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Matches 651 - 700 out of 5,222

Document Document Title
JP5889543B2  
JP5889443B2  
JP5886041B2  
JP5883485B2  
JP2016507652A
本発明は、硫酸銅溶液の逆流による電解銅箔 の生産方法及びシステムであって、陰極ロー ルと陽極槽を含み、陽極槽両側の上端口は陰 極ロールの両側にあり、陽極槽の中には...  
JP5875350B2  
JP5873894B2  
JP5870148B2  
JP2016027190A
【課題】表面が平滑性で、かつ伸びに優れる アルミニウム膜を連続的に製造可能なアルミ ニウムめっき液の提供。【解決手段】基材表 面にアルミニウムを電着させることが可...  
JP5859078B1
【課題】絶縁基板と貼り合わせる際の反りの 発生が良好に抑制されたキャリア付銅箔を提 供する。【解決手段】キャリア、中間層、極 薄銅層をこの順に備えたキャリア付銅箔...  
JP5858849B2  
JP5854875B2  
JP5854872B2  
JP5855259B2  
JP5855244B2  
JP2016023322A
【課題】本発明は、水分吸着量が少ない三次 元網目状構造を有するアルミニウム多孔体の 製造方法を提供することを目的とする。【解 決手段】三次元網目状構造を有する樹脂...  
JP5850574B2  
JP5851165B2  
JP2016017205A
【課題】電鋳部品であって、打ち込みやカシ メ等により別部品との嵌合により、クラック 、破壊等の破損を生ぜず、高硬度、耐磨耗性 、高耐久バネ性等に優れた電鋳部品を提...  
JPWO2013176133A1
樹脂と良好に接着し、且つ、銅箔をエッチン グで除去した後の樹脂の透明性に優れた表面 処理銅箔及びそれを用いた積層板を提供する 。表面処理銅箔は、粗化処理表面側から...  
JP2016000480A
To provide an injection molding machine individually reducing design surface molding dies in weight with a simple configuration and being capable of easily replacing the design surface molding dies with respect to a mother die in accorda...  
JPWO2013161334A1
絶縁基板への積層工程前にはキャリアと極薄 銅層との密着力が高い一方で、絶縁基板への 積層工程後にはキャリアと極薄銅層との密着 性が低下し、キャリア/極薄銅層界面で...  
JPWO2013153578A1
電鋳により製造される、幅に対する高さの比 率が大きなハイレシオ部品を形成するための 電気鋳造部品の製造方法を提供する。部品4 0の移植工程において部品40の転倒又...  
JP5830635B1
キャリアピール強度の調整が簡便にできるキ ャリア付き極薄銅箔等を提供する。本発明の キャリア付き極薄銅箔(10)は、キャリア 箔(11)上に、拡散防止層(12)、...  
JP2015214750A
To provide a copper foil with a carrier having good suppressed change of peel strength of the carrier before and after heating press of the copper foil with the carrier.The copper foil with a carrier has the carrier, an intermediate laye...  
JP5826322B2  
JP2015212426A
To provide surface-treated copper foil which allows removal of copper foil at reasonable costs without the need of etching in removing copper foil from a resin substrate after sticking of the resin substrate to the copper foil or impairm...  
JP5823005B1
【課題】極薄銅層に対する回路形成性が良好 なキャリア付銅箔の製造方法の提供。【解決 手段】キャリア、中間層、極薄銅層、シラン カップリング処理層を含む表面処理層を...  
JP5822928B2  
JP2015206119A
To provide a copper foil having an improved peel strength for a flexible printed circuit board (FPC) suitable for a high-frequency application, in which a copper foil is laminated on a liquid crystal polymer (LCP), because making a surfa...  
JP5814168B2  
JP2015199354A
To provide carrier-provided copper foil having good circuit formability.Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carri...  
JP2015200026A
To provide carrier-provided copper foil having good circuit formability.Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carri...  
JP2015200025A
To provide carrier-provided copper foil having good circuit formability.Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carri...  
JP5810249B1
二次電池製造時のハンドリング性に優れ、1 50℃、1時間加熱しても引張り強度が低下 しない電解銅箔を提供し、さらに該電解銅箔 を集電体として用いることでサイクル寿...  
JP5810197B2  
JP2015193884A
To provide an electrolytic copper foil capable of effectively preventing circuit peeling caused by insertion or the like in an etching stage upon circuit formation, thus contributing to the facilitation of fine line processing and the im...  
JP2015531816A
【課題】種々の均一なまたは層状のハイブリ ッドナノ構造体を電界誘導アッセンブリ法に よって組立てる。【解決手段】ナノ要素、お よびナノ構造体は、導電性、半導電性ま...  
JP5803301B2  
JP5803771B2  
JP2015188314A
To make it possible to manufacture a cell-capturing device by which high repeatability can be obtained regarding capturing performance.According to a cell-capturing metal filter 30, because identification parts which identify a direction...  
JP2015188316A
To provide a cell-capturing metal filter sheet which is suitable for mass production of cell-capturing metal filters and dimensional stability of the cell-capturing metal filter.A cell-capturing metal filter sheet 300 comprises: a plural...  
JP5799393B2  
JP2015183240A
To provide a surface-treated copper foil free from the need of etching when removing a copper foil from a resin substrate after sticking the resin substrate to the copper foil, and enabling removing a copper foil at an excellent cost wit...  
JP2015183294A
To provide an electrolytic copper foil that reduces the formation of copper particles on a copper foil surface and is particularly applicable to the application of a printed circuit board and a lithium ion secondary battery.In a method f...  
JP5798351B2  
JP5797133B2  
JP2015180777A
To provide a copper foil having improved peel strength as a copper foil for a flexible printed board (FPC) having the copper foil laminated on a liquid crystal polymer (LCP) suitable for high-frequency use.There is provided a surface-tre...  
JP2015178683A
To provide a manufacturing method of a microstructure in which a metal microstructure with high aspect ratio can be obtained highly accurately and easily.A manufacturing method of a microstructure has: a first process in which a first in...  
JP5789723B2  

Matches 651 - 700 out of 5,222