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WO/2013/062095 |
The present invention relates to a film which contains solder particles and a thermoplastic resin which can be dissolved by a solvent. In this reflow film, the solder particles are scattered throughout the film. Also provided is a solder...
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WO/2013/052428 |
A Sn-Ag-Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt.% and less than or equal to about 1.5 wt.% Ag; between greater than or e...
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WO/2013/048664 |
A tin based white metal alloy consisting essentially by weight of approximately 5.0%-9.0% antimony, approximately 3.0%-8.0% copper, approximately 0.1%-0.7% cobalt, and the balance tin.
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WO/2013/042572 |
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...
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WO/2013/038621 |
Disclosed is an electrical connection structure comprising: a first conductive portion constituted of aluminium or an aluminium alloy; a second conductive portion; and an alloy body which includes at least tin, silver and nickel and whic...
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WO/2013/038816 |
Provided is an electroconductive material having excellent heat resistance and ensuring that a first metal and a second metal have good diffusivity in a soldering process when the material is used, for example, as soldering paste, that a...
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WO/2013/038817 |
Provided are an electroconductive material having excellent heat resistance and ensuring that a first metal and a second metal have good diffusivity in a soldering step when the material is used, for example, as a solder paste, that a hi...
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WO/2013/017883 |
High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0 to.0 wt% Ag; from 0 to 1.0 %wt Au; from 0 to 1.0 %wt Cr; from 0 to 2.0 %wt In; from 0 to 1.0 %wt P...
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WO/2013/015329 |
The present invention provides a wiring member having: a conductive material; and a solder coating layer that is disposed at a portion of the region of the surface of the conductive material and that contains an amorphous solder material.
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WO/2013/002112 |
A highly reliable joint which is inhibited, during operation, from suffering a volume change accompanying phase transformation or suffering troubles such as strains or cracks caused by a volume change is rendered possible with an Sn-Cu s...
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WO/2012/172428 |
An ingot which includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot and the at least two metals are 40-95 wt.% copper, 3-80 wt.% tin, 1-40 wt.% bismuth, and/or 1-80 wt.% z...
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WO/2012/172854 |
This bonding method is a bonding method that bonds two members (A, B) using an Au-Sn solder. In this bonding method, the Sn wt% concentration in the Au-Sn solder (S') after bonding is 38.0%-82.3%.
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WO/2012/168530 |
The invention relates to a compound material for the manufacture of ecological ammunition, characterized in that it includes a) a metal matrix consisting of an alloy of zinc and bismuth, of zinc and aluminum, of tin and bismuth or of zin...
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WO/2012/141331 |
The present invention addresses the problem of providing, at low cost, a lead-free solder alloy which has high reliability and excellent joining characteristics and which is suitable for mounting a microscopic electronic component. This ...
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WO/2012/140928 |
This sputtering target for solar cells is characterized in being formed by bonding together a backing plate and a target material using an indium-tin alloy bonding material or an indium-gallium alloy bonding material, said target materia...
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WO/2012/137901 |
This solder alloy contains Al and/or Al2O3 in the amount of 0.006-0.15 wt% in an Sn-Cu hypereutectic area. In addition, this solder alloy comprises Cu in the amount of 0.7-7.6 wt%, and Al and/or Al2O3 in the amount of 0.006-0.5 wt%, with...
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WO/2012/131861 |
There have been no drop impact resistant solder balls with a composition that satisfies requirements for both Cu electrodes and Ni electrodes. Some solder balls with good drop impact resistance have a composition suitable for Cu electrod...
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WO/2012/132175 |
In order to provide a solder transfer base which enables a transfer without breaking a fragile film of a semiconductor element that has a fragile dielectric film, the present invention provides a solder transfer base (5), which is provid...
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WO/2012/133598 |
Provided are solder balls that peel less at bonded interfaces, have less non-fusion between solder balls and solder past, and few failure modes when electronic components are dropped. These solder balls can be used for both Ni electrodes...
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WO/2012/128356 |
With the use of this solder alloy that includes 0.2 to 1.2 mass% Ag, 0.6 to 0.9 mass% Cu, 1.2 to 3.0 mass% Bi, 0.02 to 1.0 mass% Sb, and 0.01 to 2.0 mass% In, with the remainder comprising Sn, it is possible to achieve a portable device ...
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WO/2012/127642 |
In Sn-Ag-Cu solders among conventional solder alloys with good drop impact resistance, the amount of Ag and Cu is reduced and the growth of intermetallic compounds such as Cu6Sn5 and Ag3Sn occurring at the interface between the electrode...
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WO/2012/119977 |
Energy-saving lamps contain a gas filling of mercury vapour and argon in a gas discharge bulb. Amalgam balls are used for filling the gas discharge bulb with mercury. Novel coated balls whose operating life in the case of automatic meter...
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WO/2012/118203 |
Disclosed is a method that is for joining an automobile window glass to an electricity supply terminal and that contains: a first step wherein, using a lead-free solder alloy, a solder layer is formed by heat welding to a predetermined l...
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WO/2012/117988 |
This lead-free solder alloy for vehicle glass comprises an alloy composition of 26.0-56.0 mass% of In, 0.1-5.0 mass% of Ag, 0.002-0.05 mass% of Ti, and 0.001-0.01 mass% of Si, the remainder being Sn. Furthermore, the alloy may contain 0....
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WO/2012/118202 |
Provided is a glass plate article that has a feed terminal structure to be connected to a feeding section of a glass plate with a conductive section. The glass plate article is characterized in that the feed terminal structure has one or...
