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WO/2012/060359 |
This copper alloy hot-forged part has an alloy composition which contains 0.21 to 0.44 mass% of Co, 0.06 to 0.13 mass% of P, 0.003 to 0.08 mass% of Sn and 0.00003 to 0.0030 mass% of O, with the balance consisting of Cu and unavoidable im...
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WO/2012/057055 |
Disclosed is a pressure-resistant and corrosion-resistant copper alloy which contains 73.0-79.5 mass% of Cu and 2.5-4.0 mass% of Si with the balance made up of Zn and unavoidable impurities. The Cu content expressed as [Cu] mass% and the...
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WO/2012/055244 |
A copper alloy comprises 57-63 wt.% of copper, 2-5 wt.% of aluminum, 1-3.8 wt.% of iron, 0.2-2.5 wt.% of manganese and the balance zinc. The copper alloy has high wearing resistance, high tensile strength and low manufacturing cost. Also...
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WO/2012/058628 |
A composition for a low lead ingot comprising primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain manganese. The low lead ingot, when solidified, includes sulfur or sulfur containing compound...
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WO/2012/052192 |
The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles 20, in addition to...
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WO/2012/048460 |
A low resistivity high thermal-stability copper-nickel-molybdenum alloy film comprises Ni as a solid-solution element and Mo as a diffusion-barrier element, wherein the atomic ratio of Mo and Ni is 0.06-0.20 or the weight ratio of Mo and...
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WO/2012/046666 |
The present invention relates to electrically conductive copper particles containing a chlorine atom in an amount of 50-1000 ppm by mass relative to the total mass of the particles, wherein the chlorine atom is present in a water-insolub...
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WO/2012/047300 |
Alloys of copper and manganese and copper, manganese and zinc can be used for the production of coins, such as the U.S. five cent piece or "nickel." With appropriate platings, these alloys can match the electromagnetic signatures or elec...
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WO/2012/043170 |
A Cu-Co-Si-based alloy that has even mechanical properties and that is provided with favorable mechanical and electrical properties as a copper alloy for an electronic material is provided. The copper alloy for an electronic material con...
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WO/2012/043462 |
[Problem] To provide a rolled copper foil, of which the surface is roughened adequately so as to improve the handling properties of the foil, and which has excellent flexibility and good surface etching properties. [Solution] A rolled co...
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WO/2012/035862 |
A coaxial cable (1) is a short-length material of length no more than 1000mm. A center conductor (10) is a single-wire conductor configured mainly from a single Cu-Ag alloy wire (11). Said Cu-Ag alloy wire (11) is configured from a Cu-Ag...
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WO/2012/032155 |
The present invention is related to an improved brass alloy providing improved ability for machining, is free of lead and is at the same time environmental friendly. The alloy comprises added alloying elements in an amount that is identi...
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WO/2012/029717 |
Provided is a copper alloy material which is a copper alloy sheet material containing 1.0-5.0 mass% Ti, with the remainder comprising copper and incidental impurities, and which has excellent bendability and excellent strength and are su...
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WO/2012/029470 |
The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substr...
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WO/2012/029624 |
Provided are a negative electrode for a secondary battery which exhibits satisfactory cycle characteristics, a method for manufacturing the same, and a nonaqueous electrolyte secondary battery having satisfactory cycle characteristics. T...
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WO/2012/026610 |
Provided are a copper alloy sheet and a manufacturing method for the same, said sheet having a high Young's modulus and excellent strength, and being suited to electrical/electronic device lead frames, connectors, terminals and the like,...
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WO/2012/026488 |
The disclosed copper alloy for electrode material provides a copper-cobalt-silicon (Cu-Co-Si) alloy that improves the balance between conductivity, strength and bending workability. The alloy is comprised of 0.5-3.0 mass% Co, 0.1-1.0 mas...
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WO/2012/026611 |
Provided is a copper alloy sheet that has superior bending workability, has superior strength, is suitable for switches, relays, terminals and connectors and the like for mounting on automobiles or the like, is suitable for lead frames, ...
