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Matches 1 - 50 out of 15,984

Document Document Title
WO/2018/001260A1
An impregnated metal material for use in a carbon slider of a maglev train, comprising a metal raw material, silicon, and charcoal; the ratio by weight part of silicon, charcoal and the metal raw material is: silicon 3-5, charcoal 0.5-2,...  
WO/2017/222041A1
This copper alloy is characterized by having a composition that contains from 0.05 mass% to 0.70 mass% (inclusive) of Co, from 0.02 mass% to 0.20 mass% (inclusive) of P, from 0.005 mass% to 0.70 mass% (inclusive) of Sn, and one or more e...  
WO/2017/221770A1
This copper alloy bonding wire for a semiconductor device achieves improvement in the ball bond life in high temperature, high humidity environments. This semiconductor device bonding wire is characterized by containing a 0.03-3 mass% to...  
WO/2017/218646A1
Guitar strings made of a magnetic copper-nickel-tin-manganese alloy are disclosed. Also disclosed are processing steps that can be performed to fabricate the guitar strings from the alloy. Further described herein are alternative uses fo...  
WO/2017/217085A1
The present invention provides an electrolytic copper foil having high strength, high heat resistance, and small elongation anisotropy, a lithium ion secondary cell negative electrode, a lithium ion secondary cell, and a printed wiring b...  
WO/2017/212731A1
A method for manufacturing an electrode material, comprising molding and sintering a powder mixture of a solid solution powder of Cr and a heat-resistant element including Cr and a heat-resistant element (Mo, W, Ta, Nb, V, Zr, or the lik...  
WO/2017/213147A1
Provided is a negative terminal active substance material which is used in a nonaqueous electrolyte secondary battery and can improve capacity per volume and charge-discharge cycle properties. The negative terminal active substance mater...  
WO/2017/208723A1
The purpose of the present invention is to provide an electrolytic capacitor which raises no concerns regarding an outer case swelling or rupturing even in cases where a large quantity of hydrogen gas is generated, has a large capacitanc...  
WO/2017/204252A1
One aspect of this brass alloy hot-worked article contains 61.5-64.5 mass% of Cu, 0.6-2.0 mass% of Pb, 0.55-1.0 mass% of Sn, 0.02-0.08 mass% of Sb and 0.02-0.10 mass% of Ni, with the remainder comprising Zn and unavoidable impurities, an...  
WO/2017/204129A1
The present invention is a cladding material for electrical contacts, which is obtained by bonding a contact material formed of an Ag alloy to a base formed of a Cu-based precipitation age hardened material, and which is characterized in...  
WO/2017/202998A1
The invention relates to a highly heat-conductive valve seat ring (1) having a carrier layer (2) and a functional layer (3), the carrier layer (2) has a solidified copper matrix having 0.10 - 20 wt.% of a solidified component, and the fu...  
WO/2017/198127A1
A high-strength and high-conductivity copper alloy and applications of the alloy as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour. The copper alloy has the following characteris...  
WO/2017/198698A1
The invention relates to a lead-free high tensile brass alloy containing 0 - 65 wt.-% Cu; 0.4 - 3 wt.-% Mn; 0.55 - 3 wt.-% Sn; 1 wt.-% Fe; max. 1 wt.-% Ni; max. 1 wt.-% Al; max. 1.5 wt.-% Si; the remainder being Zn and inevitable impurit...  
WO/2017/199147A1
A method for obtaining a lead-free or low lead content brass billet envisages subjecting a mixture of lead-free or low lead content brass chips and graphite powder to extrusion, either direct or inverted, obtaining lead-free or low lead ...  
WO/2017/199906A1
The purpose of the present invention is to provide a copper alloy wire material having high tensile strength, high flexibility, high conductivity and high bending fatigue resistance at the same time. This copper alloy wire material is ch...  
WO/2017/198691A1
The invention relates to a high tensile brass alloy containing 55 - 65 wt.-% Cu; 1 - 2.5 wt.-% Mn; 0.7 - 2 wt.-% Sn; 0.2 - 1.5 wt.-% Fe; 2 - 4 wt.-% Ni; 2 - 5 wt.-% Al; 0.2 - 2 wt.-% Si; max. 2.0 wt.-% Co; the remainder being Zn and inev...  
