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WO/2015/119221A1 |
The purpose of the present invention is to provide an electrically conductive adhesive tape provided with both excellent adhesiveness and electroconductivity. The present invention provides an electrically conductive adhesive tape having...
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WO/2015/119131A1 |
A first anisotropic conductive film (1A) has a first insulating resin layer (2) and a second insulating resin layer (3). The first insulating resin layer (2) is formed from a photopolymerizable resin, and the second insulating resin laye...
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WO/2015/115161A1 |
The purpose of the invention is to ensure that there is conductivity between an electronic component and a circuit substrate when the wiring pitch of the circuit substrate or the electrode terminals of the electronic component are given ...
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WO/2015/115781A1 |
The present invention relates to a conductive adhesive comprising a conductive polymer and, more particularly, to a conducive adhesive comprising metal powder, a conductive polymer, and a polymer binder and an adhesive film. A conducive ...
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WO/2015/115712A1 |
The present invention provides an anisotropic conductive film and a semiconductor device connected by the same, the film comprising an adhesive layer, which contains: a complex of boron trifluoride and an amine compound of which the pKb ...
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WO/2015/115658A1 |
Provided are a reaction rate measurement method by which the reaction rate of an acrylic adhesive can be measured accurately, even with a small quantity of a sample; and an acrylic adhesive. Using a compound having a fluorene skeleton as...
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WO/2015/112532A1 |
An electrically conductive, single-sided tape includes a conductive adhesive layer, which includes a first conductive porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the...
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WO/2015/111738A1 |
Provided are: a film-shaped adhesive whereby a semiconductor element can easily be sealed by affixing the film-shaped adhesive to the semiconductor element, and whereby the semiconductor element can be sealed by a cured product having ex...
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WO/2015/105028A1 |
Provided are: a film-like adhesive which is capable of relaxing a stress that is caused by expansion difference; a dicing tape with a film-like adhesive; and a method for manufacturing a semiconductor device. The present invention relate...
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WO/2015/104594A1 |
A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light o...
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WO/2015/104988A1 |
Provided are: a conductive film-like adhesive which is capable of suppressing migration and enables the production of a highly reliable semiconductor device; and a dicing tape with a film-like adhesive. The present invention is a conduct...
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WO/2015/104986A1 |
Provided are: a film-like adhesive having excellent conductivity; and a dicing tape with a film-like adhesive. The present invention relates to a film-like adhesive which contains conductive particles having a specific shape. Examples of...
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WO/2015/099289A1 |
The present invention relates to an adhesive composition containing an ionic anti-static agent, and more specifically, to an adhesive composition comprising an acrylic copolymer, a cross-linking agent, and the ionic anti-static agent rep...
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WO/2015/098059A1 |
The purpose of the present invention is to provide a material for bonding an electronic component, such as an electroconductive paste or electroconductive film provided with each of reworkability, storage stability, heat resistance, etc....
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WO/2015/099279A1 |
The present invention relates to an adhesive composition containing an ionic anti-static agent, and more specifically, to an adhesive composition comprising an acrylic copolymer, a cross-linking agent, and the ionic anti-static agent rep...
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WO/2015/094881A1 |
A method of stencil printing includes printing a layer of non-sag adhesive onto a first substrate, adding topography to the layer of non-sag adhesive, and contacting the layer of non-sag adhesive with a second substrate. The second subst...
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WO/2015/095118A1 |
A solid thermoplastic semi-crystalline friction-activated adhesive composition comprising the mixture of: (a) from about 50 to about 100 parts by weight of a semi-crystalline adhesive polymer that comprises: (1) crystalline monomer havin...
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WO/2015/093597A1 |
Provided are highly reliable silver-coated conductive particles, which are prevented from the occurrence of migration. A tin layer is formed on the surface of each spherical base particle, and a silver plating layer is formed on the surf...
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WO/2015/095094A1 |
An electrically conductive, single-sided tape includes a conductive adhesive layer and a conductive polymeric layer positioned adjacent the conductive adhesive layer. The conductive adhesive layer includes a conductive, porous substrate ...
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WO/2015/087971A1 |
This adhesive composition includes silver particles containing silver atoms, zinc particles containing metallic zinc, and a thermosetting resin.
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WO/2015/083306A1 |
Provided is an anisotropic conductive adhesive which, when manufacturing a light-emitting device involving flip-chip mounting of a light-emitting element such as a light-emitting diode (LED) to a wiring board using an anisotropic conduct...
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WO/2015/081698A1 |
The present invention relates to an antistatic pressure-sensitive adhesive protection film, comprising a substrate and a pressure-sensitive adhesive layer applied on the substrate and having an antistatic function, the antistatic functio...
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WO/2015/080536A1 |
The present application relates to an adhesive composition, a protective film, an optical laminate, a polarizing plate, and a display device. In the present application, an adhesive composition may be provided which has good overall phys...
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WO/2015/076174A1 |
The present invention addresses the problem of providing a conductive adhesive sheet which exhibits good adhesiveness and conductivity even if the conductive adhesive sheet is thinner than the conventional ones. The present invention rel...
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WO/2015/068611A1 |
This electroconductive adhesive includes a thermosetting resin (A) having a carboxyl group, an epoxy resin (B), an elastomer (C) having a reactive functional group, an electroconductive filler (D), and a curing agent (E). Through this co...
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WO/2015/060090A1 |
A thermally conductive multilayer sheet (F) which comprises a thermally conductive layer having thermally conductive properties and an insulating layer having electrically insulating properties. This thermally conductive multilayer sheet...
