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Matches 1 - 50 out of 5,986

Document Document Title
WO/2018/170471A1
Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a chan...  
WO/2018/170371A1
Provided herein are novel polyaromatic compounds which, upon cure, produce high refractive index polymers. In accordance with certain aspects of the present invention, there are provided high refractive index formulations containing the ...  
WO/2018/165445A1
An electrically conductive adhesive composition with one or more epoxy resins, one or more nanoparticulate conductive metals having a functionalized coating, and one or more electrically conductive nanoscopic carbon materials with a coat...  
WO/2018/163921A1
Provided are: an anisotropic conductive adhesive in which conductive particles are able to be dispersed by a simple method, and which is capable of suppressing short-circuit between electrode terminals of an electronic component; a metho...  
WO/2018/159784A1
The purpose of the present invention is to provide an electrically peelable adhesive composition for producing an electrically peelable adhesive layer suitable for suppressing corrosion of a metal adherend surface. In addition, the prese...  
WO/2018/159608A1
Provided is an alumina-based thermally conductive oxide which has not only excellent thermal conductivity but also excellent chemical resistance, water resistance and electrical insulation properties, while exhibiting excellent kneadabil...  
WO/2018/161025A1
The present disclosure generally relates to ionic compositions which may be used in or as an adhesive material for selectively adhering two items together. More particularly, but not exclusively, the present disclosure relates to ionic c...  
WO/2018/156878A1
A nanofiber structure is described that is composed of a substrate and a layer of oriented nanofibers. Nanofibers of the layer can be oriented in a common direction. An angle of the common direction can be selected so that nanofibers of ...  
WO/2018/151139A1
One aspect of the present invention is an adhesive film provided with: a first adhesive layer which includes a first adhesive component, first conductive particles that are dendritic conductive particles, and second conductive particles ...  
WO/2018/151131A1
One aspect of the present invention is an adhesive film provided with: a first adhesive layer which includes first conductive particles that are dendritic conductive particles; and a second adhesive layer which includes second conductive...  
WO/2018/143501A1
The present invention relates to a method for manufacturing a fine-pitch anisotropic conductive adhesive, and a fine-pitch anisotropic conductive adhesive manufactured by the method. The method for manufacturing a fine-pitch anisotropic ...  
WO/2018/139552A1
According to the present invention, each one of insulation covered conductive particles comprises a conductive base material particle and insulating fine particles that cover the surface of the base material particle, and has a sparse re...  
WO/2018/138084A1
In a component or retaining element which is usable for the plasma processing or the thermal processing of workpieces using an electric arc, on a component that is mechanically connectable by way of a retaining element in a region formed...  
WO/2018/129899A1
A safe explosion-proof easy-to-disassemble adhesive tape and a preparation method therefor. The adhesive tape comprises a flame-retardant, current conducting, heat conducting, and heat-expanding pressure-sensitive adhesive layer, a flame...  
WO/2018/124578A1
The present invention relates to a method for preparing a hot-melt adhesive resin composition having improved thermal stability. According to the preparation method, an SBS resin and an aromatic component-added dicyclopentadiene resin ar...  
WO/2018/116813A1
The present invention provides: a bonding film which is capable of bonding a semiconductor element to a substrate to produce a semiconductor device having improved mechanical strength and thermal cycling characteristics; and a tape for w...  
WO/2018/118880A1
Conductive particles, articles including such particles, and methods of making such conductive particles, are provided; wherein the conductive particles include: a core particle including at least one of a glass, a glass-ceramic, or a me...  
WO/2018/110285A1
The problem that the present invention attempts to address is to provide a thin-profile electroconductive adhesive tape having exceptional adhesive strength, said thin-profile electroconductive adhesive tape allowing air bubbles to quick...  
WO/2018/110754A1
The present invention relates to an adhesive sheet or an adhesive tape which has an electromagnetic wave-blocking function, and provides a method for producing a UV-curable adhesive sheet in which an electromagnetic wave filler has enhan...  
WO/2018/110755A1
The present invention relates to an adhesive tape exhibiting electromagnetic wave absorption anisotropy by imparting orientation to an electromagnetic wave-absorbing filler, and to a method for producing the adhesive tape, and provides a...  
WO/2018/101003A1
Provided is an anisotropic electrically-conductive adhesive agent that has excellent heat resistance and light energy resistance. An anisotropic electrically-conductive adhesive agent for connecting a light-emitting element on an electro...  
WO/2018/101438A1
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...  
WO/2018/092671A1
The present invention provides: a bonding film which gives connections having sufficient heat resistance and high reliability and which facilitates a step for bonding a semiconductor element to a substrate; a tape for wafer processing; a...  
