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Patent Searching and Data


Matches 501 - 550 out of 2,309

Document Document Title
WO/1991/019024
This invention relates to electrodeposited copper foil having an elongation measured at 180 �C in excess of about 5.5 %, an ultimate tensile strength measured at 23 �C in excess of about 60,000 psi, and a matte-side Rtm in the range ...  
WO/1991/007700
In the process, negative moulds of the microstructures are produced from plastics material on an electrically conducting substrate by electron-beam lithography, X-ray lithography or microforming techniques, and the cavities in the negati...  
WO/1991/004358
Copper conductive foil (20) for use in preparing printed circuit boards is electrodeposited from an electrolyte solution (18) containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughnes...  
WO/1990/012350
The invention relates to a method for producing a heatable and refrigerable element (12) for a system handling small amounts of liquid and to an element manufactured by the method. The element comprises flow channels (11) and one or more...  
WO/1990/009865
In order to manufacture a working copy of an endless metallic strip (3) provided with an embossed pattern for use in the continuous production of pressed laminates, a polyurethane casting in the form of an endless elastic plastic strip (...  
WO/1990/008208
A drum cathode (10) for the production of metal foil, the drum having a titanium top cylinder (26) and a steel base cylinder (28) integrally connected by welding a niobium or vanadium ring (54) to the top cylinder (26), a copper ring (56...  
WO/1990/002828
A method of fabricating a hollow jewellery object in which an electrically conductive coating is applied to part (18) of a non-conductive mandrel or mould (10), the coated mandrel being presented for a first dip into an electrolyte conta...  
WO/1989/004749
It has hitherto been difficult to achieve the even deposition of a cup-shaped body from slurry flowing around a mandrel. This specification discloses a deposition apparatus including control means providing a substantially uniform slurry...  
WO/1988/010327
An electrodeposited foil having isotropic tensile elongation properties. The foil is formed by a process and apparatus wherein the plating surface is polished in a random manner. This provides a surface finish on the plating surface havi...  
WO/1988/006647
A copper layer is deposited on the outer surface of a straight horizontal first run (3) of an endless belt (1), and is treated on the first run (3) to enhance its bonding to dielectric material. The belt (1) is moved so that the treated ...  
WO/1988/006195
Plant for making an extra thin metal sheet by electrolytic deposition on a movable cathode and further separation of the deposit. The movable cathode is comprised of a metal belt (1) tensioned between two parallel preferably motor-driven...  
WO/1988/006195
Plant for making an extra thin metal sheet by electrolytic deposition on a movable cathode and further separation of the deposit. The movable cathode is comprised of a metal belt (1) tensioned between two parallel preferably motor-driven...  
WO/1987/003915
A process and apparatus for producing surface treated metal foil. The process comprises plating a relatively smooth metal foil onto a cathodic surface (12) and thereafter forming a dendritic layer on the foil and firmly bonding it theret...  
WO/1987/003364
Thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly (28). This assembly includes constricted ink flow ports (58) to reduce cavitation damage and smooth, contoured c...  
WO/1986/004015
A novel in-mold electrodeposition process for the production of plastic parts having conductive polymeric coatings such as polypyrroles or polythiophenes. Parts produced according to the novel disclosed in-mold electrodeposition process ...  
WO/1983/003850
A method for the connection of a metallic connector, the connector including a metallic member having a plurality of holes through a thickness of the member, to a metallic surface in order to provide an electrical contact between the con...  
WO/1983/002784
A die (12) used for plastic injection molding is masked on its inner surface with a plating resist (11) to leave only a selected area exposed. A conforming anode (14) is fit into the die leaving a small clearance between the die cavity s...  
JP2014051741
To provide a machine component which allows reliable supply of lubricating oil to a sliding portion and reduces the friction force when it is slid with another component, and can be improved in yield, a method for manufacturing the machi...  
JP2014051743
To provide a method of manufacturing a high purity aluminium foil having high film deposition rate and extensibility by an electrolysis method using low chloride concentration plating liquid.A method includes forming an aluminium film on...  
JP2014037582
To provide an electrolytic copper foil excellent in extensibility durable against change of expansion and contraction in minute unit while having strong strength.The electrolytic copper foil has a normal tensile strength obtained from a ...  
JP2014037635
To form a multi-layer three-dimensional structure on the basis of the electrodeposition of both a structural material and a sacrificial material.A substrate to be plated 2 is contacted with a first article 4a, which includes a mask 6 and...  
JP2014037583
To provide an electrolytic copper foil having an excellent charge-discharge cycle life, and suitable as the negative electrode collector material of a secondary battery including a lithium ion secondary battery.Disclosed is an electrolyt...  
JP2014037615
To provide a continuous pattern plating transfer system and a method for manufacturing a continuous pattern plating transfer material, in which patterning is performed only by plating and etching is unnecessary.A continuous pattern plati...  
JP2014015650
To provide extra-thin copper foil in which the thickness precision of an extra-thin copper layer on supporting copper foil is improved.The extra-thin copper foil comprises: a supporting copper foil; a peeling layer laminated on the suppo...  
JP2014009364
To provide electrolytic copper foil having increased tensile strength and electric conductivity, and to provide a lithium secondary battery with the electrolytic copper foil as a collector for a negative pole.The electrolytic copper foil...  
