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Patent Searching and Data


Matches 1 - 50 out of 5,424

Document Document Title
WO/2017/030083A1
The purpose of the present invention is to provide a resin composition which is composed of an epoxy resin having a specific structure and a rubber-modified polyamide resin having a phenolic hydroxyl group and exhibiting excellent adhesi...  
WO/2017/027482A1
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...  
WO/2017/027178A1
The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitr...  
WO/2017/025682A1
The invention relates to a blade comprising a blade body (9) made of a fibre reinforced polymer matrix composite material and a leading-edge shield (10) made of a material having better resistance to point impacts than the composite mate...  
WO/2017/022523A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when a semiconductor power element is bonded to a metal lead frame, and which is free from lead, thereby placing...  
WO/2017/018657A1
The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method for manufacturing the same, and has a purpose of manufacturing a conductive adhesive tape by applying an adhesive on one side or bot...  
WO/2017/014414A1
An embodiment of the present invention relates to a composition for an anisotropic conductive film, the composition containing: a copolymerized compound of a fluorene-based compound and a bisphenol type epoxy compound; an epoxy resin hav...  
WO/2017/010101A1
Provided are: a conductive adhesive sheet (3) having a conductive adhesive layer (2) that has good temporary bonding properties, good bonding strength to a reinforcing plate, and good conductivity, while being less susceptible to blockin...  
WO/2017/006460A1
Provided are: a thermoconductive member that has a combination of properties including (A) having high thermoconductivity, (B) adaptability to the irregularities in the surface of an electronic component and the surface of a heat-dissipa...  
WO/2017/006854A1
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to ...  
WO/2016/208243A1
The present invention addresses the problem of suppressing an increase in contact point resistance caused when a contact point is removed. One aspect of the present invention is a conductive material comprising a liquid conductive resin ...  
WO/2016/204162A1
Provided are: an electrically conductive adhesive agent which does not undergo the deterioration in electric conductivity and the fluctuations in resistivity; an electrically conductive structure; and an electronic part. The electrically...  
WO/2016/199252A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) one or more radical-polymerizable compounds, and (c) a free-radical polymerization initiator, wherein the radical-polymerizable compo...  
WO/2016/195818A1
A method of initiating polymerization of a composition formed of a 1, 1-disubstituted alkene compound includes contacting the composition with a substrate and passing an electrical charge through the composition. The composition can also...  
WO/2016/194952A1
An adhesive composition which can have excellent life performance and can have a wide margin for mounting, the composition comprising a cationically polymerizable compound, a hardening catalyst based on both an aluminum chelate and a sil...  
WO/2016/186099A1
Provided is an electroconductive pressure-sensitive adhesive material which can have a sufficiently heightened electromagnetic-wave-shielding function even when the adherend has a rugged surface. The electroconductive pressure-sensitive ...  
WO/2016/180573A1
An electrically conductive composition comprising (A) 5 to 20 vol.-% of electrically conductive particles having an average particle size in the range of 1 to 25 μm and exhibiting an aspect ratio in the range of 5 to 30 : 1, (B) 8 to 50...  
WO/2016/179914A1
A polarizing plate (20) comprises a polarizing layer (21), a support layer (22), a surface protective layer (23), a peel-off protection layer (24), and an adhesive layer (25). The polarizing layer (21) is configured to polarize incident ...  
WO/2016/180574A1
The use of an electrically conductive composition for the adhesive bonding of an electronic component having a contact surface to a substrate having a contact surface via said contact surfaces, wherein the electrically conductive composi...  
WO/2016/178871A1
A viscoelastic adhesive composition is provided, wherein at a dispensing temperature of between 35°C and 120°C, the viscoelastic adhesive composition can be discretely dispensed and has a tan delta of at least 1 as determined by dynami...  
WO/2016/178954A1
A laminate structure and method of welding the laminate structure is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core made of an ...  
WO/2016/178651A1
A laminate structure and method of forming is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core having an adhesive thickness. The ...  
WO/2016/175232A1
A purpose of the present invention is to provide a carrier film for transparent electroconductive films which can be inhibited from causing zipping, is excellent in terms of tight adhesion to transparent electroconductive films and remov...  
WO/2016/171253A1
An adhesive composition which contains (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator and (d) a complex containing boron, and wherein (d) the complex containing boron is a compou...  
WO/2016/169190A1
Embodiments of the present invention relate to the technical field of display. Provided are a conductive adhesive composition and a preparation method therefor, a frame sealing adhesive and a display panel. The dispersion uniformity of c...  
