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Patent Searching and Data


Matches 651 - 700 out of 2,272

Document Document Title
JP2010007127
To provide an electroconductive base material for plating, from which a conductor layer pattern being patterned and free from plating burning and a base material with the conductor layer pattern can be manufactured with good productivity...  
JP2010007095
To provide a plating method for easily forming a conductive layer pattern in high productivity; to provide a plating method using a conductive material having excellent durability for plating; and to provide a plating method by which a p...  
JP2010003967
To manufacture a patterned conductor layer pattern or a substrate with the conductor layer pattern with sufficient productivity, and to provide the conductive substrate for plating excellent in durability.At the conductive substrate for ...  
JP2009299100
To supply an electrolytic copper foil provided with bending performance as same as a rolled copper foil.In the electrolytic copper foil obtained by electrolyzing a copper electrolytic solution to attain the bending performance, the elect...  
JP2009293103
To provide a copper foil with support suitable for the formation of fine wiring.The copper foil with support comprises: a metal foil as a support; a strippable layer; and an ultrathin copper foil layer, wherein protrusions having a heigh...  
JP2009291293
To manufacture an ultra-small variable aperture apparatus as a stacked structure by using a plating process, other metal-layer formation process, and an etching process, and also to make small a shaking of a diaphragm blade as a movable ...  
JP2009287091
To provide a method of manufacturing electric nickel for special shape plating, by which a part discolored to black does not occur on the base plate surface of an electrodeposited material even when plating is carried out with high curre...  
JP2009289312
To provide a metal-clad laminate having a sufficient strength for forming a stable flying lead and meeting the demand of microfabricated circuit by using an electrolytic copper foil.In the metal-clad laminate, a copper foil layer formed ...  
JP2009280892
To provide a method of manufacturing a large pore diameter mesoporous metal having uniform pore diameter exceeding 4 nm.The method includes following steps. (1) A surfactant capable of forming a lyotropic liquid crystal having a size (pa...  
JP2009275276
To provide a three-dimensional structure having a conductive layer, wherein the conductive layer can be formed without undergoing a complicating, expensive vapor deposition method and a part of the conductive layer can be efficiently rem...  
JP2009258232
To provide a method of manufacturing a mask in which a plating film is bonded directly to a frame not across a supporter screen to suppress a shape change of the plating film.The plating film 3 is formed on a substrate, the frame 1 which...  
JP2009256772
To provide an electrode base body in an electrolytic metal foil production apparatus, which has a low electric contact resistance and prevents electric power loss.A curved surface-like anode base material 20 opposing to an electrodeposit...  
JP2009249718
To provide a metal made stamper free from the occurrence of wrinkle or deformation around a fine recessed and projecting pattern.The metal made stamper having the recessed and projecting pattern includes: a recessed and projecting patter...  
JP2009249643
To provide a plating die for manufacturing a metal foil having an opening by peeling a metal foil formed by plating from a conductive base material, the plating die superior in repetition of manufacturing of metal foils with high perform...  
JP2009228127
To provide a method of manufacturing a movable component by electroforming comprising a simple step.The method for manufacturing the electroformed component includes: a step of arranging a child component 4 coated with a removable resin ...  
JP2009228893
To provide a sliding part having strength and having high dimensional accuracy, and a timepiece using the same.An escape wheel 200 is composed of a first metallic layer 221, a second metallic layer 222 and a third metallic layer 223. A m...  
JP2009221592
To provide a high-strength electrolytic copper foil which is an electrolytic copper foil for fine pitch circuit formation and can be used as an alternative to a Corson alloy foil.The electrolytic copper foil produced by electrolyzing a c...  
JP2009203536
To provide a nickel plating solution capable of forming a plated coating film having high hardness and mitigated coating film stress.This invention relates to the nickel plating solution comprising a nickel sulfate aqueous solution, wher...  
JP2009185384
To provide a novel method by which the flexibility of an electrolytic copper foil is improved.An untreated copper foil is surface-treated to have 310 Hv Vickers hardness, flexibility factor (F) of 0.01, 1.0-3.5 m roughness Rz of coarse r...  
JP2009174058
To provide a metal belt and a coated belt each having excellent durability and a long life.The metal belt is made by an electroforming process using a nickel electrolytic bath containing a primary brightening agent and a secondary bright...  
JP2009167523
To provide a conductive substrate for plating with which more uniform plating is possible, and to manufacture a substrate with a conductor layer pattern by using a transfer process with high productivity.There are provided the substrate ...  
JP2009167497
To provide an electroformed product and an electroforming method wherein production processes can be shortened.In the electroforming method of manufacturing the electroformed product by forming an electroformed layer 2 having a pattern s...  
JP2009157386
To manufacture a lens molding die capable of forming a diffraction structure for aberration correction in an optical lens without causing deterioration of diffraction efficiency or deterioration of a product value, and an optical element...  
JP2009155710
To provide a method of manufacturing a fine structure having prescribed pattern shape and curved surface shape.When manufacturing an outer lens 14, a photolithography process comprising respective processes of resist coating, exposure an...  
JP2009149943
To provide a bearing member having high fixing force between an electrocast part and a mold-molded part.The bearing member 7 is provided with the electrocast part 8 and the mold-molded part 9 formed by inserting the electrocast part 8 an...  
