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WO/2021/143257A1 |
The present invention relates to a titanium bronze alloy material, comprising the following components in percentage by mass: 5-7% of titanium, 0.8-1.5% of aluminum, 0.1-0.3% of silver, 0.2-0.4% of iron, 0.03-0.08% of rare earth, and the...
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WO/2021/145043A1 |
Provided is a copper alloy plate in which: the alloy composition contains 0.10-0.80 mass% of Cr, and the remainder is Cu and inevitable impurities; the tensile strength is 350-800 MPa; the conductivity is 55-90% IACS; the average crystal...
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WO/2021/145148A1 |
A copper sheet material according to an embodiment has a composition comprising 99.96% by mass or more of Cu and unavoidable impurities, and has such a property that the area percentage of crystal grains each having a GAM value, which is...
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WO/2021/145294A1 |
Provided is a connection terminal comprising a base material of a copper alloy that contains, in mass percentages, 21% ≤ Zn ≤ 27%, 0.6% ≤ Sn ≤ 0.9%, 2.5% ≤ Ni ≤ 3.7%, and 0.01% ≤ P ≤ 0.03%,...
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WO/2021/140915A1 |
Provided is a copper alloy sheet material which exhibits etching properties that are advantageous for achieving high dimensional accuracy even when etching is carried out with an extremely narrow pitch, has a chemical composition that co...
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WO/2021/139245A1 |
A method for preparing a high Te content CuCr contact, mainly comprising the following steps: S1, preparing and selecting CuCr(25-50) alloy blocks, Cu blocks and CuTe(10-50) alloy blocks for use; S2, loading matched CuCr(25-50) alloy blo...
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WO/2021/134210A1 |
A preparation method for an oil-free bearing material, comprising: preparing copper Cu, tin Sn, zinc Zn, lead Pb, phosphorus P, nickel Ni, aluminum Al, iron Fe, manganese Mn, silicon Si, antimony Sb, and sulfur S; and according to the pe...
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WO/2021/129802A1 |
A high-strength and high-toughness copper-zinc-aluminum shape memory alloy and a preparation method therefor. According to the preparation method, grains of an alloy are further refined by performing smelting and cryogenic treatment twic...
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WO/2021/128969A1 |
Disclosed is a titanium bronze alloy strip material containing Ce and B, characterized in that: the weight percentage composition of said titanium bronze alloy strip material comprises 2.50 wt% to 4.00 wt% Ti, 0.003 wt% to 0.2 wt% Ce, an...
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WO/2021/121863A1 |
The invention relates to a device (1) consisting of at least one first (2) and one second (3) component, wherein the first (2) and the second component (3) are components of a field device for processing and automation technology, which ...
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WO/2021/117528A1 |
A free-cutting copper alloy comprising more than 59.7% but less than 64.7% of Cu, more than 0.60% but less than 1.30% of Si, more than 0.001% but less than 0.20% of Pb, more than 0.001% but less than 0.10% of Bi, and more than 0.001% but...
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WO/2021/117698A1 |
Provided is a copper alloy sheet in which surface discoloration or an increase in contact electric resistance is suppressed, and the copper alloy sheet has excellent plating film adhesion, by a configuration in which the center Mg concen...
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WO/2021/111908A1 |
Provided is copper bonding wire that has improved storage lifespan in the atmosphere. Specifically, semiconductor device copper bonding wire, in which the crystal grain boundary density at the surface is 0.6 (µm/µm2) or more and 1.6 (Â...
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WO/2021/107096A1 |
This copper alloy has a compositional makeup in which the contained amount of Mg is in the range of 70-400 mass ppm, the contained amount of Ag is in the range of 5-20 mass ppm, and the remaining portion is Cu and unavoidable impurities....
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WO/2021/107102A1 |
This copper alloy has a composition containing an Mg content in the range of 70-400 mass ppm, inclusive, and an Ag content in the range of 5-20 mass ppm, inclusive, with the remainder thereof constituting Cu and inevitable impurities, wh...
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WO/2021/106007A1 |
The invention discloses a process for manufacturing of copper-titanium alloy by a lost wax process. This process comprises the steps: fixing a crucible (12) in an induction melting furnace (10); preheating said crucible (12) followed by ...
