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Patent Searching and Data


Matches 651 - 700 out of 5,415

Document Document Title
JP6055378B2  
JP6055379B2  
JP6054523B2  
JP2016214712A
[Subject] Heat like laser processing provides a manufacturing method of a stent which is not generated at the time of processing. [Means for Solution] One mode of the present invention is drawing optical hardenability or thermosetting re...  
JP6044546B2  
JP2016207790A
[Subject] Corresponding to narrow-pitched [of an electrode on a work], a mask for suction of a solder ball provided with a suction hole at a narrower interval is provided, having required and sufficient strength of structure. [Means for ...  
JP2016204747A
[Subject] This indication is related with copper foil showing improved curl-proof and the wrinkles-proof characteristic, and a manufacturing method of the copper foil. [Means for Solution] Typically, a difference [of this indication] of ...  
JP2016204706A
[Subject] The pace of expansion after heat treatment is highly provided with folding endurance, and the unusual projections by the side of a rough side are few electrolytic copper foils, and when a copper-clad laminate sheet is used, the...  
JP2016206670A
[Subject] A formation method of a mask which can provide and form a resin layer in the state where it stuck simply and certainly, on the surface of a base material layer, and a manufacturing method of a printed-circuit board, Electroform...  
JP6039540B2  
JP6038748B2  
JP2016199775A
[Subject] A method of manufacturing a vapor deposition mask in which a penetration hole which has complicated shape was formed using plating processing is provided. [Means for Solution] A low adhesion field where a vapor deposition mask ...  
JP2016537514A
:1.5<= (Rmax*Rz) /Ra<=6.5 which is provided with an electrolytic copper foil with which center line average coarseness (Ra), the maximum height (Rmax), and ten-point average height (Rz) of a precipitation side fill the following formula ...  
JP6029764B2  
JP6032207B2  
JP6031624B2  
JP6030229B2  
JP6029629B2  
JP2016194112A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  
JP2016193524A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  
JP6028563B2  
JP2016191135A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of a metal layer is high, and a...  
JP2016191086A
[Subject] Before a lamination process to an insulating board, there are no extreme rise and fall of adhesion nature of a career, a career by a lamination process to an insulating board while adhesion power of ultra-thin copper foil is hi...  
JP6021127B2  
JP2016186105A
[Subject] Fall control and stabilization of aluminum ion concentration on the surface of a cathode pole are attained, and a manufacturing method and a manufacture device of electrolysis aluminum foil which can continuously and fully supp...  
JP6014920B1
[Subject] Provide a metal compound hydrogen permeable film which is excellent in hydrogen permeability, and its manufacturing method. [Means for Solution] A metal compound hydrogen permeable film is provided with the following. Hydrogen ...  
JP6014186B2  
JP2015067872A5  
JP6010580B2  
JP2016176714A
[Subject] It is the Electrocasting parts which have a sliding part, and provides what has the high holdout of lubricating oil in a sliding part. [Means for Solution] A photomask and an exposure machine optical system which are used when ...  
JP2016176090A
[Subject] In Electroformed mold for Electrocasting part production for transfer reproduction being carried out by pressurization and heating at a resin board etc., and also an electric conduction film for Electrocasting being formed in t...  
JP2016172896A
[Subject] Metal membranes, such as gold which has the meso-porous structure which was not able to be realized until now, are provided. [Means for Solution] By making this micell deposit on an electrode, a meso-porous film of the metal co...  
JP2016529115A
The method of producing metal microneedle is indicated. A certain method includes preparing a mold pillar, forming a perforated electric conduction layer on a mold pillar, and making a metal layer deposit on an electric conduction layer,...  
JP2016168687A
[Subject] Compound metallic foil which has the peel strength which carried out stable at lower levels also after a heating compression process, and its manufacturing method are provided. [Means for Solution] Career 2 which consists of me...  
JP2016166420A
[Subject] Surface treatment copper foil which can give profile shape of a substrate side after copper foil removal of maintaining detailed wiring formation nature and realizing good adhesion power of an unelectrolyzed copper plating coat...  
JP2016160503A
[Subject] Though thickness is thin and mechanical strength is high, electric parts and a battery containing an electrolytic copper foil which is a low rough degree in which the Takanobu growth is possible, and an electrolytic copper foil...  
JP2016526514A
The present invention relates to a method of rolling round which used a take-up motion of a thin film film, and it. In a take-up motion with which a take-up motion of a thin film film by the present invention rolls round a thin film film...  
JP5981743B2  
JPWO2014051123A1
A roughening treating layer formed by performing roughening (Treat) processing on copper foil or copper alloy foil, A heat-resistant layer which consists of a nickel*Co layer formed on this roughening treating layer, and Zn formed on thi...  
JP5979117B2  
JP5973921B2  
JP2016148114A
[Subject] The laser perforation nature of an ultra-thin copper layer is good, and provides suitable copper foil with a career for production of a large-scale-integration board. [Means for Solution] Copper foil with a career whose 60-degr...  
JP2016148113A
[Subject] A method of manufacturing a vapor deposition mask in which a penetration hole which has complicated shape was formed using plating processing is provided. [Means for Solution] The 2nd membrane formation process of forming the 2...  
JP2016149438A
[Subject] It excels in a transmission characteristic and provides suitable processing copper foil for a high printed wired board with the degree of cloudy weather tear off, and have strength and low after etching (HAZE value), and the hi...  
JPWO2014045986A1
It is the method of making aluminum electrodepositing and manufacturing an aluminum film on a substrate in the electrolysis vessel to which the electrolysis solution containing fusion salt is supplied, A manufacturing method of the alumi...  
JP5971312B2  
JP5970861B2  
JP5970217B2  
JP2016146477A
[Subject] Even if it performs Desmear processing, surface treatment copper foil which can give profile shape of a substrate side after copper foil removal of having desired concavo-convex shape and realizing good adhesion power of an une...  
JPWO2014038717A1
The laminate sheet using surface treatment copper foil and it excellent in the transparency of resin after pasting up satisfactorily with resin and removing copper foil by etching is provided. After surface treatment copper foil pastes c...  

Matches 651 - 700 out of 5,415