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Patent Searching and Data


Matches 251 - 300 out of 5,186

Document Document Title
WO/2021/027246A1
A conductive carbon black coating liquid, comprising the following components in parts by mass based on total weight: 23-25 parts of a conductive filler containing carbon black; 1-1.5 parts of an acid polyester polyamide solution; 0.8-1....  
WO/2021/028795A1
A core-sheath filament having a) a core that is a thermally conductive pressure-sensitive adhesive particles and b) a non-tacky, thermoplastic sheath is provided. The thermally conductive pressure-sensitive adhesive in the core includes ...  
WO/2021/025114A1
Provided is a resin particle which makes it possible to bring about increases in the area of contact between the resin particle or a particle comprising the resin particle and an adherend and in the resistance of friction therebetween an...  
WO/2021/024204A1
A core-sheath filament having a non-tacky sheath and a hot-melt processable adhesive core, the sheath exhibiting a melt flow index of less than 15 grams per 10 minutes, is provided. Methods of making the core-sheath filament and methods ...  
WO/2021/021417A1
Described herein are hydrocarbon polymer modifiers for use in various applications. The hydrocarbon polymer modifier comprises a cyclic component, and has a glass transition temperature and Mn defined by the following two equations: (1) ...  
WO/2021/021416A1
Described herein are hydrocarbon polymer modifiers for use in various applications. The hydrocarbon polymer modifier comprises a cyclic component, and has a glass transition temperature and Mn defined by the following two equations: (1) ...  
WO/2021/012354A1
Provided in the present disclosure are a conductive adhesive and a preparation method therefor. The conductive adhesive comprises a photosensitive small molecule monomer, a photocationic polymeric compound, a photoinitiated cationic curi...  
WO/2021/010171A1
Provided are: a bonding film that exhibits sufficient contact heat resistance and high reliability, achieves a preferable bond with respect to a substrate irrespective of the type of electrodes of a semiconductor element, and involves an...  
WO/2021/008190A1
A pressure-sensitive conductive adhesive tape and application thereof in photovoltaic cell sheet lamination. Preparation steps are as follows: step I, uniformly dispersing conductive particles in an acrylic acid pressure-sensitive adhesi...  
WO/2021/006466A1
Disclosed is a manufacturing method for an anisotropic conductive adhesive film. In the present method, by using a mold including an adhesive film having barrier particles attached to the surface thereof, the barrier particles having a d...  
WO/2021/006465A1
Disclosed is a method for manufacturing an anisotropic conductive adhesive film. The method comprises the steps of: preparing a mold including an adhesive film having barrier particles attached to one surface thereof, the barrier particl...  
WO/2021/006898A1
A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a li...  
WO/2021/001823A1
A suspended-particle device with improved adhesion between the active and conductive layers is disclosed. The conductive layers are coated with an adhesion promoter that comprises at least one organosilane that covalently bonds to the su...  
WO/2020/262944A1
A bonding film according to an embodiment comprises at least one bonding layer which comprises a polyvinyl acetal resin, a plasticizer, and a bonding strength regulator, wherein the bonding strength regulator is a film comprising a butyl...  
WO/2020/260719A1
The aim of the invention is to devise a pressure-sensitive adhesive compound which has a wide spectrum of bonding performance, can be efficiently produced and in particular has an excellent thermal conductivity. The compound should possi...  
WO/2020/262858A1
According to an embodiment of the disclosure, an electronic device includes: a transparent front surface plate defining at least a portion of a front surface of the electronic device, and including a first edge and a second edge disposed...  
WO/2020/262849A1
Provided is an electronic apparatus comprising: a front plate oriented in a first direction; a rear plate oriented in a second direction that is the opposite direction of the first direction; an inner structure which forms an inner space...  
WO/2020/250848A1
A temperature-sensitive pressure-sensitive adhesive according to the present invention comprises a side-chain-crystalline polymer and has reduced adhesive force at temperatures lower than a melting point of the side-chain-crystalline pol...  
WO/2020/241818A1
Provided is an electroconductive pressure-sensitive adhesive sheet which can be easily adhered to adherends to have high adhesive force, has excellent electrical-connection stability, and changes little in resistivity through a heat cycl...  
WO/2020/236337A1
A piezoelectric MEMS scanning mirror system is provided. In particular, the efficiency and life of the system are improved by use of new bonding methods. Mechanical and electrical connections between the actuator frame of a piezoelectric...  
WO/2020/235573A1
Provided is a conductive adhesive sheet that has outstanding connection stability even if the quantity of conductive particles blended in is low. This conductive adhesive sheet includes a binder constituent and conductive particles. The ...  
WO/2020/212291A1
The present invention concerns a water based glue stick composition comprising adhesive and nanocrystalline cellulose. It also concerns a glue stick containing the glue stick composition according to the present invention and the use of ...  
