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WO/2017/060528A1 |
A particle 10 for use in a conductive adhesive 20 is provided. The particle 10 comprises a core1having a core diameter. The core is formed of a first material having a first elastic modulus. The particle 10 further comprises a shell 2 ar...
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WO/2017/057128A1 |
Provided is a thermal bonding sheet that prevents the material thereof from overflowing during adhering and from traveling up to the surface of the object to be adhered, and that obtains a strong sintered layer following sintering. A the...
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WO/2017/057429A1 |
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of...
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WO/2017/057920A1 |
The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesqu...
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WO/2017/047389A1 |
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An...
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WO/2017/048813A1 |
Techniques are disclosed for producing multilayered composites of adhesive nanofiber composites. Specifically, one or more sheets of highly aligned nanofibers are partially embedded in an adhesive such that at least a portion of the nano...
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WO/2017/047889A1 |
Provided is a photocurable composition for an optical adhesive comprising an acrylic photocurable compound and a plasticizer, wherein the acrylic photocurable compound comprises a monofunctional acrylic photocurable monomer and a (meth)a...
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WO/2017/043455A1 |
[Problem] In the case of fabricating a flexible wiring device, for example, when the final curing and bonding time during final curing and bonding of an electroconductive reinforcing board and a flexible wiring board is reduced, peeling ...
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WO/2017/035709A1 |
Coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper...
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WO/2017/037951A1 |
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...
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WO/2017/035694A1 |
Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and option...
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WO/2017/038572A1 |
Provided is a conductive paste which is capable of suppressing the occurrence of a large void in a bonded portion even in cases where a relatively large chip is bonded to a substrate. A conductive paste which contains: a metal powder hav...
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WO/2017/035710A1 |
Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.
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WO/2017/033935A1 |
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width...
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WO/2017/033933A1 |
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity c...
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WO/2017/033930A1 |
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconduc...
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WO/2017/033932A1 |
To provide an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and improve conduction reliability. In the electroconductive material according to the prese...
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WO/2017/035284A1 |
A cell phone case cover having four layer system screen protector including a first polyethylene terephthalate (PET) layer, an optically clear adhesive (OCA) layer, a second polyethylene terephthalate (PET) layer and a silicon adhesive l...
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WO/2017/030083A1 |
The purpose of the present invention is to provide a resin composition which is composed of an epoxy resin having a specific structure and a rubber-modified polyamide resin having a phenolic hydroxyl group and exhibiting excellent adhesi...
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WO/2017/027482A1 |
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...
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WO/2017/027178A1 |
The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitr...
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WO/2017/025682A1 |
The invention relates to a blade comprising a blade body (9) made of a fibre reinforced polymer matrix composite material and a leading-edge shield (10) made of a material having better resistance to point impacts than the composite mate...
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WO/2017/022523A1 |
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...
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WO/2017/018657A1 |
The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method for manufacturing the same, and has a purpose of manufacturing a conductive adhesive tape by applying an adhesive on one side or bot...
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WO/2017/014414A1 |
An embodiment of the present invention relates to a composition for an anisotropic conductive film, the composition containing: a copolymerized compound of a fluorene-based compound and a bisphenol type epoxy compound; an epoxy resin hav...
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WO/2017/010101A1 |
Provided are: a conductive adhesive sheet (3) having a conductive adhesive layer (2) that has good temporary bonding properties, good bonding strength to a reinforcing plate, and good conductivity, while being less susceptible to blockin...
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WO/2017/006460A1 |
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...
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WO/2017/006854A1 |
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...
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WO/2016/208243A1 |
The present invention addresses the problem of suppressing an increase in contact point resistance caused when a contact point is removed. One aspect of the present invention is a conductive material comprising a liquid conductive resin ...
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WO/2016/204162A1 |
Provided are: an electrically conductive adhesive agent which does not undergo the deterioration in electric conductivity and the fluctuations in resistivity; an electrically conductive structure; and an electronic part. The electrically...
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WO/2016/199252A1 |
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) one or more radical-polymerizable compounds, and (c) a free-radical polymerization initiator, wherein the radical-polymerizable compo...
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WO/2016/195818A1 |
A method of initiating polymerization of a composition formed of a 1, 1-disubstituted alkene compound includes contacting the composition with a substrate and passing an electrical charge through the composition. The composition can also...
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WO/2016/194952A1 |
An adhesive composition which can have excellent life performance and can have a wide margin for mounting, the composition comprising a cationically polymerizable compound, a hardening catalyst based on both an aluminum chelate and a sil...
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WO/2016/186099A1 |
Provided is an electroconductive pressure-sensitive adhesive material which can have a sufficiently heightened electromagnetic-wave-shielding function even when the adherend has a rugged surface. The electroconductive pressure-sensitive ...
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WO/2016/180573A1 |
An electrically conductive composition comprising (A) 5 to 20 vol.-% of electrically conductive particles having an average particle size in the range of 1 to 25 μm and exhibiting an aspect ratio in the range of 5 to 30 : 1, (B) 8 to 50...
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WO/2016/179914A1 |
A polarizing plate (20) comprises a polarizing layer (21), a support layer (22), a surface protective layer (23), a peel-off protection layer (24), and an adhesive layer (25). The polarizing layer (21) is configured to polarize incident ...
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WO/2016/180574A1 |
The use of an electrically conductive composition for the adhesive bonding of an electronic component having a contact surface to a substrate having a contact surface via said contact surfaces, wherein the electrically conductive composi...
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WO/2016/178871A1 |
A viscoelastic adhesive composition is provided, wherein at a dispensing temperature of between 35°C and 120°C, the viscoelastic adhesive composition can be discretely dispensed and has a tan delta of at least 1 as determined by dynami...
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WO/2016/178954A1 |
A laminate structure and method of welding the laminate structure is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core made of an ...
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WO/2016/178651A1 |
A laminate structure and method of forming is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core having an adhesive thickness. The ...
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WO/2016/175232A1 |
A purpose of the present invention is to provide a carrier film for transparent electroconductive films which can be inhibited from causing zipping, is excellent in terms of tight adhesion to transparent electroconductive films and remov...
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WO/2016/171253A1 |
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...
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WO/2016/169190A1 |
Embodiments of the present invention relate to the technical field of display. Provided are a conductive adhesive composition and a preparation method therefor, a frame sealing adhesive and a display panel. The dispersion uniformity of c...
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WO/2016/167245A1 |
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...
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WO/2016/163573A1 |
The present invention relates to a fire-resistant adhesive composition, a fire-resistant sandwich panel using same, and a manufacturing method thereof, and provided according one embodiment of the present invention are the fire-resistant...
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WO/2016/158828A1 |
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus...
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WO/2016/157631A1 |
The purpose of the present invention is to improve the adhesiveness and tight adhesion of a composite material to substrates such as copper, silver, aluminum, silicon, and ferrite by compositing a low-melting-point glass which is used fo...
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WO/2016/158829A1 |
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...
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WO/2016/157594A1 |
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...
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WO/2016/152385A1 |
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...
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