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JP2009091596 |
To provide a nozzle and a mesh having a corrosion resistance, heat resistance and wear resistance, particularly having improved heat resistance which is a problem of a nozzle formed by perforating various saphire or carbon plates and use...
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JP2009091600 |
To provide a method for forming an electroconductive layer having a transferred shape in an electrocasting method, which can forcibly peel the electroconductive layer from a master mold, and forms the electroconductive layer while contro...
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JP2009090423 |
To provide a manufacturing method of a new microstructure having a metal nanostructure which generates an intensified electric field by an antenna effect of a sharpened tip portion, and to provide the microstructure.The manufacturing met...
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JP2009084644 |
To provide a method for manufacturing a stamper, in which the stamper is formed by controlling the width of a projecting part pattern as desired while estimating an amount of side etching during pattern transfer by an imprinting method a...
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JP2009079295 |
To provide a nano-scale molecular assembly such as a conductive nano-wire.Specifically, there is provided a method for producing a molecular assembly, including two electrodes and an electrolytic cell holding an electrolyte and the two e...
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JP2009068107 |
To provide a manufacturing method of an electroforming die, capable of faithfully reproducing surface shape of a master for shibo by directly shibo processing (wave-shaped wrinkling) a mandrel.The manufacturing method of the electroformi...
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JP2009062603 |
To provide a method for producing an electroformed image such as a character with a pattern which can finely form an electroformed product in which cut patterns and various patterns are fitted to each surface of a characteristic, a symbo...
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JP2009056659 |
To provide a high-quality micro mold for making micro fluid chips or the like with a simple manufacturing method at a low cost within a short period of time.The micro mold is manufactured by forming a metal film to be the mold with elect...
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JP2009046742 |
To provide a method for producing a metal wire pattern where a satisfactory metal film can be securely formed on a supporting substrate having a rugged part with an optional shape in a submicron order; to provide a backlight system; and ...
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JP2009038806 |
To provide small-sized RF components.A plurality of components for guiding or controlling RF and microwave radiation are integrated by a plurality of electrodepositions and/or a plurality of laminated materials. The components include a ...
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JP2009021479 |
To provide a CIS solar battery, wherein a rugged shape with a high light scattering effect can be formed on the surface of a lower electrode positioned on the back surface side of a light absorbing layer, and its manufacturing method.An ...
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JP2009018594 |
To provide a screen printing plate, which is used to apply a periphery sealing compound to the circumference of a panel base plate for the liquid display panel device, and its manufacturing process that do not damage the liquid crystal d...
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JP2009021412 |
To provide a method of manufacturing a copper metal layer whose surface is blackened with good mass-productivity.In the method of manufacturing a pattern copper metal layer whose surface is blackened using a conductive base material 1 fo...
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JP2009013433 |
To provide an electroplating device capable of forming a plated film without unexpected variation of film thickness distribution during electroplating using an anode basket in which pellet-like metal particles are housed as a soluble ano...
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JP2008289903 |
To provide a way to store a solid substance and combine the solid substance with a liquid to form solution, and to rapidly transport the solution to an atomization device to allow the solution to be aerolized for administration, once the...
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JP2008285727 |
To provide an electrolytic copper foil which is not softened in a period while being stored at ordinary temperature after the foil production process of the copper foil has been finished and before the next manufacturing process starts, ...
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JP2008285708 |
To provide a mold assembly for forming an infrared-sensor cap, which can use a mold many times, can produce an excellent sensor cap even after having used the mold many times, thereby enhances an operation efficiency, and greatly improve...
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JP2008277376 |
To provide a metallic mesh sheet for shielding electromagnetic waves generating no result such as a distortion even when aging is conducted in a heating atmosphere at 50 to 80C by closely resembling physical properties such as the expans...
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JP2008266763 |
To provide a conductor roll for electrolytic treatment in metal electroplating and electrolytic copper foil equipment, wherein the generation of electrolytic corrosion marks, arc spots and the precipitation of plating onto the surface is...
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JP2008255462 |
To provide a copper foil with carrier sheet in which a carrier sheet can be peeled from a copper foil even if it is used for print wiring boards manufactured by press-worked at a temperature of 300C or higher.For solving the problem, the...
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JP2008248277 |
To provide an electro-casting method by which the shape of a surface opposed to a surface to be electrodeposited on a mother mold is controlled.A metallic formed product 1 is electrically cast by forming an insulating layer F on the oute...
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JP2008240142 |
To provide an electroforming mold for manufacturing a cylindrical component having strength, difficult to wear and high in dimensional precision, a method of manufacturing the same and cylindrical component for watch which is manufacture...
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JP2008230083 |
To manufacture efficiently and at a low cost a stamper in which a micro-order fine structure and a nano-order fine structure are intermingled.A base mold (substrate 10) has a layer of an electrodeposition resist layer 15 or a metal plati...
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JP2008208427 |
To provide a method of manufacturing electroforming mold by which the need of precise mask positionings when a first pattern layer and a second pattern layer are formed is eliminated and the displacement of the first pattern layer and th...
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JP2008208431 |
To provide an electroforming mold by which a plurality of electroformed components different in thickness are manufactured without dividing the electroforming mold and each of components has an electrode on the bottom surface, and to pro...