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WO/2012/018046 |
Provided is a semiconductor device wherein an internal bonding section does not melt at the time of substrate mounting by means of filling the hole portions of a porous metal body having a mesh structure with an Sn or Sn-based solder all...
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WO/2012/015339 |
The invention relates to composite carbon-containing nanomaterials for the manufacture of mint items such as coins, tokens and medals from metal powders. The composite carbon-containing material for mint items contains copper, nickel, ti...
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WO/2012/011539 |
The present invention provides a display device which is provided with a Cu alloy film having high adhesion to an oxygen-containing insulator layer and a low electrical resistivity. The present invention relates to a Cu alloy film for a ...
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WO/2012/008346 |
Provided is an input device which has an improved wiring unit structure and can reduce changes in wiring resistance that occur over time. The input device is provided with a base plate comprising: a substrate; an electrode unit provided ...
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WO/2012/008196 |
Provided is a novel copper powder for an electrically conductive paste, which retains oxidation resistance and can achieve good electrically conductivity. Proposed is a copper powder for an electrically conductive paste, which comprises ...
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WO/2012/004868 |
Provided is a copper-nickel-silicon (Cu-Ni-Si) copper alloy that strikes a balance between deep-draw characteristics, thermal ablation resistance plating and spring deflection limit and, in particular, is used in electric and electronic ...
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WO/2012/004841 |
Disclosed is a copper-zinc alloy product which has a zinc content that is higher than 35 wt.% but not higher than 43 wt.% and which has a two-phase structure composed of an α phase and a β phase. The content of the β phase in the copp...
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WO/2012/005098 |
Disclosed is a Cu-Ga alloy which comprises 25-30 mass% of Ga and a reminder made up by Cu, and which is characterized in that a γ-phase (that is a phase having a Ga concentration appearing on a structure image obtained on an electron mi...
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WO/2012/002337 |
Disclosed are: a Cu-In-Ga-Se powder which contains Cu, In, Ga and Se and is free from occurrence of cracks during sintering or processing; and a sintered body and a sputtering target, each of which uses the Cu-In-Ga-Se powder. Specifical...
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WO/2012/002526 |
Disclosed is an electrodeposited copper foil which can exhibit various properties stably even when the chlorine content therein is varied. Specifically disclosed is an electrodeposited copper foil produced by electrolyzing a copper elect...
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WO/2011/162398 |
Provided are: a method for producing an electrode material for a vacuum circuit breaker, whereby withstand voltage, large current interruption performance and capacitor switching performance can be improved; an electrode material for a v...
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WO/2011/156931 |
The present invention provides metal alloys that comprise at least copper, zinc and aluminium and, in addition, include manganese and iron, for the production of horseshoes that have bactericidal and fungicidal properties, impeding the p...
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WO/2011/155648 |
The present invention relates to a discoloration-resistant white copper alloy for manufacturing a coin, which is composed of 10 wt% to 20 wt% of Mn, 10 wt% to 20 wt% of Zn, 0.1 wt% to 1.0 wt% of Sb or Sn, and the remaining weight percent...
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WO/2011/154039 |
In a method for producing a lead-free sliding bearing, a copper-based material comprising a total of 0.1% to 3% of the elements aluminum, magnesium, silicon, titanium, zircon, and chromium is sintered. Additionally, up to 15% tin can be ...
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WO/2011/152163 |
Provided is a rolled Cu-Co-Si copper alloy sheet which has excellent workability by pressing, bendability, and strength. The rolled Cu-Co-Si copper alloy sheet contains 0.5-3.0 mass% Co and 0.1-1.0 mass% Si, with the remainder comprising...
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WO/2011/152104 |
Disclosed is a Cu-Co-Si-based alloy sheet which can be used suitably for various electronic components and can be plated satisfactorily and homogeneously. Specifically disclosed is a copper alloy sheet for an electronic material, which c...
