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Matches 1 - 50 out of 4,234

Document Document Title
WO/2013/073323
Provided is a target for use in magnetron sputtering. This target can increase, without reducing the content of a ferromagnetic metal element in the target, the magnetic flux leakage in magnetron sputtering to a level higher than that of...  
WO/2013/073241
The present invention addresses the problem of providing a novel, solid silver-copper alloy. Provided is a solid silver-copper alloy in which the concentration of copper contained in the silver-coppery alloy is 0.1-99.94 wt%, and which h...  
WO/2013/073695
The present invention addresses the problem of providing a novel, solid metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal ...  
WO/2013/073324
Provided is a thermistor for which the adhesion strength between a metal base material layer and a thermistor thin film and the adhesion strength between the thermistor thin film and an electrode film does not easily decrease, and for wh...  
WO/2013/068365
The invention relates to a timepiece or jewellery part manufactured in a nickel-free and cobalt-free gold alloy, the composition of which comprises, by weight, between 75% and 77.5% of gold, between 1.2% and 1.6% of palladium and between...  
WO/2013/065340
The present invention is a heat-resistant material which is formed of a highly heat-resistant high-strength Rh-based alloy that is composed of an Rh-based alloy obtained by adding Al and W, which are essential additional elements, to Rh,...  
WO/2013/057480
A silver alloy with exceptional resistance to both tarnishing and firestain comprises at least 92.50% silver, from 0.70 to 1.65% germanium, from 1.30 to 1.80% indium, from 0.000 to 0.015% boron, not more than 1.0% palladium and not more ...  
WO/2013/042572
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal materi...  
WO/2013/038188
The present invention provides methods for altering the surface composition of an alloy, which comprise the following steps: a)providing an alloy comprising at least two metals; b)exposing said alloy to an oxidising agent whereby to caus...  
WO/2013/031765
Powder for a clay-like composition for forming a sintered silver-copper alloy object, the powder being a powder component containing silver-containing powder and powder of a copper compound, wherein the powder of a copper compound contai...  
WO/2013/032309
The present invention generally relates to cutting inserts, and more particularly to a cutting insert in which only cutting edge portion of the cutting insert is made of SiC whisker reinforced ceramics and brazed to the shank with active...  
WO/2013/032665
An improved sterling silver alloy is at least 92.5 percent silver by weight. It has less copper than traditional sterlings: 3.0 percent versus the 7.5 percent. The improved alloy includes about 2.75 percent palladium, about 1.0 percent t...  
WO/2013/027444
Provided is a copper foil for a printed wiring board, which is capable of being used in the manufacture of a circuit that is suitable for fine-pitch wiring and has a cross-sectional shape with a small footing, and also provided is a lami...  
WO/2013/018238
Disclosed is a bonding wire (W), which has high bondability to an Ni/Pd/Au coated electrode (a) having high reliability at high temperatures, causes less damage to brittle chips, and has low cost. Specifically disclosed is a silver bondi...  
WO/2013/016179
A method of forming a brazed joint (40) is provided in which a surface portion (12) of a first metal part (10) is placed in contact with a surface portion (22) of a second metal part (20) to form a contact area (30) therebetween, and the...  
WO/2013/011959
Provided are: a high-temperature shape memory alloy which is produced by adding an element, such as Hf, Zr, Ta, Nb, V, Mo and W, to TiPd as a third element other than Ni to thereby improve high-temperature strength, and which exhibits hi...  
WO/2013/012398
Compositions having electrocatalytic activity and composites having electrocatalytic activity, as well as processes for making compositions and composites are described. Also process for using such compositions and/or composites, such as...  
WO/2013/005801
[Problem] The rollability of a conventional Ag-CuO alloy based electrode material for thermal fuses deteriorates remarkably with the increase of CuO content, so that in the rolling step after internal oxidation, it is difficult to work t...  
WO/2013/002407
Provided are: a brazing filler metal in which the amount of added indium is reduced while the bonding strength achieved in the prior art between a ceramic substrate and a metal sheet is maintained; and a brazing filler metal paste that u...  
WO/2012/176407
Provided are: a conductive film having low resistance and high reflectivity characteristics, and low surface roughness, and which combines high sulfidation resistance and heat resistance; a method for producing the conductive film; and a...  
WO/2012/172854
This bonding method is a bonding method that bonds two members (A, B) using an Au-Sn solder. In this bonding method, the Sn wt% concentration in the Au-Sn solder (S') after bonding is 38.0%-82.3%.  
WO/2012/170291
Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications....  
WO/2012/169067
[Problem] To obtain a combination of a desired elongation percentage and breaking strength in a bonding wire comprising a gold alloy wire. [Solution] At least one metal selected from copper (Cu), silver (Ag), palladium (Pd) and platinum ...  
WO/2012/170291
Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.  
WO/2012/169285
Provided are a fine crystallite high-performance metal alloy member, a method for manufacturing the same, and a business development using these, in which a metal alloy crystallite containing a high-purity alloy having a crystal lattice ...  
WO/2012/161148
The present invention is an active metal brazing material that is composed of an Ag-Cu-Ti-Sn alloy, which contains 20-40% by weight of Cu, 1.0-3.0% by weight of Ti and 1.2-6.0% by weight of Sn with the balance made up of Ag, and that has...  