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JP2008193663 |
To provide a manufacturing method which is easier but allows complex structured components.Planar antennas 4a, 4b, 4c are part of substrate integrated structures, which are connected to electromagnetic waveguides. Furthermore, this inven...
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JP2008143101 |
To provide a method for manufacturing a flexible copper-clad laminated sheet having favorable flexibility characteristics by controlling the dislocation density of copper foil in a heat treatment process even if the electrolytic copper f...
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JP2008138279 |
To provide a method for manufacturing a bearing member by which an electroformed part can be separated from a master without causing undesired deformation or damage on the bearing surface.The close contact state between the electroformed...
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JP2008132738 |
To provide a mask of high printing quality which can make an ink fully adhere even to the remote end portion of the printing pattern when performing screen printing using a double-layer structured mask.Electrically-conductive layer, as t...
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JP2008133513 |
To provide an electrolytic copper foil which can be manufactured without needing a process of decomposing a water-soluble polymer that is added to an electrolytic solution of sulfuric acid and copper sulfate, which is used when manufactu...
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JP2008132433 |
To prevent a scratch from being formed when an electroformed mask tool is attached or detached.The electroformed mask tool is used for painting a molded product or a surface-coated product or coating the surface of the molded product and...
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JP2008132394 |
To provide a process for producing microspheres that are solid microparticles or liquid microparticles for use as an emulsion employed in the food industry, production of medicine and cosmetic, etc. or an emulsion for DDS (drug delivery ...
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JP2008126375 |
To reproducibly manufacture a complicated three-dimensional microstructure with a designated shape.A manufacturing method for a three-dimensional microstructure comprises the first process of forming layers of constituent components havi...
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JP2008126370 |
To obtain a technology for manufacturing a three-dimensional micro metallic structural body such as a micro coil, and obtain a method for manufacturing the three-dimensional micro metallic structural body suitable for mass production in ...
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JP2008121033 |
To provide an apparatus for electrolytically manufacturing a metal foil, which can uniformize the flow of an electrolyte solution supplied by a solution supply device and uniformly supply the electrolyte solution onto the surface of a ro...
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JP2008115409 |
To provide a method for manufacturing a high-temperature resistant metal substrate for a light ray-processing device and a structure of the high-temperature resistant metal substrate.An opposite mold body is formed by a plastic injection...
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JP2008115469 |
To provide a bar-code nanowire containing iron and gold and its manufacturing method.The bar-code nanowire containing iron and gold has magnetic and optical multifunctional properties and its magnetization intensity can be easily control...
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JP2008111701 |
To provide an electrodeposited component for a timepiece capable of emitting light brightly and keeping high adhesive force without a cost increase and to provide its manufacturing method.The electrodeposited component 20 comprises: an e...
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JP2008111173 |
To provide an electroforming roll as a roll original plate for electroforming for making a belt-like transferring die material used in the case patterns formed by fine ruggedness of the interference fringe of light (hologram), pictures o...
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JP2008100339 |
To provide a new application of a method of nanostructuring carried out with the aid of anodized porous alumina that creates products usable for advantage in a plurality of different fields.A substrate made of a transparent material 2 ha...
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JP2008101267 |
To provide an electrolytic copper foil, which has a low profile surface equivalent to conventional low-profile electrolytic copper foil and has very large mechanical strength, and to provide a method for manufacturing the same.In order t...
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JP2008095187 |
To provide a method for producing an ultraprecise component with an electrocasting method, which strongly integrates a substrate having high mechanical strength and superior thermal stability with an electrocast layer, does not cause dis...
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JP2008095161 |
To provide an anode significant for producing metal foil with uniform foil thickness and high quality at high productivity over a long period by preventing partial current concentration on an anode thereby uniformizing a current distribu...
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JP2008089617 |
To provide a method for inexpensively mass-producing a fine structure, in particular, a three-dimensional fine structure with high accuracy having an inclined sidewall, the three-dimensional fine structure being electroformed to be usabl...
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JP2008088530 |
To provide a method of manufacturing a high precision electroformed mold using the LIGA manufacturing method by electroplating a Ni-based alloy and filling a precipitate lamination layer in an opening of a fine template.In the electrofor...
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JP2008080586 |
To provide a die for transferring a precise pattern, a manufacturing method for the die, a microfabricated article having the precise pattern, and the microfabrication method.This die is manufactured by drawing an image by changing the s...
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JP2008081765 |
To provide a palladium alloy plating solution having high stability and capable of stably forming a plating film of a prescribed alloy composition with the palladium alloy plating solution.The palladium alloy plating solution contains a ...
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JP2008062213 |
To provide an efficient manufacturing method of a structure containing a hydrogen permeable membrane with a relatively simple method at a low cost.This manufacturing method of the hydrogen permeable membrane structure comprises following...
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JP2008057004 |
To provide a method of manufacturing a master for an electroforming mold, free from defects or mottles and having exact fine structure.The method of manufacturing the master for the electroforming mold comprises: (1) a step for mixing a ...
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JP2008050648 |
To provide a method capable of producing metal pigment flakes in a high yield, and to provide a plating tool.The metal pigment flakes are produced through: a stage where a disk (1) is coated with a release agent by being dipped into the ...
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