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Patent Searching and Data


Matches 651 - 700 out of 5,446

Document Document Title
WO/1986/004015A1
A novel in-mold electrodeposition process for the production of plastic parts having conductive polymeric coatings such as polypyrroles or polythiophenes. Parts produced according to the novel disclosed in-mold electrodeposition process ...  
WO/1983/003850A1
A method for the connection of a metallic connector, the connector including a metallic member having a plurality of holes through a thickness of the member, to a metallic surface in order to provide an electrical contact between the con...  
WO/1983/002784A1
A die (12) used for plastic injection molding is masked on its inner surface with a plating resist (11) to leave only a selected area exposed. A conforming anode (14) is fit into the die leaving a small clearance between the die cavity s...  
JP2017025405A
[Subject] Circuit formation nature provides good copper foil with a career. [Means for Solution] Copper foil with a career whose ten-point average coarseness Rz of the ultra-thin copper layer side surface it is copper foil with a career ...  
JPWO2014132947A1
キャリア箔と極薄銅箔と、前記キャリア箔と 前記極薄銅箔との間に剥離層が形成されたキ ャリア付き極薄銅箔であって、前記剥離層は 金属Bの析出割合が金属Aの析出割合よ...  
JP2017025406A
[Subject] Circuit formation nature provides good copper foil with a career. [Means for Solution] It is copper foil with a career which has a career, the middle class, and an ultra-thin copper layer in this order, and the crystal grain nu...  
JP2017025409A
[Subject] The laser perforation nature of an ultra-thin copper layer is good, and provides suitable copper foil with a career for production of a large-scale-integration board. [Means for Solution] Copper foil with a career equips one fi...  
JP6073947B2  
JPWO2014119583A1
300℃×1時間の熱処理後に常温で測定し 引張強さが500MPa以上の、電解銅箔 提供すること。また、ポリイミドフィルム 張り合わせるプリント配線板において...  
JPWO2014119656A1
従来の電解銅箔を超える高温加熱後の物理的 特性に優れ、リチウムイオン二次電池の負極 集電体用途にも適した電解銅箔の提供を目的 とする。この目的を達成するため、常態...  
JPWO2014115681A1
【課題】常態における機械的強度が大きく、 約300℃に加熱しても熱劣化がしにくい電 解銅合金箔を提供すること。【解決手段】p H4以下の液中では酸化物として存在す...  
JP2017020080A
【課題】大型の基板に対応することができる 蒸着マスクを提供する。【解決手段】蒸着マ スク20の長手方向における一対の端部を構 成する一対の耳部17と、一対の耳部1...  
JPWO2014119582A1
常温での引張強度が650MPa以上、30 0℃で1時間の熱処理後に常温で測定した引 張強度が450MPa以上、導電率が60% 以上の電解銅箔を提供する。pH4以下...  
JPWO2014119355A1
銅の結晶粒3の内部又は銅の結晶粒3同士の 粒界に、平均粒径0.5〜100nmの介在 物5を有し、前記介在物が無機化合物及び/ 又は有機化合物を含み、前記無機化合物...  
JP6067910B1
[Subject] Endurance over stress accompanying charge and discharge is high like a rechargeable lithium-ion battery, and it aims at providing an electrolytic copper foil suitable for copper foil for rechargeable lithium-ion batteries as wh...  
JP6067256B2  
JP6066484B2  
JP2017013385A
[Subject] Copper foil with a career which can suppress a rise of peel strength of career foil even if it gives a hot and prolonged heat history, namely, peel strength stabilized is provided. [Means for Solution] It is the copper foil wit...  
JPWO2014104233A1
製造・加工ラインでのハンドリングが容易で あり、フィルム貼付工程で掛かる熱処理後の 低反発性に優れ、電気機器の小型化に対し対 応可能であり、且つ結晶粒組織の過度な...  
JP2017014608A
[Subject] It excels in handlability at the time of rechargeable battery manufacture, and provides an electrolytic copper foil to which it pulls and intensity does not fall even if it heats for 1 hour in 150 °C , Provide a rechargeable l...  
JP2017008410A
[Subject] Copper foil with a career with thickness of an ultra-thin copper layer able to control satisfactorily generating of a pinhole which arises at the time of career influence peel-off about 0.9 micrometer or less of copper foil wit...  
JP2017008411A
