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Matches 1 - 50 out of 5,913

Document Document Title
WO/2018/110285A1
The problem that the present invention attempts to address is to provide a thin-profile electroconductive adhesive tape having exceptional adhesive strength, said thin-profile electroconductive adhesive tape allowing air bubbles to quick...  
WO/2018/110754A1
The present invention relates to an adhesive sheet or an adhesive tape which has an electromagnetic wave-blocking function, and provides a method for producing a UV-curable adhesive sheet in which an electromagnetic wave filler has enhan...  
WO/2018/110755A1
The present invention relates to an adhesive tape exhibiting electromagnetic wave absorption anisotropy by imparting orientation to an electromagnetic wave-absorbing filler, and to a method for producing the adhesive tape, and provides a...  
WO/2018/101003A1
Provided is an anisotropic electrically-conductive adhesive agent that has excellent heat resistance and light energy resistance. An anisotropic electrically-conductive adhesive agent for connecting a light-emitting element on an electro...  
WO/2018/101438A1
The purpose of the present invention is to provide: an electrode structure which is free of the problem of dryness caused by the volatilization of water or an organic solvent and is provided with an adhesive agent layer having sufficient...  
WO/2018/092671A1
The present invention provides: a bonding film which gives connections having sufficient heat resistance and high reliability and which facilitates a step for bonding a semiconductor element to a substrate; a tape for wafer processing; a...  
WO/2018/087858A1
Provided is a semiconductor-bonding resin composition that exhibits superior thermal conductivity and electrical conductivity, and is optimal for bonding a power semiconductor element and an element-supporting member. The semiconductor-b...  
WO/2018/089078A3
Embodiments of this invention relate to methods of adhering in an aqueous environment. More specifically, embodiments of this invention relate to use of a copolymer mimics of mussel adhesive proteins as a high-strength adhesive in aqueou...  
WO/2018/069512A1
The invention relates to a thermally conductive acrylic adhesive tape, which comprises 600 - 800 parts by weight of a metal hydroxide, and 100 parts by weight of an acrylic copolymer that is based on least one alkyl (meth)acrylate and 1 ...  
WO/2018/066411A1
An electroconductive film which comprises a continuous release film and, disposed on the release film, a plurality of adhesive film pieces having electroconductivity. The plurality of adhesive film pieces have been arranged along the lon...  
WO/2018/053828A1
An adhesive agent and a preparation method therefor. The adhesive agent consists of the following formula ingredients in parts by mass: a non-diluted starch 30-40 parts, zirconium sulfate solution 3-5 parts, limonene 6-8 parts, carvone 5...  
WO/2018/053802A1
Disclosed herein are adhesive compositions comprising : (a) a continuous insulating binder phase, (b) a plurality of conductive particles, (c) a first particulate non-conductive phase formed of a plurality of insulating particles, and (d...  
WO/2018/051799A1
The purpose of the invention is, in a filler-containing film in which filler is dispersed in a resin layer, to limit filler flow due to unnecessary flow of the resin layer during pressure bonding of the filler-containing film and an obje...  
WO/2018/047598A1
In the past, it was necessary to add many electroconductive particles in order to improve electroconductivity, and adding many particles caused the initial viscosity to rise and made it difficult to stabilize storage stability. In the pr...  
WO/2018/047957A1
A conductive adhesive composition which contains at least one of a thermoplastic resin and a thermosetting resin, a conductive filler and inorganic particles. The inorganic particles have a cumulative frequency of 40% or less at the part...  
WO/2018/047690A1
Provided is a conductive material that allows solder on conductive particles to be disposed efficiently on an electrode even after the conductive material has been left standing for a set period of time, and is such that the yellowing of...  
WO/2018/047597A1
In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc. In addition to reducing connection re...  
WO/2018/042701A1
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...  
WO/2018/043505A1
One aspect of the present invention pertains to an adhesive composition for attaching electronic members together, said adhesive composition containing first conductive particles having protrusions capable of penetrating through an oxide...  
WO/2018/043296A1
This (meth)acrylic resin composition is capable of achieving both storage stability in an atmosphere of 25°C and cold curing in an atmosphere of 60 to 140°C when a sealed container is used, and is also capable of exhibiting these chara...  
WO/2018/038475A1
The present invention relates to a pressure-sensitive adhesive tape, a method for manufacturing the same, and an electronic device comprising the same. The pressure-sensitive adhesive tape comprises: a fiber accumulation type substrate i...  
