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Matches 501 - 550 out of 5,394

Document Document Title
WO2001016402A8
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...  
WO/2001/057932A1
Substrates known in the art for use in flexible CIS solar cells have a series of drawbacks. The aim of the invention is to overcome these drawbacks. To this end, the substrate is characterized by a layer structure that comprises a chromi...  
WO/2001/056343A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056344A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056342A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056345A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/051687A1
A production method for ferrules, which uses one or a plurality of metal or plastic line(s) (9) as a master block and removes the line(s) (9) after electrocasting, characterized in that the line(s) (9) is electrocast by being rotated wit...  
WO/2001/049903A1
An electrolytic copper foil having the low temperature annealing property that the crystal structure of the electrolytic copper foil undergoes recrystallization through the heat history during the manufacture of a copper clad laminate us...  
WO/2001/048272A1
An electrolytic copper foil, characterized in that 20 % or more of crystals in the lustrous face side thereof have twin structure; a method for manufacturing the electrolytic copper foil by an electrolysis process comprising preparing a ...  
WO/2001/048271A1
A method of producing metal ferrules and a device therefor, wherein metal ferrules are produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A metal ferrule producing method and ...  
WO/2001/048270A1
A dimensionally accurate small-sized metal ferrule and a method of producing the same, wherein the energy cost is low and an expensive molding machine or mold is not required. A metal ferrule having an inner diameter of 0.125 - 0.130 mm ...  
WO2000032273A9
This invention is directed to a radioactive expandable stent (See Fig. 2) useful for implantation into an artery or the like. In one aspect of this invention, the stents can be made into radioactive beta emitters by direct exposure to th...  
WO/2001/043196A1
A method for forming an ordered structure of fine metal particles for use in a single electron element, which comprises forming a self-assembly membrane (11) of APTS on a substrate (13), depositing metal particles (12) on the self-assemb...  
WO1998015202A8
The invention concerns a method for setting stones (4) in the surface of a jewel produced by electroforming, comprising the following steps: producing a base (1) having external shapes and dimensions with a thickness close to the gold fi...  
WO/2001/034879A1
An electrolytic copper foil with a carrier foil comprising a carrier foil layer, an organic jointing interface layer formed on the carrier foil layer and an electrolytic copper foil layer formed on the interface layer, characterized in t...  
WO/2001/034880A1
An electrolytic copper foil with a carrier foil having a carrier foil, a bonding interface layer formed thereon, and an electrolytic copper foil formed on the interface layer, characterized in that the carrier foil is a copper foil and t...  
WO/2001/032963A1
Copper foil having electrodeposited on at least one thereof a stainproofing layer containing chromium, zinc and nickel, and providing improved protection from oxidation at elevated temperatures, e.g., 400 °F and higher, while being easi...  
WO/2001/031095A1
A one-step, integrated process and apparatus for producing electrolytic copper foil (10) having a dual-layer copper bond enhancing treatment electrodeposited on the matter side of the foil, which employs two 'super-anodes' (27, 28) on a ...  
WO/2001/026498A1
A system for producing a die includes means for generating a reference CAD model of a die of desired dimensions and a production facility arranged to produce an oversized casting of the die from a mould thereof. The system includes, furt...  
WO/2001/025002A1
Freestanding particles comprising a plurality of segments, wherein the particle length is from 10 nm to 50 $g(m)m and the particle width is from 5 nm to 50 $g(m)m.  
WO/2001/026038A1
Methods for imaging colloidal rod particles as nanobar codes is described in which imaging or reading free-standing particles comprising a plurality of segments of length from 10 nm to 50 $g(m)m and width from 5 nm to 50 $g(m)m is perfor...  
WO/2001/025510A1
An apparatus and synthetic methods for manufacture of segmented nanoparticles are described. The nanoparticles of the present invention may be comprised of any material, including metal, metal chalcogenide, a metal oxide, a metal sulfide...  
WO/2001/021403A1
Disclosed are a roller screen capable of being manufactured by an electroforming process with a low cost and a method of manufacturing the same. In the manufacturing method of the roller screen, a master roller screen is manufactured by ...  
WO/2001/021859A1
An electrolytic copper foil with a carrier foil comprising a carrier foil, a fine copper particle layer for the copper foil and an organic bonding interface layer formed between the carrier foil and the fine copper particle layer, and a ...  
