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WO/2020/014582A1 |
A copper alloy that does not contain beryllium and has a 0.2% offset yield strength of at least 80 ksi and an electrical conductivity of at least 48% IACS is disclosed. The copper alloy contains nickel, silicon, chromium, manganese, zirc...
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WO/2020/008763A1 |
This motor is provided with a substantially cylindrical commutator and a carbon brush that makes contact with the outer circumferential surface of the commutator. The commutator has a contact member formed from a copper alloy including c...
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WO/2020/006205A1 |
Disclosed herein are embodiments of copper-based alloys. The alloys can comprise hard phases of silicides and can be free or substantially free of Co, Mn, Mo, Ta, V, and W. The copper-based alloys can be used as feedstock for PTA and las...
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WO/2020/004034A1 |
The present invention provides a copper alloy sheet having excellent press workability, a copper alloy sheet manufacturing method, and a connector that uses a copper alloy sheet. In a copper alloy sheet 1, a cross-section 10, which inc...
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WO/2019/244842A1 |
The purpose of the present invention is to provide: a copper alloy sheet material having both of a small resistance temperature coefficient and good press-moldability; a method for producing the copper alloy sheet material; and a resisto...
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WO/2019/244840A1 |
[Problem] To provide an electrode which can be produced inexpensively without using platinum group elements, has catalytic activity (catalytic action), and can be used as an anode or a cathode. [Solution] The present invention provides a...
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WO/2019/237215A1 |
The present invention relates to a copper alloy and use thereof. Said copper alloy contains: 5% wt – 15 wt% Zn, 0.2 wt% - 2.5 wt% Sn, 0.1 wt% - 2.0 wt% Ni, 0.01 wt% - 0.3 wt % P, 0 - 0.3 wt% Mg and 0-0.5 wt% Fe, and the balance being C...
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WO/2019/230018A1 |
Provided is a Cu-based alloy powder which is suitable for a process involving rapid melting and rapid solidification and can be shaped into an article having excellent properties. The powder is made from a Cu-based alloy. The Cu-based al...
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WO/2019/225589A1 |
The purpose of the present invention is to provide: a copper-based powder, a surface-coated copper-based powder and a mixed powder thereof, each of which enables the formation of a powder layer by lining the powder at a small void ratio ...
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WO/2019/213789A1 |
Disclosed is a copper alloy material, the composition thereof comprising, in percentages by weight: 5.01-15.0 wt% of Zn, 0.1-3.0 wt% of Ni, 0.1-2.0 wt% of Sn, 0.01-0.5 wt% of Si, 0.01-0.25 wt% of P, 0-0.2 wt% of Mg, 0-0.3 wt% of Fe, and ...
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WO/2019/203258A1 |
A Cu-Ni alloy sputtering target including Ni, the remainder comprising Cu and unavoidable impurities, wherein the twinning ratio defined by the expression LT/L × 100 is in the range of 35% to 65%, where L is the total grain boundary len...
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WO/2019/201469A1 |
The invention relates to a copper alloy having the following composition (in % by weight) Zn: 17 to 20.5%, Ni : 17 to 23%, Mn: 8 to 11.5%, optionally up to 4% Cr, optionally up to 5.5% Fe, optionally up to 0.5% Ti, optionally up to 0.15%...
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WO/2019/197941A2 |
The invention relates to an alloy for silverware, jewelry, timepieces or similar products, consisting of a mixture of 50 to 90 wt.% copper, 0.1 to 25 wt.% silver, 0.1 to 40 wt.% gold, and optionally a total of 0.1 to 20 wt.% of one or mo...
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WO/2019/198042A1 |
The invention refers to an alloy, in particular for jewellery, characterized in that it comprises: Gold in the amount comprised between 330 ‰ and 420 ‰ in weight; Copper in the amount comprised between 500 ‰ and 620 ‰ in weight; ...
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WO/2019/198369A1 |
[Problem] To provide a sliding member which is provided with an overlay that enables the achievement of good fatigue resistance, while preventing ply separation. [Solution] A sliding member which is provided with an overlay that is forme...
