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Matches 1 - 50 out of 17,221

Document Document Title
WO/2020/187758A1
The invention relates to the use of a Cu-Zn alloy of the following composition (stated as wt.%): Cu: 80 - 85, Si: 2.0 - 6.0, Al: 0.55 - 2.0, Fe: maximum 0.8, Ni: maximum 0.5, Sn: maximum 0.5, Mn: maximum 0.1, Pb: maximum 0.3, remainder Z...  
WO/2020/182846A1
The invention relates to a method for producing metal components, consisting at least partially of a copper alloy, comprising the following alloy components in wt.%: 0 wt.% < Sn ≤ 8 wt.%; 0 wt.% < Zn ≤ 6 wt.%; 0.1 wt.% ≤ S ≤ 0.7 ...  
WO/2020/182845A1
The invention relates to a method for producing components for media-guiding gas or water lines, in particular pipe or plumbing fittings for drinking water lines, consisting at least partially of a copper alloy, comprising the following ...  
WO/2020/184773A1
The present invention pertains to a heat-dissipating plate which can be bonded with elements formed of ceramic material during the packaging of high-power electronic devices or optical devices that generate large amounts of heat, and can...  
WO/2020/179515A1
The purpose is to provide a rolled copper foil for secondary battery negative electrode current collectors, whereby it becomes possible to satisfactorily prevent the plastic deformation and breakage of a copper foil which may be caused b...  
WO/2020/174880A1
A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode mat...  
WO/2020/170956A1
The present invention provides a composition characterized by containing 0.3-0.7 mass% of Cr, 0.025-0.15 mass% of Zr, 0.005-0.04 mass% of Sn, 0.005-0.03 mass% of P, and the remainder comprising Cu and inevitable impurities, wherein Vicke...  
WO/2020/162526A1
Provided are: a palladium-coated copper bonding wire which does not undergo the formation of shrinkage cavities during a first bonding procedure, has high bonding reliability, and can keep excellent bonding reliability steadily for a lon...  
WO/2020/162445A1
According to the present invention, a copper member has a composition in which the Cu purity is 99.96 mass% or more, the balance is inevitable impurities, the contained amount of P is 2 mass ppm or less, and the total contained amount of...  
WO/2020/155322A1
A nano dispersion copper alloy having high airtightness and low free oxygen content, and a short-process preparation technology. The compositions of the alloy comprise Al2O3, Ca, and La. The preparation technology for the alloy comprises...  
WO/2020/158684A1
A Cu-Al-Mn-based shape-memory alloy molded article according to the present invention has a screw part, wherein the screw part is a thread-rolled part. A method for producing a Cu-Al-Mn-based shape-memory alloy molded article according t...  
WO/2020/153834A1
The invention relates to a copper-zinc alloy with low lead content that is useful in the production of wire used for manufacturing cages for aquaculture, wherein said wire suffers the least possible damage due to zinc loss during the exp...  
WO/2020/151349A1
A lead-free dezincification-resistant copper alloy material and a valve core assembly made of same, comprising in parts by mass: 59-64 parts Cu, 36-40 parts Zn, 0.2-0.4 parts Bi and 0.05-0.2 parts As, and also comprising Pb, wherein ther...  
WO/2020/152967A1
A copper alloy plate material according to the present invention has an alloy composition comprising 0.3 to 2.5% by mass of Co, 0.1 to 0.7% by mass of Si and a remainder made up by Cu and unavoidable impurities. When a longitudinal secti...  
WO/2020/148685A1
A metal composite container 100 for storing liquid is provided herein. The container includes an outer casing 102 made from either plastic or metal or in combination to define shape of a bottle, a flask 104 placed inside the outer casing...  
WO/2020/149404A1
Provided is a negative electrode active material that has excellent capacity, has an excellent capacity retention ratio, and has excellent coulomb efficiency when repeatedly charged/discharged. The chemical composition of alloy particles...  
