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Patent Searching and Data


Matches 601 - 650 out of 2,272

Document Document Title
JP2011162844
To provide a method for manufacturing an extra-thin wire of a compound semiconductor with high precision, which is suitable for mass production, and to provide an assembly of the extra-thin wire of the compound semiconductor.The manufact...  
JP2011164028
To accurately and precisely manufacture an extrafine and thin contact for an energization test fixture provided with a spring structure.A method of manufacturing the contact for the energization test fixture includes forming an Ni-electr...  
JP2011157596
To provide a method for manufacturing an MEMS (Micro Electro Mechanical Systems) device capable of maintaining a neatly aligned state when finally removing a sacrificial layer when manufacturing the MEMS device.The method for manufacturi...  
JP2011157622
To provide a method for manufacturing a microstructure, wherein easy manufacturing of a metal microstructure having a high aspect ratio with a high degree of precision is achieved.The method for manufacturing a microstructure includes th...  
JP2011153370
To provide a method of manufacturing a micro structure that increases the absorption of X-rays and is composed of high-aspect gold-plated materials.The method of manufacturing the micro structure composed of columnar gold-plated material...  
JP2011140101
To provide a manufacturing method capable of keeping a neatly arranged state when a sacrificial layer is finally removed in manufacturing a MEMS device.The manufacturing method includes: a step of forming a seed layer 2 on a base substra...  
JP2011129845
To produce and provide an electromagnetic wave shield that has precision of micron order of boring of a small hole inexpensively by electroforming.The electromagnetic wave shield 1 is made of metal, and alloy thereof can be freely select...  
JP2011115942
To obtain a nano-scale molecular assembly such as a conductive nanowire.Provided is a method for producing a molecular assembly, wherein two electrodes and an electrolytic cell holding an electrolyte and the two electrodes are included, ...  
JP2011094189
To provide a mechanical component in which eutectoid of a fibrous body is carried out in a state of being uniformly dispersed inside and which exhibits excellent wear resistance.A conductive film 11 is formed on the surface of a silicon ...  
JP2011089182
To provide an electroformed body which has a concave part on the surface thereof and in which a metal layer comprising a metallic material different from that of the electroformed body is formed on the bottom of the concave part so that ...  
JP2011089169
To provide a method for producing an electroformed body having a concave part of an optional pattern shape on one surface thereof so that a surface shape of the concave part is made different from those of other portions except the conca...  
JP2011089168
To provide an electroformed body on the surface of which a pattern, which has optional design properties such as a letter and a picture pattern, decorative properties and visibility, is formed by using a metal layer comprising a metallic...  
JP2011084774
To provide a method of manufacturing a high hardness nickel alloy electroformed blade without damaging it.A plating bath contains nickel sulfonate, citric acid and an alloy material supply source, wherein the concentration of nickel sulf...  
JP2011080157
To provide an ultrafine nozzle in which the inside diameter of the tip is made into the fine one of ≤30 μm, and further, the wall thickness of the nozzle is made thin, thus the discharge of a liquid is made smooth, and which is applic...  
JP2011077433
To provide a method of manufacturing a new terminal which can minimize the influence of burrs caused by breaking of a connection member, or is able to facilitate breaking of a connection member.The method of manufacturing a terminal incl...  
JP2011067950
To provide a pattern of a metallic film (mold) for conveniently manufacturing a metal work product or fine parts, and to provide a method of forming the pattern of a metallic film (mold).A curable resin composition 4 applied on a substra...  
JP2011056645
To provide a method for manufacturing a metallic microstructure, which manufactures a structural body superior in mechanical strength, simplifies the manufacturing process, while reducing costs.In the method for manufacturing the metalli...  
JP2011047004
To reduce the load of a finishing work after an electroforming by uniforming the thickness of a metal coating film as much as possible regardless of a portion of a master in the electroforming.A resinous regulation member 4 is fitted to ...  
JP2011042877
To provide a metallic porous body capable of keeping a satisfactory joint state between a body plate 2 and a frame body 3 over a long time in the metallic porous body comprising the body plate 2 having a number of independent through-hol...  
JP2011039287
To provide a metal belt and a fixing belt using the same which secure durability even when burden is increased due to a reduced diameter or deformation.The endless metal belt 10 has a metal layer containing nickel, wherein the metal laye...  
JP2011031219
To provide a separation membrane with nano-holes, excellent in fractionation, water-permeability, and fouling resistance.The separation membrane with nano-holes includes fine holes with a tapered shape: and in the separation membrane wit...  
JP2011032522
To provide a method for manufacturing patterned metal foil by which various types of fine-patterned metal foil can be produced.The method for manufacturing metal foil with a pattern formed on at least one side thereof, includes the steps...  
JP2011005605
To provide a microstructure, a donor substrate, and a microstructure manufacturing method capable of restraining sags due to grinding processing and deterioration of durability.In this microstructure 10, Ni film patterns 2A-2E comprising...  
JP2010261064
To provide machine parts which allows lubricating oil to be uniformly retained over the whole face of the side face.The machine parts are provided with: a metallic plate body 132 formed to have a prescribed thickness by electroforming; a...  
JP2010261083
To precipitate metal at uniform film thickness using a master.In the master 1 with a shape where arc parts 5, 7 and straight barrel parts 4, 6 are connected in succession, corner parts 8 between the arc parts and the straight barrel part...  