JP2014008693
To provide a method of manufacturing a polishing pad molding die in which a polishing pad that performs a flattening work highly accurately and highly efficiently is manufactured, a polishing pad molding die manufactured by the method, a...  
JP2014005507
To provide a metal-clad laminate including a thin metal film which is free from wrinkles and flaws without requiring a carrier foil made of a material such as copper.A metal film-attached adhesive film is used which includes a metal film...  
JP2014005545
To provide an electrolytic copper foil with a peelable type carrier foil, capable of easily peeling the carrier foil even when heated at a temperature over 300°C.In an electrolytic copper foil 1 with a carrier foil, having a layer struc...  
JP2014001460
To provide an apparatus for manufacturing an electrolytic aluminum foil, which prevents the aluminum foil from having uneven thickness due to drops of dew condensation products of alkyl sulfone in the apparatus.In an apparatus for manufa...  
JP2013256712
To provide an electrolytic copper foil for a secondary battery collector, which is free from discoloration or wrinkles after stretching along the length direction and is excellent in gloss.An electrolytic copper foil for a secondary batt...  
JP2013256711
To provide an electrolytic copper foil for a secondary battery collector, which has a small surface roughness, and in which formation of wrinkles after stretching and discolored streaks along the length direction is suppressed by making ...  
JP2013256677
To provide an electrolytic copper foil for a secondary battery collector, which has a small surface roughness and uniform thickness in the width and length directions, is free from wrinkles after stretching and suppresses formation of di...  
JP2013257943
To provide an electrolytic copper foil for secondary battery having a small surface roughness, in which formation of "ruffled wrinkles" or discolored streak along the length direction is prevented, by making the thickness uniform in the ...  
JP2013249526
To provide a metal material which can be subjected to super-fine cutting processing such as high precision engraving or mirror-like finishing.An amorphous metal material mainly contains nickel, and contains 10-20 wt.% of phosphorus, 0.3-...  
JP2013243396
To provide a copper foil for printed wiring board capable of enhancing bond strength of a copper foil and resin by improving the roughening layer of a copper foil, and to provide a manufacturing method therefor.A copper foil for printed ...  
JP2013242330
To provide components for a clock with excellent impact resistance, and dimension accuracy, and the clock using the components.Components for a clock are constituted by including: a plurality of unevennesses 202 with surfaces facing surf...  
JP2013227637
To provide a perforated metallic foil in which through holes with a seamless and fine pattern are formed without generation of burrs and loss of metal during producing processes, and also to provide a method for producing the perforated ...  
JP2013224483
To manufacture a solid electroforming component easily at low cost.A forming die 10 of an electroforming component W is provided including a metal electrode plate 1 that has on one surface 1a thereof an electrode plane region 5 where the...  
JP2013213250
To provide a metal foil which has excellent adhesion to adhesives.In a metal foil, at least one surface has a ten-point average roughness Rz of 2.0-6.0 μm and has a ratio (Rz/S) of the roughness to the average spacing S between the loca...  
JP2013204065
To provide a copper foil with carrier in which an adhesive force between a carrier and an extremely thin copper layer is high before a process of lamination to an insulation substrate, meanwhile, adhesion between the carrier and the extr...  
JP2013204042
To provide an insoluble electrode structural body which easily makes female screw diameter the same before and after repair even when the insoluble electrode structural body is repeatedly repaired and, even when damage of a part which is...  
JP2013204088
To provide an electrolytic solution for producing electrolytic copper foil for producing an electrolytic copper foil that has tensile strength after heat treatment at 300°C for 1 hour of 450 MPa or more and the electric conductivity of ...  
JP2013199684
To obtain a method of manufacturing a metal mask, in which a resist height can be made 0.1-2 μm by making a mold using electrodeposition resist.A method of manufacturing a metal mask includes steps of: putting a base material in an elec...  
JP2013194308
To provide a porous aluminum body in which a skeletal structure constituted by an aluminum layer and having a cavity inside forms a three-dimensional network structure and which can be used as an electrode material having a high porosity...  
JP2013185228
To provide an electrolytic copper foil by which adhesion between a current collector (copper foil) and an active material is maintained and the current collector (copper foil) does not break upon high expansion and contraction of the act...  
JP2013185188
To produce a master mold at higher throughput.This invention relates to: a method of producing a master mold 10; and a surface treating method. The method of producing the master mold includes: subjecting a substrate 1 to hydrothermal tr...  
JP2013181189
To provide a method of manufacturing metal foil by an electrolytic process, which is capable of easily peeling a metal film from a cathode electrode and stably manufacturing uniform metal foil.Using, as a cathode electrode, a workpiece o...  
JP2013181236
To provide an electrolytic copper foil which has high normal tensile strength and whose tensile strength is hardly deteriorated after thermal history, in regard to an electrolytic copper foil used as a negative electrode collector for a ...  
JP2013177696
To provide a method for manufacturing a multicomponent nanowire, in which a manufacturing process is easy and a manufacturing cost is low.A method for manufacturing a multicomponent nanowire includes: (a) a step of preparing an anode oxi...  
JP2013170300
To provide a method for producing an electroformed part and the electroformed part which prevent formation of voids and cleft-like defects, in regard to one produced by an electroforming method using a transfer die and comprising nickel ...  

Matches 501 - 550 out of 2,309