WO/2020/145397A1
A copper alloy material is characterized by having a composition comprising 0.15 to 0.50 mass% inclusive of Mg, 0.20 to 0.90 mass% inclusive of Cr and a remainder made up by Cu and unavoidable impurities, and also characterized by having...  
WO/2020/144913A1
A sputtering target material contains one or more elements selected from Ag, As, Pb, Sb, Bi, Cd, Sn, Ni and Fe in a total amount of 5 to 50 massppm inclusive, with the remainder made up by Cu and unavoidable impurities, wherein, when the...  
WO/2020/144322A1
The invention relates to a test needle for measurement of electrical contact connection and to a bonding wire for electrical contact connection of a chip, wherein the test needle or bonding wire has been manufactured from a foil for prod...  
WO/2020/095255A3
An electrical discharge welding apparatus (90) for welding metal products, comprising at least one gripping member (30), said at least one gripping member (30) comprising at least one pad (10), the pad (10) being adapted to come into con...  
WO/2020/135582A1
Disclosed is an aerogel-reinforced metal matrix composite material, a preparation method and an application thereof. The preparation method of the composite material comprises obtaining an aerogel; obtaining a metal as a material matrix;...  
WO/2020/136772A1
The invention of the present application addresses the problem of providing: a bronze alloy for casting use, which has a lead-free composition and is imparted with high seize resistance and adhesive wear resistance enough to withstand fl...  
WO/2020/136935A1
The invention of the present application addresses the problem of providing: a bronze alloy which has a lead-free composition and is imparted with high seize resistance and adhesive wear resistance enough to withstand fluctuating high-sp...  
WO/2020/137726A1
A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoid...  
WO/2020/133680A1
A method for preparing a nickel-aluminum-bronze alloy, comprising: mixing Cu, Al, Ni, Fe and Mn powders according to a ratio, melting, forging and thermally treating the powders to obtain a bar, treating the bar by using plasma electrode...  
WO/2019/141916A8
The invention relates to an electrode for welding sheets of steel or aluminium, with a conductivity greater than or equal to 90% IACS and made of an alloy consisting, by weight based on the total weight of the alloy, of chromium in a pro...  
WO/2020/130403A1
The present invention relates to a copper alloy, for a terminal and a connector, exhibiting excellent bending processability, strength and spring threshold, and a preparation method thereof. Particularly, the present invention relates to...  
WO/2020/131360A1
The International Bureau acknowledges receipt of Article 19 amendments received on 12 November 2019 (12.11.2019). Although the applicant appears to have indicated the basis of the amendment in the application as filed in the cover letter...  
WO/2020/130039A1
This semiconductor device joining member 10 is used to join a to-be-joined surface of a semiconductor device 11 and a to-be-joined surface of a substrate 12 on which said semiconductor device 11 is to be placed, includes a layer comprisi...  
WO/2020/129156A1
A lead-free cutting phosphor bronze bar or wire rod material comprises 1.5 to 7.0% by mass of Sn, 0.5 to 7.0% by mass of Ni, 0.02 to 0.6% by mass of S and 0.01 to 0.35% by mass of P, with the remainder made up by Cu and unavoidable impur...  
WO/2020/128953A1
Disclosed is an electrode wire (1) for electroerosion machining, the electrode wire (1) comprising a metal core (2), made of one or more layers of metal or metal alloy, on the metal core (2), a coating (3) having an alloy different to th...  
WO/2020/130247A1
The present invention relates to a high-strength free-cutting lead-free copper alloy having excellent machinability and corrosion resistance and, to a free-cutting lead-free copper alloy which does not contain lead and which comprises 58...  
WO/2020/059856A9
The purpose of the present invention is to provide a Cu alloy bonding wire for a semiconductor device, the bonding wire being capable of satisfying the required performance of high-density LSI applications. A Cu alloy bonding wire for a ...  
