| Document |
Document Title |
|
WO/2014/080895A1 |
[Problem] To provide a negative electrode for an electrical device such as a lithium ion secondary battery that maintains high cycle characteristics, that has a high initial capacity, and that exhibits well-balanced characteristics. [Sol...
|
|
WO/2014/080883A1 |
[Problem] To provide a negative electrode for an electrical device such as a Li ion secondary battery, the electrode exhibiting a good balance of characteristics such as high initial capacity and maintaining high cycle characteristics. [...
|
|
WO/2014/080892A1 |
[Problem] To provide a negative electrode for an electrical device such as a lithium ion secondary battery that maintains high cycle characteristics, that has a high initial capacity, and that exhibits well-balanced characteristics. [Sol...
|
|
WO/2014/080893A1 |
[Problem] To provide a negative electrode for an electrical device such as a lithium ion secondary battery that maintains high cycle characteristics, that has a high initial capacity, and that exhibits well-balanced characteristics. [Sol...
|
|
WO/2014/080885A1 |
[Problem] To provide a negative electrode for an electrical device such as a Li-ion secondary battery, said negative electrode exhibiting well-balanced characteristics, namely maintaining a high cycle characteristic, while also having a ...
|
|
WO/2014/080886A1 |
[Problem] To provide a negative electrode for an electrical device such as a Li ion secondary battery, the electrode exhibiting a good balance of characteristics such as high initial capacity and maintaining high cycle characteristics. [...
|
|
WO/2014/069132A1 |
The purpose of the present invention is to provide a solder ball that makes it possible to limit agglomeration without the use of a dispersant, and to provide an agglomeration limiting device and agglomeration limiting method that can li...
|
|
WO/2014/069357A1 |
Provided is a bismuth characterized in that the bismuth emits 0.01 cph/cm2 or less of α rays. Also provided is a method for producing a low α-emitting bismuth, characterized in that a titanium cathode and a bismuth anode are introduced...
|
|
WO/2014/054189A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
|
|
WO/2014/054190A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
|
|
WO/2014/032215A1 |
Disclosed are an environmentally friendly tin, zinc and manganese alloy bar for welding and a preparation method therefor, wherein the tin, zinc and manganese alloy bar is composed of the following components: tin accounting for 68-70% o...
|
|
WO/2014/034139A1 |
A conventional solder material does not always exhibit sufficiently high thermal fatigue characteristics in soldering an Au electrode on which Au has been deposited by flashing. Flashing is useful for forming a thin deposit in a short ti...
|
|
WO/2014/034863A1 |
An electroconductive bonding material, which has high bonding strength with inorganic non-metals such as glass or ceramics, which does not peel even when subjected to high temperatures, and which is highly reliable, contains the followin...
|
|
WO/2014/024271A1 |
Provided is an Sn-Sb-Ag-Cu based high-temperature lead-free solder alloy which does not form any low-melting phase even when solidified at a low cooling rate and which exhibits excellent joint reliability. This solder alloy has an alloy ...
|
|
WO/2014/024715A1 |
Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250ºC. In order to make the structure of an Sn-Sb-Ag-Cu solder alloy finer and cause stress appl...
|
|
WO/2014/021204A1 |
This solder paste can be produced by mixing a flux which comprises a solvent, a rosin, a thixotropic agent and an activator with a solder powder which has a mean particle diameter of 0.1 to 5μm. The solder powder is composed of composit...
|
|
WO/2014/017238A1 |
Provided are: a metal material for electronic components, which has low occurrence of whiskers, low adhesive wear properties and high durability; a connector terminal which uses the metal material for electronic components; a connector; ...
|
|
WO/2014/013847A1 |
Provided is a tin/silver/copper solder alloy that contains tin, silver, copper, bismuth, nickel, and cobalt. When expressed relative to the total amount of the solder alloy, the silver content ratio is 2-4 mass%, the nickel content ratio...
|
|
WO/2014/013632A1 |
Provided is a tin/silver/copper solder alloy that contains tin, silver, copper, indium, bismuth, nickel, and cobalt. When expressed relative to the total amount of the solder alloy, the silver content ratio is 2-4 mass%, the nickel conte...
|
|
WO/2014/002283A1 |
Provided is a solder ball that suppresses interfacial peeling at the bonding interface of the solder ball and suppresses non-fusion that occurs between the solder ball and a solder paste. The solder ball can be used for both a Ni electro...
|
|
WO/2014/003006A1 |
This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, antimony, bismuth, copper, and nickel, essentially does not contain germanium, and with respect to the total quantity of solder alloy, has a silver conten...
|
|
WO/2014/003145A1 |
An electronic component metal material having low whiskering, low adhesive wear and high durability, and a connector terminal using said electronic component metal material, and a connector terminal, a connector and an electronic compone...
|
|
WO/2014/002303A1 |
This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, copper, nickel, antimony, bismuth, and indium, essentially does not contain magnesium, and with respect to the total quantity of solder alloy, has a silve...
|
|
WO/2014/002893A1 |
The present invention is an anisotropic conductive sheet which contains a resin (2) and conductive particles (1) that are dispersed in the resin (2), and which is characterized in that: the conductive particles (1) contain particles that...
|
|
WO/2014/002304A1 |
This solder alloy is a tin-silver-copper-based solder alloy, contains tin, silver, copper, nickel, antimony, and bismuth, essentially does not contain magnesium, and with respect to the total quantity of solder alloy, has a silver conten...
