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Patent Searching and Data


Matches 651 - 700 out of 5,513

Document Document Title
WO/1993/009460A1
A film (24) suitable for use as the light modulating unit of a light valve (27) comprises a cross-linked polymer matrix having droplets (26) of liquid light valve suspension distributed in the cross-linked polymer matrix, and a light val...  
WO/1992/020204A1
The means of the invention for the selective formation of a thin oxidising layer by means of permanganate on polymers, glass fibres and ceramics but not on copper consists of an aqueous solution of potassium permanganate adjusted to a pH...  
WO/1992/014867A1
A green ceramic shape is formed by electrophoretic deposition on to a mandrel from a slurry of finely divided ceramic material in a carrier liquid. The mandrel is supported in the slurry and an electric field is applied to deposit materi...  
WO/1992/005952A1
A dense, smooth, ductile, hard, highly reflective, corrosion-resistant, temperature resistant, and wear-resistant crystalline alloy of nickel, cobalt and boron. The alloy is epitaxially electrodeposited on an activated substrate (16) usi...  
WO/1992/001087A1
Copper roofing panels and like contoured articles are formed from copper sheets electrolytically deposited on an electrode during an electrowinning process. The contoured roofing panels are formed by pressing planar copper sheets strippe...  
WO/1991/019024A1
This invention relates to electrodeposited copper foil having an elongation measured at 180 �C in excess of about 5.5 %, an ultimate tensile strength measured at 23 �C in excess of about 60,000 psi, and a matte-side Rtm in the range ...  
WO/1991/007700A1
In the process, negative moulds of the microstructures are produced from plastics material on an electrically conducting substrate by electron-beam lithography, X-ray lithography or microforming techniques, and the cavities in the negati...  
WO/1991/004358A1
Copper conductive foil (20) for use in preparing printed circuit boards is electrodeposited from an electrolyte solution (18) containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughnes...  
WO/1990/012350A1
The invention relates to a method for producing a heatable and refrigerable element (12) for a system handling small amounts of liquid and to an element manufactured by the method. The element comprises flow channels (11) and one or more...  
WO/1990/009865A1
In order to manufacture a working copy of an endless metallic strip (3) provided with an embossed pattern for use in the continuous production of pressed laminates, a polyurethane casting in the form of an endless elastic plastic strip (...  
WO/1990/008208A1
A drum cathode (10) for the production of metal foil, the drum having a titanium top cylinder (26) and a steel base cylinder (28) integrally connected by welding a niobium or vanadium ring (54) to the top cylinder (26), a copper ring (56...  
WO/1990/002828A1
A method of fabricating a hollow jewellery object in which an electrically conductive coating is applied to part (18) of a non-conductive mandrel or mould (10), the coated mandrel being presented for a first dip into an electrolyte conta...  
WO/1989/004749A1
It has hitherto been difficult to achieve the even deposition of a cup-shaped body from slurry flowing around a mandrel. This specification discloses a deposition apparatus including control means providing a substantially uniform slurry...  
WO/1988/010327A1
An electrodeposited foil having isotropic tensile elongation properties. The foil is formed by a process and apparatus wherein the plating surface is polished in a random manner. This provides a surface finish on the plating surface havi...  
WO/1988/006647A1
A copper layer is deposited on the outer surface of a straight horizontal first run (3) of an endless belt (1), and is treated on the first run (3) to enhance its bonding to dielectric material. The belt (1) is moved so that the treated ...  
WO/1988/006195A1
Plant for making an extra thin metal sheet by electrolytic deposition on a movable cathode and further separation of the deposit. The movable cathode is comprised of a metal belt (1) tensioned between two parallel preferably motor-driven...  
WO/1987/003915A1
A process and apparatus for producing surface treated metal foil. The process comprises plating a relatively smooth metal foil onto a cathodic surface (12) and thereafter forming a dendritic layer on the foil and firmly bonding it theret...  
WO/1987/003364A1
Thermal ink jet printhead and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly (28). This assembly includes constricted ink flow ports (58) to reduce cavitation damage and smooth, contoured c...  
WO/1986/004015A1
A novel in-mold electrodeposition process for the production of plastic parts having conductive polymeric coatings such as polypyrroles or polythiophenes. Parts produced according to the novel disclosed in-mold electrodeposition process ...  
