| Document |
Document Title |
|
JP2010215937 |
To provide a method for producing silica gel, which can deposit silica gel in a form of cylinder or a sheet from a solution of an alkaline silicate, in order to expand the use of the silica gel.This production method includes: adjusting ...
|
|
JP2010216013 |
To provide a mold for galvanoplasty and a method for fabricating a mold for galvanoplasty, concerning the field of micromechanical parts, particularly micromechanical parts for timepiece movements.There is discloded a method (3) of fabri...
|
|
JP2010196167 |
To provide a metal foil obtained by a method of manufacturing a patterned metal foil with high productivity.The method of manufacturing the patterned metal foil includes: (1) a step of depositing a metal by plating on the surface of a co...
|
|
JP2010196169 |
To provided an apparatus and a method of producing a patterned conductive polymer film wherein production cost is reduced and particularly reproducibility is improved.The apparatus for producing the patterned conductive polymer film incl...
|
|
JP2010189759 |
To provide a component for a clock, the component having excellent shock resistance and high dimensional accuracy, and to provide a clock using the component.The component for a clock includes: a claw 101 that has a plurality of concavo-...
|
|
JP2010173015 |
To provide a nickel plated film used as a coupling member for an electrodeposition cutting tool, in particular, with the excellent retention power of abrasive grains, and to provide the cutting tool using such a nickel-plated film and a ...
|
|
JP2010174380 |
To provide a method of manufacturing an electroformed component by which an electroformed component is taken out from an electroforming die without deforming, dissolving and destroying the electroforming die.The method of manufacturing a...
|
|
JP2010113937 |
To prevent a failure, such as a rupture at a coil connection during heat treatment, and to perform uniform heat treatment regardless of a shape of a heat-treated part.A high-frequency induction heating coil 1 is molded by electroforming ...
|
|
JP2010100942 |
To provide an ultra-thin copper foil with carrier, wherein an ultra-thin copper foil having minimized number of pinholes is formed, by plating, on a peeling layer that withstands high working temperature, and to provide a printed circuit...
|
|
JP2010084162 |
To provide a method for manufacturing replica molds, by which a fine pattern of a master mold can be transferred to a mother mold with a good precision, a fine pattern of the mother mold can be transferred to a replica mold with a good p...
|
|
JP2010084158 |
To provide an electroforming method by which the shape of the surface of a metal layer on the side opposite from the face electrically deposited to a matrix can be controlled.The matrix 11 is fabricated by opening a cavity 15 in an insul...
|
|
JP2010077476 |
To provide a method of manufacturing a stamper by which difference in height of unevenness of a pattern of a mother stamper is increased for solving the following problems: a resist layer is made thinner with the narrowing and the densif...
|
|
JP2010078147 |
To provide a mechanical part, a method for manufacturing the mechanical part, a mechanical part assembly and a clock capable of softening stress when fitting a shaft member and capable of improving productivity.In the mechanical part 126...
|
|
JP2010077528 |
To provide a machine part capable of reducing the frictional force and holding lubricant in the sliding to other part and capable of improving the yield, a method of manufacturing the same and a clock.In the machine part 126g formed by e...
|
|
JP2010059550 |
To provide a contact or adhered mask plating or electrochemical fabrication process or apparatus that provides enhanced quality of the plating operations.The conformable contact mask plating process for manufacturing a structure includes...
|
|
JP2010058325 |
To provide a copper foil enabling a via hole to be made, which penetrate the surface copper foil and a resin base material but not penetrating a copper foil surface as an underlayer, and to provide a multilayered wiring board which achie...
|
|
JP2010047842 |
To provide an electrolytic copper foil for a printed wiring board at a low cost, which is excellent in adhesion between a glossy surface of the copper foil and a resist, and allows low profile by improving adhesive strength when the glos...
|
|
JP2010043336 |
To provide a large-scale production method for easily producing a metal nanoparticle array in which metal nanoparticles oriented in the same direction are arranged at a desired pitch.The production method of the metal nanoparticle array ...
|
|
JP2010037654 |
To provide an electrolytic copper foil having flexibility/bending ability equivalent to or better than that of rolled copper foil.The electrolytic copper foil is produced such that after thermal treatment is applied to the electrolytic c...
|
|
JP2010024493 |
To provide an electric connection member having a connection surface having a metallized layer fitted to the requirement of micronization, high aspect and mutual connection, and to provide a method of manufacturing the same.The electric ...
|
|
JP2010018885 |
To provide an electrolytic copper coating film that develops plasticity and flexibility equal to or greater than those of a rolled copper foil after applying the heat history in the circuit board fabrication process, especially a heat hi...
|
|
JP2010013738 |
To provide a surface treated copper foil laminated with a liquid crystal polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility...
|
|
JP2010007127 |
To provide an electroconductive base material for plating, from which a conductor layer pattern being patterned and free from plating burning and a base material with the conductor layer pattern can be manufactured with good productivity...
|
|
JP2010007095 |
To provide a plating method for easily forming a conductive layer pattern in high productivity; to provide a plating method using a conductive material having excellent durability for plating; and to provide a plating method by which a p...
|
|
JP2010003967 |
To manufacture a patterned conductor layer pattern or a substrate with the conductor layer pattern with sufficient productivity, and to provide the conductive substrate for plating excellent in durability.At the conductive substrate for ...
