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Patent Searching and Data


Matches 1 - 50 out of 5,722

Document Document Title
WO/2017/156674A1
The present disclosure is directed to a process for preparing foamed articles comprising at least one ethylene/α-olefin interpolymer and use of the foamed articles in various applications, such as footwear applications. The ethylene/α-...  
WO/2017/154226A1
Provided is an adhesive film having few fish eyes, exceptional mechanical strength and heat resistance, little dust adhesion, and excellent adhesive characteristics, the adhesive film being used in various types of surface protection fil...  
WO/2017/149426A1
A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive on...  
WO/2017/138253A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138252A1
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top...  
WO/2017/138483A1
Provided are insulated coated conductive particles which enable the achievement of a good balance between excellent insulation reliability and conduction reliability even in a connection between micro circuits. Each insulated coated cond...  
WO/2017/133864A1
Electrical debonding of PU hot melt adhesives by use of conductive inks The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conducti...  
WO/2017/130892A1
Provided is a conductive material capable of providing high conduction reliability since the conductive material has high storage stability, and shows, after being arranged on a member to be connected, excellent solder cohesiveness perfo...  
WO/2017/130789A1
In one embodiment, the present invention provides an adhesive film 1 which comprises, superposed in the following order, a first non-electroconductive adhesive layer 2, an electroconductive adhesive layer 3 containing electroconductive p...  
WO/2017/130754A1
The anisotropic conductive film connects a terminal of a first circuit member and a terminal of a second circuit member in an anisotropically conductive manner, and comprises a film-forming resin, a radical polymerizable compound, an oxi...  
WO/2017/119103A1
The present invention provides a two-part urethane-based adhesive agent composition for automobiles, which has a high curing rate and excellent productivity, has such a property that a cured article formed from a first solution alone sho...  
WO/2017/119274A1
Provided is an adhesive composition having excellent life properties. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent and a hindered amine compound. This is consid...  
WO/2017/112386A1
A polymerizable pre-adhesive composition includes packaging material and a packaged pre-adhesive reactive mixture sealed within the packaging material. The packaging material includes: a semicrystalline polylactic acid (PLA); a polyvinyl...  
WO/2017/102071A1
The present invention relates to a process for producing a hot melt adhesive (HMA) material, preferably hot melt pressure sensitive adhesive (HMPSA) material, having a substantially tack-free coating comprising a novel moulding and spray...  
WO/2017/104665A1
Provided is a conductive adhesive tape which can have improved adhesiveness while maintaining electrical characteristics, and is less likely to lift or peel even when being exposed to high temperature or high humidity after being attache...  
WO/2017/090659A1
This adhesive composition for circuit connection contains (A) a radical-polymerizable compound, (B) a radical generator, and (C) particles including at least one type of metal compound selected from the group consisting of metal hydroxid...  
WO/2017/090759A1
[Problem] To provide a thermosetting composition which, when being cured quickly at a high temperature (within one minute at 100-150°C), can achieve the ability to avoid sudden boiling, and the ability of fast curing ability. [Solution]...  
WO/2017/090875A1
The present invention relates to an anisotropic conductive film comprising a conductive layer and an insulation layer, wherein each of the conductive layer and the insulation layer comprises two types of inorganic fillers having differen...  
WO/2017/090693A1
This adhesive composition contains (a) a thermoplastic resin, (b) a silane compound having a urethane bond and an alkoxysilyl group in one molecule, (c) a radical-polymerizable compound, and (d) a radical-polymerization initiator, and, a...  
WO/2017/086441A1
Provided are a film-wound body capable of achieving good temporary adhesion, and a method for producing the film-wound body. The film-wound body is provided with: an adhesive film (2) having a first surface (recessed surface) which is fo...  
WO/2017/086455A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load. These particles are particles used to obtain a connecting material for forming...  
WO/2017/086454A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking and peeling during a hot-cold cycle. These particles are particles used to obtain a connecting mater...  
WO/2017/086453A1
A connecting material is provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking during a stress load, can further suppress thickness variation in the connection part to ...  
WO/2017/086452A1
Particles are provided which, in a connection portion that connects two members to be connected, can suppress the occurrence of cracking and peeling during a hot-cold cycle, can further suppress thickness variation in the connection port...  
