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Matches 1 - 50 out of 8,649

Document Document Title
WO/2018/001564A1
A white gold alloy of the composition (Au1-a-bAga(Pd1-cPtc)b)100-x-y(Cu1-d- eLdMe)x(Si1-fGef)y has been produced in which L represents In, Ga or Sn or Ld represents L1 d1L2 d2 or L1 d1L2 d2L3 d3, wherein L1, L2 and L3 are selected from t...  
WO/2017/213207A1
A ceramic circuit board according to the present invention is provided with: a ceramic substrate; a copper circuit that is made of a copper-based material and joined to one surface of the ceramic substrate via a joint layer; and a copper...  
WO/2017/208723A1
The purpose of the present invention is to provide an electrolytic capacitor which raises no concerns regarding an outer case swelling or rupturing even in cases where a large quantity of hydrogen gas is generated, has a large capacitanc...  
WO/2017/204129A1
The present invention is a cladding material for electrical contacts, which is obtained by bonding a contact material formed of an Ag alloy to a base formed of a Cu-based precipitation age hardened material, and which is characterized in...  
WO/2017/199873A1
Provided is a metal evaporation material with which it is possible to prevent splashing without lowering the purity of the thin film. A metal evaporation material having a metal material in which a metal is the parent member and an addit...  
WO/2017/195929A1
The present invention relates to a silver alloy composition. Disclosed as embodiments of the present invention are: a silver alloy composition comprising 0.01-5.0 wt% of indium (In), 0.01-5.0 wt% of at least one or more elements of zinc ...  
WO/2017/153264A1
The present invention relates to an iridium-platinum alloy which contains platinum in an amount of 70 wt% or less,the remainder being iridium and unavoidable impurities, and has an average grain width to height ratio of at least 5.  
WO/2017/154741A1
Through the present invention, a thin film including a FePt-based alloy usable as a magnetic recording medium can be independently formed, and the quantity of particles can be further reduced. A FePt-C-based sputtering target containing ...  
WO/2017/154717A1
The present invention is an embolization coil which is composed of a wire material made from an Au-Pt alloy and has good dimensional stability, wherein the wire material that constitutes the embolization coil has such a material structur...  
WO/2017/150596A1
The present invention provides: multicomponent solid solution microparticles represented by the following formula PdxRuyMz (where M is one or more elements selected from the group consisting of Rh, Pt, Cu, Ag, Au, and Ir, x + y + z = 1, ...  
WO/2017/150580A1
The present invention provides Ru Cu solid solution nanoparticles wherein Ru and Cu form a solid solution at the atomic level.  
WO/2017/150524A1
A film which is composed of a non-magnetic material and a magnetic metal containing Fe and Pt, and which is characterized by additionally containing Mg and having a composition represented by (Fe1-αPtα)1-βMgβ (wherein α and β are n...  
WO/2017/147088A1
The present disclosure provides Au-based alloys comprising Si capable of forming metallic glass matrix composites, and metallic glass matrix composites formed thereof. The Au-based metallic glass matrix composites according to the presen...  
WO/2017/141984A1
This conductive paste exhibits excellent solder heat resistance and excellent adhesion to a substrate. This conductive paste contains (A) a silver powder, (B) a glass frit, (C) an organic binder and (E) a powder containing an oxide of a ...  
WO/2017/132725A1
Metal alloys including platinum are disclosed. The alloys have a similar variety of applications to platinum-based alloys. The alloy with a solid solution matrix consisting of: Platinum (Pt) 20 to 70 at.%; Palladium (Pd) >0 to 70 at.%; C...  
WO/2017/130781A1
The present invention pertains to a sliding contact point material which is used for a motor component, particularly, for a brush and which comprises: 20.0-50.0 mass% of Pd; 0.6-3.0 mass% of Ni and/or Co in total concentration; and Ag an...  
WO/2017/130247A1
According to the present invention, the consumption resistance and the peeling resistance of a spark plug discharge member are compatible in a high temperature environment. A spark plug electrode base material includes at least 50 wt% Ni...  
WO/2017/132504A1
Palladium-based ternary or higher alloys include palladium at about 45-55 wt%, copper about 32-42 wt%, silver at about 8-15 wt%, rhenium at about 0-5 wt%, and optionally one or more modifying elements at up to 1.0 wt%. The alloys are age...  
WO/2017/115462A1
This silver alloy powder is produced by melting silver and one kind of metal selected from the group consisting of tin, zinc, lead and indium in a nitrogen atmosphere to obtain a molten metal, and then while dropping the molten metal, ra...  
WO/2017/111700A1
The present invention relates to a Ru-Co-Cr alloy sputtering target which is used for depositing an intermediate layer of magnetic media for use in hard disk drive, wherein the sputtering target is made of a single Ru -Co-Cr alloy phase,...  
WO/2017/102858A1
Disclosed is a composite material (3) comprising a first metallic material component (5) and a second metallic material component (7) which are different from each other, the second material component (7) being mixed with the first mater...  
WO/2017/099076A1
Provided is a silver-coated graphite mixed powder that contains silver-coated graphite particles comprising graphite particles and silver which is coated onto the surfaces of the graphite particles, wherein the silver-coated graphite mix...  
WO/2017/098930A1
The purpose of the present invention is to provide a hydrogen discharge membrane which is thin and from which necessary components in an electrochemical element other than hydrogen gas do not readily leak to the outside. Another purpose ...  
WO/2017/094713A1
A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is made of nickel and is between the core an...  
