Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 501 - 550 out of 5,504

Document Document Title
WO2001077416A3
Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to elec...  
WO/2002/027073A1
A method for producing a metal mask, characterized in that it comprises forming a Cr film (2) having a mask pattern (2a) on the surface of a glass substrate (1), forming a dry film (4) on the Cr film (2), exposing the dry film (4) from t...  
WO/2002/024444A1
A carrier-equipped ultrathin copper foil which comprises a laminate of a separation layer, a diffusion preventing layer, and an electric copper plating layer, or a diffusion preventing layer, a separation layer, and an electric copper pl...  
WO/2002/016758A1
The invention relates to a swirl plate WHICH IS characterized in that it comprises at least one inlet zone (65) and at least one outlet opening (69), the at least one outlet opening (69) being disposed in a lower bottom layer (62). The s...  
WO/2002/014585A1
A cathode electrode material which is extensively usable in metal electrolytic winning and easy to maintain, can produce quality deposit metals in terms of physical properties and shapes, and is used to electro-deposit metals, characteri...  
WO/2002/000966A1
The invention relates to an electroforming die (10) for the electroforming of products, which die comprises a structure of interconnected, electrically conductive metal die tracks, the structure comprising a random, disordered network (3...  
WO/2001/088228A1
An electrolysis apparatus equipped with a circulating system, wherein an adjusted copper sulfate solution containing thiourea added thereto is electrolyzed in an electrolysis vessel to produce an electrolytic copper foil, a copper sulfat...  
WO/2001/088226A2
The invention relates to a method of manufacturing an Al or alloy workpiece, comprising the steps of (a) providing an AlAl alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal lay...  
WO/2001/085053A1
The invention relates to the production of substructures, especially copings, consisting of ceramic material, preferably alumina. The stump of a work model is lined with a film or a separating agent. This lining is made electroconductive...  
WO/2001/084747A2
Optical mirror elements for high bandwidth free space optical communication are produced by an electroforming replication technique. Onto the precision surface of a mandrel that is a negative of the required optical surface a layer of me...  
WO/2001/077415A1
The disclosure of the present invention provides a method for fabricating an imprint tool master. The process begins by providing a metallic substrate on which a first layer of photoresist is placed. An image pattern mask is then aligned...  
WO/2001/077416A2
Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to elec...  
WO2001021282A3
A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge o...  
WO2001012880A3
The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathod...  
WO/2001/071065A1
A hole structure having fine openings and drilled deep through holes, and a production method therefor. The hole structure is characterized by having through holes having first openings and second openings larger in size than the first o...  
WO/2001/068940A1
A method of replicating a structured surface that includes providing a tool having a structured surface having a surface morphology of a crystallized vapor deposited material; and replicating the structured surface of the tool to form a ...  
WO/2001/064433A1
A carrier foil-pasted metal foil comprising a carrier foil layer and a metal foil layer pasted together via an organic phase boundary layer, wherein the metal foil layer consists of one of nickel, tin, cobalt, chromium, lead, iron and zi...  
WO/2001/063016A1
A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release l...  
WO/2001/063015A1
A method of manufacturing a stamper, comprising the steps of manufacturing, by electrocasting, a father (4) from an original disk (I3) having a resist pattern formed thereon, laterally connecting a plurality of the donut-shaped fathers (...  
WO2001016402A8
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...  
WO/2001/057932A1
Substrates known in the art for use in flexible CIS solar cells have a series of drawbacks. The aim of the invention is to overcome these drawbacks. To this end, the substrate is characterized by a layer structure that comprises a chromi...  
WO/2001/056343A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056344A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056342A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056345A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/051687A1
A production method for ferrules, which uses one or a plurality of metal or plastic line(s) (9) as a master block and removes the line(s) (9) after electrocasting, characterized in that the line(s) (9) is electrocast by being rotated wit...  
WO/2001/049903A1
An electrolytic copper foil having the low temperature annealing property that the crystal structure of the electrolytic copper foil undergoes recrystallization through the heat history during the manufacture of a copper clad laminate us...  
WO/2001/048272A1
An electrolytic copper foil, characterized in that 20 % or more of crystals in the lustrous face side thereof have twin structure; a method for manufacturing the electrolytic copper foil by an electrolysis process comprising preparing a ...  