WO/1983/003850A1
A method for the connection of a metallic connector, the connector including a metallic member having a plurality of holes through a thickness of the member, to a metallic surface in order to provide an electrical contact between the con...  
WO/1983/002784A1
A die (12) used for plastic injection molding is masked on its inner surface with a plating resist (11) to leave only a selected area exposed. A conforming anode (14) is fit into the die leaving a small clearance between the die cavity s...  
JPWO2016038923A1
【課題】回路パターン形成後の視認性が良好 であり、常態ピール強度が高くかつ耐熱ピー ル強度が高水準で維持される配線板用銅箔及 び銅張積層板を提供する。【解決手段】...  
JPWO2015170715A1
キャリアと銅箔層との界面の剥離強度のバラ ツキを低減させることで、安定した引き剥が し作業を行うことを可能とするキャリア付銅 箔を提供することを目的とする。この目...  
JPWO2015152380A1
キャリアを剥離した後の銅箔に酸化が生じ難 いキャリア付銅箔を提供することを目的とす る。この目的を達成するため、キャリア、剥 離層、銅箔の順に積層されたキャリア付...  
JPWO2015133296A1
本発明は、燃料電池の電極に利用可能な、耐 食性により優れた金属多孔体を安価に提供す ることを目的とする。ニッケル(Ni)、ス ズ(Sn)及びクロム(Cr)を含む三...  
JP2017061080A
[Subject] It is enabling physical exfoliation of a resin base material when a releasing layer is provided in metallic foil and the metallic foil concerned is pasted together to a resin base material, Metallic foil which can paste togethe...  
JP2017061720A
[Subject] It is enabling physical exfoliation of a resin base material when a releasing layer is provided in metallic foil and the metallic foil concerned is pasted together to a resin base material, Metallic foil which can paste togethe...  
JP2017508890A
照度が低いでありながらも接着強度が優秀な 銅箔が提案される。提案された銅箔は、少な くとも一つの表面に凹凸が形成されて、表面 に微細粒子層が形成された銅箔として、...  
JP2017061718A
[Subject] It is enabling physical exfoliation of a resin base material when a releasing layer is provided in metallic foil and the metallic foil concerned is pasted together to a resin base material, Metallic foil which can paste togethe...  
JPWO2015122258A1
キャリアピール強度の調整が簡便にできるキ ャリア付き極薄銅箔等を提供する。本発明の キャリア付き極薄銅箔(10)は、キャリア 箔(11)上に、拡散防止層(12)、...  
JPWO2015118977A1
めっき室内に水分及び酸素が侵入することの ないアルミニウム膜の製造方法及び製造装置 の提供。溶融塩電解液中で、導電性が付与さ れた長尺状の多孔性樹脂基材の表面にア...  
JPWO2015099156A1
銅よりも良好な低熱膨張性能、良好な導電性 能、及び、銅エッチング液による良好な溶解 性という3つの特性を兼ね備えたプリント配 線板製造用複合金属箔の提供を目的とす...  
JPWO2015111542A1
本発明は、微細な導通路を担保しつつ、絶縁 性基材の絶縁耐圧を向上することができる微 細構造体、多層配線基板および微細構造体の 製造方法を提供することを課題とする。...  
JPWO2015104999A1
二次電池製造時のハンドリング性に優れ、1 50℃、1時間加熱しても引張り強度が低下 しない電解銅箔を提供し、さらに該電解銅箔 を集電体として用いることでサイクル寿...  
JP6100375B2  
JP6099778B1
[Subject] In the layered product which produced copper foil with a career by laminating on a resin substrate, the copper foil with a career which can be satisfactorily exfoliated from a career in an ultra-thin copper layer is provided. [...  
JPWO2015076180A1
サイドエッチングの問題を解消しつつ、パタ ーン付ロール製造時の感光材剥離処理におけ る感光材の剥離性及びパターン付ロールを用 いて転写した際の転写物の剥離性に優れ...  
JP2017053004A
[Subject] Offer of a method which is not restricted to prototypal shape or a size but forms thick large-sized Electroforming shell at high efficiency, high quality, and low cost. [Means for Solution] In an electroforming method which mak...  
JPWO2015080052A1
250℃以上の温度が負荷される銅張積層板 製造に用いても、銅箔層からキャリア箔を容 易に引き剥がすことの可能なキャリア箔付銅 箔の提供を目的とする。この目的を達成...  
JP2017048444A
[Subject] Film thickness of the present invention is thin, and it makes it a subject to provide aluminum foil excellent in breaking strength. [Means for Solution] aluminum foil those [whose] of a crystal for Distribution of aluminum foil...  
JP2017048467A
[Subject] It aims at offer of copper foil which has good adhesion nature with an insulating resin substrate, and is provided with good etching performance equivalent to unroughened copper foil compared with unroughened copper foil. [Mean...  
JP2017048453A
[Subject] A manufacturing method of aluminum foil by electrolysis from which quality aluminum foil is obtained that it is easy to exfoliate from a cathode drum made from titanium is provided. [Means for Solution] A process which aluminum...  
JP2017048423A
[Subject] A contact probe containing a nickel tungsten alloy and it which are excellent in heat resistance and ductility is provided. [Means for Solution] As for a nickel tungsten alloy, content of the tungsten is [in / are below 10.0 at...  
JPWO2015063910A1
[課題]穿刺の際の痛みを軽減させるととも に、安価で高精度に製造できる針及びその製 造方法を提供する。[解決手段]電解液に芯 材122を浸漬し、芯材122の外周面...  
JP6090741B2  
JPWO2015030209A1
熱の吸収性及び放熱性が良好な表面処理金属 材を提供する。表面処理金属材は、金属材の 熱伝導率が32W/(m・K)以上であり、 表面のJISZ8730に基づく色差Δ...  
JPWO2015040998A1
無粗化銅箔に比べて、絶縁樹脂基材との良好 な密着性を有し、且つ、無粗化銅箔と同等の 良好なエッチング性能を備える銅箔の提供を 目的とする。この目的を達成するため、...  
JPWO2015029881A1
本発明は、マイクロポアへの金属充填が容易 となり、かつ、金属充填に伴う残留応力の発 生を抑制することができる金属充填微細構造 体の製造方法を提供することを課題とす...  
JPWO2015033917A1
プリント配線板を構成する表面処理銅箔と絶 縁樹脂基材との密着性のバラツキが極めて少 ないものとする表面処理銅箔の提供を目的と する。この目的を達成するため、電解銅...  
JPWO2015016271A1
FCCLまたはFPC等のプリント配線基板 用銅箔に求められる、厚さが18μm以下の 箔であって、ロールtoロールの搬送で箔 れやシワが起こらず、ポリイミド硬化...  

Matches 651 - 700 out of 5,513