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WO/2016/006326A1 |
Provided is a bonding wire capable of satisfying joint reliability, spring performance, and chip damage performance requirements for high density mounting. The bonding wire is characterized by including a total of 0.05-5 at.% of at least...
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WO/2015/193659A2 |
Precious metal-containing alloy compositions having good fusibility as well as good colour and workability properties comprise: (i) at least one precious metal selected from gold (Au), platinum (Pt) and palladium (Pd); and (ii) a fusibil...
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WO/2015/194472A1 |
The present invention provides a hydrogen release film and hydrogen release laminate film that do not fail even when an electrochemical element is used for a long period of time or the amount of hydrogen release has increased due to a la...
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WO/2015/187842A1 |
In one embodiment, a heating element includes a central particle and a plurality of plasmonic nanoparticles attached to the central particle, wherein the nanoparticles undergo plasmonic heating when exposed to near infrared light.
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WO/2015/182415A1 |
The problem addressed by the present invention is to provide: a cladding member that is for the airtight sealing of an electronic component, comprises Kovar and a silver-based brazing material, and has superior punching workability. At t...
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WO/2015/184438A1 |
The disclosure provides Au-Al-Rare-Earth metallic glass-forming alloys and metallic glasses comprising various other additions including but not limited to Cu, Pd, Sn and Mg. In certain embodiments, the metallic glasses according to the ...
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WO/2015/182576A1 |
[Problem] To provide a low-cost semiconductor package which has excellent heat dissipation properties. [Solution] The present invention provides a semiconductor package in which a heat dissipating member, a bonding layer and an insulatin...
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WO/2015/174462A1 |
By adopting a thermoelectric conversion element formed by connecting one end of an n-type thermoelectric conversion material and one end of a p-type thermoelectric conversion material to a conductive substrate, respectively, using a bond...
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WO/2015/173790A1 |
Use of a 18K, 14K, 10K or 9K gold powder alloy for the rapid prototyping by addition of SLM material of yellow, red or white gold jewellery items. The alloy comprises: (A) 37,5% to 38,5% by weight or 41,7% to 42,5% by weight or 58,5% to ...
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WO/2015/171892A1 |
Alloyed Ag/Au nanospheres with high compositional homogeneity ensured by annealing at elevated temperatures show large extinction cross-sections, extremely narrow band-widths and remarkable stability in harsh chemical environments. Nanos...
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WO/2015/166795A1 |
Provided are a sputtering target with which it is possible to fabricate a magnetic thin film having high coercive force (Hc), and a process for production thereof. The sputtering target contains metallic Co, metallic Pt, and an oxide, bu...
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WO/2015/156093A1 |
An Ag alloy film comprises 0.1 to 1.5% by mass inclusive of In and 1 to 50 ppm by mass inclusive of Cu, with the remainder made up by Ag and unavoidable impurities. A sputtering target comprises 0.1 to 1.5% by mass inclusive of In and 1 ...
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WO/2015/152191A1 |
A bonding wire for use with semiconductor devices that, in order to minimize leaning problems and spring problems, is characterized in that: (1) a cross-section that is parallel to the lengthwise direction of the wire and contains the ce...
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WO/2015/152197A1 |
A bonding wire for use with semiconductor devices that, in order to minimize leaning problems and spring problems, is characterized in that: (1) a cross-section that is parallel to the lengthwise direction of the wire and contains the ce...
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WO/2015/151581A1 |
The purpose of the present invention is to provide a platinum wire in which crystal growth is slowed to prevent damage resulting from creep without dispersing a metal oxide, and slip at crystal grain boundaries is slowed. A platinum ther...
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WO/2015/146931A1 |
This Ni-Ir-based heat-resistant alloy is constituted of an Ni-Ir-Al-W alloy comprising 5.0-50.0 mass% Ir, 1.0-8.0 mass% Al, 5.0-20.0 mass% W, and Ni as the remainder and contains, as an essential reinforcing phase, a γ' phase that has a...
