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Matches 1 - 50 out of 3,907

Document Document Title
WO/2018/012642A1
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.  
WO/2018/008165A1
Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0....  
WO/2018/003760A1
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow solde...  
WO/2018/001574A1
The invention relates to a thermoelectric article for a thermoelectric conversion device having a total composition consisting essentially of 6 at.% ≤ Ti ≤ 27 at.%, 6 at.% ≤ Zr < 27 at.%, 0 at.% ≤ Hf ≤ 1.7 at.%, wherein 28 at.%...  
WO/2018/003820A1
The purpose of the invention is to provide a flux composition and a solder paste composition capable of ensuring excellent printability regardless of the thickness and opening diameter of a metal mask without impairing solderability (the...  
WO/2017/221861A1
The purpose of the present invention is to provide a solder paste with which, in a solder joint joining an electronic component electrode and a printed circuit board electrode, the effect of an additive element can be obtained and a low ...  
WO/2017/221425A1
[Problem] To provide a guide wire that ensures the strength of joining between a core shaft and a coil body even when the materials of the core shaft and the coil body are variously changed, particularly, when the core shaft and the coil...  
WO/2017/217145A1
The present invention suppresses a fracture at the interface between different materials. A solder bonded part which comprises: a solder bonding layer 10 wherein a solder material, which contains more than 5.0% by mass but 10.0% by mass ...  
WO/2017/200361A2
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu all...  
WO/2017/200361A3
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu all...  
WO/2017/198795A1
The present invention relates to novel composite materials enriched with silicon dispersed in matrices comprising Ni, Ti and Si and/or Sn, optionally passivated. The invention also relates to the method for producing said materials and t...  
WO/2017/192517A1
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150°C, for example up to...  
WO/2017/179250A1
A semiconductor package manufacturing method of the present invention is characterized by having: a step for preparing a lead frame having a section to be cut, said section being formed of a Cu alloy; a step for applying a bonding materi...  
WO/2017/179532A1
Provided is a conductive material which is capable of efficiently arranging a solder between electrodes to be connected, thereby being capable of enhancing the conduction reliability and insulation reliability. A conductive material acco...  
WO/2017/164194A1
The purpose of the present invention is to provide the following: a lead-free solder alloy which can suppress development of cracks in soldered junctions even in harsh environments in which large temperature differences occur and the vib...  
WO/2017/160132A2
The present invention relates to a thin film material in which at least two kinds of metals are electroplated. In a first heating, melting occurs at a melting point (Tms) of a metal having a low melting point from among the metals, and a...  
WO/2017/159842A1
This magnesium-based thermoelectric conversion material is characterized in that a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (where x is 0 or more but less than 1) are directly joined, and in that the second la...  
WO/2017/154329A1
This production method is for a joined body wherein a first member and a second member are joined. The production method is characterized by including: an arrangement step for arranging a joining material between the first member and the...  
WO/2017/154330A1
This joining material includes a first metal powder and a second metal powder that has a higher melting point than the first metal powder. The joining material is characterized in that the first metal powder comprises Sn or an alloy that...  
WO/2017/154740A1
Provided is high-purity tin having a purity of 5N (99.999 mass%) or higher, wherein the high-purity tin has particles suppressed by high-purity tin that has 50,000 or fewer particles having a grain size of 0.5 μm or greater per 1 g.  
WO/2017/154957A1
The purpose of the present invention is to provide a solder alloy, a solder ball, a chip solder, a solder paste, and a solder joint in which discoloration is suppressed and the growth of an oxide film is suppressed in a high-temperature ...  
WO/2017/134974A1
A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (1...  
WO/2017/130880A1
Provided is a metal porous body that has a skeleton with a three-dimensional network structure that includes at least nickel and tin, wherein the nickel content ratio is 50 mass% or more, the tin content ratio is 5-25 mass%, inclusive, a...  
WO/2017/115462A1
This silver alloy powder is produced by melting silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium in a nitrogen atmosphere to obtain a molten metal, and then while dropping the molten metal, ra...  
WO/2017/094713A1
A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is made of nickel and is between the core an...  
WO/2017/086335A1
Provided is a solder joining material whereby solder can be effectively positioned between electrodes to be connected even when the electrode width or the electrode gap is small, and whereby the reliability of conduction and the reliabil...  
WO/2017/064991A1
Provided is a joining composition that contains tin, germanium, and nickel, the germanium content being 10% by mass or less, and the germanium content and nickel content satisfying formula (1). Formula (1): [Ni]≤2.8×[Ge]0.3 (where [Ni...  