WO/2017/200046A1
Provided is a negative electrode active substance material which can be used in a nonaqueous electrolyte secondary battery in order to improve capacity per volume and charge-discharge cycle properties. The negative electrode active subst...  
WO/2017/198128A1
A super-strong high-conductivity copper alloy used as a material of a contact line of a high-speed railway allowing a speed higher than 400 kilometers per hour. The copper alloy comprises the following components according to percentages...  
WO/2017/195826A1
The present invention relates to a multilayer wiring film which is provided with a wiring layer that is formed of Cu or a Cu alloy and has an electrical resistance of 10 μΩcm or less and a Cu-X alloy layer that contains Cu and an eleme...  
WO/2017/195729A1
Provided is a copper alloy tube that is a drawn tube comprising a CuCrZr alloy, wherein deterioration of mechanical strength, in particular the coarsening of crystal grains, is suppressed, even in the solution treatment temperature range...  
WO/2017/186252A1
The invention concerns the production of a bimetal via a synthesis process following the high-frequency induction melting of two metals, Al and Cu, which separate in the liquid state because of a miscibility gap and which solidify at roo...  
WO/2017/186192A1
A preparation method for a highly-conductive oxidation-resistant copper-silver composite powder. The method comprises the following steps: (1) using gas atomization to prepare a copper-silver alloy powder, the mass percentage of silver i...  
WO/2017/179250A1
A semiconductor package manufacturing method of the present invention is characterized by having: a step for preparing a lead frame having a section to be cut, said section being formed of a Cu alloy; a step for applying a bonding materi...  
WO/2017/179573A1
This copper alloy backing tube comprises a copper alloy having a composition containing 0.10-0.30% by mass of Co, 0.030-0.10% by mass of P, 0.01-0.50% by mass of Sn, 0.02-0.10% by mass of Ni, 0.01-0.10% by mass of Zn, and the remainder c...  
WO/2017/175713A1
This superconducting wire is provided with a wire formed from a superconductor and with a superconducting stabilizer arranged in contact with the wire. The superconducting stabilizer is formed from a copper material which contains, in to...  
WO/2017/176233A1
The invention can be used in the production of materials for current collectors on electrically-driven vehicles. The material contains carbon fibres and filaments, sintered iron powders and graphite, with localised inclusion of granules ...  
WO/2017/175711A1
This superconducting stabilizer is used in the superconducting wire and is formed from a copper material which contains a total of 3 to 100 ppm by mass of one or more additive elements selected from Mg, Mn, Ti, Y and Zr and has a remaind...  
WO/2017/175251A1
Copper alloy comprising Cu, Ni, Al, Zn, Si, Fe, P, and Mn, especially usable for the manufacture of molds for the production of glass containers, having the following chemical composition (percentage by weight ): Cu = 68.0-73%, Fe = 0.50...  
WO/2017/175710A1
This superconducting stabilizer is formed from a copper material which contains a total of 3 to 400 ppm by mass of one or more additive elements selected from Ca, La and Ce and has a remainder of Cu and unavoidable impurities, wherein th...  
WO/2017/168803A1
[Problem] To provide a high strength Cu-Ni-Si copper alloy sheet with excellent surface smoothness of the etching surface. [Solution] A copper alloy sheet having a composition made, in mass%, of Ni: 1.0-4.5%, Si: 0.1-1.2%, Mg:0-0.3%, Cr:...  
WO/2017/170699A1
The present invention is characterized by: including at least 0.15 mass% and less than 0.35 mass% Mg and at least 0.0005 mass% and less than 0.01 mass% P, with the remainder being Cu and unavoidable impurities; the conductivity exceeding...  
WO/2017/170113A1
A copper or copper alloy strip for a vapor chamber, the copper or copper alloy strip being characterized in that the maximum height roughness Rz of the surface is 1.5 µm or less, the arithmetic average roughness Ra is 0.15 µm or less, ...  
WO/2017/170733A1
The present invention is characterized by: including at least 0.15 mass% and less than 0.35 mass% Mg and at least 0.0005 mass% and less than 0.01 mass% P, with the remainder being Cu and unavoidable impurities; the conductivity exceeding...  