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WO/2015/148510A2 |
The disclosure provides Pt-Cu-P glass-forming alloys bearing at least one of B, Ag, and Au, where each of B, Ag, and Au can contribute to improve the glass forming ability of the alloy in relation to the alloy that is free of these eleme...
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WO/2015/146932A1 |
The present invention is a metal wire rod composed of iridium or an iridium-containing alloy, wherein the number of crystal grains in an arbitrary cross-section of the longitudinal direction is 2 to 20 per 0.25 mm2, and the Vickers hardn...
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WO/2015/133264A1 |
An alloy wherein particles containing Cr are miniaturized and uniformly dispersed and Cu portions, which serve as a highly conductive component, are also miniaturized and uniformly dispersed. This alloy is produced, for example, by: a mi...
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WO/2015/133262A1 |
This electrode material results from reducing the size of and uniformly dispersing particles containing Cr, and also minutely and uniformly dispersing a Cu portion, which is a highly conductive component. The electrode material is prepar...
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WO/2015/125406A1 |
The objective of the present invention is to provide a spark plug having excellent durability by providing a central electrode and/or a grounding electrode with a tip having excellent resistance to spark-wear under high-temperature envir...
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WO/2015/120978A1 |
The invention relates to a precious metal alloy containing palladium and rhodium for producing items of jewellery such as ornaments, jewellery, bijouterie, watches and watch cases and/or writing implements and/or a component part thereof...
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WO/2015/119242A1 |
The silver alloy film according to the present invention has a composition including 0.01-1.00 at% of antimony and 0.05-1.00 at% of magnesium, with the remainder being silver and inevitable impurities.
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WO/2015/118790A1 |
The purpose of the present invention is to achieve bonding that has a good balance between heat resistance and stress relaxation. A plate-like bonding material (1) that is configured of an alloy of bismuth and silver and is bonded with o...
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WO/2015/097350A1 |
The present invention relates to the production of a silver alloy blackened in the body used, for example, in jewellery. The method for manufacturing said material comprises placing the alloy in contact with the sulphur in the form of su...
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WO/2015/093064A1 |
The present invention provides an alloy for medical use comprising an Au-Pt alloy, wherein the alloy for medical use comprises an Au-Pt alloy in which the Pt concentration is at least 24 mass% but less than 34 mass%, the balance being Au...
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WO/2015/093306A1 |
Provided is a bonding wire with which the occurrence of defective loops can be reduced. The present invention is provided with: a core material including more than 50 mol% of a metal (M); an intermediate layer which is formed on the surf...
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WO/2015/087588A1 |
Provided is a lead-free, high-temperature-use Au-Sn-Ag series solder alloy that is fully usable for bonding an electronic component or an electronic component-equipped device which requires extremely high reliability, such as a liquid cr...
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WO/2015/082630A1 |
The invention relates to a method for processing a dispersion-hardened platinum composition, wherein a volume body of a dispersion-hardened platinum composition having at least 70 wt% of platinum, at most 29.95 wt% of other noble metals,...
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WO/2015/076190A1 |
A sputtering target for forming an Fe-Pt magnetic recording film containing C, which is characterized in that the average thickness of an Fe-Pt alloy phase in the polished surface of a cross-section vertical to the sputtering surface is ...
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WO/2015/074349A1 |
Disclosed in the present invention are a method for preparing a silver metallic oxide graphite composite electrical contact material and a product thereof. The technical solution of the present invention mainly comprises the following co...
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WO/2015/075855A1 |
In a spark plug provided with a tip on at least one among a central electrode and a grounding electrode, an abnormal depletion of the tip is suppressed to provide a spark plug having excellent durability, as per an objective of the inven...
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WO/2015/068853A1 |
The present invention makes it possible, with similar or different types of metal bonding using metal nanoparticles, to obtain a bonded structure having satisfactory bonding strength by bonding, via a bonding layer containing Ni nanopart...
