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Matches 1 - 50 out of 4,128

Document Document Title
WO/2019/049917A1
Provided is a flux which enables improvement of solderability, while maintaining activeness by suppressing the formation of an ester by a reaction between an organic acid and a hydroxy group of an alcohol that is contained in a solvent. ...  
WO/2019/039320A1
Provided is a thermoelectric material 1 having: a parent phase 10 containing a MgSiSn alloy as a main component; vacancies 12 formed in the parent phase 10; and a silicon layer which is formed on at least the wall surfaces of the vacanci...  
WO/2019/035197A1
Provided are a solder alloy for preventing Fe erosion, a flux cored solder, a wire solder, a flux cored wire solder, a flux-coated solder and a solder joint which, in order to prolong the life of a soldering iron tip, suppress erosion of...  
WO/2019/027261A1
Disclosed is a lead-free alloy composition comprising: a solder comprising at least one alloy selected from a Sn-Ag-Cu alloy, a Sn-Cu alloy, and a Sn-Ag alloy; and an additive added to the solder, the additive comprising a tungsten metal...  
WO/2019/022193A1
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...  
WO/2019/017182A1
[Problem] To provide a sliding member and a sliding bearing which are capable of improving fatigue resistance. [Solution] Provided is a sliding member in which a coating layer is laminated on a base layer, wherein the coating layer compr...  
WO/2019/017349A1
Provided is a negative electrode active material having a greater capacity retention rate and capacity per volume. The negative electrode active material according to this embodiment of the present invention contains alloy particles. The...  
WO/2019/012947A1
A metal porous body according to an embodiment of the present invention has a flat shape and continuous pores. The metal porous body skeleton has an alloy layer containing nickel and chromium, and a silver layer is formed on the surface ...  
WO/2019/013158A1
The present invention addresses the problem that: if a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a flow due to heating, the amount of flux residue increases, and, if applied for uses t...  
WO/2019/009191A1
A flux according to the present invention contains a phosphine oxide. Accordingly, it is possible to provide a flux capable of enhancing the solder wettability, a resin-flux cored solder containing said flux, and a solder paste containin...  
WO/2019/009427A1
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least tw...  
WO/2018/225288A1
The purpose of the present invention is to provide: a resin flux cored solder or a flux coated solder, which is suppressed in scattering of flux and solder when the solder is in use; and a flux which is contained in the resin flux cored ...  
WO/2018/198515A1
The present invention provides: a Nb3Sn superconducting wire rod that is produced by the internal tin process and that has a number of useful functions in such aspects as promotion of Nb3Sn layer generation, mechanical strength (and incr...  
WO/2018/193760A1
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means o...  
WO/2018/193960A1
The purpose of the present invention is to provide: a flux composition which does not undergo the scattering of a flux; and a solder paste composition. A flux composition containing an anti-scattering agent represented by formula (1). (I...  
WO/2018/189154A1
Disclosed is a pyrometallurgical process for producing a crude solder from a feedstock selected in terms of its levels of Sn, Cu, Sb, Bi, Zn, As, Ni and Pb, the process comprising at least the steps of obtaining in a furnace a liquid bat...  
WO/2018/186218A1
Provided is a solder material including 2.5-3.3 wt% Ag, 0.3-0.5 wt% Cu, 5.5-6.4 wt% In, and 0.5-1.4 wt% Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.  
WO/2018/181873A1
Provided are a solder alloy, a solder paste, and a solder joint which provide high reliability in that the solder alloy has a high tension strength and that excellent vibration resistance is achieved at a joint part between a printed-cir...  
WO/2018/181690A1
The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy ...  
WO/2018/174066A1
Provided are conductive particles which can be easily mounted at low temperatures, and which are capable of effectively improving impact resistance of connection parts. Conductive particles according to the present invention are provided...  
WO/2018/174162A1
This solder joint has used therein an Sn-Cu-Ni-Bi-Ge-based lead-free solder alloy, wherein the lead-free solder alloy is configured from an alloy comprising 0.1-2.0% by weight of a Cu additive, 0.05-0.5% by weight of a Ni additive, 0.1-8...  
WO/2018/168858A1
Provided is a solder material which has excellent thermal cycle fatigue characteristics and excellent wettability. A solder material which contains from 5.0% by mass to 8.0% by mass (inclusive) of Sb and from 3.0% by mass to 5.0% by mass...  
WO/2018/164171A1
The purpose of the present invention is to provide a lead-free solder alloy, solder paste, and electronic circuit board that ensure reliable connections between solder joints and electronic components by suppressing thermomigration, whic...  
WO/2018/161416A1
The invention discloses a liquid metal thermal interface material with a melt-back property and a preparation method thereof. The liquid metal thermal interface material is characterized by containing in percent by weight: 20-40 wt% of i...  
WO/2018/159664A1
Provided is a solder material which is capable of suppressing the occurrence of electromigration. This solder material is a core ball 1A which comprises a spherical core 2A that is configured from Cu or a Cu alloy, and a solder layer 3A ...  
