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Patent Searching and Data


Matches 751 - 800 out of 4,748

Document Document Title
WO/2001/014135A1
Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surfa...  
WO/2001/012880A2
The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathod...  
WO/2001/004384A1
The invention relates to a method for producing micro stamping tools which is designed to achieve a highly accurate reproductible match between said micro stamping tools, such as a force plate with stamps and a cutting plate, and to achi...  
WO/2001/000905A1
A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one und...  
WO/2000/073056A1
The invention relates to a method for producing microcomponents with at least one individual layer, which has functional layers (3) on the walls of inner structures such as flow channels. The aim of the invention is to produce microcompo...  
WO/2000/074047A1
A substrate (3) coated with photoresist (2) is exposed to light lineally through a lens (1). The portion to be exposed is shifted from the first exposure position (O¿1?) to a position (O¿2?) spaced from the first exposure position (O¿...  
WO/2000/068465A1
Disclosed is a technique for manufacturing an Ni-Fe alloy thin foil using an electrodeposition-based plating process of a single step without requiring processes such as melting, casting, forging, and rolling processes. A manufacturing a...  
WO/2000/057743A2
A system for setting a gemstone in a hollow jewellery piece, comprises means for creating a metallic attachment region secured to a surface of the gemstone, and a bonding means for bonding the at least one metallic attachment region to a...  
WO/2000/048758A1
This invention relates to copper wire (30) and process for making copper wire comprising: (A) electrodepositing copper foil, characterized by a twinning or stacking fault population in its crystal structure, having a thickness of about 0...  
WO/2000/049187A1
This invention relates to a process for making copper wire comprising the steps of (A) extracting copper ions from a copper-bearing material using an aqueous leaching solution to form a copper-rich aqueous leaching solution; (B) extracti...  
WO/2000/037226A1
The invention relates to a hair clipper (HSM) comprising a drive mechanism located in a housing (1) and a cutting head (S) with a cutting comb (3) and a cutting blade (4, 82) that moves back and forth, wherein a foil (47) is provided bet...  
WO/2000/036188A2
The invention relates to a method for producing a self-supporting metal film (40), especially copper film, which has a lower cohesive strength due to its microstructure and which can be formed so as to produce sharp edges. According to t...  
WO/2000/031574A1
Nickel is electrodeposited around an aluminum alloy wire (9) by electrocasting in an electrocasting bath (50) using the metal wire (9) immersed in an electrocasting solution (3) as a cathode. A nickel cylinder formed with a through hole ...  
WO/2000/015875A1
A copper foil suitable as a collector for a lithium ion secondary cell, which has pores passing through the foil in the thickness direction so as to render possible the transmission of light, is formed by carrying out electrodeposition s...  
WO/2000/011628A1
The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or ori...  
WO/2000/006807A2
The anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath.  
WO/2000/000673A1
Method for producing a nickel foam having a specific rate of between 200 and 400 g/m?3¿, at least comprising the steps of: providing a base foam having a conductive surface; nickel being electroplated in an electroplating bath, succes...  
WO/2000/000672A2
The invention relates to a galvanic bath, to a method for precipitating chromium onto objects using said galvanic bath, and to the use of this method for producing structured hard chromium layers on machine parts. The galvanic bath conta...  
WO/1999/063946A2
The invention provides exemplary aerosolization apparatus, and methods for aerosolizing a substance. According to one exemplary method, a liquid is transferred from a first chamber (328) into a second chamber (330) having a substance tha...  
WO/1999/062058A2
A system and method for electroforming a metal layer on a substrate such as a glass master to be used in the production of optical disks. An electroforming cell (12) includes a toroidally-shaped manifold (14). Directly downstream from th...  
WO/1999/060188A2
A method for electro copperplating substrates, using insoluble anodes in acid copper baths and a separate supply of used copper ions. The inventive method is characterized in that the bulk of the copper ions are supplied directly without...  
WO/1999/060189A2
The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductiv...  
WO/1999/057341A1
A dispersion-strengthened electrolytic cupper foil containing SnO¿2? and Sn and having a high tensile strength, wherein cupper is present as microcrystalline grains and SnO¿2? is dispersed as ultra-fine particles. The electrolyte used ...  
WO/1999/050480A1
A method for electrophoretic deposition of ceramic particles as a green body shaped as a dental appliance, the method comprising the steps of (a) forming a suspension of the ceramic particles in a first polar solvent, the ceramic particl...  
WO/1999/045176A2
Treated electrolytic copper foil wherein the shiny side of the raw foil is modified and smoothed by an electrodeposited copper gilding layer, a copper-clad laminate produced with such foil, and an electrical circuit produced from such a ...  
WO/1999/031300A2
A water deposition bath is used for homogeneous electrolytic deposition of copper coatings, more particularly, on printed boards. Said bath contains at least one copper ion source, at least one compound enhancing the electric conductivit...  
