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WO/2012/176883A1 |
The present invention provides a manufacturing method and manufacturing device for metal foil with which it is possible to efficiently manufacture extremely thin metal foil having a thickness of 5 μm or less. Current is passed between a...
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WO/2012/165213A1 |
Provided are a porous metallic body having a three-dimensional network structure, a method for manufacturing the porous metallic body, an electrode material using the porous metallic body, and a cell. The porous metallic body exhibits a ...
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WO/2012/165214A1 |
The purpose of the present invention is to provide a method for producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, said method being capable of forming an aluminum structure tha...
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WO/2012/137614A1 |
Provided is a composite metal foil provided with a porous metal foil comprising a two-dimensional mesh structure composed of metal fibers, and a primer disposed on the insides and/or at least part of the periphery of the holes of the por...
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WO/2012/137613A1 |
This porous metal foil comprises a two-dimensional mesh structure composed of metal fibers. The porous metal foil has a first surface with a high degree of glossiness, and a second surface, positioned on the opposite side of the first su...
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WO/2012/138463A2 |
A system and method to form beam tunnels in interaction circuits. Forms, such as fibers or sheets can be located and secured above a substrate at a desired size and desired shape to form the final shape of the beam tunnels. Fiber holders...
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WO/2012/133564A1 |
The objective of the present invention is to provide: an electrolytic copper foil that is for a secondary battery anode collector and that has superior extensibility that can withstand changes in expansion/contraction at minute units whi...
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WO/2012/133565A1 |
The objective of the present invention is to provide: an electrolytic copper foil that has a high normal tensile strength, a low decrease in tensile strength after a thermal history, and a low concentration of impurities in the copper fo...
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WO/2012/132574A1 |
Provided is a composite copper foil formed from copper/nickel/copper, which is characterized in comprising rolled copper foil or electrolytic copper foil (A) having a thickness of 10 to 150 µm, a nickel layer (B) having a thickness of 0...
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WO/2012/132578A1 |
Provided is a copper foil with a copper carrier, the copper foil being characterized by comprising: a copper carrier (A) comprising an electrolytic copper foil or a rolled copper foil; a nickel layer (B) having a thickness of 0.03-2 μm ...
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WO/2012/132573A1 |
Provided is a composite copper foil that comprises a copper layer having a thickness of at least 5.1 μm and a nickel layer having a thickness of 0.5-3 μm on both surfaces or one surface of an electrolytic copper foil or a rolled copper...
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WO/2012/121020A1 |
Provided is an electrolytic copper foil, especially an electrolytic copper foil useful for a secondary battery negative electrode collector, having a high tensile strength in an ordinary state, a surface roughness (Rz) of 2.0 μm or less...
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WO/2012/111585A1 |
Provided is a method in which the urethane resin is easily removed from an aluminum structure obtained by forming an aluminum film on the surface of a porous urethane resin having a three-dimensional network structure, while preventing t...
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WO/2012/098941A1 |
A porous metal which has a three-dimensional network structure constituted of an alloy comprising Ni and Cr, the porous metal being characterized in that the porous metal has a framework which is constituted of a shell having a hollow at...
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WO/2012/096220A1 |
The purpose of the present invention is to enable the aluminum plating of the surface of an article even when the article is a porous resin molding having a three-dimensional network structure, and to form a plating film having a uniform...
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WO/2012/096233A1 |
Provided is a reinforced porous metal foil comprising: a porous part which is composed of metal fibers and has a two-dimensional network structure; and a reinforcing part which is composed of a metal that is the same as a metal constitut...
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WO/2012/091060A1 |
To supply an electrolytic copper foil for lithium-ion secondary battery negative electrodes with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even ...
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WO/2012/077550A1 |
Provided is a metallic porous body having excellent corrosion resistance, which is suitable for batteries, such as lithium-ion batteries, capacitors and current collectors of fuel cells. A method for manufacturing the metallic porous bod...
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WO/2012/073652A1 |
Provided are a method for producing a porous silicon material filled with a metal, the method comprising the steps of rendering hydrophobic a porous silicon substrate having pores from 1 to 5 nm in diameter, and depositing a metal into t...
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WO/2012/066991A1 |
An electrolytic copper foil which has a surface roughness Rz of 2.0 µm or less, characterized by having a width-direction difference in thickness of 1.5% or less. Also disclosed are the electrolytic copper foil characterized by having a...
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WO/2012/063920A1 |
The object of the present invention is to provide a method for producing high-purity aluminium foil having excellent tensile strength that is maintained even after exposure to high temperatures, and which makes it possible for accumulato...
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WO/2012/057073A1 |
Disclosed is a solar thermal collector member (10A, 10B) provided with a metal layer (M) having a surface. The surface of the metal layer (M) has a moth eye structure containing multiple convexities (10p) or an inverted moth eye structur...
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WO/2012/049991A1 |
The objective of the present invention is to provide: an aluminum-made porous metal body having a three-dimensional mesh structure as a porous metal body suitable for use as an electrode of a molten salt battery; a method for producing t...
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WO/2012/046804A1 |
Provided is a copper foil with carrier capable of providing wirings of line/space=15 μm/15 μm or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed ci...
