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WO/2020/148960A1 |
[Problem] To enhance durability between substrates of a probe substrate, and/or durability of the probe substrate and a member to be joined. [Solution] A probe substrate pertaining to the present invention has a plurality of electrical c...
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WO/2020/149439A1 |
The present invention relates to a conductive adhesive film with excellent heat resistance and moisture resistance, in which an adhesive layer made of a conductive adhesive composition comprising: 100 parts by weight of a polyamide resin...
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WO/2020/145170A1 |
The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an ave...
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WO/2020/136609A1 |
Thermally conductive sheets are composites of a thermoplastic polymer resin and a thermally conductive powder that includes boron nitride platelets and may also include aluminum hydroxide. The thermally conductive sheet has a first major...
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WO/2020/136588A1 |
A substantially planar self-folding film assembly to generate a folded three-dimensional assembly. The assembly includes a flexible support substrate, adhesive elements, and folding members. The folding members include a base, a folding ...
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WO/2020/129894A1 |
This conductive adhesive sheet (10) has a first adhesive layer (12), a second adhesive layer (14), and a third layer (16) arranged between the first adhesive layer (12) and the second adhesive layer (14), wherein the storage elastic modu...
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WO/2020/124931A1 |
The present invention provides an anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive uses a thermal-cured epoxy resin system as a base, and comprises the following components in percentage by mass: 10-...
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WO/2020/124909A1 |
Provided by the present invention are an anisotropic conductive adhesive and a conducting film thereof. The conductive adhesive employs a cationic curing system, and comprises the following components by mass: 10-40 wt% of film-forming r...
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WO/2020/119898A1 |
The present invention relates to an adhesive film that can be wound and stamped, having an epoxy-based adhesive compound that can be activated thermally or by UV radiation, and a dye and/or a pigment mixed into the adhesive compound for ...
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WO/2020/108765A1 |
The present invention relates to a latently reactive, conductive, polyurethane-based adhesive film, comprising a crystalline and/or crystalline and amorphous polyurethane component and a conductive filler.
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WO/2020/111303A1 |
The present invention relates to a photocurable optical adhesive composition, an adhesive produced from the composition, and a method for producing the adhesive.
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WO/2020/097340A1 |
Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned o...
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WO/2020/095919A1 |
An electromagnetic shielding film comprising: a shielding film part provided with an adhesive layer, a shielding layer layered on the adhesive layer, and an insulating layer layered on the shielding layer; and a protective part comprisin...
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WO/2020/093556A1 |
The present invention provides an anisotropic conductive adhesive and a conducting film thereof. The conductive adhesive uses a thermosetting acrylate system as a basis, and comprises an acrylate monomer, a radical initiator, a film-form...
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WO/2020/090757A1 |
The present invention addresses the problem of providing a low-temperature rapid-curing type low-elasticity conductive adhesive that is useful as a conductive adhesive for mounting components used in the field of FHE. This conductive res...
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WO/2020/084202A1 |
The invention relates to a method for manufacturing or constructing or reconstructing electric circuits, in particular on the micrometric scale, as well as the means for implementing such a method such as the use and manufacture of an el...
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WO/2020/083815A1 |
The invention relates to an adhesive (5, 5'), which comprises: at least one electrically conductive particle (11), at least one conversion particle (10), and at least one polymer matrix (9). The invention also relates to an optoelectroni...
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WO/2020/085316A1 |
The present invention provides a conductive adhesive sheet which exhibits good provisional bondability even in cases where the surface smoothness is low. A conductive adhesive sheet which has a peak top temperature of storage elastic mod...
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WO/2020/081507A1 |
An electrically conductive material includes an anionic polymer having a polymer backbone that is bonded to a plurality of terminal catechol moieties and a plurality of terminal sulfonate moieties. It also includes a cationic polymer inc...
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WO/2020/073099A1 |
1. A conductive apparatus, including: a first conductive portion for attaching to an inner portion of a footwear garment; a second conductive portion for attaching to an underside of the footwear garment; and a connecting portion that a...
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WO/2020/076054A1 |
An electronic device is disclosed. The electronic device may comprise: a housing; a substrate disposed inside the housing and comprising a first electric element and an adhesive material; and a shielding material fixed to the substrate b...
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WO/2020/071471A1 |
The method for bonding metallic members according to an aspect of the present invention is a method for bonding metallic members to each other which comprises: a step in which a silver ink composition adherent to a surface of a first met...
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WO/2020/066870A1 |
Provided are: a surface-protection-sheet adhesive composition for a surface protection sheet that is easily laminated on an adherend, that is easily peeled off therefrom, that is capable of preventing the occurrence of adhesive residue o...
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WO/2020/060894A1 |
A composition of matter includes an ultraviolet (UV) and thermally curable, non-epoxy acrylic adhesive having a concentration in the range of 5 to 30 weight percent of the composition and conductive metal particles having a concentration...
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WO/2020/054495A1 |
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG m...
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WO/2020/050188A1 |
The present invention provides: a novel and improved method for producing a connected structure, said method enabling provisional bonding without the application of heat; and a connection film. The above are achieved by means of a method...