WO/2001/021282A2
A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge o...  
WO/2001/018280A1
A method for performing an aperture plate (10) comprises providing a mandrel (26) that is constructed of a mandrel body (28) having a conductive surface (30) and a plurality of non-conductive islands (32) disposed on the conductive surfa...  
WO/2001/016402A1
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...  
WO/2001/014135A1
Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surfa...  
WO/2001/012880A2
The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathod...  
WO/2001/004384A1
The invention relates to a method for producing micro stamping tools which is designed to achieve a highly accurate reproductible match between said micro stamping tools, such as a force plate with stamps and a cutting plate, and to achi...  
WO2000057743A3
A system for setting a gemstone in a hollow jewellery piece, comprises means for creating a metallic attachment region secured to a surface of the gemstone, and a bonding means for bonding the at least one metallic attachment region to a...  
WO/2001/000905A1
A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one und...  
WO/2000/073056A1
The invention relates to a method for producing microcomponents with at least one individual layer, which has functional layers (3) on the walls of inner structures such as flow channels. The aim of the invention is to produce microcompo...  
WO/2000/074047A1
A substrate (3) coated with photoresist (2) is exposed to light lineally through a lens (1). The portion to be exposed is shifted from the first exposure position (O¿1?) to a position (O¿2?) spaced from the first exposure position (O¿...  
WO2000036188A3
The invention relates to a method for producing a self-supporting metal film (40), especially copper film, which has a lower cohesive strength due to its microstructure and which can be formed so as to produce sharp edges. According to t...  
WO2000032273A3
This invention is directed to a radioactive expandable stent (See Fig. 2) useful for implantation into an artery or the like. In one aspect of this invention, the stents can be made into radioactive beta emitters by direct exposure to th...  
WO/2000/068465A1
Disclosed is a technique for manufacturing an Ni-Fe alloy thin foil using an electrodeposition-based plating process of a single step without requiring processes such as melting, casting, forging, and rolling processes. A manufacturing a...  
WO/2000/057743A2
A system for setting a gemstone in a hollow jewellery piece, comprises means for creating a metallic attachment region secured to a surface of the gemstone, and a bonding means for bonding the at least one metallic attachment region to a...  
WO/2000/048758A1
This invention relates to copper wire (30) and process for making copper wire comprising: (A) electrodepositing copper foil, characterized by a twinning or stacking fault population in its crystal structure, having a thickness of about 0...  
WO/2000/049187A1
This invention relates to a process for making copper wire comprising the steps of (A) extracting copper ions from a copper-bearing material using an aqueous leaching solution to form a copper-rich aqueous leaching solution; (B) extracti...  
WO1999016935A3
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of ...  
WO/2000/037226A1
The invention relates to a hair clipper (HSM) comprising a drive mechanism located in a housing (1) and a cutting head (S) with a cutting comb (3) and a cutting blade (4, 82) that moves back and forth, wherein a foil (47) is provided bet...  
WO/2000/036188A2
The invention relates to a method for producing a self-supporting metal film (40), especially copper film, which has a lower cohesive strength due to its microstructure and which can be formed so as to produce sharp edges. According to t...  
WO/2000/032273A2
This invention is directed to a radioactive expandable stent (See Fig. 2) useful for implantation into an artery or the like. In one aspect of this invention, the stents can be made into radioactive beta emitters by direct exposure to th...  
WO/2000/031574A1
Nickel is electrodeposited around an aluminum alloy wire (9) by electrocasting in an electrocasting bath (50) using the metal wire (9) immersed in an electrocasting solution (3) as a cathode. A nickel cylinder formed with a through hole ...  
WO2000011628A8
The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or ori...  
WO1999062058A3
A system and method for electroforming a metal layer on a substrate such as a glass master to be used in the production of optical disks. An electroforming cell (12) includes a toroidally-shaped manifold (14). Directly downstream from th...  
WO/2000/015875A1
A copper foil suitable as a collector for a lithium ion secondary cell, which has pores passing through the foil in the thickness direction so as to render possible the transmission of light, is formed by carrying out electrodeposition s...  
WO/2000/011628A1
The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or ori...  
WO1999063946A3
The invention provides exemplary aerosolization apparatus, and methods for aerosolizing a substance. According to one exemplary method, a liquid is transferred from a first chamber (328) into a second chamber (330) having a substance tha...  

Matches 501 - 550 out of 5,394