Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 57,698

Document Document Title
WO/2017/179479A1
Provided are: a pressure-sensitive adhesive composition which can be thermally melted at a relatively low temperature to enable hot-melt bonding and which is excellent in terms of adhesive force, holding power, and tack; and a pressure-s...  
WO/2017/179439A1
[Problem] To provide: an adhesive tape for semiconductor processing, which is suppressed in excessive winding around a conveyance roll, and which is able to be easily separated in a pick-up step; and a method for producing a semiconducto...  
WO/2017/181042A1
The present invention relates to a sealing tape for welding and a preparation method thereof. The sealing tape for welding comprises a base layer, and a hot-melted polymer layer sprayed on the base layer and having a network structure fo...  
WO/2017/179910A1
According to one embodiment of the present invention, provided is a multilayer marking film comprising: an adhesive layer; a colored substrate layer having a first color; and a colored coating layer having a second color, wherein the fir...  
WO/2017/179797A1
The present invention relates to a novel adhesive pad and a use thereof, the adhesive pad enabling various articles such as a mobile phone, a tablet PC, and an auxiliary battery to be simply adhered, and facilitating reversible attachmen...  
WO/2017/174303A1
The invention relates to a pressure-sensitive adhesive tape, containing or consisting of a radiation-activatable polymerizable composition containing or consisting of: A) 5 to 60 parts by weight of at least one film-forming component; B)...  
WO/2017/177157A1
Disclosed herein is a kit including one or more decorative elements (pixel layers) and a substrate. The pixel layers can comprise a pre-shaped layer of rigid, semi-rigid, and/or flexible material that can mate with and/or attach to a sub...  
WO/2017/175480A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/175706A1
Provided is clothing in which the stretchability of fabric is equally maintained at a joint and the surrounding area of the joint, and is comfortable to wear by having a pleasant feel and the like. The clothing is configured from a plura...  
WO/2017/176832A1
A weldable adhesive or sealant formulation comprising a structural tape including a solid rubber, a liquid rubber, a tackifier, and an epoxy, wherein the tape is weldable and substantially free of any fibrous filler and includes less tha...  
WO/2017/175753A1
The present invention addresses the problem of providing a pressure-sensitive adhesive sheet which is used for forming a non-slip layer capable of imparting excellent slip-resistance properties without compromising the design aesthetic o...  
WO/2017/175742A1
A mounting film (20) is mounted, via a first bonding layer, to the surface of a slidingly movable moving plate (32) on the inner surface of a base cover (1) of a protective cover (200) for protecting an electronic device (100) such that ...  
WO/2017/175481A1
This sheet 1 for producing a three-dimensional integrated laminated circuit, which is interposed between a plurality of semiconductor chips having through-electrodes and is used to adhere the semiconductor chips to each other and obtain ...  
WO/2017/170021A1
A semiconductor processing sheet comprises an adhesive agent layer on a base material, and has the following characteristics: when the adhesive agent layer has a thickness of 200 μm, the adhesive agent layer with the thickness of 200 μ...  
WO/2017/169662A1
Provided is a film having excellent electrical insulation performance, heat dissipation performance, and workability. In addition, by using the film, provided are an electrical insulation sheet having excellent heat conductivity, a rotat...  
WO/2017/168812A1
Disclosed is an adhesive tape including, on at least one surface of a base material, an adhesive layer (which preferably contains a rubber adhesive) in which not only adhesive portions 2 but also non-adhesive portions 1 partially exist i...  
WO/2017/170437A1
This adhesive sheet for semiconductor processing comprises an adhesive layer on a substrate film and the 5% modulus of the substrate film is 7.0-20.0 MPa. The substrate film is a single layer and comprises 5-39 parts by mass of a styrene...  
WO/2017/171518A1
The present invention relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same. The present invent...  
WO/2017/169451A1
Provided is a surface protection film that comprises an adhesive layer, a middle layer, and a back surface layer, and that is characterized in that the back surface layer comprises a polyolefin resin composition containing 0.3-10 wt% of ...  
WO/2017/171367A1
The present invention relates to a semiconductor device comprising: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermi...  
WO/2017/166116A1
The present invention provides a structural adhesive tape, the structural adhesive tape comprising: a first adhesive layer for adhering to an adhered object and comprising a first adhesive, the surface of the first adhesive layer adherin...  
WO/2017/170941A1
This polyolefin resin foam sheet is formed by foaming a polyolefin resin composition that contains a polyolefin resin and a pigment, wherein the 25% compressive stress is 80-1400 kPa, the pigment content is 0.60-10.00 parts by mass per 1...  
WO/2017/170446A1
Provided is a double-sided pressure-sensitive adhesive sheet which comprises a support and, disposed respectively on both surfaces thereof, a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer, wherein...  
WO/2017/170371A1
Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is prov...  
WO/2017/169895A1
Provided is a pressure-sensitive adhesive film that renders a release paper unnecessary and enables broader applications. This pressure-sensitive adhesive film (10) is formed by stacking a transparent film base material (11), a first adh...  
WO/2017/167806A1
The invention relates to a dosage form (1, 101) for removing at least one adhesive assembly (3) with a double-sided adhesive effect, comprising the following: (a) at least one carrier sheet (20) with an anti-adhesion coated front face (2...  