WO/2018/036163A1
A touch screen production method and an electrically conductive peelable tape. The production method of touch screen comprises: forming a touch electrode (10), and forming an electrically conductive peelable tape layer (20) on the touch ...  
WO/2018/034234A1
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least...  
WO/2018/030184A1
[Problem] The present invention provides: an epoxy resin composition which exhibits excellent storage stability, while having low initial viscosity and good curability at low temperatures; and a conductive adhesive which contains this ep...  
WO/2018/024073A1
The invention provides a heat-dissipating type conductive silver paste and a preparation method therefor. The heat-dissipating type conductive silver paste is prepared from 100 parts of a resin mixture, 100 to 500 parts of silver powder ...  
WO/2018/013342A1
Disclosed herein are electrically conductive adhesive compositions and their use in solar cell modules, wherein the electrically conductive adhesives comprise one or more olefinic carboxylic acids or derivatives thereof.  
WO/2018/008693A1
Provided are insulated particles with which an anisotropic conductive adhesive can be obtained, the anisotropic conductive adhesive achieving, if circuit substrates, each having a plurality of terminals, are to be electrically connected ...  
WO/2018/006503A1
Provided are a silver salt-doped conductive silver adhesive, and a preparation method and a use thereof. The silver salt-doped conductive silver adhesive is prepared and obtained from the following raw materials: 0.01-5 parts by weight o...  
WO/2018/009891A1
Blends comprising a conductive polymer and a matrix material are provided. The blends find utility in a number of applications, including use as a conformal coating on consumer electronic articles.  
WO/2018/003704A1
The present invention provides a thermally curable electroconductive adhesive which, when cured at a high temperature in a short time, can attain high electroconductivity (low connection resistance). The present invention further provide...  
WO/2017/206645A1
A conductive particle, manufacturing method thereof, conductive adhesive comprising the conductive particle, and manufacturing method thereof. The conductive particle comprises: a core microsphere (10); a conductive polymer layer (12) co...  
WO/2017/209427A1
The present invention relates to a flexible electromagnetic shielding sheet and an electronic device provided with same, the flexible electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape provided with an electro...  
WO/2017/209429A1
The present invention relates to a thin electromagnetic shielding sheet and an electronic device provided with same, the thin electromagnetic shielding sheet comprising: a pressure-sensitive adhesive tape comprising accumulated-fiber-typ...  
WO/2017/204218A1
Provided is an electroconductive adhesive composition which comprises: a thermosetting resin having a functional group capable of reacting with an epoxy group; an epoxy resin; an electroconductive filler; and urethane resin particles hav...  
WO/2017/204238A1
Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticl...  
WO/2017/195400A1
The present invention addresses the problem of providing an electrically conductive adhesive which has superior heat cycle properties and good reflow properties, and is less likely to come off a substrate. The problem is solved by an ele...  
WO/2017/192682A1
Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, at least one T, optionally D and optionally Q type monomers and is cross-linkable. The resin has a fluorine content of at l...  
WO/2017/188615A1
A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may inc...  
WO/2017/186192A1
A preparation method for a highly-conductive oxidation-resistant copper-silver composite powder. The method comprises the following steps: (1) using gas atomization to prepare a copper-silver alloy powder, the mass percentage of silver i...  
WO/2017/182621A1
The present invention is related to an electrically conductive, hot-melt adhesive or moulding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of pol...  
WO/2017/178128A1
The present invention relates to a stick-type hot-melt adhesive body for use in hot-melt glue guns, the hot-melt adhesive body having at least one first section containing at least one reactive adhesive or consisting thereof and at least...  
WO/2017/169534A1
An electroconductive adhesive is provided with which sintered objects that are less apt to suffer cracks, chipping, or the like due to sintering and that have excellent mechanical strength are obtained. The electroconductive adhesive com...  
WO/2017/170371A1
Provided is an electroconductive adhesive tape whereby high levels of repulsion resistance and electrical characteristics can be obtained at the same time. The electroconductive adhesive tape 1 pertaining to the present invention is prov...  
WO/2017/163721A1
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arrang...  
WO/2017/164318A1
The present invention provides an anisotropic conductive adhesive which allows for flip chip mounting of a light emission element, such as an LED chip having fine-pitch wiring, and is capable of imparting high optical characteristics, hi...  
WO/2017/156674A1
The present disclosure is directed to a process for preparing foamed articles comprising at least one ethylene/α-olefin interpolymer and use of the foamed articles in various applications, such as footwear applications. The ethylene/α-...  
WO/2017/154226A1
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...  
WO/2017/149426A1
A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive on...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138252A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  

Matches 1 - 50 out of 5,913