JP2009147016
To provide a fluidic element which excels in a heat exchange properties and being capable of preventing deformations of a passage, and to provide a cooling device.This microreactor 10 is formed, by sequentially jointing a plurality of Cu...  
JP2009138257
To provide a nickel stamp having flexibility.The nickel-plating solution contains 600 to 650 g/L of nickel sulfamate, 5 to 6 g/L of nickel chloride, and 25 to 35 g/L of boric acid. Such a nickel-plating solution can provide the nickel st...  
JP2009138245
To provide electrolytic copper foil for a wiring board having flexibility and bendability equal to or above those of rolled copper foil, particularly, in thermal history applied when the electrolytic copper foil and a polyimide film are ...  
JP2009127105
To provide a method of manufacturing electroforming components by which an electroforming mold is formed on a substrate having projecting and recessed parts on the surface by using photoresist highly precisely without leaving residue on ...  
JP2009126066
To provide a method for repairing a metallic die, in which the time required to form an electroformed layer can be shortened and the physical strength of the electroformed layer can be improved and to provide a method for reinforcing the...  
JP2009102749
To form a multi-layer three-dimensional structure by electrodepositing both of a structural material and a sacrificial material on a substrate.This method for manufacturing the multi-layer three-dimensional structure comprises the steps ...  
JP2009102743
To form a multi-layer three-dimensional structure by electrodepositing both of a structural material and a sacrificial material on a substrate.This method for manufacturing the multi-layer three-dimensional structure comprises the steps ...  
JP2009091596
To provide a nozzle and a mesh having a corrosion resistance, heat resistance and wear resistance, particularly having improved heat resistance which is a problem of a nozzle formed by perforating various saphire or carbon plates and use...  
JP2009091600
To provide a method for forming an electroconductive layer having a transferred shape in an electrocasting method, which can forcibly peel the electroconductive layer from a master mold, and forms the electroconductive layer while contro...  
JP2009090423
To provide a manufacturing method of a new microstructure having a metal nanostructure which generates an intensified electric field by an antenna effect of a sharpened tip portion, and to provide the microstructure.The manufacturing met...  
JP2009084644
To provide a method for manufacturing a stamper, in which the stamper is formed by controlling the width of a projecting part pattern as desired while estimating an amount of side etching during pattern transfer by an imprinting method a...  
JP2009079295
To provide a nano-scale molecular assembly such as a conductive nano-wire.Specifically, there is provided a method for producing a molecular assembly, including two electrodes and an electrolytic cell holding an electrolyte and the two e...  
JP2009068107
To provide a manufacturing method of an electroforming die, capable of faithfully reproducing surface shape of a master for shibo by directly shibo processing (wave-shaped wrinkling) a mandrel.The manufacturing method of the electroformi...  
JP2009062603
To provide a method for producing an electroformed image such as a character with a pattern which can finely form an electroformed product in which cut patterns and various patterns are fitted to each surface of a characteristic, a symbo...  
JP2009056659
To provide a high-quality micro mold for making micro fluid chips or the like with a simple manufacturing method at a low cost within a short period of time.The micro mold is manufactured by forming a metal film to be the mold with elect...  
JP2009046742
To provide a method for producing a metal wire pattern where a satisfactory metal film can be securely formed on a supporting substrate having a rugged part with an optional shape in a submicron order; to provide a backlight system; and ...  
JP2009038806
To provide small-sized RF components.A plurality of components for guiding or controlling RF and microwave radiation are integrated by a plurality of electrodepositions and/or a plurality of laminated materials. The components include a ...  
JP2009021479
To provide a CIS solar battery, wherein a rugged shape with a high light scattering effect can be formed on the surface of a lower electrode positioned on the back surface side of a light absorbing layer, and its manufacturing method.An ...  
JP2009018594
To provide a screen printing plate, which is used to apply a periphery sealing compound to the circumference of a panel base plate for the liquid display panel device, and its manufacturing process that do not damage the liquid crystal d...  
JP2009021412
To provide a method of manufacturing a copper metal layer whose surface is blackened with good mass-productivity.In the method of manufacturing a pattern copper metal layer whose surface is blackened using a conductive base material 1 fo...  
JP2009013433
To provide an electroplating device capable of forming a plated film without unexpected variation of film thickness distribution during electroplating using an anode basket in which pellet-like metal particles are housed as a soluble ano...  
JP2008289903
To provide a way to store a solid substance and combine the solid substance with a liquid to form solution, and to rapidly transport the solution to an atomization device to allow the solution to be aerolized for administration, once the...  
JP2008285727
To provide an electrolytic copper foil which is not softened in a period while being stored at ordinary temperature after the foil production process of the copper foil has been finished and before the next manufacturing process starts, ...  
JP2008285708
To provide a mold assembly for forming an infrared-sensor cap, which can use a mold many times, can produce an excellent sensor cap even after having used the mold many times, thereby enhances an operation efficiency, and greatly improve...  
JP2008277376
To provide a metallic mesh sheet for shielding electromagnetic waves generating no result such as a distortion even when aging is conducted in a heating atmosphere at 50 to 80C by closely resembling physical properties such as the expans...  

Matches 651 - 700 out of 2,272