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WO/2013/070522 |
The disclosed cleaning surface includes a reactivatable adhesive to capture and hold dirt, dust, and debris and a spacing element to allow for the cleaning surface to glide over a surface to be cleaned. The reactivatable adhesive can be ...
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WO/2013/069784 |
The purpose of the present invention is to provide an adhesive tape that has a feel and texture that is very close to paper tape; that follows curved surfaces, rough surfaces, and irregular surfaces well; has excellent water resistance; ...
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WO/2013/069013 |
A microstructure made of flexible material includes a plurality of projections extending from a common substrate. A distal end of each projection includes a resilient flap. All lateral dimensions of each of the projections increase monot...
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WO/2013/069870 |
The present invention relates to a UV-cured adhesive composition, a display device including the same, and a module assembly method using the same. More specifically, the present invention comprises a compound including a structure of ch...
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WO/2013/069907 |
The present invention relates to an adhesive composition for a protective film which is made using an acrylic resin able to minimise the occurrence of static electricity while exhibiting film soiling resistance and a low peeling force du...
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WO/2013/069576 |
An adhesive agent composition comprising (A) a (meth)acrylic polymer and (B) an ionic compound having an anionic component and a cationic component, said composition being characterized in that the anionic component is at least one anion...
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WO/2013/068819 |
A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.
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WO/2013/065662 |
[Problem] To efficiently shield heat rays not only in the infrared region but also in the near-infrared region. [Solution] The present invention provides: a heat ray shielding adhesive composition which contains (A) fine metal particles,...
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WO/2013/066971 |
Masking tapes that changes color when the tape is rubbed down or dispensed onto an adherend and methods of making such tapes are disclosed herein. The tape includes a backing, a layer of adhesive on the bottom surface of the backing, and...
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WO/2013/065417 |
This adhesive composition for bonding a wafer and a supporting body for the wafer contains an elastomer which contains, as a constituent unit for the main chain, a styrene unit in an amount of from 14% by weight to 50% by weight (inclusi...
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WO/2013/065981 |
The present invention relates to an adhesive film for protecting a wafer including an adhesive layer formed on one surface of a substrate film. The present invention relates to an adhesive film for protecting the surface of a semiconduct...
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WO/2013/065578 |
The present invention addresses the problem of obtaining a self-adhesive surface-protecting film that is highly processing-friendly, and despite adhering to the protected object strongly and being usable on a variety of objects, is not p...
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WO/2013/066401 |
Various systems, methods and materials are disclosed that enable efficient delivery of an agent into an adhesively adhered article, in which the agent elicits a desired outcome, on demand. This strategy, though general in scope, is also ...
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WO/2013/065482 |
The sheet manufacturing device comprises a feeding means (10) for feeding a base sheet (BS), a first laminating means (20A) for laminating a first adhesive layer (AD1) on one surface of the base sheet (BS), and a second laminating means ...
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WO/2013/062836 |
A conductive double-sided tape includes a conductive, nonwoven adhesive layer including an adhesive material, a nonconductive, nonwoven substrate having a plurality of passageways, and a plurality of conductive particles penetrating thro...
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WO/2013/062996 |
A micro-structured optically clear adhesive, including a first major surface and a second major surface, wherein at least one of the first and second major surfaces comprises a micro- structured surface of interconnected micro-structures...
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WO/2013/063197 |
Disclosed is a waterproofing membrane that comprises a carrier sheet (layer A); a waterproofing adhesive (layer B); a protective coating (layer C), wherein the protective coating is substantially free of surfactant and comprises an acryl...
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WO/2013/061925 |
The purpose of the present invention is to provide an adhesive tape whereby dicing can be performed by preventing cut dust from adhering to semiconductor devices without implementing extra improvement of equipment and introducing extra c...
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WO/2013/060806 |
The invention relates to an adhesive paste containing at least • a vinyl aromatic block copolymer • at least one adhesive resin • a second copolymer based on a vinyl aromatic and on an unsaturated anhydride, wherein the vinyl aroma...
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WO/2013/061830 |
This mixed composition contains 100 parts by mass of a (meth)acrylate resin composition (A) containing (meth)acrylate acid ester polymers (A1) and (meth)acrylate acid ester monomers (α1), 90-1200 parts by mass of a thermally conductive ...
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WO/2013/061938 |
A pressure-sensitive adhesive sheet provided with a pressure-sensitive adhesive layer (X) containing a pressure-sensitive adhesive obtained by using heat to semi-cure a pressure-sensitive adhesive composition containing the following: a ...
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WO/2013/061951 |
The purpose of the present invention is to provide an adhesive tape package production method that is suitable for mass production. This production method is one for producing an adhesive tape package (10) for housing adhesive tape (14) ...
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WO/2013/061931 |
The purpose of the present invention is to provide a dicing adhesive tape for processing semiconductors, the tape having adhesive strength to sufficiently hold a semiconductor wafer during the process of performing dicing on the wafer, w...
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WO/2013/061896 |
A protective film (40) is provided with a first surface (42a) which can be applied to a display screen, and a second surface (41b) which is the other side of the first surface (42a) and to which a stripping tab (50) that is used when str...