[Subject] Copper foil with a career with thickness of an ultra-thin copper layer able to control satisfactorily generating of a pinhole which arises at the time of career influence peel-off about 0.9 micrometer or less of copper foil wit...  
JP2017008377A
[Subject] It can respond to slimming down and provides a manufacturing method of a bimetallic element which can make flexibility of a design of shape high. [Means for Solution] It is characterized by a manufacturing method of a bimetalli...  
JP2017008357A
[Subject] A metal mask with Vickers hardness comparable as what was produced by the unelectrolyzed plating method, and printing durability higher than what was produced by the conventional electric nickel plating method, and a manufactur...  
JP6058182B1
[Subject] Circuit formation nature provides good copper foil with a career. [Means for Solution] Copper foil with a career whose ten-point average coarseness Rz of the ultra-thin copper layer side surface it is copper foil with a career ...  
JP2017005053A
[Subject] A mask for ball arrangement which makes R shape a periphery edge part of a tip part of a projection which protrudes on the mask back, and does not need advanced technical capabilities for height adjustment of a projection, and ...  
JPWO2014081041A1
ファインピッチ化が可能で且つ樹脂との密着 信頼性に優れた表面処理電解銅箔、積層板、 及びプリント配線板を提供する。触針式粗度 計を用いて測定される銅箔の粗面の粗度...  
JPWO2014080958A1
絶縁基板への積層工程前にはキャリアと極薄 銅箔の密着力が高い一方で、絶縁基板への積 層工程によるキャリアと極薄銅箔の密着性の 極端な上昇や低下がなく、キャリア/極...  
JP6055378B2  
JP6055379B2  
JP6054523B2  
JP2016214712A
[Subject] Heat like laser processing provides a manufacturing method of a stent which is not generated at the time of processing. [Means for Solution] One mode of the present invention is drawing optical hardenability or thermosetting re...  
JP6044546B2  
JP2016207790A
[Subject] Corresponding to narrow-pitched [of an electrode on a work], a mask for suction of a solder ball provided with a suction hole at a narrower interval is provided, having required and sufficient strength of structure. [Means for ...  
JP2016204747A
[Subject] This indication is related with copper foil showing improved curl-proof and the wrinkles-proof characteristic, and a manufacturing method of the copper foil. [Means for Solution] Typically, a difference [of this indication] of ...  
JP2016204706A
[Subject] The pace of expansion after heat treatment is highly provided with folding endurance, and the unusual projections by the side of a rough side are few electrolytic copper foils, and when a copper-clad laminate sheet is used, the...  
JP2016206670A
[Subject] A formation method of a mask which can provide and form a resin layer in the state where it stuck simply and certainly, on the surface of a base material layer, and a manufacturing method of a printed-circuit board, Electroform...  
JP6039540B2  
JP6038748B2  
JP2016199775A
[Subject] A method of manufacturing a vapor deposition mask in which a penetration hole which has complicated shape was formed using plating processing is provided. [Means for Solution] A low adhesion field where a vapor deposition mask ...  
JP2016537514A
:1.5<= (Rmax*Rz) /Ra<=6.5 which is provided with an electrolytic copper foil with which center line average coarseness (Ra), the maximum height (Rmax), and ten-point average height (Rz) of a precipitation side fill the following formula ...  
JP6029764B2  
JP6032207B2  
JP6031624B2  
JP6030229B2  
JP6029629B2  
JP2016194112A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  
JP2016193524A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  
JP6028563B2  
JP2016191135A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  

Matches 651 - 700 out of 5,446