WO/2017/080040A1
The present invention provides a damp-heat-resistant and highly reliable conductive silver epoxy adhesive, a method for preparing same, and an application thereof. Considering the total weight of the damp-heat-resistant and highly reliab...  
WO/2017/078157A1
This adhesive composition comprises a silane compound having a structure represented by general formula (I). (In the formula, X represents an organic group, R1 and R2 each independently represent an alkyl group, m represents an integer f...  
WO/2017/078087A1
This adhesive composition comprises: a first silane compound having a radical-polymerizable functional group; a second silane compound that reacts with the first silane compound; a radical-polymerizable compound (except for compounds cla...  
WO/2017/064925A1
This double-sided adhesive sheet has a multilayer structure including, for example, an electrolyte-containing adhesive layer (11), an adhesive layer (21), and a conducting substrate (30). This joined body comprising a double-sided adhesi...  
WO/2017/066563A1
In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation ther...  
WO/2017/060528A1
A particle 10 for use in a conductive adhesive 20 is provided. The particle 10 comprises a core1having a core diameter. The core is formed of a first material having a first elastic modulus. The particle 10 further comprises a shell 2 ar...  
WO/2017/057128A1
Provided is a thermal bonding sheet that prevents the material thereof from overflowing during adhering and from traveling up to the surface of the object to be adhered, and that obtains a strong sintered layer following sintering. A the...  
WO/2017/057429A1
A thermal bonding sheet provided with a layer in which, after heating the layer from 80°C to 300°C at a temperature increase rate of 1.5°C/second under 10 MPa pressurization and then maintaining 300°C for 2.5 minutes, the hardness of...  
WO/2017/057920A1
The present invention relates to an anisotropic conductive film and a display device comprising the same, the anisotropic conductive film being formed of a composition for an anisotropic conductive film, containing 1-14 wt% of a silsesqu...  
WO/2017/047389A1
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An...  
WO/2017/048813A1
Techniques are disclosed for producing multilayered composites of adhesive nanofiber composites. Specifically, one or more sheets of highly aligned nanofibers are partially embedded in an adhesive such that at least a portion of the nano...  
WO/2017/047889A1
Provided is a photocurable composition for an optical adhesive comprising an acrylic photocurable compound and a plasticizer, wherein the acrylic photocurable compound comprises a monofunctional acrylic photocurable monomer and a (meth)a...  
WO/2017/043455A1
[Problem] In the case of fabricating a flexible wiring device, for example, when the final curing and bonding time during final curing and bonding of an electroconductive reinforcing board and a flexible wiring board is reduced, peeling ...  
WO/2017/035709A1
Coated copper particles formed of copper cores that are surface coated with a coating composition comprising one or more conductive oxides. Electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) surface coated copper...  
WO/2017/037951A1
The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy...  
WO/2017/035694A1
Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and option...  
WO/2017/038572A1
Provided is a conductive paste which is capable of suppressing the occurrence of a large void in a bonded portion even in cases where a relatively large chip is bonded to a substrate. A conductive paste which contains: a metal powder hav...  
WO/2017/035710A1
Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of silver particles and surface coated copper particles, and optional (c) solvent.  
WO/2017/033935A1
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width...  
WO/2017/033933A1
Provided is an electroconductive material in which solder can be selectively disposed in the electroconductive particles on an electrode without an inorganic filler excessively inhibiting the movement of the solder, electroconductivity c...  
WO/2017/033930A1
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconduc...  
WO/2017/033932A1
To provide an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and improve conduction reliability. In the electroconductive material according to the prese...  
WO/2017/035284A1
A cell phone case cover having four layer system screen protector including a first polyethylene terephthalate (PET) layer, an optically clear adhesive (OCA) layer, a second polyethylene terephthalate (PET) layer and a silicon adhesive l...  
WO/2017/030083A1
The purpose of the present invention is to provide a resin composition which is composed of an epoxy resin having a specific structure and a rubber-modified polyamide resin having a phenolic hydroxyl group and exhibiting excellent adhesi...  
WO/2017/027482A1
The present invention provides compositions, including die attach adhesives, coatings and underfill materials, which are useful in electronics packaging and the composite fields. Specifically, the invention provides liquid and very low m...  
WO/2017/027178A1
The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitr...  

Matches 1 - 50 out of 5,722