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Patent Searching and Data


Matches 701 - 750 out of 4,748

Document Document Title
WO/2002/058442A1
A flexible printed wiring board composed of: an electrolytic copper foil which has not undergone surface roughening; a zinc-based metallic layer deposited on the electrolytic copper foil in an amount of 0.25 to 0.40 mg/dm?2¿; and a poly...  
WO/2002/057516A2
A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation or a thermoplastic through a porous metal substrate (sheet, screen, mesh or f...  
WO/2002/057515A2
A continuous electroforming process to form a strip for battery electrodes, comprising the steps of providing a mandrel having on its surface a reusable pattern subdivided into conductive and non-conductive areas; moving said mandrel thr...  
WO/2002/053805A1
A cathode electrode for producing an electrolytic copper foil, which can be continuously used over a long time of at least 3000 hours, requires a minimum maintenance work, and can contribute to a reduction in running costs of producing e...  
WO/2002/054129A1
In order to precisely align an optical waveguide (7) in relation to an electro-optical component (2), said electro-optical component is fixed to a submount (1) which can be arranged on any site on a carrier (4). A coupling element (3) co...  
WO/2002/040207A1
The invention concerns the manufacture of diamond wire (2) and the beads (1) therefor by making the beads by electroformation of metal on a filament in a layer of diamond grit (3) to embed the diamond in the metal and subsequently removi...  
WO/2002/038834A1
(1) Porous nickel foil for an alkaline battery cathode, which is porous nickel foil formed by an electrolytic deposition method, having a thickness of 10-35 $g(m)m and a Vickers hardness of 70-130, the porous nickel foil formed by an ele...  
WO/2002/030362A1
The invention relates to a dental moulded part which can be produced from ceramic particles by firing the green product obtained therefrom. The structure of said moulded part contains ceramic fibres and/or nanocrystalline particles. The ...  
WO/2002/030361A1
The invention relates to a method for producing ceramic moulded parts for dental use, by using a mixture containing at least one ceramic powder and by solidifying the mixture containing at least one metallic powder by sintering. The sint...  
WO/2002/029136A1
A method is disclosed for the manufacture of colloidal rod particles as nanobarcodes. Figure 3 shows an embodiment of the invention using a four-layer stack on a silicon wafer substrate (101). the substrate (101) is overlaid with conduct...  
WO/2002/027073A1
A method for producing a metal mask, characterized in that it comprises forming a Cr film (2) having a mask pattern (2a) on the surface of a glass substrate (1), forming a dry film (4) on the Cr film (2), exposing the dry film (4) from t...  
WO/2002/024444A1
A carrier-equipped ultrathin copper foil which comprises a laminate of a separation layer, a diffusion preventing layer, and an electric copper plating layer, or a diffusion preventing layer, a separation layer, and an electric copper pl...  
WO/2002/016758A1
The invention relates to a swirl plate WHICH IS characterized in that it comprises at least one inlet zone (65) and at least one outlet opening (69), the at least one outlet opening (69) being disposed in a lower bottom layer (62). The s...  
WO/2002/014585A1
A cathode electrode material which is extensively usable in metal electrolytic winning and easy to maintain, can produce quality deposit metals in terms of physical properties and shapes, and is used to electro-deposit metals, characteri...  
WO/2002/000966A1
The invention relates to an electroforming die (10) for the electroforming of products, which die comprises a structure of interconnected, electrically conductive metal die tracks, the structure comprising a random, disordered network (3...  
WO/2001/088228A1
An electrolysis apparatus equipped with a circulating system, wherein an adjusted copper sulfate solution containing thiourea added thereto is electrolyzed in an electrolysis vessel to produce an electrolytic copper foil, a copper sulfat...  
WO/2001/088226A2
The invention relates to a method of manufacturing an Al or alloy workpiece, comprising the steps of (a) providing an AlAl alloy workpiece, (b) pre-treating of the outersurface of the Al or Al alloy workpiece, and (c) plating a metal lay...  
WO/2001/085053A1
The invention relates to the production of substructures, especially copings, consisting of ceramic material, preferably alumina. The stump of a work model is lined with a film or a separating agent. This lining is made electroconductive...  
WO/2001/084747A2
Optical mirror elements for high bandwidth free space optical communication are produced by an electroforming replication technique. Onto the precision surface of a mandrel that is a negative of the required optical surface a layer of me...  
WO/2001/081657A2
A rotation element (9,10), especially a contact cylinder is used to electrically contact printed circuit boards and conductor films in order to produce printed circuit boards and conductor films (7) wherein there is only a low amount of ...  
WO/2001/077415A1
The disclosure of the present invention provides a method for fabricating an imprint tool master. The process begins by providing a metallic substrate on which a first layer of photoresist is placed. An image pattern mask is then aligned...  
WO/2001/077416A2
Copper foil produced on a rotating drum cathode machine, wherein each of the outer edge portions of a web of the foil has a thickness greater than the thickness of the central portion of the web. In the process and apparatus used to elec...  
WO/2001/071065A1
A hole structure having fine openings and drilled deep through holes, and a production method therefor. The hole structure is characterized by having through holes having first openings and second openings larger in size than the first o...  