WO/2020/205437A1
Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during stora...  
WO/2020/205433A1
Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during stora...  
WO/2020/203295A1
Provided is an adhesive composition that can achieve high reliability. An adhesive composition that contains silicone particles, a silane coupling agent, a polymerizable compound, and a curing agent. The total surface area of perfectly s...  
WO/2020/203072A1
The present invention includes: a conductive case (3); a piezoelectric material (1) that has a piezoelectric electrode (2b); and an adhesive member (4) that adheres the case (3) to the piezoelectric material (1). The adhesive member (4) ...  
WO/2020/200464A1
A method (300) for manufacturing an antenna element for transmitting or receiving a RF signal comprises: providing (301) a metallized electrical conduction line on a non- conductive surface of a first support element; bringing (305) a co...  
WO/2020/193526A1
The present invention relates to a conductive multicomponent system (10, 110) comprising at least one first substance (S1) and comprising at least one substrate (B), wherein a) the first substance (S1) is present in one or more substance...  
WO/2020/198426A1
Introduced here are carrier assemblies that include a rigid tray having a deck area with a patterned surface of cavities for receiving semiconductor components. The cavities can be designed to accommodate semiconductor components of diff...  
WO/2020/193536A1
The invention relates to a multicomponent system comprising at least one first substance and at least one second substance. The multicomponent system can be activated, and the first substance and the second substance are provided in mult...  
WO/2020/189359A1
A metal particle-containing composition according to the present invention comprises: at least one thermosetting resin (R); a curing agent (H); and at least three metal particles (P) different from each other. The metal particles (P) inc...  
WO/2020/181747A1
The present application relates to an anisotropic conductive adhesive structure and a production method therefor. The anisotropic conductive adhesive structure comprises several conductive wires distributed evenly, and a binding layer fo...  
WO/2020/184585A1
One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest ...  
WO/2020/184584A1
A circuit-connecting adhesive film 1 comprising a first adhesive layer 2 and a second adhesive layer 3 layered upon the first adhesive layer 2, wherein the first adhesive layer 2 is formed from a cured product of a photosetting compositi...  
WO/2020/184583A1
An adhesive film 1 for circuit connection comprises a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the first adhesive layer 2 is composed of a photocured product of a photocurable ...  
WO/2020/184594A1
The present invention provides an adhesive sheet that uses an adhesive layer, to which a conductive organic polymer compound is added, and still enhances the production efficiency of a product that uses this adhesive layer. According t...  
WO/2020/184636A1
An adhesive film 11 for circuit connection is provided with: a peelable support film 12, a first adhesive layer 13 containing conductive particles P, the first adhesive layer being disposed on the support film; and a second adhesive laye...  
WO/2020/180425A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/180577A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/180580A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/180653A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/179179A1
The present invention provides a conductive adhesive composition which has both isotropic electrical conduction and excellent adhesiveness, while being processable at 120°C or less. A conductive adhesive composition which contains 50-...  
WO/2020/180587A1
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy th...  
WO/2020/175055A1
The present invention addresses the problem of providing a conductive composition and a conductive adhesive agent that have high fluidity and conductivity. The present invention provides a conductive composition containing (A) conductive...  
WO/2020/173853A1
The invention relates to a method for bonding a first component (1) to a second component (2), involving the following steps: - depositing, onto the first component (1) and/or onto the second component (2), an adhesive means of a first t...  
WO/2020/175685A1
This anisotropic conductive sheet has: an insulation layer that has a first surface and a second surface and that is formed of a first resin composition; a plurality of resinous columns that are formed of a second resin composition and t...  
WO/2020/174175A1
The invention relates to a method for bonding a first component (1) to a second component (2), involving the following steps: - depositing, onto the first component (1) and/or onto the second component (2), an adhesive means of a first t...  
WO/2020/175056A1
Provided is an electroconductive adhesive having high flowability and electrical conductivity. The electroconductive adhesive comprises (A) electroconductive particles, (B) a solvent, (C) a thermosetting resin, and (D) silica particles...  
WO/2020/162677A1
The present application relates to a radical-based adhesive composition, an adhesive layer, a polarizing plate, and an image display device.  
WO/2020/162231A1
Provided is a novel adhesive sheet suitably used for simultaneous batch inspection of a plurality of electrically-conductive small pieces. This adhesive sheet comprises an adhesive agent layer. The adhesive agent layer has a surface resi...  

Matches 251 - 300 out of 5,186