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WO/2017/130880A1 |
Provided is a metal porous body that has a skeleton with a three-dimensional network structure that includes at least nickel and tin, wherein the nickel content ratio is 50 mass% or more, the tin content ratio is 5-25 mass%, inclusive, a...
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WO/2017/115462A1 |
This silver alloy powder is produced by melting silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium in a nitrogen atmosphere to obtain a molten metal, and then while dropping the molten metal, ra...
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WO/2017/094713A1 |
A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is made of nickel and is between the core an...
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WO/2017/086335A1 |
Provided is a solder joining material whereby solder can be effectively positioned between electrodes to be connected even when the electrode width or the electrode gap is small, and whereby the reliability of conduction and the reliabil...
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WO/2017/064991A1 |
Provided is a joining composition that contains tin, germanium, and nickel, the germanium content being 10% by mass or less, and the germanium content and nickel content satisfying formula (1). Formula (1): [Ni]≤2.8×[Ge]0.3 (where [Ni...
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WO/2017/061443A1 |
Provided is an Sn-coated copper powder which can be suitably used in a conductive paste, an electromagnetic-wave shield, etc., by preventing aggregation of the copper powder particles while ensuring excellent conductivity, through an inc...
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WO/2017/057651A1 |
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...
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WO/2017/047289A1 |
Provided is a lead-free solder that has high heat-resistance temperature and a heat conduction property which remains unaffected in a high-temperature range. The present invention pertains to: a soldering material comprising more than 5....
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WO/2017/018167A1 |
This solder alloy is substantially composed of tin, silver, copper, bismuth, antimony, and cobalt. Relative to the total amount of the solder alloy, the content percentage of silver is 3%-3.5% by mass inclusive, the content percentage of...
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WO/2017/018155A1 |
Provided is a coated solder wire manufactured on an industrial scale, said coated solder wire being provided with a dense coating film which is uniformly formed, by a single operation, over the entire surface of the solder wire, thus bei...
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WO2017010814A1 |
The present invention relates to a method and an apparatus for preparing a reduced product of carbon dioxide by electrically reducing carbon dioxide. The present invention can prepare, in an energy-efficient manner, a reduced product of ...
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WO/2017/007011A1 |
Provided is a metal fine particle-containing composition which enables metal parts on electrical components to be joined at a relatively low temperature, and which achieves a strong joint and leaves little residual organic matter after j...
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WO/2017/002704A1 |
The present invention accurately distinguishes a soldering material which is less apt to oxidize. The soldering material is Cu-core balls which comprise: Cu balls that have a given size and ensure a space between a semiconductor package ...
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WO/2017/002851A1 |
The purpose of the present invention is to provide a sintered alloy having high mechanical strength (particularly high toughness suitable for a sputtering target material) and a sputtering target material which includes the sintered allo...
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WO/2017/001042A1 |
The invention relates to a plug connector from an aluminum alloy strip (1), comprising at least one adhesion promoter layer (2), said adhesion promoter layer (2) being a copper-zinc alloy applied by electroplating.
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WO/2016/205781A1 |
Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of ...
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WO/2016/199747A1 |
The present invention addresses the problem of providing a flux for a lead-free solder, which ensures solder metal wettability while a flux residue generated in a reflow process exhibits excellent insulation resistance and the storage st...
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WO/2016/189900A1 |
The purpose of the present invention is to provide a solder alloy, solder ball, chip solder, solder paste and solder joint in which discoloration is suppressed and growth of oxide films is suppressed in high temperature and high humidity...
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WO/2016/185673A1 |
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0....
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WO/2016/185674A1 |
A solder alloy which contains from 0.5% by mass to 1.25% by mass (inclusive) of Sb, In in an amount satisfying 5.5 ≤ [In] ≤ 5.50 + 1.06[Sb] in cases where 0.5 ≤ [Sb] ≤ 1.0, while satisfying 5.5 ≤ [In] ≤ 6.35 + 0.212[Sb] in ca...
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WO/2016/185672A1 |
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0....
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WO/2016/179358A1 |
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mix...
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WO/2016/178000A1 |
A lead-free solder alloy comprising: from 20 to 35 wt.% bismuth, from 0.01 to 10 wt. % copper, one or more of: from 0.001 to 4 wt.% antimony, from 0.001 to wt.% cobalt, from 0.001 to 1 wt.% germanium, from 0.001 to 1 wt.% manganese, from...
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WO/2016/163070A1 |
Provided are: a flux for soldering that brings about flux residues which, even when exposed for a long period to thermal cycling which involves a maximum temperature as high as 150ºC, as in the engine room of an automotive vehicle, can ...
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WO/2016/158693A1 |
A metal nanoparticle dispersion solution for solder paste, containing a reducible dispersion medium and metal nanoparticles comprising an alloy, wherein the average particle size of the metal nanoparticles is 1.0-200 nm, the sintering st...
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WO/2016/158391A1 |
A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient str...
