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Matches 1 - 50 out of 4,185

Document Document Title
WO/2019/117041A1
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...  
WO/2019/116910A1
A semiconductor device according to the present invention is provided with: an insulating substrate (1) which is obtained by integrating a ceramic base material (1b) and a fin (1a) for cooling with each other; a plate-like wiring member ...  
WO/2019/111898A1
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...  
WO/2019/102671A1
The present invention addresses the problem of providing a flux from which no crystal is precipitated and which enables the improvement of the wettability of a solder. A flux characterized by containing 0.4 to 10.0% by mass of ditolylgua...  
WO/2019/103090A1
Provided are: a flux which imparts thixotropy, and which exhibits excellent printing properties, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a t...  
WO/2019/103025A1
The purpose of the present invention is to provide a solder material which shows little discoloration, has excellent wetting properties, is highly reliable in terms of cycling properties, etc., and, when made into a solder paste, has a s...  
WO/2019/094243A1
A lead-free solder alloy is based on tin and comprises silver, copper, bismuth, cobalt and titanium. The alloy may further comprise antimony, nickel, or both. Silver is present in an amount from 3.1% to 3.8% by weight of the solder. Copp...  
WO/2019/092947A1
[Problem] To provide a car window glass equipped with a lead-free solder joined portion, which passes the VDA test. [Solution] This car window glass comprises: a glass plate having an electrically conductive body layer; a connection term...  
WO/2019/094241A2
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...  
WO/2019/094242A1
A lead-free, tin based solder alloy comprises silver, copper, cobalt and optionally bismuth and antimony. The alloy may further comprise nickel. Silver is present in an amount from 2.0% to 2.8% by weight of the solder. Copper is present ...  
WO/2019/088222A1
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...  
WO/2019/088068A1
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...  
WO/2019/074006A1
Provided are a flux which has improved wet-spreadability and is capable of preventing the occurrence of dewetting and a solder paste with the use of the flux. The flux comprises one member selected from among a dimer acid that is a produ...  
WO/2019/069788A1
This solder alloy is used in soldering and has a chemical composition that includes, in percent by mass, 2.0-4.0% of Ag, 0.6-1.2% of Cu, 2.0-5.0% of Sb, 1.1-3.5% of In, 0-0.20% of Ni, 0-0.2% of Co, and 0-0.05% of Ge, the balance being Sn...  
WO/2019/058650A1
Provided is a solder alloy that makes it possible to ensure long-term bonding reliability in metal piping by minimizing the growth of an intermetallic compound layer at the bonding interface when performing low-temperature bonding of met...  
WO/2019/053866A1
The purpose of the present invention is to provide: a lead-free solder alloy with which progression of cracking in solder joints can be suppressed even in a rugged environment with severe differences between hot and cold and with a vibra...  
WO/2019/049917A1
Provided is a flux which enables improvement of solderability, while maintaining activeness by suppressing the formation of an ester by a reaction between an organic acid and a hydroxy group of an alcohol that is contained in a solvent. ...  
WO/2019/039320A1
Provided is a thermoelectric material 1 having: a parent phase 10 containing a MgSiSn alloy as a main component; vacancies 12 formed in the parent phase 10; and a silicon layer which is formed on at least the wall surfaces of the vacanci...  
WO/2019/035197A1
Provided are a solder alloy for preventing Fe erosion, a flux cored solder, a wire solder, a flux cored wire solder, a flux-coated solder and a solder joint which, in order to prolong the life of a soldering iron tip, suppress erosion of...  
WO/2019/027261A1
Disclosed is a lead-free alloy composition comprising: a solder comprising at least one alloy selected from a Sn-Ag-Cu alloy, a Sn-Cu alloy, and a Sn-Ag alloy; and an additive added to the solder, the additive comprising a tungsten metal...  
WO/2019/022193A1
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...  
WO/2019/017182A1
[Problem] To provide a sliding member and a sliding bearing which are capable of improving fatigue resistance. [Solution] Provided is a sliding member in which a coating layer is laminated on a base layer, wherein the coating layer compr...  
WO/2019/017349A1
Provided is a negative electrode active material having a greater capacity retention rate and capacity per volume. The negative electrode active material according to this embodiment of the present invention contains alloy particles. The...  
WO/2019/012947A1
A metal porous body according to an embodiment of the present invention has a flat shape and continuous pores. The metal porous body skeleton has an alloy layer containing nickel and chromium, and a silver layer is formed on the surface ...  
WO/2019/013158A1
The present invention addresses the problem that: if a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a flow due to heating, the amount of flux residue increases, and, if applied for uses t...  
