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Matches 51 - 100 out of 4,748

Document Document Title
WO/2023/027473A1
The present invention relates to: a carrier material, which enables forming a perforated metal foil having a desired array pattern and aperture ratio, without using an expensive cathode drum or generating burrs; and a perforated metal fo...  
WO/2023/027974A1
A 3D printed, complex polymer structure can include a seed layer on the polymer structure. A thin film can be disposed on the seed layer. The seed layer can be an oxide, a nitride, or an oxynitride. The thin film can be an oxide, dielect...  
WO/2023/016607A1
The invention relates to an electrode (10), a rechargeable battery (100) and corresponding manufacturing processes. According to the invention, a silicon substrate (2) having a length (1) of 156 mm or more is provided, and a porous silic...  
WO/2023/012036A1
Disclosed is a method for manufacturing a timepiece component, the method being characterised in that it includes the following steps: –Ÿ providing (E1) a substrate (20) comprising an upper surface (21); Ÿ–Ÿ applying (E2) an anti-...  
WO/2023/282482A1
The present specification relates to a method for manufacturing a copper foil for a semiconductor, which is manufactured by a copper foil manufacturing apparatus including a negative electrode rotating plate rotating in one direction and...  
WO/2022/258726A1
The present invention relates to a composite and a method for manufacturing a composite and a composite, the method comprises in this order the steps: (i) providing a first pure copper structure having a first copper surface; (ii) contac...  
WO/2022/255687A1
The present specification relates to a multilayer metal thin film and a manufacturing method therefor, the multilayer metal thin film comprising: a first plating layer; a metal layer formed on the upper surface of the first plating layer...  
WO/2022/255421A1
Provided is a roughened copper foil having excellent transmission characteristics and circuit linearity and capable of achieving high peel strength when used in a copper clad laminate or a printed wiring board. This roughened copper foil...  
WO/2022/255422A1
Provided is a roughened copper foil which, when used in a copper-clad laminate board or a printed circuit board, is capable of attaining both excellent transmission properties and high peel strength. This roughened copper foil has a roug...  
WO/2022/248416A1
A porous electrode (1) comprising:a. an electrically conductive porous network (2) of interconnected wires, and b. an electrically conductive support structure (3),wherein the network (2) is in direct physical and electrical contact with...  
WO/2022/247694A1
The present invention relates to the technical field of additive decomposition products, and specifically relates to a filling material and a preparation method therefor, and a preparation method for an electrolytic copper foil for high-...  
WO/2022/244828A1
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and a high shear strength in the processing of a copper-clad laminate or in the production of a printed wiring board. This roughened cop...  
WO/2022/244827A1
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high shear strength in processing of a copper-clad laminate or manufacturing of a printed wiring board. This roughened copper foil h...  
WO/2022/244826A1
Provided is a roughened copper foil capable of realizing both excellent transmission properties and high shear strength, in the processing of a copper-clad laminate or the production of a printed wiring board. This roughened copper foil ...  
WO/2022/235055A1
An anodized film structure according to the present invention comprises: a body, formed from an anodized film material, which is formed by anodizing a base metal and then removing the base metal; through holes having a greater inner widt...  
WO/2022/234113A1
A method for producing an electrodeposited copper foil with a matte side having a Rz ISO of 0.8 µm or less, the electrodeposited copper foil being continuously formed in an electroforming cell comprising a rotating drum-shaped cathode, ...  
WO/2022/231143A1
The present specification relates to an apparatus for manufacturing a metal thin film, the apparatus comprising: a titanium rotating plate in which titanium plates are connected in one direction; a plurality of electrolytic cells corresp...  
WO/2022/208065A1
A method of forming a pressure vessel for holding a compressed fluid is described herein. The method comprises forming a metallic layer on a mandrel with an electrodeposition process, the mandrel having the desired vessel configuration, ...  
WO/2022/209990A1
Provided is a roughened copper foil that has excellent transmission characteristics and suppresses the falling off of powder. This roughened copper foil has a roughened surface on at least one side. The roughened surface has a roughness ...  
WO/2022/209989A1
Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened su...  
WO/2022/210159A1
The present invention prevents the tip of a corner portion of a photoresist layer pattern from blunting. A photomask (80) has formed therein a pattern comprising a light-blocking section (82) and a light-transmitting section (81), which ...  
WO/2022/202540A1
Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side ...  
WO/2022/202539A1
Provided is a copper foil with a carrier, with which excellent laser processability can be achieved. This copper foil with a carrier is provided with a carrier, a release layer, and an ultrathin copper foil in said order, wherein copper ...  
WO/2022/200429A1
The present invention relates to a composite material made of an open-pored porous, sintered matrix material and elemental silver, wherein the elemental silver is infiltrated into the pores of the open-pored porous, sintered matrix mater...  
WO/2022/202541A1
Provided is a roughened copper foil capable of having both high adhesiveness with a thermoplastic resin and excellent high frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The rou...  
