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JP7425872B2 |
This disclosure relates to a polycrystalline diamond (PCD) body comprising a PCD material formed of intergrown diamond grains forming a diamond network, and an iron-containing binder.
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JP7350058B2 |
A composite material contains a metallic phase and a non-metallic phase. The composite material further contains a specific element. At least 90 mass % of the metallic phase is composed of at least one selected from the group consisting ...
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JP7318172B1 |
The sintered body includes diamond particles and a binder. The boron concentration in the diamond particles is 0.001% by mass or more and 0.9% by mass or less. The boron concentration in the binder is 0.5% by mass or more and 40% by mass...
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JP7299183B2 |
To provide a sintered body, a heat sink, a method for producing a sintered body and a method for producing a heat sink that can achieve improved thermal conductivity.A sintered body CUD1 has a sintered copper member 51, a plurality of di...
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JP7273374B2 |
A composite material includes: coated particles, each of which includes a carbon-based particle made of a carbon-based substance and a carbide layer that covers at least a part of the surface of the carbon-based particle; and a copper ph...
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JP7242652B2 |
Provided are a sputtering target and a method for manufacturing the same, whereby generation of particles can be reduced, and manufacturing yield can be enhanced in a process of forming a magnetic thin film. A sputtering target having an...
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JP3240444U |
A double-structural shock-resistant diamond plate is provided by a casting method for containing diamond particles and exposing them on the surface in order to compensate for the disadvantages of using aluminum as a metal material for bo...
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JP7196193B2 |
A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulati...
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JP7189214B2 |
This composite member is provided with: a composite material which has multiple diamond particles and a metal matrix that bonds the diamond particles together; and a metal plating layer covering at least a portion of the surface of the c...
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JP2022163085A |
To provide a diamond tool improving defect resistance.A diamond tool has on at least a tip part of blade, a diamond which includes one or more diamond particles. The diamond particle includes a diamond phase comprising a crystal structur...
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JP7104620B2 |
Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film ...
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JP7101754B2 |
A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase that bonds the diamond grains; and a coating layer made of metal and coating at least a part of a surface ...
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JP7042989B1 |
A diamond sintered body containing diamond particles, the content of the diamond particles is 80% by volume or more and 99% by volume or less with respect to the diamond sintered body, and the average particle size of the diamond particl...
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JP7010592B2 |
A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distributi...
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JP6980161B1 |
The composite material of the present disclosure comprises a plurality of diamond particles, copper, and at least one first element selected from the group consisting of silicon, chromium, cobalt, nickel, molybdenum, titanium, vanadium, ...
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JP2021168376A |
To provide a method of manufacturing a heat dissipation substrate, capable of increasing a heat conductive rate reduced by a thin wall treatment during the manufacturing process, and provide a method of manufacturing a composite substrat...
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JP6937356B2 |
To provide a sputtering target in which quality and a yield of a magnetic recording layer can be improved by suppressing a sedimentation of a black carbon particle on a surface thereby reducing generation probability of abnormal discharg...
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JP6908713B2 |
A composite sintered material includes a plurality of diamond grains, a plurality of cubic boron nitride grains, and a remainder of a binder phase, wherein the binder phase includes cobalt, a content of the cubic boron nitride grains in ...
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JP2021070091A |
To provide a high hardness sintered body made mainly of diamond, which is a massive tool material that can be manufactured and processed under a same condition as a condition for conventional cobalt-system PCD and has appropriate conduct...
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JP2021059782A |
To provide a heat radiation component for a semiconductor element having a high heat conductivity, and a thermal expansion coefficient near to that of a semiconductor element without causing bulging and cracking under an actual use condi...
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JP6853439B2 |
A drilling tip according to the disclosure has a tip body which is provided with a tip portion tapered toward a tip side of the tip body; and a hard layer which is formed on a surface of the tip portion of the tip body, an outermost laye...
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JP6849267B1 |
A diamond-based composite material containing 40% by volume or more and 70% by volume or less of diamond particles, the balance of which is composed of Ag and unavoidable impurities, and the Cr content with respect to the Ag content is 0...
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JP6841841B2 |
A cutting tool according to an aspect of the present disclosure includes a shank, a joint, and a cutting portion attached through the joint to the shank. The cutting portion includes a core and a surface portion. The surface portion is d...
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JP6788669B2 |
A powder molding method of aluminum and aluminum alloy includes: preparing a feedstock by kneading aluminum powder, aluminum alloy powder, or aluminum composite powder containing a reinforcing material with a thermoplastic organic binder...
