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WO/2012/056244 |
A process for the preparation of an activated polymer particle comprising contacting a polymer particle with at least one polyamine, wherein said polyamine has three or more amino groups, to form a surface treated polymer particle; and a...
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WO/2012/053373 |
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adh...
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WO/2012/046710 |
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surf...
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WO/2012/043025 |
The present invention provides a conductive adhesive composition that has superior adhesive properties and low surface resistance and is capable of use as a buffer layer foran electronic device. This conductive adhesive composition conta...
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WO/2012/043493 |
Provided are: an anisotropic conductive film material which has excellent connection reliability under high temperature, high humidity conditions; and a method for producing the anisotropic conductive film material. Good bonding strength...
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WO/2012/043545 |
Disclosed is an adhesive composition having high electrical conductivity and thermal conductivity even with no load and at curing temperatures of less than or equal to 200C, and having a high adhesive strength even at 260C; also disclose...
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WO/2012/043472 |
Provided are: conductive particles, each of which is not susceptible to a large crack in a conductive layer even in cases where a large force is applied thereto; an anisotropic conductive material which uses the conductive particles; and...
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WO/2012/038373 |
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar module...
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WO/2012/037509 |
The present disclosure relates to the field of fabricating microelectronic devices, wherein a conductive adhesive is used as a temporary microelectronic wafer bonding adhesive to prevent damage to microelectronic devices resulting from e...
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WO/2012/033355 |
The present invention relates to a phase retardation device comprising a base substrate, a liquid crystal polymer layer formed on the base substrate and oriented in one direction and hardened, an optical adhesive layer interposed between...
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WO/2012/033998 |
An improved adhesive composition having increased insulative properties is provided. The adhesive composition having improved insulative properties includes a starch component; an alkaline component; sodium tetraborate; water; and a plur...
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WO/2012/030088 |
Disclosed are a removal aqueous emulsion adhesive, as an aqueous adhesive, which is environmental-friendly, exhibits superior adhesive strength and heat resistance, and low removal noise and is free of residues (ghost), as compared to ru...
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WO/2012/026470 |
The present invention relates to a circuit connecting material which is interposed between a first circuit member, wherein a first circuit electrode is formed on a main surface of a first substrate, and a second circuit member, wherein a...
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WO/2012/025518 |
The invention relates to a polymer composite which forms a barrier for sulphureous compounds. The invention further relates to the use of the polymer composite and to an optoelectronic component containing said polymer composite.
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WO/2012/022011 |
A conductive curable composition filled with silver coated material, and more particularly, an organic curable composition comprising micron meter scale fine silver coated material with flaky shape, which have stabilized against prematur...
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WO/2012/023566 |
This silver-coated spherical resin comprises a spherical resin and silver that is applied over the surface of the spherical resin. The amount of silver is 2-80 parts by mass relative to 100 parts by mass of the silver-coated spherical re...
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WO/2012/014562 |
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first...
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WO/2012/014563 |
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adh...
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WO/2012/012060 |
Adhesive articles having surface-modified nanoparticles located on or near at least one surface of a layer of pressure sensitive adhesive are described. Methods of making such adhesive articles are also described.
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WO/2012/011265 |
Disclosed is an adhesive agent composition that does not use halogens, has excellent adhesive strength, long-term reliability, and workability, and is suitable for use in anisotropic conductive paste favorably used in connecting substrat...
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WO/2012/012060 |
Adhesive articles having surface-modified nanoparticles located on or near at least one surface of a layer of pressure sensitive adhesive are described. Methods of making such adhesive articles are also described.
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WO/2012/011457 |
An anisotropic conductive film comprises an insulating adhesive agent composition comprising a (meth)acrylate monomer composition, a radical polymerization initiator and a film-forming resin and electrically conductive particles disperse...
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WO/2012/006132 |
The present invention provides a hot melt adhesives for absorbent articles, such as sanitary napkins. The hot melt adhesives comprises (A) a thermally reversible block copolymer that comprises a polymer of a vinyl aromatic hydrocarbon an...
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WO/2012/005144 |
Disclosed is an anisotropic conductive adhesive in which the conductive particles thereof exist in an insulating adhesive composition without aggregating in cases where magnetic powder particles, such as nickel-coated resin particles, ar...
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WO/2012/006132 |
The present invention provides a hot melt adhesives for absorbent articles, such as sanitary napkins. The hot melt adhesives comprises (A) a thermally reversible block copolymer that comprises a polymer of a vinyl aromatic hydrocarbon an...