WO/2020/118744A1
A rare earth-copper alloy lightweight glass mold and a preparation method therefor, relating to the field of glass mold materials. The method comprises: putting weighed nickel, silicon, chromium, 50% of copper, and rare earth into a smel...  
WO/2020/122620A1
Disclosed is a method for manufacturing an electrode tip for spot welding, the method comprising: an arrangement step for arranging the tip of a rod-shaped copper alloy material and the tip of a rod-shaped tungsten alloy material so as t...  
WO/2020/121775A1
A copper alloy sheet according to the present invention has a composition containing 1.0-5.0 mass% in total of at least one among Ni and Co, and 0.1-1.5 mass% of Si, with the remainder comprising Cu and inevitable impurities, and has a c...  
WO/2020/122230A1
This pure copper sheet is characterized in that the purity of Cu exclusive of S is 99.96 mass% or more, the balance being unavoidable impurities, and that S is included in the range of 20-1000 mass ppm. It is preferred that the total con...  
WO/2020/122112A1
This pure copper plate has a Cu purity of 99.96 mass% or greater, the remainder being unavoidable impurities, and has a P content of 2 mass ppm or less, and a total content of Pb, Se, and Te of 10 mass ppm or less. The S content in the p...  
WO/2020/116631A1
This method for producing a positive electrode active material for a lithium secondary battery is characterized by including a calcination step for performing calcination, using a calcination means, on a mixture of a composite metal comp...  
WO/2020/113352A1
A high-performance copper alloy and a preparation method therefor. The weight percentage composition of the copper alloy is: Sn: 0.05 wt% to 3.0 wt%, Ni: 0.01 wt% to 2.5 wt%, Si: 0.01 wt% to 0.6 wt%, and Zn: 5 wt% to 15 wt%, the weight p...  
WO/2020/116464A1
Provided is a corrosion-resistant CuZn alloy, in which: the Zn content is 36.8 to 56.5 mass% and the balance is Cu and inevitable impurities; and the β-phase surface area percentage is 99.9% or greater.  
WO/2020/115932A1
This copper alloy contains from 7.0% by mass (exclusive) to 20.0% by mass of nickel, from 4.0% by mass to 20.0% by mass of tin and from 0.1% by mass to 1.0% by mass of sulfur, with the balance being made up of copper and unavoidable impu...  
WO/2020/117102A1
The invention relates to the field of powder metallurgy. The method comprises the steps of providing an aqueous solution of copper nitrate which contains iron nitrate at a concentration of 0.5-1%, followed by flash drying at a temperatur...  
WO/2020/111384A1
Provided is a preparation method of magnetic nanostructures. The preparation method of magnetic nanostructures may comprise the steps of: preparing a source solution comprising a first precursor comprising a rare earth element, a second ...  
WO/2020/110986A1
The present invention is a conductive material comprising 10 to 70% by mass inclusive of Ag, 30 to 90% by mass inclusive of Pd, more than 5% by mass and 45% by mass or less of Ni and unavoidable impurities, wherein the ratio of the Ni co...  
WO/2020/099288A1
The invention concerns the fields of materials science, electrical engineering, medical technology and process technology, and relates to a method for producing single-piece components from shape memory material, as well as single-piece ...  
WO/2020/102539A1
A copper-based nanocomposite includes a matrix including copper, and nanostructures dispersed in the matrix, wherein the nanocomposite has a yield strength of about 300 MPa or greater, and a ductility of about 5% or greater. Manufacturin...  
WO/2020/101566A1
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of a material selected from the group consisting of pure copper, doped copper with a co...  
WO/2020/100614A1
The present invention relates to a solder joint part production method, wherein at least one metal substrate among a first metal substrate and a second metal substrate is an alloy in which the Ni content is 0 to less than 44% by weight a...  
WO/2020/095508A1
Provided is a titanium copper foil, which has the high strength required when used as a spring as well as good etching properties and low permanent set, and which can be used suitably as an electrically conductive spring material to be u...  

Matches 1 - 50 out of 17,221