WO/2016/167245A1
The purpose of the present invention is to provide a means which exhibits excellent heat resistance and mounting reliability when joining a semiconductor power element to a metal lead frame, and which is lead free and places little burde...  
WO/2016/163573A1
The present invention relates to a fire-resistant adhesive composition, a fire-resistant sandwich panel using same, and a manufacturing method thereof, and provided according one embodiment of the present invention are the fire-resistant...  
WO/2016/158828A1
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus...  
WO/2016/157631A1
The purpose of the present invention is to improve the adhesiveness and tight adhesion of a composite material to substrates such as copper, silver, aluminum, silicon, and ferrite by compositing a low-melting-point glass which is used fo...  
WO/2016/158829A1
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...  
WO/2016/157594A1
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...  
WO/2016/152385A1
This anisotropically conductive film connects a terminal of a first electronic component and a terminal of a second electronic component in an anisotropically conductive manner, and is characterized by containing at least conductive part...  
WO/2016/152943A1
The present invention provides conductive particles, an anisotropic conductive adhesive, and a connection structure which are capable of achieving low connection resistance, and high connection reliability, even when used on wiring of al...  
WO/2016/152543A1
[Problem] To provide: a novel and improved anisotropic conductive connection structure which is able to be produced by a simple process and has high reliability; an anisotropic conductive connection method; and an anisotropic conductive ...  
WO/2016/152791A1
Provided is an anisotropic conductive film (1A) in which a sufficient amount of conductive particles (2) can be trapped even if connection terminals are at a fine pitch, and short-circuiting can be mitigated. The anisotropic conductive f...  
WO/2016/153292A1
The present application relates to an adhesive composition and an organic electronic apparatus comprising same. The adhesive composition has a structure in which moisture or oxygen can be effectively blocked from flowing into an organic ...  
WO/2016/148004A1
According to the present invention, a light emitting device is manufactured by bonding an LED element 52 on a wiring substrate 51 with an anisotropic conductive adhesive 50 being interposed therebetween. During the production of this dev...  
WO/2016/142422A1
The invention relates to a non-adhesive film-forming polymer composition (covering material) and to adhesive hot-melt glues in the form of pellets, which are covered with said polymer composition and can be produced by coextruding the ho...  
WO/2016/139221A1
The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive composition...  
WO/2016/140452A2
The present invention provides a vacuum thermoforming adhesive composition containing a polyurethane polymer and an acrylic polymer and having a difference in melting temperature and cross-linking temperature of 30-60°C. In addition, pr...  
WO/2016/140204A1
[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold...  
WO/2016/140452A3
The present invention provides a vacuum thermoforming adhesive composition containing a polyurethane polymer and an acrylic polymer and having a difference in melting temperature and cross-linking temperature of 30-60°C. In addition, pr...  
WO/2016/140196A1
The conduction paste comprises an adhesive and conductive particles that enable conduction between electrodes, wherein the coefficient of variation for the conductive particle diameter dimension is 25% or less. The average particle diame...  
WO/2016/136436A1
The purpose of the present invention is to provide a pressure-sensitive adhesive film through which air bubbles trapped at the bonding interface upon application of the pressure-sensitive adhesive film are apt to disappear at ordinary te...  
WO/2016/125644A1
A thermoconductive electroconductive adhesive composition including an electroconductive filler (A), an epoxy resin (B), a curing agent (C), and an organic solvent (D), the electroconductive filler (A) being a submicron silver fine powde...  
WO/2016/127056A1
Various labels for use in adverse environments are described. The labels are particularly well suited for applications in which a permanent label bond is required. The labels utilize a two stage adhesive which is initially in the form of...  
WO/2016/125737A1
The present invention provides a thermally conductive paste with improved conductivity that uses silver particles and has high conductivity while meeting a requirement for low-temperature firing at not more than 300°C and a manufacturin...  
WO/2016/122145A1
The present invention relates to: an antistatic adhesive composition containing an acrylate resin, a reactive acrylate monomer comprising an alkylene oxide unit, and an ionic antistatic agent; and an antistatic adhesive tape using the same.  
WO/2016/121806A1
This paste adhesive composition includes metal particles (A) and a compound (B) polymerized by heating, and when the metal particles (A) are caused to undergo sintering and form a particle connection structure by heat treatment, and the ...  
WO/2016/121296A1
Provided is a bonding composition with which it is possible to suppress fillet formation while maintaining sufficient spread to the bonding interface together with obtaining high bonding strength by bonding at a relatively low temperatur...  

Matches 1 - 50 out of 5,424