WO/2017/061443A1
Provided is an Sn-coated copper powder which can be suitably used in a conductive paste, an electromagnetic-wave shield, etc., by preventing aggregation of the copper powder particles while ensuring excellent conductivity, through an inc...  
WO/2017/057651A1
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...  
WO/2017/047289A1
Provided is a lead-free solder that has high heat-resistance temperature and a heat conduction property which remains unaffected in a high-temperature range. The present invention pertains to: a soldering material comprising more than 5....  
WO/2017/018167A1
This solder alloy is substantially composed of tin, silver, copper, bismuth, antimony, and cobalt. Relative to the total amount of the solder alloy, the content percentage of silver is 3%-3.5% by mass inclusive, the content percentage of...  
WO/2017/018155A1
Provided is a coated solder wire manufactured on an industrial scale, said coated solder wire being provided with a dense coating film which is uniformly formed, by a single operation, over the entire surface of the solder wire, thus bei...  
WO2017010814A1
The present invention relates to a method and an apparatus for preparing a reduced product of carbon dioxide by electrically reducing carbon dioxide. The present invention can prepare, in an energy-efficient manner, a reduced product of ...  
WO/2017/007011A1
Provided is a metal fine particle-containing composition which enables metal parts on electrical components to be joined at a relatively low temperature, and which achieves a strong joint and leaves little residual organic matter after j...  
WO/2017/002704A1
The present invention accurately distinguishes a soldering material which is less apt to oxidize. The soldering material is Cu-core balls which comprise: Cu balls that have a given size and ensure a space between a semiconductor package ...  
WO/2017/002851A1
The purpose of the present invention is to provide a sintered alloy having high mechanical strength (particularly high toughness suitable for a sputtering target material) and a sputtering target material which includes the sintered allo...  
WO/2017/001042A1
The invention relates to a plug connector from an aluminum alloy strip (1), comprising at least one adhesion promoter layer (2), said adhesion promoter layer (2) being a copper-zinc alloy applied by electroplating.  
WO/2016/205781A1
Disclosed herein is a shape memory alloy comprising 45 to 50 atomic percent nickel; and 1 to 30 atomic percent of at least one metalloid selected from the group consisting of germanium, antimony, zinc, gallium, tin, and a combination of ...  
WO/2016/199747A1
The present invention addresses the problem of providing a flux for a lead-free solder, which ensures solder metal wettability while a flux residue generated in a reflow process exhibits excellent insulation resistance and the storage st...  
WO/2016/189900A1
The purpose of the present invention is to provide a solder alloy, solder ball, chip solder, solder paste and solder joint in which discoloration is suppressed and growth of oxide films is suppressed in high temperature and high humidity...  
WO/2016/185673A1
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0....  
WO/2016/185674A1
A solder alloy which contains from 0.5% by mass to 1.25% by mass (inclusive) of Sb, In in an amount satisfying 5.5 ≤ [In] ≤ 5.50 + 1.06[Sb] in cases where 0.5 ≤ [Sb] ≤ 1.0, while satisfying 5.5 ≤ [In] ≤ 6.35 + 0.212[Sb] in ca...  
WO/2016/185672A1
In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0....  
WO/2016/179358A1
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mix...  
WO/2016/178000A1
A lead-free solder alloy comprising: from 20 to 35 wt.% bismuth, from 0.01 to 10 wt. % copper, one or more of: from 0.001 to 4 wt.% antimony, from 0.001 to wt.% cobalt, from 0.001 to 1 wt.% germanium, from 0.001 to 1 wt.% manganese, from...  
WO/2016/163070A1
Provided are: a flux for soldering that brings about flux residues which, even when exposed for a long period to thermal cycling which involves a maximum temperature as high as 150ºC, as in the engine room of an automotive vehicle, can ...  
WO/2016/158693A1
A metal nanoparticle dispersion solution for solder paste, containing a reducible dispersion medium and metal nanoparticles comprising an alloy, wherein the average particle size of the metal nanoparticles is 1.0-200 nm, the sintering st...  
WO/2016/158391A1
A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient str...  
WO/2016/157594A1
Provided are: a sheet-like joining material which is used in cases such as when an electronic component provided with electrodes is to be mounted on a circuit board, exhibits excellent handling properties, and is capable of achieving rel...  
WO/2016/158390A1
A copper alloy sheet is provided which, in the case that part of the process of manufacturing a heat dissipation component involves a process for heating to a temperature of 650°C or greater, makes it possible to maintain sufficient str...  

Matches 1 - 50 out of 3,907