WO/2019/009191A1
A flux according to the present invention contains a phosphine oxide. Accordingly, it is possible to provide a flux capable of enhancing the solder wettability, a resin-flux cored solder containing said flux, and a solder paste containin...  
WO/2019/009427A1
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least tw...  
WO/2018/225288A1
The purpose of the present invention is to provide: a resin flux cored solder or a flux coated solder, which is suppressed in scattering of flux and solder when the solder is in use; and a flux which is contained in the resin flux cored ...  
WO/2018/198515A1
The present invention provides: a Nb3Sn superconducting wire rod that is produced by the internal tin process and that has a number of useful functions in such aspects as promotion of Nb3Sn layer generation, mechanical strength (and incr...  
WO/2018/193760A1
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means o...  
WO/2018/193960A1
The purpose of the present invention is to provide: a flux composition which does not undergo the scattering of a flux; and a solder paste composition. A flux composition containing an anti-scattering agent represented by formula (1). (I...  
WO/2018/189154A1
Disclosed is a pyrometallurgical process for producing a crude solder from a feedstock selected in terms of its levels of Sn, Cu, Sb, Bi, Zn, As, Ni and Pb, the process comprising at least the steps of obtaining in a furnace a liquid bat...  
WO/2018/186218A1
Provided is a solder material including 2.5-3.3 wt% Ag, 0.3-0.5 wt% Cu, 5.5-6.4 wt% In, and 0.5-1.4 wt% Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.  
WO/2018/181873A1
Provided are a solder alloy, a solder paste, and a solder joint which provide high reliability in that the solder alloy has a high tension strength and that excellent vibration resistance is achieved at a joint part between a printed-cir...  
WO/2018/181690A1
The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy ...  
WO/2018/174066A1
Provided are conductive particles which can be easily mounted at low temperatures, and which are capable of effectively improving impact resistance of connection parts. Conductive particles according to the present invention are provided...  
WO/2018/174162A1
This solder joint has used therein an Sn-Cu-Ni-Bi-Ge-based lead-free solder alloy, wherein the lead-free solder alloy is configured from an alloy comprising 0.1-2.0% by weight of a Cu additive, 0.05-0.5% by weight of a Ni additive, 0.1-8...  
WO/2018/168858A1
Provided is a solder material which has excellent thermal cycle fatigue characteristics and excellent wettability. A solder material which contains from 5.0% by mass to 8.0% by mass (inclusive) of Sb and from 3.0% by mass to 5.0% by mass...  
WO/2018/164171A1
The purpose of the present invention is to provide a lead-free solder alloy, solder paste, and electronic circuit board that ensure reliable connections between solder joints and electronic components by suppressing thermomigration, whic...  
WO/2018/161416A1
The invention discloses a liquid metal thermal interface material with a melt-back property and a preparation method thereof. The liquid metal thermal interface material is characterized by containing in percent by weight: 20-40 wt% of i...  
WO/2018/159664A1
Provided is a solder material which is capable of suppressing the occurrence of electromigration. This solder material is a core ball 1A which comprises a spherical core 2A that is configured from Cu or a Cu alloy, and a solder layer 3A ...  
WO/2018/135426A1
The present invention is a flux, etc., including a terpene phenol resin and having an acid value of 120 mg KOH/g or greater.  
WO/2018/135427A1
Flux, etc., that includes a terpene phenol resin that has a hydroxyl value of at least 110 mgKOH/g.  
WO/2018/134673A1
Provided is a soldering method for bonding an electrode on a substrate and an electrode on an electronic component by forming a solder joint that exhibits superior connection reliability while reducing thermal damage to the electronic co...  
WO/2018/129476A1
Contemplated is a magnetocaloric materials comprising: (CexNd1 -x)Si wherein x is in the range of about 0.1 to about 0.9, and wherein the magnetocaloric material exhibits a 2nd order magnetic phase transition in the temperature range of ...  
WO/2018/096061A1
A method for synthesising an Ag-Sn intermetallic compound comprising the following sequence of steps: - a step of providing a mixture (E1) during which a solution of a mixture of a silver salt and a protective agent in a polyol solvent i...  
WO/2018/096917A1
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...  
WO/2018/084072A1
A flux which contains at least one component selected from the group consisting of diglycolic acid and salts thereof; and the like.  
WO/2018/071931A1
The invention relates to a multilayer sliding bearing element comprising a supporting layer and a sliding layer, wherein the sliding layer consists of a white metal comprising the elements of tin, zinc and copper, the proportion of coppe...  
WO/2018/066657A1
Provided is a thermoelectric material which has excellent heat resistance and is suppressed in decrease of thermoelectric characteristics even in a high temperature environment. This thermoelectric material is obtained by substituting at...  

Matches 1 - 50 out of 4,185