WO/2017/170413A1
[Problem] To provide: a novel and improved method for cutting an adhesive film, which is capable of producing an adhesive film that has a width of less than 1 mm, while having a low glass transition point and high quality; and an adhesiv...  
WO/2017/168828A1
Provided is a tape for an electronic device package, with which it is possible to suppress the occurrence of bending and marks in a metal layer, which are caused by the edge section of the rotating stage of a pickup device when picking u...  
WO/2017/168829A1
Provided is a tape for an electronic device package which, when picking up an adhesive layer-equipped metal layer from a pressure-sensitive adhesive tape, enables appropriate recognition of individual segments of the adhesive layer-equip...  
WO/2017/170436A1
This adhesive sheet for semiconductor processing comprises an adhesive layer on a substrate film and has a loss factor of 0.08 or more but less than 0.15 at a frequency of 0.01-10 Hz. The substrate film is a single layer and comprises 5-...  
WO/2017/170449A1
In a semiconductor device manufacturing method involving at least steps (A) to (C) below, this adhesive film (50) for semiconductor device manufacture comprises a solvent resistant resin layer (10), an uneven absorptive resin layer (20) ...  
WO/2017/169672A1
[Problem] To provide a radio wave absorbing material having increased reflective attenuation. [Solution] A radio wave absorbing adhesive sheet is characterized in that two or more sets of laminates are stacked, the laminates comprising a...  
WO/2017/169574A1
The purpose of the present invention is to provide a photosensitive adhesive composition that has an excellent filler dispersibility at the time of preparation of a coating material, and a photosensitive adhesive sheet that has a high me...  
WO/2017/169387A1
A film adhesive (13) according to the present invention is a curable film adhesive. A single layer of the film adhesive (13) that has a thickness of 60 µm and that is uncured, or a laminate formed by stacking two or more layers of the f...  
WO/2017/168825A1
Provided is an electronic device package tape such that a metal layer can be held on a base tape during precutting and the base tape can be satisfactorily detached during use. An electronic device package tape 1 of the present invention ...  
WO/2017/168869A1
Provided are a pressure-sensitive adhesive composition for optical films and an optical film, which, even after having been placed in a high-temperature environment, has excellent reworkability and which satisfies durability. The pressur...  
WO/2017/169747A1
[Problem] To provide a film for manufacture of a semiconductor component and a film for manufacture of an electronic component which, even when used in an environment with a changing temperature, can be easily removed from a table surfac...  
WO/2017/168820A1
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhib...  
WO/2017/170452A1
This adhesive film (50), for use in semiconductor device manufacturing, is used for temporarily fixing an electronic component (70) when sealing the electronic component (70) by means of a sealing member (60) in a semiconductor device ma...  
WO/2017/168830A1
Provided is tape for electronic device package which, when picking up an adhesive layer-equipped metal from a pressure-sensitive adhesive tape, can minimize the occurrence of pin indentations due to the deformation of the metal layer by ...  
WO/2017/164088A1
The purpose of the present invention is to provide a display in which an adhesive having zero temperature-dependent birefringence is used to join together a glass sheet and an optical film, whereby the display does not exhibit warping or...  
WO/2017/164066A1
The present invention provides a method for producing a polarizing film protected on one side and having a transparent resin layer, said polarizing film comprising a polarizing film that is protected on one side and as a result of having...  
WO/2017/164064A1
A method for producing a polarizing film protected on one side and equipped with an adhesive layer, by positioning a transparent resin layer and an adhesive layer, in this order, from the polarizer side thereof onto a polarizing film pro...  
WO/2017/162737A1
The invention relates to an adhesive tape for, in particular, wrapping cables, made from preferably a textile support and from an adhesive mass which is in the form of a dried polymer dispersion and which is applied to at least one side ...  
WO/2017/163971A1
This supporting sheet comprises a base and an adhesive layer that is laminated on the base. The surface roughness (Ra) of the adhesive layer-side surface of the base is 0.4 μm or less; and the surface roughness (Ra) of another surface o...  
WO/2017/163817A1
The present invention relates to a surface-treated metal plate for polyolefin resin bonding, which is obtained by laminating an adhesive layer on at least one surface of a metal substrate, with a chemical conversion coating film being in...  
WO/2017/164313A1
In order to improve fixing properties of a thermal transfer ribbon during transfer and to improve printing quality, in a masking tape cassette that supplies masking tape including paper to a tape base layer, a tape cassette 31 has: a mas...  
WO/2017/164536A1
The present invention provides a thermosetting adhesive composition and an adhesive film formed by drying the composition, the thermosetting adhesive composition having a Cl content of 100 ppm or less and comprising 0.01-2 parts by weigh...  
WO/2017/164322A1
[Problem] To improve the fixing properties of a thermal transfer ribbon during transfer, even if a tape base layer includes paper, and to improve printing quality. [Solution] A masking tape cartridge TK capable of being attached to a tap...  
WO/2017/165744A1
The present invention relates to an optical silicone double-side tape. The optical silicone double-side tape comprises a silicone substrate layer having low storage modulus. Specifically, the optical silicone double-side tape comprises a...  

Matches 1 - 50 out of 57,698