WO/2012/161864
Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications.  
WO/2012/150558
An article made of an alloy of the general formula Pt1-a-bMa(B1-xMdx)b in which i) M stands for one or a mixture of metallic element(s) of the group Zr, Ti, Fe, Ni, Co, Cu, Pd, Ag, Al; ii) Md stands for one or a mixture of several metall...  
WO/2012/141543
The present invention provides a dental alloy containing palladium (Pd) and indium (In) for CAD/CAM machining. Specifically, the invention comprises palladium (Pd) and indium (In) as basic components and can further include one component...  
WO/2012/141543
The present invention provides a dental alloy containing palladium (Pd) and indium (In) for CAD/CAM machining. Specifically, the invention comprises palladium (Pd) and indium (In) as basic components and can further include one component...  
WO/2012/133166
A sputtering target for magnetic recording films which contains C, the sputtering target being characterized in that the ratio of the peak intensity of G-band to that of D-band as determined by Raman scattering spectrometry, IG/ID, is 5....  
WO/2012/132939
The present invention enables an FePtC-based thin film having a high carbon content to be formed from a single target without requiring the use of a plurality of targets. The invention provides an FePt-C-based sputtering target which com...  
WO/2012/133107
The present invention relates to a molten glass holding refractory in which a face of the refractory contacting the molten glass is coated with platinum or platinum alloy containing 5-20% of rhodium or iridium, and the platinum or platin...  
WO/2012/125516
Titanium sterling silver alloy compositions that exhibit enhanced tarnish resistance while maintaining an acceptable hardness. Applications and manufacturing methods thereof are disclosed.  
WO/2012/124846
The present invention relates to a method for manufacturing a platinum-rhodium alloy in which oxides are dispersed. The object of the invention is to manufacture a platinum alloy powder containing platinum, rhodium, and an alloy element ...  
WO/2012/121275
Provided are a hydrogen separation membrane having exceptional resistance to extrinsic airborne particles, and a hydrogen-separation device having this hydrogen separation membrane. A hydrogen separation membrane provided with a surface ...  
WO/2012/119977
Energy-saving lamps contain a gas filling of mercury vapour and argon in a gas discharge bulb. Amalgam balls are used for filling the gas discharge bulb with mercury. Novel coated balls whose operating life in the case of automatic meter...  
WO/2012/120292
A method of making a supported catalytic species comprising an alloy of at least two metals, comprisesthe steps of: (i)combining a particulate support material, a solution of a first metal compound, a solution of a secondmetal compound, ...  
WO/2012/117512
An ultrafine wire having a diameter of 20 µm or less for ball bonding, with which bonding can be successively conducted hundreds of thousands of times. Ca, Mg, and La are incorporated as minor additive elements in a concentration of 5-5...  
WO/2012/110421
The present invention relates to dispersion strengthened platinum-base alloys, and more particularly to a method for welding of these alloys and is based on providing an improved process for connecting oxide-dispersed precious metal shee...  
WO/2012/110421
The present invention relates to dispersion strengthened platinum-base alloys, and more particularly to a method for welding of these alloys and is based on providing an improved process for connecting oxide-dispersed precious metal shee...  
WO/2012/108082
[Problem] To improve the reliability at which a bonding wire for semiconductors that is used in high-temperature and high-humidity environments is bonded to an aluminum pad. [Solution] A ternary-alloy-based wire comprising 4-10 mass% of ...  
WO/2012/105205
Provided are: a sputtering target that is for forming a magnetic recording medium film, is able to form a film having a low ordering temperature, and can suppress the generation of particles; and a method for producing the sputtering tar...  
WO/2012/105201
Provided are: a sputtering target that is for forming a magnetic recording medium film, is able to form a film having a low ordering temperature, and can suppress generation of particles; and a method for producing the sputtering target....  
WO/2012/101568
Composite material for the making of decorative items which contains at least a polymeric component and at least a metallic powder dispersed in the polymeric component in an amount in weight between 2% and 95%. The metallic powder includ...  
WO/2012/101568
Composite material for the making of decorative items which contains at least a polymeric component and at least a metallic powder dispersed in the polymeric component in an amount in weight between 2% and 95%. The metallic powder includ...  
WO/2012/088736
The invention discloses a method for manufacturing Ag based oxide electrical contact materials with fibrous structure, and the following steps are: the first step, homogeneously mixing the Ag-metal alloying powders and graphite powders, ...  
WO/2012/090714
This metal wire rod is made of iridium or an iridium-containing alloy. The metal wire rod is biaxially oriented in the cross section and exhibits equal to or greater than 50% abundance ratio of crystal texture that has the preferred orie...  
WO/2012/088734
A method for preparing silver-based oxide electrical contact material with oriented particles involves: producing complex powder by chemical co-precipitation method combined with sintering; granulating by high-energy ball-milling and sie...  
WO/2012/088735
A method for preparing a fibrous silver-based oxide electrical contact material involves: melting Ag ingot, metal ingot and additive in a melting furnace, and atomizing to obtain powder; high-energy ball-milling; inner-oxidizing; granula...  

Matches 1 - 50 out of 4,234