexed with a front plate side as the inner side the...  
WO/2020/173805A1
The present invention relates to a two-dimensional element, which comprises a first subarea T1 of a first adhesive compound K1, at least one second subarea T2 of a second adhesive compound K2, which is different from the adhesive compoun...  
WO/2020/175421A1
A thermosetting resin film according to the embodiments is a thermosetting resin film that is adhered to a workpiece surface that has protruding electrodes and is heat cured to form a first protective film on the surface, said thermosett...  
WO/2020/175096A1
The purpose of the present invention is to provide a laminate which has excellent adhesion and in which the occurrence of air bubbles is suppressed even when the laminate is repeatedly flexed with a front plate side as the outer side the...  
WO/2020/175368A1
The purpose of the present invention is to provide: a dual-sided pressure-sensitive adhesive tape that can be suitably used to secure electronic apparatus components and to secure vehicle components and that has high flexibility, shock r...  
WO/2020/175098A1
An objective of the present invention is to provide a laminate that has excellent adhesive force and suppresses the generation of air bubbles even after bending with the front plate side facing inwards. The present invention provides a l...  
WO/2020/175092A1
The purpose of the present invention is to provide a laminate which has excellent adhesion in high-temperature environments and in which the occurrence of air bubbles is suppressed even when the laminate is flexed with a front plate side...  
WO/2020/174154A1
The invention relates to: 1) an HMPSA composition containing from 20 to 50% styrenic block copolymer composition; from 35 to 65% tackifying resin; and from 7 to 25% vegetable oil as a plasticiser, selected from sunflower oil, rapeseed oi...  
WO/2020/175220A1
Provided are a urethane prepolymer from which is obtained an adhesive which has excellent moisture permeability and which attains both low adhesion to skin and high adhesion to a base material, an adhesive, a skin patch material, an adhe...  
WO/2020/175776A2
The present invention particularly relates to an adhesive sheet made of a fiber material, and a method for manufacturing same, and the purpose of the prevent invention is to provide a sticky adhesive mesh and a method for manufacturing t...  
WO/2020/175685A1
This anisotropic conductive sheet has: an insulation layer that has a first surface and a second surface and that is formed of a first resin composition; a plurality of resinous columns that are formed of a second resin composition and t...  
WO/2020/175087A1
The purpose of the present invention is to provide a laminate having excellent heat resistance and flexibility at low temperatures. The present invention provides a laminate including a front plate, a first adhesive layer, a polarizer la...  
WO/2020/175093A1
The purpose of the present invention is to provide a flexible laminate which has excellent adhesion and in which the occurrence of air bubbles is suppressed even when the flexible laminate is repeatedly flexed with a front plate side as ...  
WO/2020/175089A1
The purpose of the present invention is to provide a flexible laminate which has excellent adhesion and in which the occurrence of air bubbles is suppressed even when the flexible laminate is repeatedly flexed with a front plate side as ...  
WO/2020/175698A1
A polyolefin resin foam sheet according to the present invention has a bending modulus of elasticity of 150 kPa or less, while having a shrinkage in the plane direction of 5% or less if cured at the temperature of 120°C for one hour. Me...  
WO/2020/175364A1
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sh...  
WO/2020/175958A1
The present application pertains to an encapsulation film and an organic electronic device comprising same, and provides an encapsulation film which not only has excellent moisture-blocking properties, but is also flexible and rollable, ...  
WO/2020/175095A1
An objective of the present invention is to provide a laminate that has excellent adhesive force and suppresses the generation of air bubbles even after bending with the front plate side facing inwards. The present invention provides a l...  
WO/2020/173622A1
Provided are an oil-in-water silicone emulsion composition for a release film that can keep the release properties inherent in silicone and achieve the coating properties of a high polar coating material even when the coating material is...  
WO/2020/172787A1
Provided herein are a pressure sensitive adhesive (PSA) and labels as well as the methods producing the PSA and the labels. The PSA comprises a combination of epoxy, isocyanate crosslinkers and a polyacrylate tackifier. The PSA has impro...  
WO/2020/175328A1
The present invention pertains to an electrical insulation material which is provided with an adhesive layer, and has a 180-degree peel adhesion of at least 3 N/20 mm at 23˚C under a tensile strength of 300 mm/min, a relative permittivi...  

Matches 1 - 50 out of 66,004