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WO/2005/048303A2 |
A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn-Ag-Cu solder alloys f...
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WO/2004/105053A1 |
Conductive ball part (1) is produced by applying a coating layer composed of Cu layer (3) and layer of Sn-5.5Ag alloy of noneutectic composition (2) onto approximately spherical core (4) constituted of a nonmetallic material. The conduct...
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WO/2004/100293A1 |
An negative active material which comprises an alloy based material containing an element M capable of alloying with lithium and at least one element R selected from the elements having an atomic number of 20 or less (exclusive of H, Li ...
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WO/2004/095594A1 |
A thermoelectrically transducing material which comprises a half Heuisler alloy represented by the formula: QR(L1-pZp), wherein Q is at least one element selected from the 5 Group elements, R is at least one element selected from cobalt,...
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WO2004038052B1 |
A friction-resistant alloy being a tin matrix containing copper, antimony, and between about 0.10% and about 2% by weight bismuth; and an industrial bearing component having this alloy on a wear surface.
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WO/2004/047507A2 |
A solder material has been produced and is described herein that comprises a conventional solder component, such as a solder sphere, solder ball, solder powder, solder preform, some other suitable material or form of solder or a combinat...
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WO/2004/044254A1 |
A method for manufacturing fuel additive for use in fuel combustion apparatus comprises the steps of forming a molten mixture comprising tin and antimony, adding an aerating agent to the molten mixture, and quenching the aerated molten m...
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WO2002097145B1 |
A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5 DEG C and a liquidus of no higher than 400 DEG C. C...
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WO/2004/039533A1 |
A Sn-Zn based lead-free solder which contains 5 to 10 mass % of Zn, 0.005 to 1.0 mass % in total of one or more selected from the group consisting of Au, Pt, Pd, Fe and Sb, optionally 15 mass % or less of one or more selected from the gr...
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WO/2004/038053A2 |
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C or greater. In addition, ...
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WO/2004/026527A1 |
In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a $g(b)' phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed whe...
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WO/2004/026517A2 |
A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for...
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WO/2004/024975A1 |
A Sn-based metal-coated steel strip excellent in appearance comprises a Ni-based metal (such as Ni, a Ni-Sn alloy, a Ni-Zn alloy, a Ni-Fe alloy and a Ni-Co alloy) preplating layer and a Sn-based metal (such as a Sn-Zn alloy) coating form...
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WO/2004/022118A1 |
It is intended to provide a biomaterial member made of an amorphous alloy which shows a polarization resistance in degassed Hank’s solution of 4x106 &ohm cm2 or more and an immersion potential-pitting corrosion potential window of 0.25...
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WO/2004/018145A1 |
A tin-zinc lead-free solder contains tin as a main component and essentially at least 6-10 weight% of zinc. A protective film of magnesium oxide is formed on the surface of the solder. The solder also contains 0.0015 to 0.1 weight% of ma...
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WO/2004/018146A1 |
A tin-zinc lead-free solder contains tin as a main component, at least 6-10 weight% of zinc essentially, 0.0015 to 0.03 weight% of magnesium, and 0.0010 to 0.006 weight% of aluminum. When a paste of the solder is stored in a cooled state...
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WO/2004/018719A1 |
An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around...
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WO/2004/011188A1 |
the invention relates to a brazing sheet product including a core sheet, on at least one >ide of the core sheet a clad layer of an aluminium alloy including silicon in an amount in the range of 4 to 14% by weight, and further including o...
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WO/2004/004967A1 |
An unleaded solder that exhibits the same workability, use conditions and bonding reliability as those of the conventional Sn-37 wt.% Pb eutectic solder. In particular, a solder comprising 7 to 10 wt.% of zinc, 0.001 to 6 wt.% of bismuth...
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WO/2004/002674A1 |
An Sn-Ag based lead-free solder, which comprises zinc (Zn). The Sn-Ag based lead-free solder allows the improvement of initial joint strength and the suppression of the lowering of joint strength after the heat-treatment of the joint, in...
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WO/2003/086619A1 |
The invention relates to a surface reactor (1) consisting of a copper-tin alloy for converting unsaturated hydrocarbons contained in propellants and fuels. The surface reactor (1) is configured in one-piece from a long chip or wire-shape...
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WO/2003/081702A2 |
An improved fuel cell catalyst containing platinum, rhodium at least one of tungsten, tin, and copper, and optionally molybdenum, in metallic oxidation states. Additionally, the platinum and rhodium are at concentrations such that the su...
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WO/2003/076183A1 |
A resin-coated steel sheet which comprises a steel sheet and, formed on at least one surface thereof in the following order, (i-1) a layer of an alloy of iron with at least one metal selected from among tin, zinc and nickel or (i-2) a ti...
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WO/2003/071621A2 |
An improved metal alloy fuel cell electrocatalyst composition containing comprising platinum, molybdenum, and a metal selected from the group consisting of nickel, iron, tin, and tungsten, provided (i) the concentration of each of nickel...
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WO/2003/070994A2 |
A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at leas...
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WO/2003/061896A1 |
A solder alloy which does not exert adverse influences on the environment and has soldering properties equal to those of conventional Pb−Sn solder alloys&semi and a soldered joint made with the solder alloy. The solder alloy consists o...
