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WO/2015/005455A1 |
Provided are: a semi-transparent Ag alloy film having excellent smoothness, heat-resistance and resistance to sulfurization, as well as satisfactory conductivity and permeability; and a sputtering target for forming a transparent Ag allo...
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WO/2014/208419A1 |
The present invention addresses the problem of providing an electrical contact material in which the oxide content can be increased, the manufacturing cost can be reduced, and exceptional levels of performance and workability as an elect...
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WO/2014/208114A1 |
The present invention is an Au-Pt alloy for medical use, said alloy containing 34 to 36mass% of Pt with the balance being Au, and having a single-phase α structure that exhibits, in the X-ray diffraction analysis, an X/Y ratio of 0.01 o...
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WO/2014/208341A1 |
An Ag alloy film used for a reflecting electrode or a wiring electrode, the Ag alloy film exhibiting low electrical resistivity and high reflectivity and having exceptional oxidation resistance under cleaning treatments such as an O2 pla...
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WO/2014/208610A1 |
The present invention provides a conductive member having exceptional cost performance, low contact resistance, and exceptional corrosion resistance, the conductive member being capable of being used highly reliably for a long period of ...
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WO/2014/207897A1 |
The purpose of the present invention is to provide a solder material in which the amount of radiated α-rays can be reduced. A solder ball (1A), which is a solder material, is provided with a nuclei layer (2A) having sufficient diameter ...
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WO/2014/203007A1 |
A process for preparing an alloy of silver with enhanced whiteness suitable for use in jewellery manufacture, comprising from about 50 to about 97% by weight of silver, from about 0.35 to about 5% by weight germanium, and the remainder b...
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WO/2014/200770A1 |
A metal matrix composite using as one of the components a precious metal is described. In one embodiment, the precious metal takes the form of gold and the metal matrix composite has a gold mass fraction in accordance with 18 k. The meta...
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WO/2014/196377A1 |
A sintered sputtering target containing a Fe-Pt alloy and a non-magnetic material as the main components, said sintered sputtering target being characterized in that at least C (carbon) is contained as the non-magnetic material, an addit...
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WO/2014/189501A1 |
Submerged combustion burners having a burner body and a burner tip connected thereto. The burner body has an external conduit and first and second internal conduits substantially concentric therewith, forming first and second annuli for ...
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WO/2014/185266A1 |
This sintered-body sputtering target has, as main components thereof, an Fe-Pt alloy and a non-magnetic material, and is characterized by: including at least 50 but not more than 5000 ppm by mass of an element which forms an oxide having...
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WO/2014/178155A1 |
The present invention pertains to a rivet contact comprising a head and a foot which is smaller in width than the head, the rivet contact being characterized in that: at least the upper surface of the head comprises a contact layer made ...
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WO/2014/178310A1 |
A sintered body which contains at least cobalt as a metal and is composed of boron and/or at least one metal selected from platinum group elements or an alloy of the metal and an oxide, said sintered body being characterized in that at l...
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WO/2014/174984A1 |
A silver-bismuth powder which comprises silver and bismuth at a mass ratio of silver to bismuth of 95:5 to 40:60 and which exhibits a particle diameter (D50) of 0.1 to 10μm in the volume-based particle size distribution obtained by a la...
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WO/2014/174482A1 |
A nickel- and palladium-free master alloy usable with gold for manufacturing white gold alloys, comprising: (A) 35% to 80% by weight of silver; (B) 3% to 20% by weight of zinc; (C) 0,5% to 40% by weight of copper; (D) 5% to 40% by weight...
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WO/2014/171161A1 |
A sputtering target which is composed of an Fe-Pt based alloy phase, an Ag phase and a C phase, characterized in that: in the whole composition of the sputtering target, the value obtained by dividing the atomic ratio of C by the atomic ...
