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Patent Searching and Data


Matches 1 - 50 out of 3,998

Document Document Title
WO/2018/129476A1
Contemplated is a magnetocaloric materials comprising: (CexNd1 -x)Si wherein x is in the range of about 0.1 to about 0.9, and wherein the magnetocaloric material exhibits a 2nd order magnetic phase transition in the temperature range of ...  
WO/2018/096061A1
A method for synthesising an Ag-Sn intermetallic compound comprising the following sequence of steps: - a step of providing a mixture (E1) during which a solution of a mixture of a silver salt and a protective agent in a polyol solvent i...  
WO/2018/096917A1
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...  
WO/2018/084072A1
A flux which contains at least one component selected from the group consisting of diglycolic acid and salts thereof; and the like.  
WO/2018/071931A1
The invention relates to a multilayer sliding bearing element comprising a supporting layer and a sliding layer, wherein the sliding layer consists of a white metal comprising the elements of tin, zinc and copper, the proportion of coppe...  
WO/2018/066657A1
Provided is a thermoelectric material which has excellent heat resistance and is suppressed in decrease of thermoelectric characteristics even in a high temperature environment. This thermoelectric material is obtained by substituting at...  
WO/2018/067426A1
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers betw...  
WO/2018/062255A1
This copper alloy sheet for a heat dissipation component is characterized in that: the copper alloy sheet for a heat dissipation component comprises 0.05-0.9% by mass of Co, and 0.01-0.25% by mass of P, the balance being Cu and inevitabl...  
WO/2018/056313A1
Provided is a multilayer metal ball having excellent spacer function and high bonding reliability. The multilayer metal ball 1 comprises a core ball 2 formed from Sn or Sn alloy, and an intermediate plated layer 3 of which the thickness ...  
WO/2018/056314A1
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be s...  
WO/2018/056315A1
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. In this multilayer metal ball 1, the thickness of an intermediate plating layer 3 can be made more uniform and irregularity in an interface ...  
WO/2018/051973A1
Provided is a solder alloy that has excellent wettability for preventing soldering defects, enables high bond strength in solder joints after soldering, suppresses breakage at bond interfaces, and also suppresses EM generation. In order ...  
WO/2018/046763A1
A solder alloy comprises 38.0-42.0 wt% bismuth (Bi), 0.01-2 wt% of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nic...  
WO/2018/042890A1
A semiconductor element 11 is bonded to an insulating substrate 14 by means of a bonding layer which is obtained by: forming a network of a porous metal 30 based on a porous metal body 3, said porous metal 30 being formed using a bonded ...  
WO/2018/034320A1
Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a solder...  
WO/2018/025903A1
The purpose of the present invention is to provide a solder paste flux with which it is possible to form a solder joint that produces less voids. The solder paste flux according to the present invention contains, as the main component, a...  
WO/2018/025798A1
Provided is a composition containing metal particles, whereby high-strength joining between metals of electronic components or the like is possible at relatively low temperature. A composition containing metal particles, characterized by...  
WO/2018/021540A1
Thermoelectric materials according to an embodiment of the present invention are a plurality of p-type and n-type thermoelectric materials which constitute a thermoelectric conversion element. Provided are thermoelectric materials, a the...  
WO/2018/012642A1
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.  
WO/2018/008165A1
Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0....  
WO/2018/003760A1
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow solde...  
WO/2018/001574A1
The invention relates to a thermoelectric article for a thermoelectric conversion device having a total composition consisting essentially of 6 at.% ≤ Ti ≤ 27 at.%, 6 at.% ≤ Zr < 27 at.%, 0 at.% ≤ Hf ≤ 1.7 at.%, wherein 28 at.%...  
WO/2018/003820A1
The purpose of the invention is to provide a flux composition and a solder paste composition capable of ensuring excellent printability regardless of the thickness and opening diameter of a metal mask without impairing solderability (the...  
WO/2017/221861A1
The purpose of the present invention is to provide a solder paste with which, in a solder joint joining an electronic component electrode and a printed circuit board electrode, the effect of an additive element can be obtained and a low ...  
WO/2017/221425A1
[Problem] To provide a guide wire that ensures the strength of joining between a core shaft and a coil body even when the materials of the core shaft and the coil body are variously changed, particularly, when the core shaft and the coil...  
WO/2017/217145A1
The present invention suppresses a fracture at the interface between different materials. A solder bonded part which comprises: a solder bonding layer 10 wherein a solder material, which contains more than 5.0% by mass but 10.0% by mass ...  
WO/2017/200361A2
