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Matches 1 - 50 out of 16,731

Document Document Title
WO/2019/176838A1
This copper alloy sheet has an alloy composition that contains 0-4.5% by mass of Ni, 0-2.0% by mass of Co, 0.2-1.3% by mass of Si, 0-0.5% by mass of Mg, 0-0.5% by mass of Cr, 0-0.25% by mass of Sn, 0-0.6% by mass of Zn, 0-0.15% by mass o...  
WO/2019/177147A1
Provided is a thermoelectric conversion element comprising: an element body (11) that comprises a thermoelectric conversion material that is silicide compounds; and electrodes (15) respectively formed on one surface of the element body (...  
WO/2019/177215A1
The present invention relates to a method for manufacturing a copper-titanium (Cu-Ti)-based copper alloy, and provides a method for manufacturing a copper alloy, requiring high performance, for automobiles and electrical and electronic c...  
WO/2019/171951A1
Provided are an inexpensive copper alloy sheet having excellent bendability as well as excellent stress corrosion cracking resistance and stress relaxation resistance characteristics while maintaining high strength, and a method for manu...  
WO/2019/173849A1
The successful fabrication of alloy foam (or porous alloy) is very rare, despite their potentially better properties and wider applicability than pure metallic foams. The processing of three-dimensional copper-nickel alloy foams is achie...  
WO/2019/167454A1
A joint structural body (1) has a first metal base material (11) which is configured from first metal, a second metal base material (12) which is configured from second metal, and a weld metal section (13) which connects the first metal ...  
WO/2019/168166A1
This copper alloy powder having excellent laser absorptivity contains one or both of B and S in the amount of 0.003% by mass to 5.0% by mass, the remainder comprising unavoidable impurities and Cu, the average particle diameter of the co...  
WO/2019/167564A1
A Cu-Ni alloy sputtering target containing Ni, with the remainder comprising Cu and unavoidable impurities, said target characterized in that Ni oxide phases are present at grain boundaries in a matrix phase comprising a solid solution o...  
WO/2019/163937A1
Provided are: a sintered valve guide which has high strength and exhibits excellent wear resistance and machinability; and a method for producing this sintered valve guide. A sintered valve guide according to the present invention has a ...  
WO/2019/159404A1
[Problem] To provide infiltration Cu-based powder to be an infiltrant for Fe-based substrates, wherein: the infiltrant comprising the Cu-based powder has a high infiltration rate and allows a Fe-based substrate to have a high density, th...  
WO/2019/155655A1
An electrical contact (10, 11) comprising a base material (31), high-melting-point substance particles (32), and an intermetallic compound (33), wherein: the intermetallic compound, which contains a MnX compound (X represents Te or Se) a...  
WO/2019/148304A1
A precipitation strengthened copper alloy, comprising, in percentage by weight: Cu: 80 wt% to 95 wt%, Sn: 0.05 wt% to 4.0 wt%, Ni: 0.01 wt% to 3.0 wt%, Si: 0.01 wt% to 1.0 wt%, and the balance of Zn and inevitable impurities. By means of...  
WO/2019/144173A1
The invention relates to a multi-layer sliding bearing element (1) having a sliding layer (9) formed from a copper-based alloy containing sulfidic precipitations (10). The copper-based alloy contains, in addition to copper: between 0.1 w...  
WO/2019/146587A1
Provided is a joining layer (13) that is included in a semiconductor module (10), that is interposed between an electronic component (14) and a substrate (15), and that comprises a CuSn intermetallic compound. This joining layer (13) is ...  
WO/2019/141916A1
The invention relates to an electrode for welding sheets of steel or aluminium, with a conductivity greater than or equal to 90% IACS and made of an alloy consisting, by weight based on the total weight of the alloy, of chromium in a pro...  
WO/2019/139785A1
A power cable may include a first plurality of copper alloy wires having a first percentage of strengthening alloying material and a second plurality of copper alloy wires having a second percentage of strengthening alloying material. On...  
WO/2019/138971A1
This insulated wire (10) comprises: a copper alloy conductor (1); and at least one resin layer (4) coated directly or indirectly on the outer circumferential surface of the copper alloy conductor (1). The copper alloy conductor (1) has a...  
WO/2019/137832A1
The invention relates to a copper-zinc alloy for producing electrically conductive components, for example contacts, consisting of: – Cu: 62.5 - 67% by weight, – Sn: 0.25 - 1.0% by weight, – Si: 0.015 - 0.15% by weight, – at leas...  
WO/2019/134541A1
The present invention relates to a copper-based microcrystalline alloy, a preparation method thereof, and an electronic product. The copper-based microcrystalline alloy comprises, in weight percent, 30-60% of Cu, 25-40% of Mn, 4-6% of Al...  
WO/2019/124837A1
The present invention relates to a copper alloy used as a material for industrial devices, electronic device parts, automobile parts, and thermal management device parts, and a method of manufacturing the same, and the objective of the p...  
WO/2019/124430A1
A Cu-Ga alloy sputtering target according to the present invention has a composition which contains Ga, as a metal component, in an amount of from 20% by atom to 45% by atom (inclusive), and which additionally contains K and Na in a tota...  
WO/2019/124351A1
This Cu-Ga alloy sputtering target has a composition containing Ga in an amount of 20-40 atomic% as a metal component, and further containing Na and K in a total amount of 0.05-1.0 atomic%, the balance comprising Cu and unavoidable impur...  
WO/2019/117041A1
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...  