WO/2001/048271A1
A method of producing metal ferrules and a device therefor, wherein metal ferrules are produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A metal ferrule producing method and ...  
WO/2001/048270A1
A dimensionally accurate small-sized metal ferrule and a method of producing the same, wherein the energy cost is low and an expensive molding machine or mold is not required. A metal ferrule having an inner diameter of 0.125 - 0.130 mm ...  
WO2000032273A9
This invention is directed to a radioactive expandable stent (See Fig. 2) useful for implantation into an artery or the like. In one aspect of this invention, the stents can be made into radioactive beta emitters by direct exposure to th...  
WO/2001/043196A1
A method for forming an ordered structure of fine metal particles for use in a single electron element, which comprises forming a self-assembly membrane (11) of APTS on a substrate (13), depositing metal particles (12) on the self-assemb...  
WO1998015202A8
The invention concerns a method for setting stones (4) in the surface of a jewel produced by electroforming, comprising the following steps: producing a base (1) having external shapes and dimensions with a thickness close to the gold fi...  
WO/2001/034879A1
An electrolytic copper foil with a carrier foil comprising a carrier foil layer, an organic jointing interface layer formed on the carrier foil layer and an electrolytic copper foil layer formed on the interface layer, characterized in t...  
WO/2001/034880A1
An electrolytic copper foil with a carrier foil having a carrier foil, a bonding interface layer formed thereon, and an electrolytic copper foil formed on the interface layer, characterized in that the carrier foil is a copper foil and t...  
WO/2001/032963A1
Copper foil having electrodeposited on at least one thereof a stainproofing layer containing chromium, zinc and nickel, and providing improved protection from oxidation at elevated temperatures, e.g., 400 °F and higher, while being easi...  
WO/2001/031095A1
A one-step, integrated process and apparatus for producing electrolytic copper foil (10) having a dual-layer copper bond enhancing treatment electrodeposited on the matter side of the foil, which employs two 'super-anodes' (27, 28) on a ...  
WO/2001/026498A1
A system for producing a die includes means for generating a reference CAD model of a die of desired dimensions and a production facility arranged to produce an oversized casting of the die from a mould thereof. The system includes, furt...  
WO/2001/025002A1
Freestanding particles comprising a plurality of segments, wherein the particle length is from 10 nm to 50 $g(m)m and the particle width is from 5 nm to 50 $g(m)m.  
WO/2001/026038A1
Methods for imaging colloidal rod particles as nanobar codes is described in which imaging or reading free-standing particles comprising a plurality of segments of length from 10 nm to 50 $g(m)m and width from 5 nm to 50 $g(m)m is perfor...  
WO/2001/025510A1
An apparatus and synthetic methods for manufacture of segmented nanoparticles are described. The nanoparticles of the present invention may be comprised of any material, including metal, metal chalcogenide, a metal oxide, a metal sulfide...  
WO/2001/021403A1
Disclosed are a roller screen capable of being manufactured by an electroforming process with a low cost and a method of manufacturing the same. In the manufacturing method of the roller screen, a master roller screen is manufactured by ...  
WO/2001/021859A1
An electrolytic copper foil with a carrier foil comprising a carrier foil, a fine copper particle layer for the copper foil and an organic bonding interface layer formed between the carrier foil and the fine copper particle layer, and a ...  
WO/2001/021282A2
A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge o...  
WO/2001/018280A1
A method for performing an aperture plate (10) comprises providing a mandrel (26) that is constructed of a mandrel body (28) having a conductive surface (30) and a plurality of non-conductive islands (32) disposed on the conductive surfa...  
WO/2001/016402A1
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...  
WO/2001/014135A1
Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surfa...  
WO/2001/012880A2
The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathod...  
WO/2001/004384A1
The invention relates to a method for producing micro stamping tools which is designed to achieve a highly accurate reproductible match between said micro stamping tools, such as a force plate with stamps and a cutting plate, and to achi...  
WO2000057743A3
A system for setting a gemstone in a hollow jewellery piece, comprises means for creating a metallic attachment region secured to a surface of the gemstone, and a bonding means for bonding the at least one metallic attachment region to a...  

Matches 501 - 550 out of 5,504