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WO/2011/152124 |
Disclosed is a Cu-Co-Si-based copper alloy having high levels of strength and conductivity and also having excellent sag resistance. Specifically disclosed is a copper alloy for an electronic material, which comprises 0.5 to 3.0 mass% of...
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WO/2011/152009 |
Disclosed are: a copper-based alloy which contains 7.8 to 8.8 mass% of Al, 7.2 to 14.3 mass% of Mn and a remainder made up by Cu and unavoidable impurities, has a largest crystal grain diameter of more than 8 mm, has good shape memory pr...
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WO/2011/148600 |
Disclosed is a process for producing a Cu-In-Ga alloy powder, the process comprising producing a melt of a Cu-In-Ga alloy, solidifying the melt by a strip casting method to produce a Cu-In-Ga alloy ribbon, and pulverizing the alloy ribbo...
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WO/2011/145457 |
Provided is an actuator which is formed of a superelastic material that requires a low heating temperature, has a high durability, and requires no composition adjustment. The actuator (1) includes a movable member which can move in two d...
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WO/2011/145378 |
Provided is a novel copper powder for a conductive paste wherein it is possible to fully control the sintering temperature property between the temperature range of 500 to 900°C while maintaining oxidation resistance. Specifically, prov...
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WO/2011/145220 |
Disclosed are: a high-strength brass alloy for a sliding member, in which the parent phase still has a single phase structure composed of a β phase and also has such a structure that a Fe-Cr-Si-based intermetallic compound is dispersed ...
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WO/2011/142643 |
The present invention relates to a copper alloy having enhanced strength and electrical conductivity, which is provided with nickel and silicon as primary alloyed elements, with copper and unavoidable impurities forming the remainder, an...
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WO/2011/142450 |
Disclosed is a copper alloy for an electronic device, one embodiment of which is a two-element alloy of Cu and Mg containing Mg in a range of 3.3- 6.9 atomic percent with the remainder being only Cu and inevitable impurities. Letting the...
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WO/2011/142428 |
Disclosed is a copper alloy for an electronic device containing Mg in a range of 2.6 - 9.8 atomic percent and Al in a range of 0.1 - 20 atomic percent with the with the remainder being substantially Cu and inevitable impurities.
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WO/2011/142643 |
The present invention relates to a copper alloy having enhanced strength and electrical conductivity, which is provided with nickel and silicon as primary alloyed elements, with copper and unavoidable impurities forming the remainder, an...
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WO/2011/142005 |
A novel process for producing an ingot of a copper-iron base alloy is provided by which a copper-iron base alloy ingot reduced in iron segregation, i.e., iron concentration unevenness within the ingot, is obtained even when the alloy is ...
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WO/2011/136061 |
Disclosed is a laminate for flexible wiring, in which a copper plate is applied entirely or locally on a copper foil that is cladded on an insulating resin substrate, and which is characterized in that the ratio (A) of the area intensity...
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WO/2011/136284 |
Provided is a high-strength Cu-Ag alloy wire having high conductivity, and a method for producing the Cu-Ag alloy wire. The Cu-Ag alloy wire is made from a copper alloy containing Ag, with the Ag content falling within the range of 0.1 m...
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WO/2011/132703 |
Disclosed is a copper alloy having excellent sliding properties, which is developed without relying on lead or molybdenum. Specifically disclosed is a copper alloy comprising a sintered product of Cu5FeS4 which is produced by sintering a...
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WO/2011/129281 |
Disclosed is a Cu-Co-Si alloy which has improved balance between electrical conductivity and strength. Specifically disclosed is a copper alloy for electronic materials, which contains 0.5-4.0% by mass of Co and 0.1-1.2% by mass of Si wi...
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WO/2011/127513 |
The invention relates to a multi-layer plain bearing (1) that has a front side (4) that can face the element to be supported and a rear side (6) opposite the front side, comprising a supporting layer (2), a sliding layer (3) arranged on ...
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