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WO/2012/115268 |
A soldered joint capable of withstanding a high current density without the occurrence of electromigration such that it can be used in a power device and the like is formed from an Sn-Ag-Bi-In alloy. This soldered joint is formed from a ...
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WO/2012/111185 |
The present invention provides a solder-plated copper wire sheathed by a lead-free solder plating layer, wherein the solder-plated copper wire is characterized in that the copper wire comprises copper and unavoidable impurities, the cros...
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WO/2012/108395 |
In a connecting structure which is used in situations of electronic component mounting and via hole connection, where a first article being connected and a second article being connected are connected using solder, the present invention ...
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WO/2012/086745 |
The present invention addresses the problem of providing a bonding method, bonding structure, etc., which ensure sufficient bonding strength and which suppress and prevent the leakage of bonding material in the second reflow stage, etc.,...
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WO/2012/086835 |
Provided is an Sn alloy powder for negative electrodes of lithium ion batteries, which contains, in at%, 35-50% of Co and/or Fe (provided that Co and Fe can be partially substituted by Ni within the range where Ni%/(Co% + Fe% + Ni%) is 0...
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WO/2012/086201 |
Provided is a mounting structure in which fatigue properties of heat resistance are improved. A mounting structure (107) is provided with a substrate (100) having substrate electrodes (101), an electronic component (103) having electrode...
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WO/2012/081688 |
The main purpose of the present invention is to provide a flux which can produce a lead-free solder paste having excellent viscosity stability and displaying good wettability even after atmospheric soldering. A lead-free solder flux has ...
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WO/2012/077228 |
The purpose of the present invention is to obtain a lead-free solder alloy with high connection reliability for power cycles in semiconductor devices that operate at high temperatures and a semiconductor device using the same. The compos...
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WO/2012/066795 |
Provided is an electroconductive material in which, when the electroconductive material is used as, for example, a solder paste, a first metal and a second metal show satisfactory diffusibility during a soldering step to yield a high-mel...
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WO/2012/056753 |
This low-silver-content solder alloy comprises 0.05-2.0 mass% of silver, 1.0 mass% or less of copper, 3.0 mass% or less of antimony, 2.0 mass% or less of bismuth, 4.0 mass% or less of indium, 0.2 mass% or less of nickel, 0.1 mass% or les...
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WO/2012/053178 |
The present invention addresses the problem of obtaining a semiconductor junction structure having superior stress absorption and possessing heat resistance at the same time. The junction structure has a semiconductor element (102) and a...
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WO/2012/042926 |
The purpose of the present invention is to provide a soldering paste that makes possible a surface mounting structure for electronic components that can withstand 1000 heat shock cycles of -40 - 150°C as required for use in the proximit...
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WO/2012/029470 |
The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substr...
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WO/2012/028136 |
The invention relates to a slide bearing alloy which combines high static mechanical strength properties with a long useful life under dynamic loading and has the following composition: 6-18 wt. % Sb, 3-10 wt.% Cu, 0.5-3.5 wt.% Bi, 0-2.0...
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WO/2012/023440 |
Provided is a solder ball that assures sufficient thermal fatigue characteristics even if the solder ball has a diameter of 250 µm or less, which has been used in recent years for solder balls for semiconductor mounting and electronic m...
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WO/2012/018046 |
Provided is a semiconductor device wherein an internal bonding section does not melt at the time of substrate mounting by means of filling the hole portions of a porous metal body having a mesh structure with an Sn or Sn-based solder all...
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WO/2011/158834 |
Disclosed is a saw wire which comprises: a steel wire (11) comprising a base steel wire (11a) having a given composition; abrasive grains (13) adhered to the steel wire (11) by means of an adhesion part (12); and an intermetallic compoun...
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WO/2011/151894 |
Size reductions in electronic appliances have resulted in the appearance of printed boards which cannot be subjected to cleaning and in the necessity of a lead-free solder paste capable of conforming to the omission of cleaning. In order...
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WO/2011/145591 |
Disclosed is a lead-free solder composition for a vehicle, which is characterized by being composed of 26-56% by mass of In, 0-10% by mass of Ag and the balance, namely 34-74% by mass of Sn. The composition is useful as a solder composit...
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WO/2011/125140 |
Lead-free connecting materials having satisfactory wetting properties and high heat resistance have come to be required as a result of increases in the temperature of element connection parts due to increases in the capacity of power mod...
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WO/2011/115305 |
Disclosed is a metal tape material having improved characteristics in terms of a low Young's modulus, a low yield stress, and a high break elongation. Also disclosed is a metal tape material for semiconductor mounting comprising said met...
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WO/2011/115297 |
Disclosed is a production apparatus and method for producing inexpensive Mg2Si1-xSnx polycrystals that can be used effectively for thermoelectric conversion materials that can be expected to have high performance indices by doping accord...
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WO/2011/114824 |
Tin characterized in that a melted and casted sample thereof has an α-dose less than 0.0005 cph/cm2. With the recent tendency toward high-density and high-capacity semiconductor devices, the risk of soft errors caused by α-rays emitted...
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WO/2011/106421 |
A low melting temperature composite material including an alloy having about 0.1% by weight to about 99% by weight of tin and about 0.1% by weight to about 90% by weight of an element selected from the group consisting of silver and gold...
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WO/2011/102034 |
Provided is a lead-free solder alloy which makes possible lower soldering temperatures and improves the reliability of the soldered joint, and a solder paste and packaged components using the lead-free solder alloy. The lead-free solder ...
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