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WO/2014/155178A1 |
The invention concerns an alloy for the production of jewels, constituted by: 4 - 10%, preferably 5 - 10%, more preferably 6 - 10% zinc by weight; 0.1 - 4.3% gold by weight; 8 - 20% copper by weight; 1 - 6% indium by weight; 0 - 4.3% pla...
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WO/2014/150653A1 |
A light emitting diode (10) with a front surface (12) adapted to emit light and a rear surface (14) is provided with a reflective coating (20) on the rear surface, the reflective coating being primarily silver and containing either.4% bi...
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WO/2014/142089A1 |
The present invention is a heat-resistant material made from a heat-resistant Ni-based alloy comprising an Ni-Ir-Al-W alloy obtained by adding to Ni, as essential additive elements, Ir, Al, and W; the Ni-based alloy comprising, by mass, ...
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WO/2014/142028A1 |
A silver alloy sputtering target having a component composition containing a total of 0.1 to 1.5% by mass of In and/or Sn, which are elements that form a solid solution in Ag, with the remainder being made up by Ag and unavoidable impuri...
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WO/2014/141789A1 |
A carbon powder which can be used for the production of a sputtering target for forming a magnetic recording film, said carbon powder being characterized by having a fluorine content of 50 ppm by weight or more; and a sputtering target f...
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WO/2014/141975A1 |
Provided is a silver bonding wire which is less expensive than a gold bonding wire and which can enable a stable connection by means of a combination of a ball bonding method and a stud bump method. A wire (W) contains Ag as a primary co...
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WO/2014/136617A1 |
An electrical contact (21, 31) containing 0.1-30% by mass of molybdenum and 10-70% by mass of at least one component selected from the group consisting of tungsten and tungsten carbide, with the balance being composed of unavoidable impu...
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WO/2014/132746A1 |
Provided is an FePt-C-based sputtering target with which a thin film that contains an FePt-based alloy and is capable of being used as a magnetic recording medium can be formed independently without using a plurality of targets, the FePt...
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WO/2014/122234A1 |
The invention relates to a timepiece or piece of jewellery comprising an alloy containing at least 750 wt.-‰ gold, characterised in that the alloy comprises at least 200‰ copper, 4‰ - 35‰ palladium and 1‰ - 16‰ indium.
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WO/2014/122233A1 |
The invention relates to a timepiece or piece of jewellery comprising an alloy containing at least 750 wt.-‰ gold, characterised in that the alloy also contains copper, palladium and indium, the sum of the concentrations of palladium a...
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WO/2014/122235A1 |
The invention relates to a timepiece or piece of jewellery comprising an alloy containing at least 750 wt.-‰ gold, characterised in that the alloy comprises copper, calcium at a concentration of less than or equal to 10 ‰ or 7‰ or ...
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WO/2014/115712A1 |
The present invention pertains to an Ag alloy film-forming sputtering target, an Ag alloy film, an Ag alloy reflective film, an Ag alloy electroconductive film, and an Ag alloy semi-permeable film, the Ag alloy film-forming sputtering ta...
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WO/2014/108848A1 |
The present invention concerns a master alloy composition for producing gold, specifically white gold, alloys, mainly used to produce precious objects, said master alloy composition comprising rhodium (Rh) as whitening component and capa...
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WO/2014/108849A1 |
A master alloy composition for producing gold alloys with innovative refiners system comprising iridium (Ir): 0.01÷0.8% by weight, ruthenium (Ru): 0.002÷0.9% by weight, rhodium (Rh): 0.002÷0.8% by weight, and copper (Cu): 20÷99.965% ...
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WO/2014/106925A1 |
Provided is a ceramic wiring substrate comprising a vertical conducting body which is formed by forming a vertical conducting hole in a substrate after the substrate is formed in a plate shape by sintering a ceramic precursor, forming a ...
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WO/2014/098038A1 |
The purpose of the present invention is to provide a hydrogen-releasing film and a hydrogen-releasing laminated film which are less susceptible to embrittling at an ambient operating temperature of an electrochemical element. This hydrog...