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WO/2012/002177 |
Disclosed is a novel aluminum chelate-based latent curing agent having a core-shell type microcapsule structure, wherein an aluminum chelate-based curing agent and a cationic polymerizable compound are enclosed in capsules formed of an i...
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WO/2011/163336 |
An athletic shoe coating for traction enhancement includes a pressure sensitive adhesive (PSA) and a tackyfying resin and a film former initially in solution within a solvent suitable for application to the surface of a shoe sole in liqu...
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WO/2011/163336 |
An athletic shoe coating for traction enhancement includes a pressure sensitive adhesive (PSA) and a tackyfying resin and a film former initially in solution within a solvent suitable for application to the surface of a shoe sole in liqu...
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WO/2011/162256 |
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...
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WO/2011/157376 |
The invention relates to a method for bonding a strip-like conductor (1) to a solar cell (2), comprising the following steps: applying an adhesive (3, 4) to the conductor (1) and/or to the solar cell (2); and - bringing the conductor and...
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WO/2011/158783 |
Disclosed are conductive particles which have a high rate of presence as primary particles (isolated particles) without being agglomerated, while suppressing as much as possible the ratio of such conductive particles wherein a part of th...
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WO/2011/158666 |
In the production of a connected structure by the anisotropic conductive connection of a wiring substrate to an electric element for the purpose of achieving good connection reliability by decreasing the temperature for the main heating ...
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WO/2011/155348 |
This light-reflective anistropic electrically conductive paste can be used when manufacturing a light-emitting device by flip-chip mounting light-emitting elements such as light-emitting diode (LED) elements on a circuit board, can suppr...
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WO/2011/153893 |
A colored jointing agent for stone is provided, which at least comprises 100 parts by weight of air-dried unsaturated polyester resin, 0 to 5 parts by weight of hydrogenated castor oil, 1 to 20 parts by weight of nano powder, 10 to 250 p...
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WO/2011/152421 |
Disclosed are an anisotropic conductive film, which may be easily manufactured even when conductive particles are arranged in a single layer, and wherein the arrangement of the conductive particles is not disrupted during bonding; and a ...
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WO/2011/147016 |
A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon...
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WO/2011/145523 |
Provided is a thermally conductive adhesive sheet wherein it is possible to easily adhere a heat generating body to a heat releasing body with sufficient adhesive force. Specifically, disclosed is a thermally conductive adhesive sheet pr...
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WO/2011/133317 |
An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when a...
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WO/2011/132578 |
Disclosed is an anisotropic conductive film which contains conductive particles, film-forming resin, a radical-polymerizable compound, a curing agent which generates free radicals, and an amine salt obtained from phosphoric acid (meth)ac...
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WO/2011/129373 |
Disclosed is a light emitting device and a light-reflective anisotropic conductive adhesive agent capable of maintaining the light emitting efficiency of a light emitting element, preventing the generation of cracks, and achieving high c...
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WO/2011/129372 |
Disclosed is a curable resin composition which exhibits high adhesion, high conduction reliability, excellent crack resistance and increased resistance to thermal shock or similar in high-temperature high-humidity environments. The curab...
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WO/2011/126263 |
The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention relates to an adhesive composition, and more particularly, to an adhesive composition for a touch panel, which is...
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WO/2011/126262 |
The present invention relates to an adhesive composition for a touch panel, to an adhesive film, and to a touch panel. The adhesive composition of the present invention provides an adhesive for a touch panel that has superior chemical re...
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WO/2011/125088 |
Disclosed is a bonding material for bonding together the layers of a fuel cell, said bonding material containing an adhesive resin, conductive particles, and a conductive resin.
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WO/2011/126263 |
The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention relates to an adhesive composition, and more particularly, to an adhesive composition for a touch panel, which is...
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WO/2011/124517 |
The invention relates to an adhesive for a floor covering, comprising, relative to the total weight of the adhesive, 5 to 30 wt % of at least one component selected from graphite and soot, and/or 0.2 to 3 wt % of conductive carbon fibers...
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WO/2011/126262 |
The present invention relates to an adhesive composition for a touch panel, to an adhesive film, and to a touch panel. The adhesive composition of the present invention provides an adhesive for a touch panel that has superior chemical re...
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WO/2011/119007 |
The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipat...
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WO/2011/119007 |
The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipat...
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WO/2011/118719 |
Disclosed is an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first cir...
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