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WO/2021/107093A1 |
This copper alloy is composed of: Mg at a content within a range of 70 to 400 mass ppm; Ag at a content within a range of 5 to 20 mass ppm; and Cu and inevitable impurities as the balance. The P content is less than 3.0 mass ppm, the ave...
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WO/2021/098381A1 |
A method for preparing a copper-iron alloy material that has an electromagnetic shielding performance, comprising smelting: weighing a CuFe master alloy and an electrolytic copper plate according to mass percentage, and smelting in an in...
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WO/2021/100595A1 |
This copper powder is configured such that the average particle diameter D50 is 100-500 nm, the sintering start temperature is 450°C or higher, and the peak degassing temperature is 150-300°C. The copper powder may be configured such t...
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WO/2021/101046A1 |
The objective of the present invention is to provide a copper alloy material having excellent abrasion resistance and electrical conductivity, and a method for manufacturing same. The abrasion-resistant copper alloy material is character...
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WO/2021/083385A1 |
A preparation method for a copper or copper alloy material, and a refining agent for refining. The refining agent for refining the copper or copper alloy material is an alloy composed of a Cu element, an Re element, and an M element. The...
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WO/2021/077241A1 |
Disclosed is a copper alloy with an excellent anti-bending performance. The copper alloy, in percentage by weight, comprises: 0.51-2.00 wt% of Ni, 0.10-0.35 wt% of P, and the balance being Cu and inevitable impurities, wherein the weight...
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WO/2021/075447A1 |
The present invention addresses the problem of improving wear resistance and seizure resistance in a copper-alloy sliding material. Provided is a copper-alloy sliding material containing 0.5-12.0 mass% of Sn, 2.0-8.0 mass% of Bi, and 1.0...
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WO/2021/069320A1 |
The invention relates to a method for producing a metal-ceramic substrate (1), having the steps of: - providing at least one ceramic layer (10), at least one metal layer (20), and at least one solder layer (30), in particular in the form...
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WO/2021/065866A1 |
This terminal material has: a substrate in which at least the surface thereof is made of Cu or a Cu alloy; a Ni layer provided on the substrate and having a thickness of 0.1-1.0 µm; an Cu-Sn intermetallic compound layer provided on the ...
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WO/2021/062485A1 |
An alloy comprising or consisting of 40 to 62.5 atomic percent copper, 5 to 40 atomic percent manganese, up to 24 atomic percent nickel, 5 to 24 atomic percent zinc, and 1 to 15 atomic percent aluminium.
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WO/2021/060023A1 |
In this pure copper plate: the contained amount of Cu is 99.96 mass% or more; it holds true that 1×10-8 ≤ X-3Y-1 ≤ 1×10-5, where X μm is the average crystal grain size of crystal grains in a rolled surface, and Y massppm is the co...
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WO/2021/060103A1 |
A heat exchanger (1) is provided with a first metal tube (20), second metal tubes (30), and metal joint portions (J) which are formed through solidification of a melted joining material and which join the first metal tube (20) and the se...
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WO/2021/060013A1 |
This copper alloy for electronic/electrical devices contains from 100 mass ppm to 400 mass ppm of Mg, from 5 mass ppm to 20 mass ppm of Ag and less than 5 mass ppm of P, with the balance being made up of Cu and unavoidable impurities; an...
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WO/2021/045131A1 |
According to the present invention, a solder bonded body that has more excellent heat resistance, thermal conductivity and reliability than ever before is able to be formed by a solder paste which contains a lead-free solder alloy powder...
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WO/2021/032542A1 |
What is disclosed is a hub bearing (1r, 1a) for bearing a hub (2) on a shaft in an oil-flooded clutch, comprising a cylindrically formed subregion (1r) for taking up radial forces (Fr), and a disc-shaped subregion (1a) for taking up axia...
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WO/2021/027486A1 |
The present invention provides a bearing bush anti-friction layer copper alloy filling device and a method for preparing a bearing bush bimetal composite material, wherein same belong to the technical field of metal alloy materials. The ...
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WO/2021/022965A1 |
The present invention provides an apparatus and method for high-throughput preparation of a multi-component uniform film material, and relates to the technical field of film preparation. According to the apparatus and method, uniform fil...
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WO/2021/025071A1 |
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, ...
