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Matches 651 - 700 out of 5,386

Document Document Title
JP2016186105A
[Subject] Fall control and stabilization of aluminum ion concentration on the surface of a cathode pole are attained, and a manufacturing method and a manufacture device of electrolysis aluminum foil which can continuously and fully supp...  
JP6014920B1
[Subject] Provide a metal compound hydrogen permeable film which is excellent in hydrogen permeability, and its manufacturing method. [Means for Solution] A metal compound hydrogen permeable film is provided with the following. Hydrogen ...  
JP6014186B2  
JP6010580B2  
JP2016176714A
[Subject] It is the Electrocasting parts which have a sliding part, and provides what has the high holdout of lubricating oil in a sliding part. [Means for Solution] A photomask and an exposure machine optical system which are used when ...  
JP2016176090A
[Subject] In Electroformed mold for Electrocasting part production for transfer reproduction being carried out by pressurization and heating at a resin board etc., and also an electric conduction film for Electrocasting being formed in t...  
JP2016172896A
[Subject] Metal membranes, such as gold which has the meso-porous structure which was not able to be realized until now, are provided. [Means for Solution] By making this micell deposit on an electrode, a meso-porous film of the metal co...  
JP2016529115A
金属マイクロニードルを作製する方法が開示 される。ある方法は、モールドピラーを準備 することと、有孔導電層をモールドピラー上 に形成することと、導電層上に金属層を...  
JP2016168687A
[Subject] Compound metallic foil which has the peel strength which carried out stable at lower levels also after a heating compression process, and its manufacturing method are provided. [Means for Solution] Career 2 which consists of me...  
JP2016166420A
[Subject] Surface treatment copper foil which can give profile shape of a substrate side after copper foil removal of maintaining detailed wiring formation nature and realizing good adhesion power of an unelectrolyzed copper plating coat...  
JP2016160503A
[Subject] Though thickness is thin and mechanical strength is high, electric parts and a battery containing an electrolytic copper foil which is a low rough degree in which the Takanobu growth is possible, and an electrolytic copper foil...  
JP2016526514A
本発明は、薄膜フィルムの巻取り装置及びそ れを用いた巻取り方法に関する。本発明によ る薄膜フィルムの巻取り装置は、薄膜フィル ムを巻き取る巻取り装置において、薄膜...  
JP5981743B2  
JPWO2014051123A1
銅箔または銅合金箔の上に、粗化(トリート )処理を施すことにより形成された粗化処理 層、この粗化処理層の上に形成されたNi− Co層からなる耐熱層、及びこの耐熱層...  
JP5979117B2  
JP5973921B2  
JP2016148114A
[Subject] The laser perforation nature of an ultra-thin copper layer is good, and provides suitable copper foil with a career for production of a large-scale-integration board. [Means for Solution] Copper foil with a career whose 60-degr...  
JP2016148113A
[Subject] A method of manufacturing a vapor deposition mask in which a penetration hole which has complicated shape was formed using plating processing is provided. [Means for Solution] The 2nd membrane formation process of forming the 2...  
JP2016149438A
[Subject] It excels in a transmission characteristic and provides suitable processing copper foil for a high printed wired board with the degree of cloudy weather tear off, and have strength and low after etching (HAZE value), and the hi...  
JPWO2014045986A1
溶融塩を含む電解液が供給される電解槽中で 、基材上にアルミニウムを電着させてアルミ ニウム膜を製造する方法であって、前記電解 液におけるアルミニウムが電析する際の...  
JP5971312B2  
JP5970861B2  
JP5970217B2  
JP2016146477A
[Subject] Even if it performs Desmear processing, surface treatment copper foil which can give profile shape of a substrate side after copper foil removal of having desired concavo-convex shape and realizing good adhesion power of an une...  
JPWO2014038717A1
樹脂と良好に接着し、且つ、銅箔をエッチン グで除去した後の樹脂の透明性に優れた表面 処理銅箔及びそれを用いた積層板を提供する 。表面処理銅箔は、銅箔を、粗化処理表...  