JP2010247418
To provide a laminated structure provided with laminated bodies of metallic films having ≥5 μm film thickness with certain intervals on a substrate, wherein the adhesive strength among the metallic films is made higher than a case tha...  
JP2010225260
To provide a mold and a method for producing the mold, which allow release of a duplicated plate formed on a groove-ridge shape of a Si original plate without generating chipped ridge portions of the duplicated plate.The method for produ...  
JP2010216014
To provide a mold for galvanoplasty and a method for fabricating the mold for galvanoplasty.There is disclosed a method of fabricating a mold 39' that includes the following steps of: (a) providing a substrate having a top layer 21' and ...  
JP2010215937
To provide a method for producing silica gel, which can deposit silica gel in a form of cylinder or a sheet from a solution of an alkaline silicate, in order to expand the use of the silica gel.This production method includes: adjusting ...  
JP2010216013
To provide a mold for galvanoplasty and a method for fabricating a mold for galvanoplasty, concerning the field of micromechanical parts, particularly micromechanical parts for timepiece movements.There is discloded a method (3) of fabri...  
JP2010196167
To provide a metal foil obtained by a method of manufacturing a patterned metal foil with high productivity.The method of manufacturing the patterned metal foil includes: (1) a step of depositing a metal by plating on the surface of a co...  
JP2010196169
To provided an apparatus and a method of producing a patterned conductive polymer film wherein production cost is reduced and particularly reproducibility is improved.The apparatus for producing the patterned conductive polymer film incl...  
JP2010189759
To provide a component for a clock, the component having excellent shock resistance and high dimensional accuracy, and to provide a clock using the component.The component for a clock includes: a claw 101 that has a plurality of concavo-...  
JP2010173015
To provide a nickel plated film used as a coupling member for an electrodeposition cutting tool, in particular, with the excellent retention power of abrasive grains, and to provide the cutting tool using such a nickel-plated film and a ...  
JP2010174380
To provide a method of manufacturing an electroformed component by which an electroformed component is taken out from an electroforming die without deforming, dissolving and destroying the electroforming die.The method of manufacturing a...  
JP2010113937
To prevent a failure, such as a rupture at a coil connection during heat treatment, and to perform uniform heat treatment regardless of a shape of a heat-treated part.A high-frequency induction heating coil 1 is molded by electroforming ...  
JP2010100942
To provide an ultra-thin copper foil with carrier, wherein an ultra-thin copper foil having minimized number of pinholes is formed, by plating, on a peeling layer that withstands high working temperature, and to provide a printed circuit...  
JP2010084162
To provide a method for manufacturing replica molds, by which a fine pattern of a master mold can be transferred to a mother mold with a good precision, a fine pattern of the mother mold can be transferred to a replica mold with a good p...  
JP2010084158
To provide an electroforming method by which the shape of the surface of a metal layer on the side opposite from the face electrically deposited to a matrix can be controlled.The matrix 11 is fabricated by opening a cavity 15 in an insul...  
JP2010077476
To provide a method of manufacturing a stamper by which difference in height of unevenness of a pattern of a mother stamper is increased for solving the following problems: a resist layer is made thinner with the narrowing and the densif...  
JP2010078147
To provide a mechanical part, a method for manufacturing the mechanical part, a mechanical part assembly and a clock capable of softening stress when fitting a shaft member and capable of improving productivity.In the mechanical part 126...  
JP2010077528
To provide a machine part capable of reducing the frictional force and holding lubricant in the sliding to other part and capable of improving the yield, a method of manufacturing the same and a clock.In the machine part 126g formed by e...  
JP2010059550
To provide a contact or adhered mask plating or electrochemical fabrication process or apparatus that provides enhanced quality of the plating operations.The conformable contact mask plating process for manufacturing a structure includes...  
JP2010058325
To provide a copper foil enabling a via hole to be made, which penetrate the surface copper foil and a resin base material but not penetrating a copper foil surface as an underlayer, and to provide a multilayered wiring board which achie...  
JP2010047842
To provide an electrolytic copper foil for a printed wiring board at a low cost, which is excellent in adhesion between a glossy surface of the copper foil and a resist, and allows low profile by improving adhesive strength when the glos...  
JP2010043336
To provide a large-scale production method for easily producing a metal nanoparticle array in which metal nanoparticles oriented in the same direction are arranged at a desired pitch.The production method of the metal nanoparticle array ...  
JP2010037654
To provide an electrolytic copper foil having flexibility/bending ability equivalent to or better than that of rolled copper foil.The electrolytic copper foil is produced such that after thermal treatment is applied to the electrolytic c...  
JP2010024493
To provide an electric connection member having a connection surface having a metallized layer fitted to the requirement of micronization, high aspect and mutual connection, and to provide a method of manufacturing the same.The electric ...  
JP2010018885
To provide an electrolytic copper coating film that develops plasticity and flexibility equal to or greater than those of a rolled copper foil after applying the heat history in the circuit board fabrication process, especially a heat hi...  
JP2010013738
To provide a surface treated copper foil laminated with a liquid crystal polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility...  

Matches 601 - 650 out of 2,272