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WO/2020/009229A9 |
This printed wiring board adhesive film comprises an bonding agent layer 111, and an insulating protective layer 112. With the insulating protective layer 112, the load area ratio (Smr2) separating a projection valley part and a core par...
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WO/2020/040726A1 |
A method of increasing conductivity in ink using radio frequency energy. A conductive ink comprising a plurality of conductive particles and a binder is printable on a surface, such as a RF antenna. A RF source is used to apply a RF sign...
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WO/2020/031144A1 |
A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, ...
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WO/2020/023995A1 |
A composition capable of forming a heat generating layer on a building element is disclosed. The composition comprises a base material and an electrically conductive filler, wherein the composition is capable of forming a heat generating...
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WO/2020/020334A1 |
A conductive adhesive, a raw material composition, an electronic element, and a preparation method and application. The raw material composition comprises the following components: a polymer elastomer resin, conductive particles, and hot...
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WO/2020/012236A1 |
The present disclosure relates to a filler for an electrically conductive adhesive, comprising a carbon nanotube, a metal nanoparticle, and a perylene linker or a pyrrolidine linker bound to the carbon nanotube; wherein the linker is als...
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WO/2020/009230A1 |
This affixation film 101 for a printed wiring board comprises a circuit pattern hiding layer 112, and an adhesive layer 111 laminated with the circuit pattern hiding layer 112. The Rku of the surface of the circuit pattern hiding layer 1...
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WO/2020/009453A1 |
A flavor compound according to an aspect comprises: a flavor component expressing flavor; and a support for supporting the flavor component in the inner space thereof, the support containing cyclodextrin.
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WO/2020/009238A1 |
Provided is a conductive particle with insulative particles, which, when electrodes are electrically connected to each other, can effectively enhance conduction reliability and can also effectively enhance insulation reliability. The con...
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WO/2019/244594A1 |
The present invention is provided with a reinforcement substrate (21), an adhesive material (22), and a sensor part (23) which is arranged on a first main surface (14) of the substrate (21), with the adhesive material (22) being interpos...
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WO/2019/239955A1 |
The problem to be solved by the present invention is to provide an electrically conductive adhesive sheet that, even in an area of an electronic substrate with an uneven surface or in bonding between rigid bodies, has good adhesiveness, ...
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WO/2019/228953A1 |
The present invention relates to a pressure-sensitive adhesive strip which can be removed again without residue and non-destructively by extensive stretching essentially in the plane of adhesion, comprising a pressure-sensitive adhesive ...
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WO/2019/227559A1 |
Provided by the present invention are a solid conductive gel suitable for an electrochemical system and a preparation method therefor. A new gelatin substrate is used to cure a liquid electrolyte of an electrochemical system by means of ...
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WO/2019/218268A1 |
Provided is a curable adhesive composition for die attach that can eliminate the void issue, minimize the fillet, and has lower bond line thickness and tilt trend, when cured.
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WO/2019/208071A1 |
This manufacturing method includes, for example: a step for forming a semiconductor wafer divided body (10) including a plurality of semiconductor chips (11) from a semiconductor wafer (W) on a dicing tape (T1); a step for bonding a sint...
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WO/2019/195915A1 |
A hot-melt formulation can utilize a depolymerized polymeric material such as a wax, styrenic polymer, and/or styrenic oligomer, wherein the wax, styrenic polymer, and/or styrenic oligomer is created via depolymerization of a polymer. In...
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WO/2019/193880A1 |
[Problem] To provide an adhesive composition with high adhesion reliability, a connection structure, and a manufacturing method of the connection structure. [Solution] This adhesive composition contains a film forming resin, an acrylate-...
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WO/2019/188372A1 |
Provided are an anisotropic conductive adhesive with which it is possible to obtain high connection reliability even in the case of pressure bonding under a low pressure condition, and a connecting body manufacturing method. The anisotro...
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WO/2019/189512A1 |
The purpose of the present invention is to provide an electroconductive adhesive composition having excellent thermal conductivity and migration resistance. The present invention relates to an electroconductive adhesive composition conta...
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WO/2019/191414A1 |
Disclosed herein is an electrically conductive adhesive composition, articles comprising at least two components adhesively bonded by the electrically conductive adhesive composition and methods of making such adhesives and articles. The...
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WO/2019/181602A1 |
Provided is a photoresponsive polymer comprising repeating units based on an alkyl glyceryl itaconate which are represented by formula (A). (In formula (A), n is an integer of 4-17.)
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WO/2019/172136A1 |
The purpose of the present invention is to provide a multilayer film which has excellent transparency and adhesiveness, while having excellent electrical conductivity at the same time. A multilayer film according to the present invention...
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WO/2019/172137A1 |
The purpose of the present invention is to provide a multilayer film which has excellent electrical conductivity, while having excellent transparency at the same time. A multilayer film according to the present invention is provided with...
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WO/2019/172870A1 |
A display mirror assembly for a vehicle may comprise a display module comprising a display element; a partially reflective, partially transmissive element disposed generally parallel to the display element; optical bonding adhesive havin...
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