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WO/2021/024529A1 |
The present invention addresses the issue of providing: a precursor for an Nb3Sn superconductive wire material that is used in the internal tin process, promotes generation of Nb3Sn, and has a high critical current density; a production ...
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WO/2021/020309A1 |
This preform solder contains a lead-free solder containing Sn as a main component, and metal particles having a melting point higher than that of the lead-free solder, wherein the metal particles are formed of a Cu-Ni alloy having a Ni c...
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WO/2021/018203A1 |
A copper-iron alloy slab non-vacuum down-drawing continuous casting production process, the main steps comprising: ingredient provision, furnace loading, smelting, refining and degassing, pouring, casting, and ingot cooling, electrolytic...
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WO/2021/020683A1 |
The present invention relates to: a method for producing a copper alloy sheet comprising 0.5-1.5 wt% of nickel (Ni), 0.3-1.5 wt% of cobalt (Co), 0.35-0.8 wt% of silicon (Si), and 0.05-0.5 wt% of chromium (Cr), with the balance being Cu a...
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WO/2021/015119A1 |
Provided is a Cu-based alloy powder that is suitable for processes accompanied by rapid melting and rapid solidification and that can provide a molded article having excellent characteristics. The powder is constituted of a Cu-based allo...
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WO/2021/005923A1 |
This copper alloy trolley wire is characterized by having: a composition comprising 0.15 to 0.50 mass% of Mg and 0.25 to 1.0 mass% of Cr, with the balance composed of Cu and inevitable impurities; a tensile strength of 600 MPa or greater...
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WO/2021/002364A1 |
Provided is a beryllium copper alloy bonded body having high bonding reliability and not including defects caused by diffusion bonding via a nickel layer and subsequent heat treatment (in particular, Kirkendall bonds or cracks caused by ...
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WO/2020/261603A1 |
This free-cutting copper alloy includes more than 61.0% and less than 65.0% Cu, more than 1.0% and less than 1.5% Si, 0.003% to less than 0.20% Pb, and more than 0.003% and less than 0.19% P, the remainder comprising Zn and unavoidable i...
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WO/2020/261604A1 |
This free-cutting copper alloy contains Cu in the amount of 58.5-63.5%, Si in an amount greater than 0.4% and no greater than 1.0%, Pb in the amount of 0.003-0.25% and P in the amount of 0.005-0.19%, with Zn and inevitable impurities con...
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WO/2020/261636A1 |
This copper allow casting comprises, 58.5-65.0 mass% (exclusive of 58.5 and 65.0) of Cu, 0.40-1.40 mass% (exclusive of 0.40 and 1.40) of Si, 0.002-0.25 mass% (exclusive of 0.002 and 0.25) of Pb, 0.003-0.19 mass% of P (exclusive of 0.003 ...
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WO/2020/261611A1 |
This free-cutting copper alloy comprises Cu: 58.0%-65.0% exclusive, Si: 0.30%-1.30% exclusive, Pb: greater than 0.001% and less than or equal to 0.20%, Bi: greater than 0.020% and less than or equal to 0.10% and P: 0.001%-0.20% exclusive...
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WO/2020/261666A1 |
This free-cutting copper alloy contains more than 57.5% but less than 64.5% of Cu, more than 0.20% but less than 1.20% of Si, more than 0.001% but less than 0.20% of Pb, more than 0.10% but less than 1.00% of Bi and more than 0.001% but ...
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WO/2020/255836A1 |
There is provided a copper composite plate material in which: one surface of a first copper layer is pressure-welded to a second copper layer; the first copper layer is configured from a precipitation-strengthened copper alloy; and the s...
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WO/2020/246094A1 |
This palladium-coated copper bonding wire includes a core material composed mainly of copper and a palladium layer on the core material, wherein: the concentration of palladium with respect to the entire wire is 1.0-4.0 mass%; and the wo...
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WO/2020/244865A1 |
The invention relates to an electrical contact element for a connector comprising a metallic base body (111, 211) and a wear layer (113, 213) which is applied to the base body (111, 211). The wear layer (113, 213) is made from pure ruthe...
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WO/2020/244866A1 |
The invention relates to an electric contact element for a connector comprising a metallic base body (111, 211) and a wear layer (113, 213) that is applied to the base body (111, 211). The wear layer (113, 213) is made from an alloy havi...
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