WO/2001/068940A1
A method of replicating a structured surface that includes providing a tool having a structured surface having a surface morphology of a crystallized vapor deposited material; and replicating the structured surface of the tool to form a ...  
WO/2001/064433A1
A carrier foil-pasted metal foil comprising a carrier foil layer and a metal foil layer pasted together via an organic phase boundary layer, wherein the metal foil layer consists of one of nickel, tin, cobalt, chromium, lead, iron and zi...  
WO/2001/063016A1
A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release l...  
WO/2001/063015A1
A method of manufacturing a stamper, comprising the steps of manufacturing, by electrocasting, a father (4) from an original disk (I3) having a resist pattern formed thereon, laterally connecting a plurality of the donut-shaped fathers (...  
WO/2001/057932A1
Substrates known in the art for use in flexible CIS solar cells have a series of drawbacks. The aim of the invention is to overcome these drawbacks. To this end, the substrate is characterized by a layer structure that comprises a chromi...  
WO/2001/056343A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056344A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056342A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/056345A1
A surface treated copper foil for use in a printed wiring board which has been subjected to a roughening treatment and a rust inhibiting treatment for its surface, wherein the rust inhibiting treatment has been carried out by a method co...  
WO/2001/051687A1
A production method for ferrules, which uses one or a plurality of metal or plastic line(s) (9) as a master block and removes the line(s) (9) after electrocasting, characterized in that the line(s) (9) is electrocast by being rotated wit...  
WO/2001/049903A1
An electrolytic copper foil having the low temperature annealing property that the crystal structure of the electrolytic copper foil undergoes recrystallization through the heat history during the manufacture of a copper clad laminate us...  
WO/2001/048272A1
An electrolytic copper foil, characterized in that 20 % or more of crystals in the lustrous face side thereof have twin structure; a method for manufacturing the electrolytic copper foil by an electrolysis process comprising preparing a ...  
WO/2001/048271A1
A method of producing metal ferrules and a device therefor, wherein metal ferrules are produced with high productivity and high dimensional accuracy by arranging a plurality of long-sized core wires. A metal ferrule producing method and ...  
WO/2001/048270A1
A dimensionally accurate small-sized metal ferrule and a method of producing the same, wherein the energy cost is low and an expensive molding machine or mold is not required. A metal ferrule having an inner diameter of 0.125 - 0.130 mm ...  
WO2000032273A9
This invention is directed to a radioactive expandable stent (See Fig. 2) useful for implantation into an artery or the like. In one aspect of this invention, the stents can be made into radioactive beta emitters by direct exposure to th...  
WO/2001/043196A1
A method for forming an ordered structure of fine metal particles for use in a single electron element, which comprises forming a self-assembly membrane (11) of APTS on a substrate (13), depositing metal particles (12) on the self-assemb...  
WO/2001/034879A1
An electrolytic copper foil with a carrier foil comprising a carrier foil layer, an organic jointing interface layer formed on the carrier foil layer and an electrolytic copper foil layer formed on the interface layer, characterized in t...  
WO/2001/034880A1
An electrolytic copper foil with a carrier foil having a carrier foil, a bonding interface layer formed thereon, and an electrolytic copper foil formed on the interface layer, characterized in that the carrier foil is a copper foil and t...  
WO/2001/032963A1
Copper foil having electrodeposited on at least one thereof a stainproofing layer containing chromium, zinc and nickel, and providing improved protection from oxidation at elevated temperatures, e.g., 400 °F and higher, while being easi...  
WO/2001/031095A1
A one-step, integrated process and apparatus for producing electrolytic copper foil (10) having a dual-layer copper bond enhancing treatment electrodeposited on the matter side of the foil, which employs two 'super-anodes' (27, 28) on a ...  
WO/2001/026498A1
A system for producing a die includes means for generating a reference CAD model of a die of desired dimensions and a production facility arranged to produce an oversized casting of the die from a mould thereof. The system includes, furt...  
WO/2001/025510A1
An apparatus and synthetic methods for manufacture of segmented nanoparticles are described. The nanoparticles of the present invention may be comprised of any material, including metal, metal chalcogenide, a metal oxide, a metal sulfide...  
WO/2001/021403A1
Disclosed are a roller screen capable of being manufactured by an electroforming process with a low cost and a method of manufacturing the same. In the manufacturing method of the roller screen, a master roller screen is manufactured by ...  
WO/2001/021859A1
An electrolytic copper foil with a carrier foil comprising a carrier foil, a fine copper particle layer for the copper foil and an organic bonding interface layer formed between the carrier foil and the fine copper particle layer, and a ...  
WO/2001/021282A2
A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge o...  
WO/2001/018280A1
A method for performing an aperture plate (10) comprises providing a mandrel (26) that is constructed of a mandrel body (28) having a conductive surface (30) and a plurality of non-conductive islands (32) disposed on the conductive surfa...  
WO/2001/016402A1
A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that ...  

Matches 701 - 750 out of 4,748