WO/2022/184502A1
The invention relates to a device (1) for galvanically growing a plurality of nanowires (2) on a substrate (3), comprising a substrate holder (4) and a receptacle (5) for the substrate holder (4), wherein the device (1) is configured to ...  
WO/2022/184504A1
The invention relates to a device (1) for galvanically growing a plurality of nanowires (2) on a substrate (3), comprising a substrate holder (4) and a housing (34), in which a chamber (18), a control unit (8) and a storage container (35...  
WO/2022/184503A1
The invention relates to a method for the galvanic growth of a plurality of nanowires (1) on a surface (2), comprising: a) placing a film (3) on the surface (2), the film (3) having a plurality of through-pores (4), in which nanowires (1...  
WO/2022/181646A1
This production method for titanium foil includes an electrodeposition step in which a molten salt bath that includes titanium ions and a molten chloride is used to perform electrolysis at an electrode that includes an anode and a cathod...  
WO/2022/180650A1
A galvanic electrodeposition process, comprising a step of coating with a layer of yellow gold alloy at least one object immersed in a galvanic bath which comprises an aqueous solution. The aqueous solution comprises at least: - gold in ...  
WO/2022/175458A1
Disclosed herein is a method for producing a probe card, the method comprising the steps: Providing a carrier board, wherein the surface of the carrier board has at least one probe guiding portion; and Generating a probe on the probe gui...  
WO/2022/175707A1
Described is a process for making pieces of jewellery, particularly for goldsmith's, silversmith's and costume jewellery products, comprising a succession of steps consisting in creating firstly at least one prototype model (1, 101) for ...  
WO/2022/173578A1
Systems and methods are proposed for controlling the electroplating of lithium metal onto negative electrodes to allow for more rapid recharging of lithium metal batteries while minimizing dendrite formation. Based on the power spectrum ...  
WO/2022/167706A1
Disclosed is an atmospheric autonomous installation for producing hydrogen, which comprises: a refrigeration system; at least one plate-form water-condensing cell on which an evaporator is disposed, the water-condensing cell being placed...  
WO/2022/158277A1
The present invention addresses the problem of providing: a plating solution able to suppress variations in the filling height of a metal filled in through holes; and a method for producing a metal-filled structure using the plating solu...  
WO/2022/158357A1
In a master mold and a method for producing a metal molded article, the master mold has: a product region having an electrodeposition surface on which a metal molded article is formed by electrodeposition, in which a product part that is...  
WO/2022/158476A1
A prepreg 100 with a metal layer comprises: a metal layer 20 having a thickness of at most 11 μm; and a prepreg 10 provided with the metal layer 20. The prepreg 100 with a metal layer does not having a carrier layer for supporting the m...  
WO/2022/149350A1
This device for manufacturing a vapor deposition mask has a support base material having a first surface for supporting a member subject to plating, a first support member and a second support member provided so as to surround the outer ...  
WO/2022/141709A1
An electrolytic copper foil for a high-frequency high-speed printed circuit board, and a preparation method therefor. The electrolytic copper foil for a high-frequency high-speed printed circuit board comprises a raw foil layer and a sur...  
WO/2022/145779A1
A surface-treated copper foil according to exemplary embodiments comprises a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed in the protrusion layer or around the boundary between...  
WO/2022/138999A1
The present invention relates to a 3D printing device using selective electrochemical deposition and particularly to a 3D printing device capable of selectively depositing metal materials onto a substrate by using additive manufacturing ...  
WO/2022/139000A1
The present invention relates to a three-dimensional printing device using selective electrochemical deposition and particularly to a three-dimensional printing device capable of selectively depositing metal materials onto a substrate by...  
WO/2022/129230A1
The invention relates to a method for joining nanolaminates by means of electrodeposition, the nanolaminate being constructed of at least two layers containing different metals or metal alloys and having a joining point in which multiple...  
WO/2022/110536A1
The present invention relates to the field of copper foil, and in particular to low-profile electrolytic copper foil for a high-density interconnection circuit board. The electrolytic copper foil sequentially comprises a copper foil laye...  
WO/2022/082933A1
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...  
WO/2022/085371A1
The present invention provides an electrolytic copper foil which is not susceptible to breaking. In this electrolytic copper foil, where t is the foil thickness (in units of µm), VAV is the recess average volume (in units of µm3), whic...  
WO/2022/057092A1
A manufacturing method for improving the tensile strength of a thinned copper foil. The manufacturing method comprises dissolving copper, then preparing a main electrolyte, performing multi-stage filtration on the main electrolyte, then ...  
WO/2022/054597A1
The present invention provides an electrolytic copper foil which is not susceptible to breaking. With respect to this electrolytic copper foil, if t (unit: μm) is the foil thickness, Gs (unit: %) is the gloss of the electrolytic deposit...  
WO/2022/049582A1
The present invention discloses a system for 3D printing by using meniscus-confined electrodeposition, using at least one pipette, carrying at least one electrolyte, at least one means of thickness or deposition rate assessment and at le...  
WO/2022/041533A1
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, s...  

Matches 51 - 100 out of 4,748