WO/2017/090481A1
The present invention provides a sputtering target with which it is possible to produce a magnetic thin film having a large coercive force Hc. Provided is a sputtering target that contains metallic Co, metallic Pt, and an oxide and that ...  
WO/2017/091144A1
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface.  
WO/2017/080968A1
The invention relates to a sputter target comprising a silver alloy which contains: - 0.01 to 2 wt %, relative to the total weight of the silver alloy, of a first element selected from among indium, tin, antimony and bismuth; and - 0.01 ...  
WO/2017/073057A1
Provided are a silver powder having a small average particle size and low thermal shrinkage, and a method for producing the silver powder. The silver powder of the present invention is produced by blowing high-pressure water (preferably ...  
WO/2017/067985A1
The present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to improving the layer appearance and to increasi...  
WO/2017/058103A1
An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 0.1 to 3 wt.-%, (b) gold in an amount in the range of from 0.1 to 3 wt.-%, (c) nickel in ...  
WO/2017/058104A1
An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 3 to 6 wt.-%, (b) gold in an amount in the range of from 0.2 to 2 wt.-%, (c) nickel in an...  
WO/2017/051798A1
This light-emitting module substrate has a circuit layer to which a light-emitting element is mounted, formed on one surface of an insulation layer. A metal layer comprising Al or an Al alloy and a heat sink are laminated, in order, on t...  
WO/2017/051794A1
This light-emission module having a cooler is characterized by: having a circuit layer to which a light-emitting element is mounted, formed on one surface side of an insulation layer; a metal layer and a cooler being laminated, in order,...  
WO/2017/038465A1
The present invention relates to a silver-coated copper powder, especially to a silver-coated copper powder having a dendrite shape, and provides a novel silver-coated copper powder which is able to have enhanced conductivity without bei...  
WO/2017/026509A1
The present invention is an electrode material used as an electrode contact for a vacuum interrupter, the electrode material containing heat-resistant elements at a weight ratio of 1 or more with respect to Cr 1, the remainder being Cu a...  
WO/2017/021818A2
The present invention relates to a sterling silver alloy, copper -free in its basic embodiment, age-hardenable, with improved resistance to tarnishing, thanks to the presence of palladium in combination with zinc and indium, this alloy b...  
WO/2017/021818A3
The present invention relates to a sterling silver alloy, copper -free in its basic embodiment, age-hardenable, with improved resistance to tarnishing, thanks to the presence of palladium in combination with zinc and indium, this alloy b...  
WO/2017/022799A1
The present invention provides a method for homogenizing a Ru-containing Cu alloy, the method being capable of improving the solubility of Ru in the Ru-containing Cu alloy and accurately measuring the noble metal content in the Cu alloy....  
WO/2017/018310A1
This Ag alloy film contains: 0.1 to 5.0 at% of Ti; at least one element selected from Cu, Sn, Mg, In, Sb, Al, Zn, Ge, and Ga in a total amount of at least 0.1 at% such that the combined total amount with the Ti is within a range that is ...  
WO/2017/011150A1
The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, in...  
WO/2017/002851A1
The purpose of the present invention is to provide a sintered alloy having high mechanical strength (particularly high toughness suitable for a sputtering target material) and a sputtering target material which includes the sintered allo...  
WO/2016/208552A1
The present invention is a platinum alloy sputtering target which is constituted of a Pt-Hf alloy, the Pt-Hf alloy having an Hf content of 10-90 mass%. In the present invention, electrical properties were improved by adding Hf from the s...  
WO/2016/208091A1
Because high quality alloys are preferred in jewelry items made of a Pt alloy, alloys containing 95 mass% of Pt (Pt950) are required, but Pt950 alloys exhibit low hardness, and therefore suffer from problems such as being easily damaged ...  
WO/2016/208517A1
The purpose of the present invention is to provide a method for manufacturing a molded material that can form metallic glass material in a state of lower viscosity, and can manufacture a small structure of several 10 µm or less in a com...  
WO/2016/194451A1
Provided is an Au-based soldering alloy which has high bonding reliability even when having a lower Au content than conventional ones. The present invention is an Au-based soldering ball which is to be used for sealing or bonding ceramic...  
WO/2016/195032A1
Provided are: a metal microparticle aggregate in which selectivity of absorbed wavelengths of light is controlled, the metal microparticle aggregate having characteristics adequate for an insolation-shielding material for shielding a wid...  
WO/2016/180359A1
A strong-permanent-magnetic nano-porous Fe-Pt alloy and a method for preparing same. The composition of the alloy is FewCoxPtyPdz. During preparation, electric-arc smelting or induction smelting is used to prepare a master alloy ingot; s...  
WO/2016/170906A1
The present invention provides a high-temperature Pb-free Au-Sn-Ag based solder paste that is superior in oxidation resistance and wettability, has a suitable melting point as a solder alloy for high temperature, is very low cost since t...  
WO/2016/155879A2
The invention relates to a noble metal alloy containing palladium and rhodium, in particular for making pieces of jewelry such as necklaces, bracelets, rings, gems, ornaments and the like, watches and watch cases and/or writing instrumen...  
WO/2016/159315A1
This alloy material has a composition of 20-30wt% of silver (Ag), 35-55 wt% vanadium (Pd), and 20-40wt% copper (Cu) in a compositional range for a ternary alloy of Ag, Pd, and Cu, uses said composition as a base, and has added to said ba...  

Matches 1 - 50 out of 8,649