JP2016145390A
[Subject] Omission of roughening particles in a roughening particle layer provided in the ultra-thin copper layer side surface are controlled satisfactorily, and peel intensity provides good copper foil with a career. [Means for Solution...  
JP2016141833A
【課題】厚さの異なる金属箔や特定の積層構 造を有する金属箔を製造するに際しても、生 産量の低下やその物性変動を生じさせにくい 金属箔の製造装置を提供する。【解決手...  
JP5963824B2  
JP5959149B2  
JP5961117B2  
JP2016135917A
[Subject] It provides that it is possible to form a very detailed circuit, and there is copper foil with a career which can control disconnection of a circuit satisfactorily. [Means for Solution] It is copper foil with a career which has...  
JP2016135924A
[Subject] When removing copper foil from a resin base material after pasting a resin base material together to copper foil, there is no necessity of etching, and surface treatment copper foil which can remove copper foil at good cost is ...  
JP2016132251A
[Subject] Thickness is thin, and an aperture has a small detailed hole and manufactures porous metallic foil with a base material which can provide new penetrable metallic foil and it which made conductivity, electromagnetic wave cover n...  
JP2016520708A
The become [independent] type metal article and preparation method by which a metal article is Electrocasting (ed) on a conductive mandrel are indicated. A mandrel has an outside surface coat which has the pattern by which preliminary fa...  
JP2015527481A5  
JP2016128799A
[Subject] A method of producing an element with which it was ornamented for a portion of an ornament clock or a jewel which can obtain an ornament of complicated shape exact enough is provided. [Means for Solution] This method is about d...  
JP2016125120A
[Subject] Tensile strength does not fall so much by hot heat treatment to which the present invention is added by a manufacturing process of a rigid printed board, a flexible printed wiring board, or a rechargeable lithium-ion battery, I...  
JP2016125072A
[Subject] It is quality and efficient and manufactures metal goods which have a fine pattern. [Means for Solution] It is characterized by a manufacturing method of metal goods comprising the following. A process of being a manufacturing ...  
JP2016121394A
[Means for Solution] Electrolytic copper foil 1 which it is electrolytic copper foil 1 used for manufacture of a copper foil laminate sheet, and ranges of a surface factor SC value in which it does not adhere to resin film 2, and which p...  
JP5941959B2  
JP5942115B2  
JP2016113653A
[Subject] Electrocasting parts in which a silicon part was embedded in the arbitrary depth are manufactured with sufficient accuracy by an easy method. [Means for Solution] Photoresist layer 2 is applied to the surface of silicon substra...  
JP2016113645A
[Subject] Electrolytic copper plating liquid which can form a copper coat which is excellent in the smooth nature of a plating side, and does not curve in the surface side of plating with time progress at a concave is provided. [Means fo...  
JP2016113644A
[Subject] Provide electrolytic copper plating liquid which can form a copper coat which is excellent in the surface smoothness of a plating side, and does not curve in the surface side of plating with time progress at a concave. [Means f...  
JP2016108601A
[Subject] In order to perform plating processing to a pillar-shaped structure, a jig suitable for holding using the side etc. are proposed. [Means for Solution] In order to perform plating processing, it is plating jig 1 holding a struct...  
JP2016108621A
[Subject] A lithium ion capacitor using metallic foil with high intensity with which a penetration hole was formed, a manufacturing method of the metallic foil, and its metallic foil as a current collection object is provided. [Means for...  
JP5930091B2  
JPWO2014002996A1
引張強度に優れ、300℃で1時間加熱して も引張強度がそれほど低下せず、導電率も良 好な電解銅箔を提供し、該電解銅箔を集電体 として用いることでサイクル特性を高め...  
JP2016103552A
[Subject] A manufacturing method of a tabular member with a projection electrode which can manufacture simple and efficiently electronic parts which have both a beer electrode (projection electrode) and a tabular member is provided. [Mea...  
JPWO2014002997A1
引張強度と導電率を高めた電解銅箔及びその 製造方法を提供し、該電解銅箔を集電体とし た負極電極を用いたリチウムイオン二次電池 を提供する。本発明の電解銅箔は、透過...  

Matches 651 - 700 out of 5,386