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WO/2019/198328A1 |
The present invention uses a mounting structure which comprises: a semiconductor element that has an element electrode; a metal member; and a sintered body which bonds the semiconductor element and the metal member with each other. This ...
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WO/2019/194275A1 |
A Cu-Ga alloy sputtering target comprising Cu, Ga, and unavoidable impurities, characterized having a single-phase structure comprising any one of a γ1 phase, a γ2 phase, and a γ3 phase, the theoretical density ratio thereof being 96%...
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WO/2019/187768A1 |
The purpose of the present invention is to provide a clad material including refined grains in a copper sheet and having an excellent elongation, a reduced elongation anisotropy, and an excellent workability, and to provide a method for ...
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WO/2019/189558A1 |
This copper alloy for electronic/electric devices contains, by mass%, greater than or equal to 0.15% and less than 0.35% of Mg and greater than or equal to 0.0005% and less than 0.01% of P, the remainder consisting of Cu and unavoidable ...
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WO/2019/189534A1 |
This copper alloy for electronic/electric devices contains greater than or equal to 0.15 mass% and less than 0.35 mass% of Mg and greater than or equal to 0.0005 mass% and less than 0.01 mass% of P, the remainder consisting of Cu and una...
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WO/2019/191282A1 |
The present disclosure relates to powders and wires made from a copper-containing alloy. The copper-containing alloy is a copper-nickel-tin alloy or a copper-nickel-silicon-chromium alloy. Articles formed from the metal powder exhibit hi...
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WO/2019/187767A1 |
The present invention relates to an insulating substrate in which a ceramic substrate, a first copper plate material formed on one surface of the ceramic substrate, and a second copper plate material formed on the other surface of the ce...
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WO/2019/181649A1 |
[Problem] To provide an electrical contact powder, electrical contact material, electrical contact, and method for producing an electrical contact powder which make it possible to balance a reduction in cost with the retention of electri...
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WO/2019/181320A1 |
The purpose of the present invention is to provide a copper alloy wire rod having excellent tensile strength even with a reduced diameter, without compromising the excellent conductivity thereof, and a method for producing the copper all...
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WO/2019/176838A1 |
This copper alloy sheet has an alloy composition that contains 0-4.5% by mass of Ni, 0-2.0% by mass of Co, 0.2-1.3% by mass of Si, 0-0.5% by mass of Mg, 0-0.5% by mass of Cr, 0-0.25% by mass of Sn, 0-0.6% by mass of Zn, 0-0.15% by mass o...
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WO/2019/177147A1 |
Provided is a thermoelectric conversion element comprising: an element body (11) that comprises a thermoelectric conversion material that is silicide compounds; and electrodes (15) respectively formed on one surface of the element body (...
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WO/2019/177215A1 |
The present invention relates to a method for manufacturing a copper-titanium (Cu-Ti)-based copper alloy, and provides a method for manufacturing a copper alloy, requiring high performance, for automobiles and electrical and electronic c...
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WO/2019/171951A1 |
Provided are an inexpensive copper alloy sheet having excellent bendability as well as excellent stress corrosion cracking resistance and stress relaxation resistance characteristics while maintaining high strength, and a method for manu...
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WO/2019/173849A1 |
The successful fabrication of alloy foam (or porous alloy) is very rare, despite their potentially better properties and wider applicability than pure metallic foams. The processing of three-dimensional copper-nickel alloy foams is achie...
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WO/2019/167454A1 |
A joint structural body (1) has a first metal base material (11) which is configured from first metal, a second metal base material (12) which is configured from second metal, and a weld metal section (13) which connects the first metal ...
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WO/2019/168166A1 |
This copper alloy powder having excellent laser absorptivity contains one or both of B and S in the amount of 0.003% by mass to 5.0% by mass, the remainder comprising unavoidable impurities and Cu, the average particle diameter of the co...
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WO/2019/167564A1 |
A Cu-Ni alloy sputtering target containing Ni, with the remainder comprising Cu and unavoidable impurities, said target characterized in that Ni oxide phases are present at grain boundaries in a matrix phase comprising a solid solution o...