WO/2018/135426A1
The present invention is a flux, etc., including a terpene phenol resin and having an acid value of 120 mg KOH/g or greater.  
WO/2018/135427A1
Flux, etc., that includes a terpene phenol resin that has a hydroxyl value of at least 110 mgKOH/g.  
WO/2018/134673A1
Provided is a soldering method for bonding an electrode on a substrate and an electrode on an electronic component by forming a solder joint that exhibits superior connection reliability while reducing thermal damage to the electronic co...  
WO/2018/129476A1
Contemplated is a magnetocaloric materials comprising: (CexNd1 -x)Si wherein x is in the range of about 0.1 to about 0.9, and wherein the magnetocaloric material exhibits a 2nd order magnetic phase transition in the temperature range of ...  
WO/2018/096061A1
A method for synthesising an Ag-Sn intermetallic compound comprising the following sequence of steps: - a step of providing a mixture (E1) during which a solution of a mixture of a silver salt and a protective agent in a polyol solvent i...  
WO/2018/096917A1
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...  
WO/2018/084072A1
A flux which contains at least one component selected from the group consisting of diglycolic acid and salts thereof; and the like.  
WO/2018/071931A1
The invention relates to a multilayer sliding bearing element comprising a supporting layer and a sliding layer, wherein the sliding layer consists of a white metal comprising the elements of tin, zinc and copper, the proportion of coppe...  
WO/2018/066657A1
Provided is a thermoelectric material which has excellent heat resistance and is suppressed in decrease of thermoelectric characteristics even in a high temperature environment. This thermoelectric material is obtained by substituting at...  
WO/2018/067426A1
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers betw...  
WO/2018/062255A1
This copper alloy sheet for a heat dissipation component is characterized in that: the copper alloy sheet for a heat dissipation component comprises 0.05-0.9% by mass of Co, and 0.01-0.25% by mass of P, the balance being Cu and inevitabl...  
WO/2018/056313A1
Provided is a multilayer metal ball having excellent spacer function and high bonding reliability. The multilayer metal ball 1 comprises a core ball 2 formed from Sn or Sn alloy, and an intermediate plated layer 3 of which the thickness ...  
WO/2018/056314A1
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. With this multilayer metal ball 1, deformation thereof when the multilayer metal ball 1 has been mounted to an electronic component can be s...  
WO/2018/056315A1
Provided is a multilayer metal ball having a superior spacer function and high bond reliability. In this multilayer metal ball 1, the thickness of an intermediate plating layer 3 can be made more uniform and irregularity in an interface ...  
WO/2018/051973A1
Provided is a solder alloy that has excellent wettability for preventing soldering defects, enables high bond strength in solder joints after soldering, suppresses breakage at bond interfaces, and also suppresses EM generation. In order ...  
WO/2018/046763A1
A solder alloy comprises 38.0-42.0 wt% bismuth (Bi), 0.01-2 wt% of at least one further element chosen from the group of manganese (Mn), antimony (Sb) and copper (Cu), the balance being tin (Sn), and is at least substantially free of nic...  
WO/2018/042890A1
A semiconductor element 11 is bonded to an insulating substrate 14 by means of a bonding layer which is obtained by: forming a network of a porous metal 30 based on a porous metal body 3, said porous metal 30 being formed using a bonded ...  
WO/2018/034320A1
Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a solder...  
WO/2018/025903A1
The purpose of the present invention is to provide a solder paste flux with which it is possible to form a solder joint that produces less voids. The solder paste flux according to the present invention contains, as the main component, a...  
WO/2018/025798A1
Provided is a composition containing metal particles, whereby high-strength joining between metals of electronic components or the like is possible at relatively low temperature. A composition containing metal particles, characterized by...  
WO/2018/021540A1
Thermoelectric materials according to an embodiment of the present invention are a plurality of p-type and n-type thermoelectric materials which constitute a thermoelectric conversion element. Provided are thermoelectric materials, a the...  
WO/2018/012642A1
A novel solder alloy is provided which contains Sn, Bi and Zn, with Bi 42-62 mass%, Zn 0.2-3.6 mass%, and the remainder Sn and unavoidable impurities; this solder alloy can be used in a low temperature range.  
WO/2018/008165A1
Provided is a solder alloy in which depletion of the plating layer can be effectively prevented, even under repeated contact in a molten state with a plating layer of which the primary component is Fe. This solder alloy comprises 0.01-0....  
WO/2018/003760A1
The purpose of the invention is to provide a flux composition and a solder paste composition with which it is possible to suppress the stickiness of flux residue after soldering while suppressing the creation of voids during reflow solde...  
WO/2018/001574A1
The invention relates to a thermoelectric article for a thermoelectric conversion device having a total composition consisting essentially of 6 at.% ≤ Ti ≤ 27 at.%, 6 at.% ≤ Zr < 27 at.%, 0 at.% ≤ Hf ≤ 1.7 at.%, wherein 28 at.%...  

Matches 1 - 50 out of 4,128