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WO/2013/058330 |
The purpose of the present invention is to provide an active-energy-ray-curable resin composition, an adhesive containing the resin composition, and a laminate film obtained using the adhesive, the active-energy-ray-curable resin composi...
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WO/2013/058526 |
The present invention relates to a self-adhesive protection film having improved release, and a product having the film attached thereto. In more detail, a carrier layer includes a monodispersive bead, or an embossed pattern is formed on...
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WO/2013/058208 |
The present invention provides a water-dispersible acrylic-based adhesive composition which offers excellent low-contamination properties for an adherend, and by which a removable adhesive layer can be formed. This removable water-disper...
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WO/2013/058054 |
In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5 × 5 mm or larger, at a temperature of 200°C, ...
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WO/2013/058187 |
Provided is a water-dispersible acrylic adhesive composition with which it is possible to form a visually attractive adhesive layer with outstanding adhesion, antistatic properties, removability, and resistance to increases in peel fo...
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WO/2013/057265 |
The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types an...
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WO/2013/058723 |
A splicing tape for accurately aligning and joining spliced component carrier reels is disclosed. The flexible splice tape allows the components to remain aligned and picked from a component carrier reel without interruption at the union...
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WO/2013/058188 |
Provided is a water-dispersible acrylic-based adhesive composition which offers excellent antistatic properties (anti-peeling-static properties), removability, adhesion (adhesiveness), and performance in preventing an elevation in peel f...
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WO/2013/058290 |
An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer...
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WO/2013/058380 |
An adhesive composition of the present invention contains a resin composition and a plurality of conductive particles, and when the maximum diameter in the particle size distribution of the conductive particles is represented by a and th...
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WO/2013/058273 |
Provided is a water-activated sheet (1) which has a porous water-absorbing layer (3) on at least one surface thereof, the liquid absorbing capacity of the water-absorbing layer being in the range of 1-10ml/m2. In the water-activated shee...
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WO/2013/058570 |
Disclosed is a sealing film for electronic paper having a multilayered structure. The multilayered film for electronic paper comprising a layered structure according to the present invention comprises: (a) a sealing layer formed with a m...
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WO/2013/057264 |
The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types an...
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WO/2013/058182 |
Provided is a re-peelable aqueous dispersion-type acrylic adhesive composition with which it is possible to form an adhesive layer that has excellent antistatic performance, adhesion properties, re-peelability, peeling stability, resista...
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WO/2013/058184 |
Provided is a water-dispersible acrylic adhesive composition capable of forming an adhesive layer, which, when peeled, can prevent the buildup of electrostatic charge in the object to which the film is adhered (antistatic properties),...
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WO/2013/058186 |
Provided is a water-dispersible acrylic adhesive composition capable of forming an adhesive layer which, when peeled, can prevent the buildup of electrostatic charge in the object to which the film is adhered (antistatic properties), ...
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WO/2013/057214 |
Dispersion of a vinyl homopolymer or copolymer with a high molecular weight, including at least one modified polyvinyl alcohol with a high degree of hydrolysis (>95%) suitable to formulate non-structural thermoplastic wood adhesives with...
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WO/2013/055015 |
The adhesive composition of the present invention comprises a (meth)acrylic copolymer; and the (meth)acrylic copolymer includes an alicyclic, an aromatic or a combination thereof; and, in the adhesive composition, the post-curing resista...
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WO/2013/055581 |
A multilayer pressure sensitive adhesive (PSA) film having a first pressure sensitive adhesive layer for bonding glass substrates and at least a second opposing layer, the first pressure sensitive adhesive layer being a polymerization re...
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WO/2013/051396 |
A double-faced pressure-sensitive adhesive tape (12) which includes a first pressure-sensitive adhesive layer (12B) formed from any of pressure-sensitive adhesive samples 2 to 7. Due to this configuration, the first pressure-sensitive ad...
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WO/2013/051712 |
Provided is a substrate-less, double-sided, pressure-sensitive adhesive sheet which minimizes the flaw resulting from foreign matter(such as oligomer) generated in a manufacturing step and thus exhibits excellent optical inspectability a...
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WO/2013/052319 |
Transfer tapes include an optically transparent adhesive layer with a first major surface and a second major surface, with at least one of the major surfaces including a microstructured pattern that is a permanent feature of the adhesive...
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WO/2013/051876 |
Disclosed is an aqueous adhesive composition, the adhesive properties of which are barely degraded due to aging. The aqueous adhesive composition according to the present invention has the technical features of comprising a monomer havin...
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WO/2013/047726 |
Provided is an insulating adhesive film which is characterized by comprising: a to-be-plated layer which is formed of a resin composition for to-be-plated layers containing a polar group-containing alicyclic olefin polymer (A1) and a cur...
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WO/2013/048945 |
The present invention is directed to a multilayer pressure sensitive adhesive (PSA) film, having a first pressure sensitive adhesive layer and at least an opposing layer, wherein the first pressure sensitive adhesive layer comprises a pr...
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WO/2013/047674 |
[Problem] To provide a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformity and excellent printing accuracy, and th...
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