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WO/2003/061897A1 |
A lead-free solder material, which is a Sn-Ag binary alloy comprising Al incorporated therein and thereby having a fine structure induced, through simultaneous and many engined crystal formation, by a coagulation accompanied with heterog...
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WO/2003/053686A1 |
An article (12) is coated with a multi-layer decorative and protective coating having the appearance of stainless steel. The coating comprises a polymeric layer (13) on the surface of said article (12) and vapor deposited on the polymeri...
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WO/2003/051572A1 |
The invention relates to a lead-free soft solder, especially for use in electronic and electrical engineering. The aim of the invention is to provide a lead-free soft solder which does not tend to form coarse tin dentrides, has a smooth ...
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WO/2003/050920A1 |
The invention relates to a contact terminal to be used for electrical purposes which contact terminal contains a metallic substrate with good conductivity and coated with a metallic element. In accordance with the invention the coating i...
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WO/2003/045618A1 |
A brazing product for fluxless brazing comprises an aluminum or aluminum alloy substrate; a layer of an aluminum eutectic-forming layer applied to the substrate, and a braze-promoting layer comprising one or more metals from the group co...
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WO/2003/045619A1 |
A family of low temperature brazing alloys wherein the alloy is utilized in the form of a filler metal or shim and consists of electroplated nickel on zinc shimstock, wherein the zinc shimstock includes zinc, aluminum and silicon, with o...
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WO/2003/043777A1 |
A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of ...
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WO/2003/030199A1 |
The invention concerns a fuse element consisting of a strip (10) comprising, at least, three coplanar parts of same thickness welded together, namely: a central metallic part (12) consisting of a tin core (16) and a silver cladding (18) ...
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WO/2003/006200A1 |
A substantially lead-free solder with enhanced properties comprises from 88.5 % to 93.5 % tin; from 3.5 % to 4.5 % silver; from 2.0 % to 6.0 % indium; and from 0.3 % to 1.0 % copper. The solder may also comprise up to 0.5 % of an anti-ox...
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WO/2003/004713A2 |
Lead-free Tin-Zinc alloy contains Manganese in the amount of about 0.001-0.9 wt.%. The alloy is suitable for use as a solder with commercially available fluxes. Various types of solders can be prepared from the alloy, like wire, cored wi...
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WO/2002/103787A1 |
A substrate for use in joining an element which comprises a base substrate of aluminum nitride or the like, a gold electrode layer formed on the surface thereof, a metal layer comprising at least one metal selected from the group consist...
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WO/2002/098601A1 |
A solder paste formulation which comprises a solder paste powder and a non-aqueous vehicle, characterized in that the vehicle includes therein at least one lubricant additive which is a branched chain fatty alcohol or fatty acid containi...
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WO/2002/099146A1 |
Novel lead-free solder alloys and intermetallic compounds are disclosed. The solders may be used for high intensity discharge lamp (1). Solder joints formed from these alloys are resistant to creep in high-temperature environments such a...
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WO/2002/070762A1 |
A method for manufacturing a member having a separation structure which comprises subjecting a melt of an alloy which separates into two phases having different compositions from each other in some range of the liquid state thereof, exhi...
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WO/2002/068897A1 |
A shotgun shot, pellet or bullet is made of an alloy containing bismuth, tin and 2% to 5% by weight copper. Preferably the alloy contains less than 50% by weight bismuth. In a preferred embodiment the content by weight is 45% bismuth, 52...
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WO/2002/066705A1 |
A surface treated steel sheet for electronic parts which has a steel sheet or a Ni-plated steel sheet and a Sn-Zn alloy layer formed thereon by subjecting the steel sheet to Sn plating and Zn plating followed by a thermal diffusion treat...
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WO/2002/063060A2 |
A niobium-based superconductor is manufactured by establishing multiple niobium components (4) in a billet of a ductile metal, working the composite billet through a series of reduction steps to form the niobium components into elongated...
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WO/2002/040213A1 |
Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper silver, bismuth, indium, and antimony and having a melting temperature between 175-215 °C.
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WO/2002/034969A1 |
An alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Al: 0.0020 to 0.0080 wt %, and balance: Sn and inevitable impurities; an alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Bi: 3.0 to 6.0 wt %, ...
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WO/2002/022913A2 |
The invention relates to ternary tin zinc alloy coatings 30 - 65 wt. % tin, 30 - 65 wt. % zinc and 0.1 - 15 wt . % metal from the following group as a third alloy component; iron, cobalt, nickel. Correspondingly, alloy coatings can be pr...
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WO/2002/022302A1 |
There is provided an improved lead-free solder material which is preferably used as a connecting material in a mounting process of an electronic component. The solder material according to the present invention contains 1.0 to 4.0 % by w...
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WO/2002/009936A1 |
An electronic device has a die that is attached to a metallic contact of a substrate via a coupling layer. The coupling layer comprises an alloy of at least two metals selected from the group consisting of Zn, Al, Mg, and Ga, and further...
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WO/2001/077403A1 |
The invention relates to metal or metal alloy based sputter target, preferably with a melting temperature of less than 750 °C. The invention also relates to a method for the production of a to metal or metal alloy based sputter target 7...
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WO/2001/070448A1 |
A lead-free solder alloy, characterized as having the following composition: Cu: 0.05 to 2.0 wt %, Ni: 0.001 to 2.0 wt %, balance: Sn. The solder alloy is completely free of Pb, and hence does not cause the environmental pollution by Pb....
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