|
|
JP2009299100 |
To supply an electrolytic copper foil provided with bending performance as same as a rolled copper foil.In the electrolytic copper foil obtained by electrolyzing a copper electrolytic solution to attain the bending performance, the elect...
|
|
JP2009293103 |
To provide a copper foil with support suitable for the formation of fine wiring.The copper foil with support comprises: a metal foil as a support; a strippable layer; and an ultrathin copper foil layer, wherein protrusions having a heigh...
|
|
JP2009291293 |
To manufacture an ultra-small variable aperture apparatus as a stacked structure by using a plating process, other metal-layer formation process, and an etching process, and also to make small a shaking of a diaphragm blade as a movable ...
|
|
JP2009287091 |
To provide a method of manufacturing electric nickel for special shape plating, by which a part discolored to black does not occur on the base plate surface of an electrodeposited material even when plating is carried out with high curre...
|
|
JP2009289312 |
To provide a metal-clad laminate having a sufficient strength for forming a stable flying lead and meeting the demand of microfabricated circuit by using an electrolytic copper foil.In the metal-clad laminate, a copper foil layer formed ...
|
|
JP2009280892 |
To provide a method of manufacturing a large pore diameter mesoporous metal having uniform pore diameter exceeding 4 nm.The method includes following steps. (1) A surfactant capable of forming a lyotropic liquid crystal having a size (pa...
|
|
JP2009275276 |
To provide a three-dimensional structure having a conductive layer, wherein the conductive layer can be formed without undergoing a complicating, expensive vapor deposition method and a part of the conductive layer can be efficiently rem...
|
|
JP2009258232 |
To provide a method of manufacturing a mask in which a plating film is bonded directly to a frame not across a supporter screen to suppress a shape change of the plating film.The plating film 3 is formed on a substrate, the frame 1 which...
|
|
JP2009256772 |
To provide an electrode base body in an electrolytic metal foil production apparatus, which has a low electric contact resistance and prevents electric power loss.A curved surface-like anode base material 20 opposing to an electrodeposit...
|
|
JP2009249718 |
To provide a metal made stamper free from the occurrence of wrinkle or deformation around a fine recessed and projecting pattern.The metal made stamper having the recessed and projecting pattern includes: a recessed and projecting patter...
|
|
JP2009249643 |
To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high perform...
|
|
JP2009228127 |
To provide a method of manufacturing a movable component by electroforming comprising a simple step.The method for manufacturing the electroformed component includes: a step of arranging a child component 4 coated with a removable resin ...
|
|
JP2009228893 |
To provide a sliding part having strength and having high dimensional accuracy, and a timepiece using the same.An escape wheel 200 is composed of a first metallic layer 221, a second metallic layer 222 and a third metallic layer 223. A m...
|
|
JP2009221592 |
To provide a high-strength electrolytic copper foil which is an electrolytic copper foil for fine pitch circuit formation and can be used as an alternative to a Corson alloy foil.The electrolytic copper foil produced by electrolyzing a c...
|
|
JP2009203536 |
To provide a nickel plating solution capable of forming a plated coating film having high hardness and mitigated coating film stress.This invention relates to the nickel plating solution comprising a nickel sulfate aqueous solution, wher...
|
|
JP2009185384 |
To provide a novel method by which the flexibility of an electrolytic copper foil is improved.An untreated copper foil is surface-treated to have 310 Hv Vickers hardness, flexibility factor (F) of 0.01, 1.0-3.5 m roughness Rz of coarse r...
|
|
JP2009174058 |
To provide a metal belt and a coated belt each having excellent durability and a long life.The metal belt is made by an electroforming process using a nickel electrolytic bath containing a primary brightening agent and a secondary bright...
|
|
JP2009167523 |
To provide a conductive substrate for plating with which more uniform plating is possible, and to manufacture a substrate with a conductor layer pattern by using a transfer process with high productivity.There are provided the substrate ...
|
|
JP2009167497 |
To provide an electroformed product and an electroforming method wherein production processes can be shortened.In the electroforming method of manufacturing the electroformed product by forming an electroformed layer 2 having a pattern s...
|
|
JP2009157386 |
To manufacture a lens molding die capable of forming a diffraction structure for aberration correction in an optical lens without causing deterioration of diffraction efficiency or deterioration of a product value, and an optical element...
|
|
JP2009155710 |
To provide a method of manufacturing a fine structure having prescribed pattern shape and curved surface shape.When manufacturing an outer lens 14, a photolithography process comprising respective processes of resist coating, exposure an...
|
|
JP2009149943 |
To provide a bearing member having high fixing force between an electrocast part and a mold-molded part.The bearing member 7 is provided with the electrocast part 8 and the mold-molded part 9 formed by inserting the electrocast part 8 an...
|
|
JP2009147016 |
To provide a fluidic element which excels in a heat exchange properties and being capable of preventing deformations of a passage, and to provide a cooling device.This microreactor 10 is formed, by sequentially jointing a plurality of Cu...
|
|
JP2009138257 |
To provide a nickel stamp having flexibility.The nickel-plating solution contains 600 to 650 g/L of nickel sulfamate, 5 to 6 g/L of nickel chloride, and 25 to 35 g/L of boric acid. Such a nickel-plating solution can provide the nickel st...
|
|
JP2009138245 |
To provide electrolytic copper foil for a wiring board having flexibility and bendability equal to or above those of rolled copper foil, particularly, in thermal history applied when the electrolytic copper foil and a polyimide film are ...
|