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WO/2015/064808A1 |
The present invention relates to the manufacture of an oxide dispersion strengthened platinum-rhodium alloy to be used for an LCD glass manufacturing device and, more specifically, provides a novel method for manufacturing an oxide dispe...
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WO/2015/059539A1 |
A decorative coating film (10) formed on a surface of a resinous base (20) placed on a path of electromagnetic waves of a radar device, the decorative coating film (10) including: fine particles (1a) of a silver alloy dispersed in the de...
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WO/2015/046457A1 |
A brazed structure in which a brazed part is formed on a substrate comprising a discoloration-resistant copper alloy containing 17-37 mass% Zn, 0.30 mass% Pb, and at least one of 0.5 mass% Ni, 0.01-1.6 mass% Al, and 0.01-2.5 mass% Sn, th...
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WO/2015/041162A1 |
An Ni alloy article (10) coated with a thermal shield, said article including a base material (12) formed from an Al-containing Ni alloy, an intermediate layer (14) formed on a surface of the base material (12), and a thermal shield laye...
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WO/2015/038636A1 |
The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.
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WO/2015/034287A1 |
The present invention relates to a silver alloy bonding wire containing silver (Ag) as a main component, palladium (Pd), and gold (Au), and, more specifically, to an alloy bonding wire in which the palladium (Pd) content is 0.1 to 0.4 wt...
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WO/2015/034387A1 |
The invention relates to the field of noble metal metallurgy, and specifically to the production of platinum or of platinum-rhodium alloys, reinforced using dispersed oxide particles. Such composite materials are widely utilized in pr...
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WO/2015/034394A1 |
The invention relates to the field of the metallurgy of noble metals, and more particularly to platinum alloys for the manufacture of catalyst gauzes that can be used in the chemical industry. The claimed alloy contains the following com...
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WO/2015/034121A1 |
The present invention provides a method for producing a high-density, oxide dispersion-strengthened, platinum-rhodium-oxide-based alloy.
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WO/2015/030155A1 |
A superelastic alloy comprising Fe or Co added to an Au-Cu-Al alloy and comprising: 12.5%-16.5% by mass Cu; 3.0%-5.5% by mass Al; and 0.01%-2.0% by mass Fe or Co; with the remainder being Au. The difference between the Al content and the...
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WO/2015/028878A1 |
A modified bimetallic nanoparticle comprising a first metal consisting of platinum and a second metal selected from the group consisting of Iridium (Ir), Ruthenium(Ru), Copper(Cu), Cobalt (Co), Titanium (Ti), Zirconium (Zr), Hafnium (Hi)...
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WO/2015/019906A1 |
The objective of the present invention is to provide a hydrogen discharge film and a hydrogen discharge laminate film that are not prone to embrittlement in the usage environment temperatures of electrochemical elements. The hydrogen dis...
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WO/2015/019493A1 |
A sintered platinum material which is useful as a decorative material, characterized by being produced by subjecting a mixed powder obtained by mixing 50 to 99.9mass% of a platinum powder having a particle diameter of 1 to 300μm with 0....
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WO/2015/019494A1 |
A sintered platinum material which is useful as a decorative material, characterized by being produced by subjecting a mixed powder obtained by mixing 50 to 99.9mass% of a platinum powder having a particle diameter of 1 to 300μm with 0....
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WO/2015/014968A1 |
The present invention relates to novel brazing filler metals comprising copper, silver, zinc, manganese and at least one metal selected from the group indium, gallium and tin, the brazing filler metal is free from cadmium and phosphorus,...
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WO/2015/008540A1 |
The present invention provides an Ag alloy sputtering target by which it is possible to perform stable DC sputtering. This Ag alloy sputtering target contains 0.1-1.5 mass% In, the balance being a composition comprising Ag and unavoidabl...
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WO/2015/008628A1 |
A silver-coated copper alloy powder obtained by coating a copper alloy powder having a composition which contains 1-50 mass% nickel and/or zinc, the remainder comprising copper and unavoidable impurities, with 7-50 mass% silver-containin...
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