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WO/2012/039287A1 |
Provided are: a method for producing an aluminum structure using a porous resin molded body that has a three-dimensional network structure, by which an aluminum structure that has a small amount of oxide on the aluminum surface (namely, ...
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WO/2012/036065A1 |
Provided is a method for producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, wherein an aluminum structure with a small amount of oxide (with a thin oxide film) on an aluminum su...
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WO/2012/007524A1 |
A chuck (100) for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for holding a master electrode or a substrate; a buffer surface (102) circumferentially of the int...
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WO/2012/007526A2 |
A device for electrochemical pattern replication, ECPR, is provided. The device comprises; a base; a bottom chuck on a X-Y-Theta stage, said bottom chuck being configured to hold a master electrode or a substrate; and a Z-stage with an a...
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WO/2012/007520A1 |
A chuck (100, 200, 500) for holding a master electrode (107, 207) or a substrate (111, 211) during an ECPR process is provided. The chuck comprises an interaction surface (102, 201) onto which the master electrode (107, 207) or the subst...
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WO/2012/007523A1 |
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck has a proximal and a distal end, and comprises an interaction surface (205) for holding the substrate or master electrode positioned in a first...
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WO/2012/002526A1 |
Disclosed is an electrodeposited copper foil which can exhibit various properties stably even when the chlorine content therein is varied. Specifically disclosed is an electrodeposited copper foil produced by electrolyzing a copper elect...
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WO/2011/156500A2 |
Probe-based methods are provided for wire bonding and joining of structures. The wire bonds are formed via a meniscus-confined electrodeposition technique. The electrodeposition technique of the invention can also be used for fabricating...
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WO/2011/142338A1 |
The disclosed method involves an conductivity-imparting step for forming on a surface of a resin molded body a conductive layer comprising one or more types of metal selected from a group comprising gold, silver, platinum, rhodium, ruthe...
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WO/2011/132538A1 |
Disclosed is a high purity aluminum structure formed by using a resin porous body having a three-dimensional network structure, plating, with aluminum in a molten salt bath, a resin molded body, at least the surface of which has been ren...
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WO/2011/129633A2 |
Provided is a copper electrolysis solution for producing an electrolytic copper foil, according to an embodiment of the present invention, includes a Cl- ion, and collagen peptide, wherein the collagen peptide has a number average molecu...
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WO/2011/119818A1 |
An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode...
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WO/2011/111639A1 |
Disclosed is a composition for manufacturing contacts, which includes prescribed quantities of cobalt and sulphur and has a specified mean particle size, and a contact and connector using the same. The composition for manufacturing conta...
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WO/2011/111517A1 |
Provided are a porous Ni-Mo plating film that can be made thick and a manufacturing method therefor.
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WO/2011/099371A1 |
Disclosed is a manufacturing method which enables more accurate and precise manufacturing of an ultra-fine, thin contact for current inspection jigs which is provided with a spring structure. After a metal or gold alloy plating layer is ...
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WO/2011/079850A1 |
The invention relates to a method for producing a composite body (100) made of at least one self-supporting surface (30) and at least one element (20, 20a, 20b, 20c) connected to the surface (30) in a coating process, wherein the followi...
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WO/2011/078087A1 |
A perforated metallic foil configured so that, even if the aperture ratio of the foil is increased, a reduction in the tensile strength of the foil is minimized to prevent the foil from breaking during handling thereof. A perforated meta...
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WO/2011/067957A1 |
Disclosed is a porous metal foil which is formed from a two-dimensional network structure made up of metal fibres. The porous metal foil has excellent characteristics and may be obtained with high productivity and at low cost.
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WO/2011/064614A1 |
The invention relates to a method for fabricating nanowires and a method for fabricating an electrode of an electrochemical device. The nanowire fabrication method according to the invention comprises: a) a step of depositing, on one of ...
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WO/2011/059023A1 |
Disclosed is an aluminum foil which can be easily produced and has low surface resistance. The aluminum foil is capable of providing a thinner positive electrode collector film that enables an electricity storage device to have a smaller...
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WO/2011/040451A1 |
Disclosed is a sliding member which is used in direct sliding contact with a partner material in a rotational, oscillatory or reciprocating configuration and which has excellent wear resistance, has a high-precision sliding surface shape...
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WO/2011/027184A1 |
The invention relates to: a device for the cold production of pure silicon nanowires by means of electrodeposition in an enclosure insulated from the atmosphere, the associated method, and the resulting nanowires. The device includes at ...
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WO/2011/023398A1 |
The invention relates to a method for producing at least one strip conductor on a substrate, characterised by the following method steps: a. preparation of an electrically conductive polymer structure by means of electrochemical polymeri...
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WO/2011/001932A1 |
Provided is a method for manufacturing a highly-ductile, high-purity aluminum foil at high speed by electrolysis using a plating solution having a low chlorine concentration. Said method is characterized by the formation of an aluminum f...
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WO/2010/142529A1 |
The invention relates to a method for manufacturing a plurality of metal microstructures characterised in that said method includes the following steps: a) obtaining a conductive substrate or an insulating substrate covered with a conduc...
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WO/2010/137568A1 |
Provided are a method for manufacturing perforated metal foil and perforated metal foil which achieve stable quality and improved production efficiency. Specifically provided is perforated metal foil with a substrate characterized by bei...
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