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WO/2019/163937A1 |
Provided are: a sintered valve guide which has high strength and exhibits excellent wear resistance and machinability; and a method for producing this sintered valve guide. A sintered valve guide according to the present invention has a ...
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WO/2019/159404A1 |
[Problem] To provide infiltration Cu-based powder to be an infiltrant for Fe-based substrates, wherein: the infiltrant comprising the Cu-based powder has a high infiltration rate and allows a Fe-based substrate to have a high density, th...
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WO/2019/155655A1 |
An electrical contact (10, 11) comprising a base material (31), high-melting-point substance particles (32), and an intermetallic compound (33), wherein: the intermetallic compound, which contains a MnX compound (X represents Te or Se) a...
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WO/2019/148304A1 |
A precipitation strengthened copper alloy, comprising, in percentage by weight: Cu: 80 wt% to 95 wt%, Sn: 0.05 wt% to 4.0 wt%, Ni: 0.01 wt% to 3.0 wt%, Si: 0.01 wt% to 1.0 wt%, and the balance of Zn and inevitable impurities. By means of...
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WO/2019/144173A1 |
The invention relates to a multi-layer sliding bearing element (1) having a sliding layer (9) formed from a copper-based alloy containing sulfidic precipitations (10). The copper-based alloy contains, in addition to copper: between 0.1 w...
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WO/2019/146587A1 |
Provided is a joining layer (13) that is included in a semiconductor module (10), that is interposed between an electronic component (14) and a substrate (15), and that comprises a CuSn intermetallic compound. This joining layer (13) is ...
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WO/2019/141916A1 |
The invention relates to an electrode for welding sheets of steel or aluminium, with a conductivity greater than or equal to 90% IACS and made of an alloy consisting, by weight based on the total weight of the alloy, of chromium in a pro...
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WO/2019/139785A1 |
A power cable may include a first plurality of copper alloy wires having a first percentage of strengthening alloying material and a second plurality of copper alloy wires having a second percentage of strengthening alloying material. On...
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WO/2019/138971A1 |
This insulated wire (10) comprises: a copper alloy conductor (1); and at least one resin layer (4) coated directly or indirectly on the outer circumferential surface of the copper alloy conductor (1). The copper alloy conductor (1) has a...
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WO/2019/137832A1 |
The invention relates to a copper-zinc alloy for producing electrically conductive components, for example contacts, consisting of: – Cu: 62.5 - 67% by weight, – Sn: 0.25 - 1.0% by weight, – Si: 0.015 - 0.15% by weight, – at leas...
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WO/2019/134541A1 |
The present invention relates to a copper-based microcrystalline alloy, a preparation method thereof, and an electronic product. The copper-based microcrystalline alloy comprises, in weight percent, 30-60% of Cu, 25-40% of Mn, 4-6% of Al...
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WO/2019/124837A1 |
The present invention relates to a copper alloy used as a material for industrial devices, electronic device parts, automobile parts, and thermal management device parts, and a method of manufacturing the same, and the objective of the p...
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WO/2019/124430A1 |
A Cu-Ga alloy sputtering target according to the present invention has a composition which contains Ga, as a metal component, in an amount of from 20% by atom to 45% by atom (inclusive), and which additionally contains K and Na in a tota...
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WO/2019/124351A1 |
This Cu-Ga alloy sputtering target has a composition containing Ga in an amount of 20-40 atomic% as a metal component, and further containing Na and K in a total amount of 0.05-1.0 atomic%, the balance comprising Cu and unavoidable impur...
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WO/2019/117041A1 |
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...
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WO/2019/116946A1 |
Provided are a cladding and a method for producing the same with which it is possible to prevent cracking and peeling from occurring even in the case of punching out (application of shear that is greater than thermal shock) due to press-...
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WO/2019/111898A1 |
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...
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WO/2019/107721A1 |
The present invention relates to a method for producing a copper-titanium (Cu-Ti)-based copper alloy material, and a copper alloy material produced thereby, wherein a copper alloy material for vehicles and electronic components requiring...
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