WO/1999/026785A1
Surface relief holograms (20) can be prepared directly in materials, such as aluminum or other hard metal substrates (30) without the need for preheating or other softening techniques. A hard holographic embossing shim (10) is prepared f...  
WO/1999/020813A1
The invention provides a method of manufacturing a screen product (1) having a screen pattern (2) of openings (5) separated by dykes (6) by causing a previously formed, electrically conducting initial skeleton (7) to grow by means of met...  
WO/1999/016935A2
A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of ...  
WO/1999/011842A1
This invention relates to a process for making wire, comprising: (A) forming a circular disk of electrodeposited copper, (B) rotating said disk about its center axis; (C) feeding a cutting tool into the peripheral edge of said disk to ca...  
WO/1999/010564A2
The invention relates to a method and device for regulating the concentration of metal ions in electrolytic fluid for depositing metal using insoluble anodes. Said electrolytic metal also contains compounds of an electrochemically revers...  
WO/1999/004064A2
The invention relates to a method for dip coating electrically conducting elements, like, for example, screws, nuts, shims or other small parts. In this method, the elements to be coated are positioned in, on or against a support element...  
WO/1999/000536A2
A method of preparing a porous film comprises electrodepositing material from a mixture onto a substrate, the mixture comprising: (I) a source of metal, inorganic oxide, non-oxide semiconductor/conductor or organic polymer; (II) a solven...  
WO/1998/059095A1
An electrolytic process for producing copper foil having a low profile surface exhibiting a high peel strength when bonded to a polymeric substrate, which process comprises: (a) preparing an electrolyte comprising a copper sulfate-sulfur...  
WO/1998/048983A1
A shaving cutter (111) comprises a skin-engaging surface (116) having both a convex elliptic region (116a) and a hyperbolic region (116b). The elliptic region merges with the hyperbolic region along a parabolic transition region (117). P...  
WO/1998/048083A2
A device (1) for carrying out continuous electrolytic precipitation processes has a cathodic live cylinder (3) whose top surface is electroconductive over its whole useful width. An anode A is arranged concentrically to and spaced apart ...  
WO/1998/048084A1
A method of electrophoretic deposition of a ceramic green body. A ceramic powder is optionally washed with a polar solvent such as deionized water, dried, and suspended in a polar organic solvent in a proportion of at least 20 % by weigh...  
WO/1998/046810A1
The present invention relates to a bipolar electrochemical process for toposelective electrodeposition of a substance on a substrate comprising (a) placing the substance and substrate into an environment capable of conducting electricity...  
WO/1998/045504A1
An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal fr...  
WO/1998/039501A1
Disclosed is a method for producing micro-components in a simple manner consisting of the following steps: a magazine is produced from an electrically non-conductive moulding material encompassing at least one micro-component made from a...  
WO/1998/036107A1
This invention includes an apparatus and method for plating. The apparatus (10) includes a housing (11) that receives a plating solution; and a cathode disposed in the housing. A heating assembly heats the cathode and establishes a tempe...  
WO/1998/033958A1
The invention relates to a component (23), characterized in that it comprises a plurality of layers (32, 33) functional planes which are built up on each other by micro-electrodeposition. At least one coding mark (60), which is optically...  
WO/1998/033957A1
A method of forming a hollow metallic article, comprising the following steps: (a) applying a layer of base metal to a fusible alloy mandrel; (b) applying a layer of precious metal to the layer of base metal; (c) applying a third layer o...  
WO/1998/033032A1
The present invention is directed to methods for preparing devices having hollow metallic microchannels (20) on a surface of a planar substrate (10). More specifically, the present invention is directed to methods for preparing devices h...  
WO/1998/029581A1
The present invention includes an electroforming apparatus (10) and method for continuously adjusting the anode (17)/cathode head (40) distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead screw ...  
WO/1998/015676A1
Disclosed is a micromechanical building component and the production thereof. The inventive building component presents a plurality of superimposed layers containing metal material, which strongly adhere to each other, at least partly. T...  
WO/1998/015202A1
The invention concerns a method for setting stones (4) in the surface of a jewel produced by electroforming, comprising the following steps: producing a base (1) having external shapes and dimensions with a thickness close to the gold fi...  
WO/1998/013537A1
A method is disclosed of producing a hollow structure, and particularly of forming channels of very small cross-sectional dimensions in a body of etchable material. In carrying out the method, a composite element is formed by providing a...  
WO/1998/009003A1
A process for preparing a porous electrolytic metal foil by electrodepositing a metal on a drum cathode by using a drum cathode and an anode to form a metal foil layer and separating the formed layer from the drum cathode, wherein a coat...  
WO/1998/008361A1
This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile...  

Matches 751 - 800 out of 4,748