WO/2019/116946A1
Provided are a cladding and a method for producing the same with which it is possible to prevent cracking and peeling from occurring even in the case of punching out (application of shear that is greater than thermal shock) due to press-...  
WO/2019/111898A1
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...  
WO/2019/107721A1
The present invention relates to a method for producing a copper-titanium (Cu-Ti)-based copper alloy material, and a copper alloy material produced thereby, wherein a copper alloy material for vehicles and electronic components requiring...  
WO/2019/102716A1
This mold material for casting is used in cases where a metal material is cast, and has a composition that contains Cr in an amount within the range of from 0.3 mass% to 0.7 mass% (inclusive), Zr in an amount within the range of from 0.0...  
WO/2019/098350A1
The present invention provides a heat dissipation plate that has a low thermal expansion coefficient and of high thermal conductivity, and that has a clad structure formed of a Cu-Mo composite material and a Cu material. This heat dissip...  
WO/2019/099830A1
Processes are disclosed for forming beryllium-copper metal rings having a fine and uniform grain structure. A raw BeCu casting is pre-forged and turned to form a BeCu billet. The BeCu billet is subjected to various heat treatment and coo...  
WO/2019/097846A1
Provided is a corrosion-resistant CuZn alloy comprising 15-55 mass% of Zn and the remainder including Cu and inevitable impurities, wherein the total amount of the Zn content and the Cu content is 99.995 mass% or more, and the number of ...  
WO/2019/088222A1
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...  
WO/2019/088080A1
Disclosed is a superconductivity stabilizing material which is used for a superconducting wire, which is formed of a copper material containing 3-100 ppm by mass, in total, of one or more types of additive elements selected from among Ca...  
WO/2019/088419A1
The present invention relates to a copper alloy having high strength and high electrical conductivity characteristics for an electrical and electronic component and a semiconductor and to a method for manufacturing the same. The copper a...  
WO/2019/082932A1
The present invention provides a method for manufacturing a thermoelectric conversion module having: a thermoelectric semiconductor portion in which a plurality of p-type semiconductors and n-type semiconductors are alternately arranged;...  
WO/2019/078474A1
The present invention provides a high-strength copper alloy sheet having high heat resistance and high heat dissipation characteristics, and a manufacturing method therefor, the sheet being suitable for: a material for a shield can for t...  
WO/2019/078975A1
Disclosed herein are composites comprising various fractions of ultra coarse (UC) tungsten carbide (WC) and cast carbide (CC). Further, disclosed herein are composites comprising fractions of UC-WC and CC having various particle size and...  
WO/2019/072581A1
The present invention relates to a bronze-polytetrafluoroethylene compound based on an oxidation-resistant bronze powder, and to a method for producing the bronze-polytetrafluoroethylene compound. In another aspect, the present invention...  
WO/2019/064745A1
This metal powder is characterized in that: a coating film, which is composed of at least one among Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, and Sm, is formed on the surface of coppe...  
WO/2019/044073A1
[Problem] To provide: a copper alloy shaped structure which has higher mechanical strength and/or higher electrical conductivity/thermal conductivity; and a copper alloy powder which enables the production of this copper alloy shaped str...  
WO/2019/045285A1
The present invention relates to a copper alloy for dental prosthesis and, specifically, to a copper alloy for dental prosthesis having such color and luster that the copper alloy can be used as a substitute for a gold alloy and having e...  
WO/2019/043499A1
A method for forming a multilayer composite structure comprises providing a first sheet comprising a copper-comprising layer sandwiched by first and second graphene layers, wrapping the first sheet to form a first rod, and compacting the...  
WO/2019/035224A1
This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the follo...  
WO/2019/035226A1
This free-cutting copper alloy comprises 75.4-78.7% Cu, 3.05-3.65% Si, 0.10-0.28% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the fol...  
WO/2019/034506A1
The present invention relates to an alloy of the following composition: Cu47at%-(x+y+z)(TiaZrb)cNi7at%+xSn1at%+ySiz, wherein c - 43 - 47 at%, a = 0.65-0.85, b=0.15-0.35, wherein a+b=1.00; x = 0-7 at%; y = 0-3 at%, z = 0-3 at%, wherein y+...  
WO/2019/035225A1
This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities...  
WO/2019/029031A1
An additive manufacturing method for a lead-free environmentally-friendly high-strength brass alloy, the method mainly comprising the five steps of gas atomization milling, model construction, molding chamber preparation, pre-powdering, ...  
WO/2019/031191A1
The purpose of the present invention is to provide a copper pipe, which is capable of exhibiting higher corrosion resistance to ant nest corrosion over long periods, can be used suitably as heat transfer pipes, coolant piping, etc. in ai...  
WO/2019/030416A1
The invention relates to a copper alloy, the elements of which have the following mass fractions: - 46 % to 53.5 % of copper (Cu); - 0 % to 1.0 % of aluminum (Al); - 0 % to 1.40 % of lead (Pb); - 0 % to 0.2 % of iron (Fe); - 0 % to 0.4 %...  
WO/2019/031612A1
Provided is a high strength/highly conductive copper alloy plate material which is practically applicable to conductive members that are required to have high strength and conductivity. A high strength/highly conductive copper alloy plat...  
WO/2019/029023A1
A copper-based composite material for a conductive part of a locomotive. The copper-based composite material comprises Sn, Al2O3 and Cu. The preparation of the copper-based composite material is controlled by the smelting temperature, sm...  

Matches 1 - 50 out of 16,731