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JP6775694B2 |
A composite sintered material includes: a plurality of diamond grains having an average grain size of less than or equal to 10 µm; a plurality of cubic boron nitride grains having an average grain size of less than or equal to 2 µm; an...
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JP2020147462A |
To provide a sintered material that can be applied to a processing tool for all materials including iron, suppresses promotion of phase transition to graphite caused by a bonding material, and can be manufactured and processed under the ...
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JP6755879B2 |
The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor element, and in which the difference between the thicknesses of both su...
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JP6721615B2 |
In composite materials containing diamond particles dispersed within cemented carbide, it is difficult to simply increase the size of the diamond particles and further improve the grinding force, while preserving the grindability and wea...
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JP6714786B1 |
Provided is a composite member having excellent heat resistance. A composite member including a substrate made of a composite material containing a non-metal phase and a metal phase and a metal layer covering at least a part of the surfa...
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JP2020059079A |
To provide a sounding diamond-containing hard composite material which is free of shape distortion and peeling, and a cutting tool element.A sintered material split body is composed of single- or multi-mode size-regulated diamond particl...
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JP6621736B2 |
The purpose of the present invention is to provide an aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurr...
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JP6584399B2 |
A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak...
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JPWO2018074275A1 |
The composite sintered body is a composite sintered body including diamond particles having an average particle size of 10 μm or less, cubic boron nitride particles having an average particle size of 2 μm or less, and a bonding phase o...
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JP6528516B2 |
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JP6502950B2 |
Provided are a heat radiating member allowing a semiconductor element to be bonded with high bondability to a surface of a composite portion composed of a composite material, and a method for producing the same. A heat radiating member i...
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JP6497616B2 |
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JP2019019871A |
To make a disc rotor which facilitates mechanical cutting work while being excellent in thermal conductivity, hardness and anticorrosion.A method for manufacturing a disc rotor includes mixing in a mixing step S10 of a material powder, p...
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JP2019019052A |
To provide a composite sintered body containing diamond having high performance in abrasion resistance, in local abrasion resistance and in chipping resistance.In a composite sintered body, which is a composite sintered body containing a...
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JP6462899B2 |
A heat-dissipating plate comprises a core layer; and two cover layers formed by being laminated on the top and bottom face of the core layer, wherein, the core layer is composed of a composite material in which a carbon phase is composit...
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JP6441915B2 |
[Problem] To provide an inexpensive semiconductor package having excellent heat dissipation properties. [Solution] The present invention provides a semiconductor package having, stacked in the following order, a heat dissipating member, ...
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JP6416776B2 |
A bonded diamond body (1) having a high bonded strength is provided. The bonded diamond body (1) includes a sintered polycrystalline diamond body (2), a hard substrate (3), and a hard layer (4) provided between the sintered polycrystalli...
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JP2018525530A |
A method of producing a component of a diamond-binder composite that uses a hot isotropic gas pressure process (HIP) to infiltrate a debindered green body (1) containing compressed diamond particles. A method comprising the step of encap...
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JP2018111883A |
To provide a dense diamond composite material which is excellent in thermal conductivity and suited as a raw material for a heat radiation member and the heat radiation member, and to provide a production method of a diamond composite ma...
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JP6317109B2 |
Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a g...
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JP6310486B2 |
A construction comprising a sintered polycrystalline super-hard layer having mutually opposite reinforced boundaries, each of which is bonded to a respective reinforcement structure, in which the super-hard layer includes polycrystalline...
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JP6292688B2 |
Provided are a diamond composite material which is excellent in thermal conductivity, suitable as a material for a heat radiating member, and dense, the heat radiating member, and a method for producing a diamond composite material that ...
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JP6257575B2 |
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JP2017141507A |
To provide a polycrystalline diamond (PCD) material that displays improved and optimized combined properties of durability, wear resistance, low residual stress and thermal stability for use in complex wear and drilling environments, mak...
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JP2017075397A |
To provide a heat radiation substrate that is a metal layer produced with an alloy composite body containing a metal and a diamond powder as a main ingredient, and having a linear expansion coefficient of 6.5 ppm/K or larger and 15 ppm/K...
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JP2017066436A |
To provide a method for manufacturing a nano diamond containing plating film, capable of obtaining a plating film suitable for achieving high hardness and high wear resistance, and a nano diamond containing plating film obtained by the m...
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