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WO/2014/097961A1 |
The present invention provides an Ag-In alloy sputtering target for which abnormal discharge and splashing are reduced when sputtering to form a reflector electrode film from an Ag-In alloy. This Ag-In alloy sputtering target has a compo...
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WO/2014/087216A1 |
Alloy for the manufacturing of jewels or clock components with minimum concentrations of gold of 75 wt%, of copper between 5% and 21%, of silver between 0% and 21%, of iron between 0.5% and 4% and vanadium between 0.1% and 2.0%, intended...
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WO/2014/087896A1 |
The present invention provides a Au-Sn-Bi alloy thin film which is uniform and thin while maintaining good bonding performance as a bonding layer using an Au-Sn-Bi alloy on a metalized layer on a substrate or an LED element. In the prese...
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WO/2014/088098A1 |
The present invention relates to an Ag alloy film, an Ag alloy conductive film, an Ag alloy reflective film, an Ag alloy semi-transmissive film and a sputtering target for forming an Ag alloy film. This Ag alloy film is characterized by ...
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WO/2014/084315A1 |
This thermoelectric conversion module is provided with: a p-type thermoelectric conversion member (111) and an n-type thermoelectric conversion member (112), each of which contains Sb; and an electrode member (120) which is bonded to the...
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WO/2014/080933A1 |
This electrode for use in a display device or input device has a laminate film which includes a first layer formed on the substrate side and containing an Al alloy, and a second layer formed on top of the first layer and containing an Ag...
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WO/2014/077043A1 |
The present invention relates to a silver powder comprising silver nanoparticles each having a particle diameter of the nano-meter order (1 to 100 nm), and provides a novel silver powder having an excellent low-temperature sintering prop...
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WO/2014/077410A1 |
[Problem] In a cladding composite material obtained by coating the surface of a base material with a silver-containing layer, it is difficult to make the size of fine particles containing silver constituting the structure of the silver-c...
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WO/2014/071583A1 |
Nickel containing gold alloys having low nickel releasing rate, master alloys for obtaining the said nickel containing gold alloys, and the use of In, Ga or the mixture thereof, in the nickel containing gold alloys or master alloy to red...
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WO/2014/074247A1 |
Methods of preparing silver nanowires by reducing silver cations are disclosed and claimed, where the silver cation reduction occurs in at least two stages. Such methods can exhibit improved reproducibility and reduced variability. For e...
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WO/2014/073555A1 |
This bonding wire bonds well with a Ni/Pd/Au-coated electrode (a) or an Au-coated electrode (a), has excellent thermal shock resistance, and is cheaper than gold bonding wire. This bonding wire (W) is for connection by the ball bonding m...
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WO/2014/069208A1 |
The problem of the present invention is to provide a platinum core shell catalyst that has superior durability and catalytic efficiency, and has gold core particles with an extremely small diameter (5 nm or less). The present invention i...
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WO/2014/065201A1 |
An Fe-Pt sintered compact sputtering target containing BN characterized in that the intensity ratio of the X-ray diffraction peak intensity of a hexagonal BN (002) plane in a plane level with the sputtering surface with respect to the X-...
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WO/2014/054189A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
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WO/2014/054190A1 |
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electron...
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WO/2014/054502A1 |
Provided is a target for magnetron sputtering and a manufacturing method therefor in which magnetic leakage flux during magnetron sputtering is kept high without a reduction in the Co content contained in the target, and in which the gen...
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WO/2014/038459A1 |
Provided are: a metal-carbon composite material which has good processability and high carbon content; and a method for producing the metal-carbon composite material. A metal-carbon composite material (1) comprises a continuous metal pha...
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WO/2014/029210A1 |
A preparation method for electrical contact materials comprises the steps: coating colloidal graphite or metallic oxides with a layer of nickel by chemical plating, and then coating with silver so as to form an Ag-Ni-C or Ag-Ni-MeO core-...
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