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WO/2016/157594A1 |
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...
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WO/2016/158390A1 |
A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient str...
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WO/2016/152648A1 |
Provided is a copper alloy sheet, with which a heat dissipating component can be given sufficient strength and heat dissipation capacity after being manufactured, in cases where a process of heating to 650°C or more is included as part ...
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WO/2016/152297A1 |
The purpose of the present invention is to provide a fluorescent light source device wherein high luminous efficiency and sufficiently high fluorescent intensity can be obtained in a fluorescent body. A fluorescent light source device of...
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WO/2016/152942A1 |
The present invention provides a method for producing conductive particles which is capable of forming uniform metal layers on particles to have a film formed thereon, without causing the particles to agglomerate during formation of the ...
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WO/2016/152259A1 |
A solder alloy which is substantially composed of tin, silver, copper, bismuth, antimony, indium and nickel. With respect to this solder alloy, the content ratio of silver is set to 0.05% by mass or more but less than 0.2% by mass; the c...
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WO/2016/144945A1 |
A solder paste consists of an amount of a first solder alloy powder between 44wt% to less than 60wt%; an amount of a second solder alloy powder between greater than Owt% and 48wt%; and a flux; wherein the first solder alloy powder compri...
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WO/2016/131916A1 |
The present invention relates to a tin-nickel layer having a high hardness value, a method for producing same, and a coated component comprising such a tin-nickel layer as a coating. The tin-nickel layer contains a NiSn phase and has a h...
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WO/2016/129599A1 |
This separator for a solid polymer fuel cell comprises: a ferritic stainless steel that serves as a base material, that has a chemical composition in which the calculated value of {Cr content (%) + 3 × Mo content (%)} is 22.5-45.0%, and...
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WO/2016/125901A1 |
Provided is a flux activating agent containing a halogen compound represented by general formula 1 (in the formula, X1 and X2 are different halogen atoms, R1 and R2 are groups that are respectively represented by general formula -OH,-O- ...
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WO/2016/125760A1 |
Provided is a bonding composition that contains tin, silver, and iridium, with the tin being the primary component, and contains 0.5-11.0 mass% of the silver.
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WO/2016/114028A1 |
Provided are: a conductive material which is capable of forming an intermetallic compound having a high melting point by reliably reacting a first metal with a second metal that has a higher melting point than the first metal, and which ...
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WO/2016/104658A1 |
Provided are a high-sphericity joining member, a solder material, a solder paste, a foam solder, a flux coating material, and a solder joint. This Ni-plated Cu ball 10 is provided with a Cu ball 12, and an Ni plating layer 14 covering th...
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WO/2016/098358A1 |
This solder alloy is substantially formed of tin, silver, copper, bismuth, antimony and cobalt. The content ratio of silver relative to the total amount of the solder alloy is from 2% by mass to 4% by mass (inclusive). The content ratio ...
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WO/2016/098669A1 |
The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn a...
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WO/2016/084550A1 |
Provided is a lead-free solder bump joining structure. In the present invention, intermetallic compound layers (11, 12) are resistant to loss as a result of the suppression of diffusion of Cu from the intermetallic compound layers (11, 1...
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WO/2016/076353A1 |
This Au-Sn alloy solder paste includes an Au-Sn alloy powder that includes Sn at a level within a range of 61-70 mass%, with the remainder being Au and unavoidable impurities, and a flux. The oxygen concentration in the Au-Sn alloy powde...
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WO/2016/071971A1 |
Provided is a solder material with which the thickness of an oxide film is controlled to a certain value or lower before solder melting and which exhibits oxidation resistance during and after solder melting. A Cu core ball 1A includes a...
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WO/2016/059744A1 |
Prevention of the occurrence of voids and solder wettability are improved in a method for soldering an Ag-containing lead-freed solder to be soldered to an Ag-containing member. A method for soldering an Ag-containing lead-freed solder a...
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WO/2016/035879A1 |
Provided is a lead-free solder alloy for use on a terminal, said alloy having improved shedding when a terminal part is withdrawn from within molten solder. This lead-free solder alloy for use in terminal preplating comprises to 4 to 6% ...
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WO/2016/031654A1 |
A conductive material for connection parts according to the present invention is configured in such a manner that a Cu-Sn alloy coating layer having a Cu content of 20 to 70 at% and an average thickness of 0.2 to 3.0 μm and an Sn coatin...
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WO/2016/028058A1 |
The present invention relates to a lead-free solder alloy composition and a method for preparing the lead-free solder alloy. The lead-free solder alloy composition of the present invention comprises a ceramic powder added to the lead-fre...
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WO/2016/017398A1 |
Provided are a solder ball having significantly greater drop and impact resistance characteristics, and an electronic member that uses the same. The present invention is a solder ball which contains 0.04-0.2 mass % of Ni, with the remain...
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WO/2016/012754A2 |
A lead-free, antimony-free solder alloy comprising: (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% ...
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