Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 651 - 700 out of 5,178

Document Document Title
JP5799393B2  
JP2015183240A
To provide a surface-treated copper foil free from the need of etching when removing a copper foil from a resin substrate after sticking the resin substrate to the copper foil, and enabling removing a copper foil at an excellent cost wit...  
JP2015183294A
To provide an electrolytic copper foil that reduces the formation of copper particles on a copper foil surface and is particularly applicable to the application of a printed circuit board and a lithium ion secondary battery.In a method f...  
JP5798351B2  
JP5797133B2  
JP2015180777A
To provide a copper foil having improved peel strength as a copper foil for a flexible printed board (FPC) having the copper foil laminated on a liquid crystal polymer (LCP) suitable for high-frequency use.There is provided a surface-tre...  
JP2015178683A
To provide a manufacturing method of a microstructure in which a metal microstructure with high aspect ratio can be obtained highly accurately and easily.A manufacturing method of a microstructure has: a first process in which a first in...  
JP5789723B2  
JP2015172250A
To provide surface-treated copper foil excellent in fine wiring formation.Surface-treated copper foil is provided with a surface treatment layer formed on copper foil. When spray-etched with a hydrogen peroxide/sulfuric acid type copper ...  
JP5786906B2  
JP5786459B2  
JP2015527481A
製造される開口板の孔または細孔の寸法を有 する垂直カラムのパターンに、フォトレジス ト(21)が付着される。このマスクパター ンは、エアロゾル粒径を画定する開口を...  
JP2015163740A
To provide a copper foil with a carrier having excellent circuit formability on the surface of an ultrathin copper layer.A copper foil with a carrier has the carrier, an intermediate layer, an ultrathin copper layer and a roughening-trea...  
JP2015163737A
To provide a production method for obtaining metal particles having high durability and excellent designing property to be used as taggant particles.An example of the production method of metal particles includes: a rugged pattern format...  
JP5773624B2  
JP2015155565A
【課題】 一方の面と他方の面で性状に大きな違いがな い電解アルミニウム箔およびその製造方法を 提供すること。また、この電解アルミニウム 箔を用いた蓄電デバイス用集...  
JP2015155564A
【課題】 箔の折り曲りや捩じれによって巻き取りに支 障が生じることがない優れた可撓性を有する 、厚みが20μm以下の薄い電解アルミニウ 箔を提供すること。また、こ...  
JP5771392B2  
JP2015151580A
To provide porous metal foil having a high opening ratio to a degree of being utilizable as a transparent conductive film, and mass-producible in an inexpensive and simple process.Provided is porous metal foil made of a two-dimensional n...  
JP2015151581A
To provide a new technology in an electroformed article having a multilayer structure, for increasing an adhesive force between metal plating layers constituting the electroformed article.A method for manufacturing an electroformed artic...  
JP5767100B2  
JP2015145535A
To provide a platinum-based mesoporous metal film that has a larger diameter and a larger specific surface area than conventional ones and therefore can be used as a catalyst of high activity applicable to a large molecule.A thin aqueous...  
JP5764192B2  
JP5758034B2  
JP5759169B2  
JP5758035B2  
JP5758033B2  
JP2015140440A
To provide an aluminum plating liquid having large current density region capable of aluminum plating and small liquid resistance.There is provided an aluminum plating liquid containing an aluminum halide, one or more kinds selected from...  
JPWO2013140941A1
内部抵抗及び製造コストを低減することがで きる集電体、電極及び非水電解質二次電池を 提供する。シート状の三次元網状金属多孔体 からなり、前記シート状の三次元網状金...  
JP2015137934A
To provide a timepiece component having high decorativeness while maintaining mechanical strength.A timepiece component includes: a shaft driving part 11 that is a contact portion with other components, and is disposed on a center part o...  
JPWO2013129508A1
黒化処理面をレーザー孔明け加工表面として 使用する銅張積層板のレーザー孔明け加工性 能の向上を目的とする。この目的達成のため 、「キャリア箔2/剥離層3/バルク銅...  
JP5755371B2  
JP2015521237A
銅電着物を製造するための銅電気めっき浴が 記載される。銅電気めっき浴は、(a)可溶 性銅塩と、(b)1種以上の酸を含む電解質 と、(c)アルキルジアミン、アリール...  
JP2015134953A
To provide a surface-treated copper foil having excellent fine wiring formability.There is provided a surface-treated copper foil which is obtained by forming a surface treatment layer on a copper foil, wherein when the surface-treated c...  
JP5752301B2  
JP5751810B2  
JP2015127136A
To provide a copper foil with a carrier having preferable circuit formability on an ultrathin copper layer surface.Because it has been found that control of light absorbency of an ultrathin copper layer surface of a copper foil with a ca...  
JP5746402B2  
JP5744407B2  
JP2015124423A
To provide an electrolytic aluminum foil which can stabilize discharging and charging efficiency.The electrolytic aluminum foil is provided which has a base material peeling surface and a precipitation surface, and has roughness Ra of bo...  
JP2015117409A
To provide an electrodeposition drum capable of maintaining the adhesiveness with a seal ring for a long period by inhibiting abrasion of both ends of a titanium plate in a width direction in polishing using an elastic grindstone, capabl...  
JP2015117436A
To provide a surface-treated copper foil, which can be well bonded to a resin and has excellent transparency of the resin after the copper foil is removed by etching; and a laminate using the same.The copper foil surface except for a rou...  
JP5740055B2  
JP5740052B2  
JP2015113521A
To provide an electrolytic copper foil which has high glossiness and can be produced in a short period of time.There is provided the electrolytic copper foil that has an area ratio occupied by a (100) plane in which deviation from <001> ...  
JP2015110843A
To provide a surface-treated copper foil and a laminate using the copper foil, having good adhesiveness to a resin, excellent transparency of the resin after the copper foil is removed by etching, and a low transmission loss of signals.T...  
JP5735265B2  
JP5730742B2  
JP5732004B2  
JP5727592B2  

Matches 651 - 700 out of 5,178