|
|
WO/2013/191121A1 |
Provided is a soldering flux that improves shape retention during printing, that is capable of suppressing heat sagging, and that has high electrical reliability between conductors. A soldering flux containing an epoxy resin, an organic ...
|
|
WO/2013/183484A1 |
[Problem] An electrical contactor which is prevented from adhering to a terminal of an electrical part after a continuity test and thus exhibits improved durability; and a socket for an electrical part, using the electrical contactor. [S...
|
|
WO/2013/172326A1 |
The purpose of the present invention is to provide a bearing for a motor-type fuel pump that has corrosion resistance against poor-quality gasoline that includes sulfur or organic acids, that, because of resistance to wear and outstandin...
|
|
WO/2013/157572A1 |
Provided is an Sn-Zn-based solder alloy which is capable of reducing the amount of generated dross even when the solder alloy in a molten state is exposed to the atmosphere, suppressing color change or reoxidation of the molten solder al...
|
|
WO/2013/153595A1 |
Provided is a Sn-Ag-Cu-based solder alloy which enables the provision of a solder joint having improved joint reliability that is evaluated under a high-temperature environment. The solder alloy has an alloy composition comprising, in ma...
|
|
WO/2013/153832A1 |
Provided is a metal material for an electronic component, having high fretting resistance, high insertion-extraction resistance, low whiskering, and low insertion force properties. A metal material for an electronic component, in which a...
|
|
WO/2013/140699A1 |
Disclosed are: an electric contact (14), which has improved durability by preventing a terminal (2a) of an electric component and the electric contact (14) from sticking to each other after continuity test; and a socket (10) for electron...
|
|
WO/2013/141166A1 |
A solder-coated ball (10A) according to one embodiment of the present invention has a ball-shaped core (11) and a solder layer (12) formed so as to coat the core (11), the solder layer (12) includes Sn and Bi, the Bi content is 45 mass% ...
|
|
WO/2013/140850A1 |
Provided are a metallic material for electronic components which is low in insertion/pulling-out force, generates few whiskers, and has high durability and a connector terminal, a connector, and an electronic component which are obtained...
|
|
WO/2013/132942A1 |
Provided are a bonding method which can obtain a bond section which has no air gaps, is precise, has high heat-resistance and excellent reliability, and a bond structure having a highly reliable bond section. When bonding a first object ...
|
|
WO/2013/132954A1 |
Provided are a bonding method which can obtain a bond section which has no air gaps, is precise, has high heat-resistance and excellent reliability, and a bond structure having a highly reliable bond section. When bonding a first objec...
|
|
WO/2013/132953A1 |
Provided is a bonding method which can bond a first metal member (1) and a second metal member (2) whilst ensuring sufficient bond strength, and which can suppress and prevent the oozing out of a bonding material during a stage such as r...
|
|
WO/2013/111434A1 |
To improve adhesion and thermal conductivity of an assembly in which a metal, a ceramic or a semiconductor is bonded. An assembly, which is obtained by bonding a second member with a first member that is a metal, a ceramic or a semicondu...
|
|
WO/2013/108599A1 |
A wiring substrate, having an insulating resin layer, a plurality of wires, and a via hole conductor. The wires are arranged via the insulating resin layer and are formed using copper foil. The via hole conductor is provided so as to pen...
|
|
WO/2013/108421A1 |
Disclosed is a solder alloy for an acoustic device, which used as solder for bonding various electronic components in an electronic circuit such as a filter circuit NW for an audio system, and which is composed of six elements (Sn, Ag, C...
|
|
WO/2013/099441A1 |
This negative electrode active material for an electrical device comprises an alloy that contains constituents in the following ranges, by mass ratio: 35% ≤ Si ≤ 78%, 7% ≤ Sn ≤ 30%, and 0% < Ti ≤ 37%, and/or 35% ≤ Si ≤ 52%,...
|
|
WO/2013/099849A1 |
Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of...
|
|
WO/2013/099712A1 |
A hot-dip plated high-strength steel sheet for press working that comprises: a cold-rolled steel sheet which contains, in term of mass%, 0.0005-0.0050% C, up to 0.30% Si, 0.70-3.00% Mn, up to 0.05% P, 0.01-0.05% Ti, 0.01-0.04% Nb, 0.0005...
|
|
WO/2013/088846A1 |
This negative electrode active material for an electrical device has an alloy containing Si at an amount in excess of 23% and less than 64%, 4% to 58% of Sn, and Zn at an amount in excess of zero and less than 65%, with the balance made ...
|
|
WO/2013/073324A1 |
Provided is a thermistor for which the adhesion strength between a metal base material layer and a thermistor thin film and the adhesion strength between the thermistor thin film and an electrode film does not easily decrease, and for wh...
|
|
WO/2013/062095A1 |
The present invention relates to a film which contains solder particles and a thermoplastic resin which can be dissolved by a solvent. In this reflow film, the solder particles are scattered throughout the film. Also provided is a solder...
|
|
WO/2013/052428A1 |
A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or e...
|
|
WO/2013/048664A1 |
A tin based white metal alloy consisting essentially by weight of approximately 5.0%-9.0% antimony, approximately 3.0%-8.0% copper, approximately 0.1%-0.7% cobalt, and the balance tin.
|
|
WO/2013/042572A1 |
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...
|
|
WO/2013/038817A1 |
Provided are an electroconductive material having excellent heat resistance and ensuring that a first metal and a second metal have good diffusivity in a soldering step when the material is used, for example, as a solder paste, that a hi...
|