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu all...  
WO/2017/200361A3
The present invention relates to a lead-free solder alloy composition and a preparation method therefor, the composition comprising: a Sn-Ag-Cu first alloy; a Sn-Bi second alloy; one or more third alloys selected from Sn-Ag and Sn-Cu all...  
WO/2017/198795A1
The present invention relates to novel composite materials enriched with silicon dispersed in matrices comprising Ni, Ti and Si and/or Sn, optionally passivated. The invention also relates to the method for producing said materials and t...  
WO/2017/192517A1
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150°C, for example up to...  
WO/2017/179250A1
A semiconductor package manufacturing method of the present invention is characterized by having: a step for preparing a lead frame having a section to be cut, said section being formed of a Cu alloy; a step for applying a bonding materi...  
WO/2017/179532A1
Provided is a conductive material which is capable of efficiently arranging a solder between electrodes to be connected, thereby being capable of enhancing the conduction reliability and insulation reliability. A conductive material acco...  
WO/2017/164194A1
The purpose of the present invention is to provide the following: a lead-free solder alloy which can suppress development of cracks in soldered junctions even in harsh environments in which large temperature differences occur and the vib...  
WO/2017/160132A2
The present invention relates to a thin film material in which at least two kinds of metals are electroplated. In a first heating, melting occurs at a melting point (Tms) of a metal having a low melting point from among the metals, and a...  
WO/2017/159842A1
This magnesium-based thermoelectric conversion material is characterized in that a first layer formed of Mg2Si and a second layer formed of Mg2SixSn1-x (where x is 0 or more but less than 1) are directly joined, and in that the second la...  
WO/2017/154329A1
This production method is for a joined body wherein a first member and a second member are joined. The production method is characterized by including: an arrangement step for arranging a joining material between the first member and the...  
WO/2017/154330A1
This joining material includes a first metal powder and a second metal powder that has a higher melting point than the first metal powder. The joining material is characterized in that the first metal powder comprises Sn or an alloy that...  
WO/2017/154740A1
Provided is high-purity tin having a purity of 5N (99.999 mass%) or higher, wherein the high-purity tin has particles suppressed by high-purity tin that has 50,000 or fewer particles having a grain size of 0.5 μm or greater per 1 g.  
WO/2017/154957A1
The purpose of the present invention is to provide a solder alloy, a solder ball, a chip solder, a solder paste, and a solder joint in which discoloration is suppressed and the growth of an oxide film is suppressed in a high-temperature ...  
WO/2017/134974A1
A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (1...  
WO/2017/130880A1
Provided is a metal porous body that has a skeleton with a three-dimensional network structure that includes at least nickel and tin, wherein the nickel content ratio is 50 mass% or more, the tin content ratio is 5-25 mass%, inclusive, a...  
WO/2017/115462A1
This silver alloy powder is produced by melting silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium in a nitrogen atmosphere to obtain a molten metal, and then while dropping the molten metal, ra...  
WO/2017/094713A1
A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is made of nickel and is between the core an...  
WO/2017/086335A1
Provided is a solder joining material whereby solder can be effectively positioned between electrodes to be connected even when the electrode width or the electrode gap is small, and whereby the reliability of conduction and the reliabil...  
WO/2017/064991A1
Provided is a joining composition that contains tin, germanium, and nickel, the germanium content being 10% by mass or less, and the germanium content and nickel content satisfying formula (1). Formula (1): [Ni]≤2.8×[Ge]0.3 (where [Ni...  
WO/2017/061443A1
Provided is an Sn-coated copper powder which can be suitably used in a conductive paste, an electromagnetic-wave shield, etc., by preventing aggregation of the copper powder particles while ensuring excellent conductivity, through an inc...  
WO/2017/057651A1
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...  
WO/2017/047289A1
Provided is a lead-free solder that has high heat-resistance temperature and a heat conduction property which remains unaffected in a high-temperature range. The present invention pertains to: a soldering material comprising more than 5....  
WO/2017/018167A1
This solder alloy is substantially composed of tin, silver, copper, bismuth, antimony, and cobalt. Relative to the total amount of the solder alloy, the content percentage of silver is 3%-3.5% by mass inclusive, the content percentage of...  
WO/2017/018155A1
Provided is a coated solder wire manufactured on an industrial scale, said coated solder wire being provided with a dense coating film which is uniformly formed, by a single operation, over the entire surface of the solder wire, thus bei...  

Matches 1 - 50 out of 3,998