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WO/2015/056754A1 |
The purpose of the present invention is to provide an anisotropic conductive adhesive that makes it possible to obtain excellent heat dissipation properties and connection reliability. In this anisotropic conductive adhesive (30), conduc...
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WO/2015/057012A1 |
The present invention relates to: an anisotropic conductive film composition comprising a binder part, a hardening part, a hardening agent, conductive particles, and a solvent having Hansen solubility parameters of 17 to 20; an anisotrop...
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WO/2015/056512A1 |
This electrical connection material for an anisotropically-conductive film or the like minimizes the occurrence of warp in the electrical connection parts such as anisotropically-conductive connection parts, and moreover does not diminis...
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WO/2015/046063A1 |
This invention provides: a shielding housing that allows reduced thickness and easier handling; a printed circuit board; an electronic device; and a method for manufacturing a shielding housing. This shielding housing (10) is formed from...
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WO/2015/046199A1 |
Provided is a thermal curing-type magnetizable adhesive composition containing an acrylic polymer (A), an epoxy resin (B), a curing agent (C), and a ferromagnetic body (D), the epoxy resin (B) including at least one type selected from th...
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WO/2015/046254A1 |
The purpose of the present invention is to provide: a heat-conductive adhesive sheet which can be stacked easily and without interposing an adhesive layer in an electronic device, and, additionally, can selectively radiate heat in a spec...
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WO/2015/040397A1 |
A circuit board assembly is described. The circuit board assembly comprises a circuit board (2) comprising a substrate (4) supporting a plurality of contact lands (9; Fig. 2) and a device (3), such as a bare die or printed circuit board,...
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WO/2015/037626A1 |
A thermally conductive sheet which comprises a thermally conductive tacky layer and a non-tacky resin layer superposed thereon, wherein the thermally conductive tacky layer comprises a thermally conductive filler and an acrylic resin obt...
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WO/2015/030186A1 |
A sheet (1) for processing a semiconductor, provided with a substrate (2) and an adhesive layer (3) laminated on at least one surface of the substrate, wherein the adhesive layer (3) is formed from an adhesive composition containing: a p...
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WO/2015/021697A1 |
A sealant composition, comprising a sealant and a fluorescent material, wherein the fluorescent material is excited by an invisible light having a wavelength of less than 400 nm and releases optical energy. The sealant composition facili...
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WO/2015/020410A1 |
The present invention relates to an adhesive film and a method for manufacturing an organic electronic device using same, and provides the adhesive film capable of effectively blocking moisture or oxygen introduced into the organic elect...
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WO/2015/020407A1 |
The present invention relates to an adhesive film and a method for producing an organic electronic device using the same, and provides an adhesive film capable of: effectively blocking moisture or oxygen flowing from the outside into an ...
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WO/2015/019414A1 |
The present invention mainly addresses the problem of producing an electronic component joint material which can be cured at a low temperature and contains CNTs that can achieve high electrical conductivity. According to the present inve...
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WO/2015/020412A1 |
The present invention relates to an adhesive film and a method for manufacturing an organic electronic device using same, and provides the adhesive film capable of effectively blocking moisture or oxygen introduced into the organic elect...
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WO/2015/020408A1 |
The present invention relates to an adhesive composition, an adhesive film, and a method for manufacturing an organic electronic device using same, and provides the adhesive composition and the adhesive film comprising same, wherein the ...
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WO/2015/018546A1 |
The invention relates to a method for connecting two metal sheets (1, 2). In said method, a first metal sheet (1) is folded at an end segment and an end segment of a second metal sheet (2) is folded into the fold, and adhesive (4) is int...
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WO/2015/018138A1 |
A conductive silver paste comprises silver powder. The silver powder is spherical silver powder. Also disclosed is a method for preparing the conductive paste. The conductive silver paste has higher and more uniform heating-curing effici...
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WO/2015/016168A1 |
Provided is an anisotropic conductive film that can prevent inter-terminal shorts even resulting from the progression of increased narrowness between connection terminals. The present invention has: a conductive support plate (10) that s...
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WO/2015/016169A1 |
In the present invention, conductive particles filling openings are reliably transferred to a binder resin layer. The present invention has: a step for filling a plurality of openings (12) formed in a predetermined pattern at the surface...
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WO/2015/012526A1 |
The present invention relates to an adhesive composition and, more specifically, to an adhesive composition which: contains an ionic antistatic agent and an acryl-based copolymer containing an acrylate-based monomer having an amino alcoh...
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WO/2015/009003A1 |
The present invention relates to an adhesive composition, and more specifically, to an adhesive composition which can improve both antistatic properties and durability, raise no concerns about deterioration in physical properties accordi...
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WO/2014/209622A1 |
An article including a release liner with an adhesive layer disposed thereon, the adhesive layer including a plurality of stripes of a first pressure-sensitive adhesive and of a second pressure-sensitive adhesive, arranged in a generally...
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WO/2014/202187A1 |
The invention relates to an adhesive means based on fiber-containing materials which have activatable adhesive components. The invention is characterized in that the adhesive means is a wettable and/or meltable textile sheet material mad...
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WO/2014/196347A1 |
Provided is a thermally conductive composite sheet affixed to the rear side of the back surface of a portable electronic terminal known as an Ultrabook, a tablet PC, or a smartphone, and provided so that a given air gap is present with r...
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