WO/2018/087858A1
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...  
WO/2018/089078A3
Embodiments of this invention relate to methods of adhering in an aqueous environment. More specifically, embodiments of this invention relate to use of a copolymer mimics of mussel adhesive proteins as a high-strength adhesive in aqueou...  
WO/2018/069512A1
The invention relates to a thermally conductive acrylic adhesive tape, which comprises 600 - 800 parts by weight of a metal hydroxide, and 100 parts by weight of an acrylic copolymer that is based on least one alkyl (meth)acrylate and 1 ...  
WO/2018/066411A1
An electroconductive film which comprises a continuous release film and, disposed on the release film, a plurality of adhesive film pieces having electroconductivity. The plurality of adhesive film pieces have been arranged along the lon...  
WO/2018/053828A1
An adhesive agent and a preparation method therefor. The adhesive agent consists of the following formula ingredients in parts by mass: a non-diluted starch 30-40 parts, zirconium sulfate solution 3-5 parts, limonene 6-8 parts, carvone 5...  
WO/2018/053802A1
Disclosed herein are adhesive compositions comprising : (a) a continuous insulating binder phase, (b) a plurality of conductive particles, (c) a first particulate non-conductive phase formed of a plurality of insulating particles, and (d...  
WO/2018/051799A1
The purpose of the invention is, in a filler-containing film in which filler is dispersed in a resin layer, to limit filler flow due to unnecessary flow of the resin layer during pressure bonding of the filler-containing film and an obje...  
WO/2018/047598A1
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the pr...  
WO/2018/047957A1
A conductive adhesive composition which contains at least one of a thermoplastic resin and a thermosetting resin, a conductive filler and inorganic particles. The inorganic particles have a cumulative frequency of 40% or less at the part...  
WO/2018/047690A1
Provided is a conductive material that allows solder on conductive particles to be disposed efficiently on an electrode even after the conductive material has been left standing for a set period of time, and is such that the yellowing of...  
WO/2018/047597A1
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...  
WO/2018/042701A1
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...  
WO/2018/043505A1
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...  
WO/2018/043296A1
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these chara...  
WO/2018/038475A1
The present invention relates to a pressure-sensitive adhesive tape, a method for manufacturing the same, and an electronic device comprising the same. The pressure-sensitive adhesive tape comprises: a fiber accumulation type substrate i...  
WO/2018/036163A1
A touch screen production method and an electrically conductive peelable tape. The production method of touch screen comprises: forming a touch electrode (10), and forming an electrically conductive peelable tape layer (20) on the touch ...  
WO/2018/034234A1
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least...  
WO/2018/030184A1
[Problem] The present invention provides: an epoxy resin composition which exhibits excellent storage stability, while having low initial viscosity and good curability at low temperatures; and a conductive adhesive which contains this ep...  
WO/2018/024073A1
The invention provides a heat-dissipating type conductive silver paste and a preparation method therefor. The heat-dissipating type conductive silver paste is prepared from 100 parts of a resin mixture, 100 to 500 parts of silver powder ...  
WO/2018/013342A1
Disclosed herein are electrically conductive adhesive compositions and their use in solar cell modules, wherein the electrically conductive adhesives comprise one or more olefinic carboxylic acids or derivatives thereof.  
WO/2018/008693A1
Provided are insulated particles with which an anisotropic conductive adhesive can be obtained, the anisotropic conductive adhesive achieving, if circuit substrates, each having a plurality of terminals, are to be electrically connected ...  
WO/2018/006503A1
Provided are a silver salt-doped conductive silver adhesive, and a preparation method and a use thereof. The silver salt-doped conductive silver adhesive is prepared and obtained from the following raw materials: 0.01-5 parts by weight o...  
WO/2018/009891A1
Blends comprising a conductive polymer and a matrix material are provided. The blends find utility in a number of applications, including use as a conformal coating on consumer electronic articles.  
WO/2018/003704A1
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...  
WO/2017/206645A1
A conductive particle, manufacturing method thereof, conductive adhesive comprising the conductive particle, and manufacturing method thereof. The conductive particle comprises: a core microsphere (10); a conductive polymer layer (12) co...  
WO/2017/209427A1
The present invention relates to a flexible electromagnetic shielding sheet and an electronic device provided with same, the flexible electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape provided with an electro...  
WO/2017/209429A1
The present invention relates to a thin electromagnetic shielding sheet and an electronic device provided with same, the thin electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape comprising accumulated-fiber-typ...  

Matches 1 - 50 out of 5,986