WO/2017/169910A1
This copper alloy wire for electrical/electronic components contains 0.15-0.60% by mass of Cr, 0.01-0.20% by mass of Si, and 0.005-0.30% by mass of Ti with the remainder consisting of Cu and unavoidable impurities, and comprises a deposi...  
WO/2017/167441A2
The present invention relates to a component for media-conducting gas or water lines, in particular a fitting for supply lines of drinking water, wherein the component is at least partially made of a lead-free copper alloy which has the ...  
WO/2017/162217A8
The present invention relates to the field of the manufacturing of electronic parts and components. Disclosed is an electronic device mid-frame. The invention addresses a technical issue of user experience being negatively affected by ex...  
WO/2017/164396A1
A copper alloy disclosed in the Description has a basic alloy composition of Cu100-(x+y)SnxAly (wherein 8≤x≤12 and 8≤y≤9 are satisfied), wherein the main phase is a βCuSn phase in which Al is solid-soluted, and said βCuSn phase...  
WO/2017/164709A1
The present invention relate to a novel metal composite. According to the present invention, the metal composite has at least two or more crystalline phases or crystal structures at room temperature in accordance with the regulation, in ...  
WO/2017/164395A1
A copper alloy disclosed in the Description has a basic alloy composition of Cu100-(x+y)SnxMny (wherein 8≤x≤16 and 2≤y≤10 are satisfied), wherein the main phase is a βCuSn phase in which Mn is solid-soluted, and said βCuSn phas...  
WO/2017/162217A1
The present invention relates to the field of the manufacturing of electronic parts and components. Disclosed is an electronic device mid-frame. The invention addresses a technical issue of user experience being negatively affected by ex...  
WO/2017/156721A1
An ultra-high strength and self-lubricating copper alloy and a preparation method therefor, the copper alloy comprising (mass fraction): 1.2%-2.3% of aluminum, 1.5%-2.7% of manganese, 0.2%-1.2% of nickel, 0.2%-0.5% of iron, 0.5%-1.0% of ...  
WO/2017/159749A1
The copper alloy plate for a heat dissipation component pertaining to the present invention includes 0.01-1.0 mass% Fe, 0.01-0.20 mass% P, 0.01-1.0 mass% Zn, and 0.01-0.15 mass% Sn, the remainder comprising Cu and unavoidable impurities....  
WO/2017/154329A1
This production method is for a joined body wherein a first member and a second member are joined. The production method is characterized by including: an arrangement step for arranging a joining material between the first member and the...  
WO/2017/154330A1
This joining material includes a first metal powder and a second metal powder that has a higher melting point than the first metal powder. The joining material is characterized in that the first metal powder comprises Sn or an alloy that...  
WO/2017/154890A1
The present invention is a sputtering target which is formed from copper or a copper alloy, and which contains argon and/or hydrogen in amounts of from 1 wt ppm to 10 wt ppm (inclusive), respectively. The objective of the present inventi...  
WO/2017/148568A1
The invention relates to a high-strength as-cast copper alloy containing tin, with excellent hot-workability and cold-workability properties, high resistance to abrasive wear, adhesive wear and fretting wear, and improved corrosion resis...  
WO/2017/150580A1
The present invention provides Ru Cu solid solution nanoparticles wherein Ru and Cu form a solid solution at the atomic level.  
WO/2017/150271A1
This Cu-based sintered sliding material comprises a sintered body having a composition which includes, expressed in mass%, 7-35% of Ni, 1-10% of Sn, 0.9-3% of P, and 0.5-5% of C, the remainder being Cu and unavoidable impurities. The sin...  
WO/2017/150658A1
This sintered sliding material is characterized by: comprising a sintered body of a plurality of Cu-Ni alloy grains including Sn and C which has a composition including, expressed in mass%, 10-35% of Ni, 5-12% of Sn, 0-0.9% of P, and 4.1...  
WO/2017/148569A1
The invention relates to a high-strength as-cast copper alloy containing tin, with excellent hot-workability and cold-workability properties, high resistance to abrasive wear, adhesive wear and fretting wear, and improved corrosion resis...  

Matches 1 - 50 out of 15,984