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Matches 101 - 150 out of 4,748

Document Document Title
WO/2022/041534A1
An additive for an electrolytic copper foil suitable for an HDI board, and an electrolytic copper foil production process, the additive being an aqueous solution containing a brightener SPS, a DPS, and gelatin, the concentration of the b...  
WO/2022/041675A1
The present invention relates to a preparation method for an AR diffractive waveguide imprint mold, a soft mold and the use thereof. The preparation method comprises the following specific steps: printing an electroforming mask on a nick...  
WO/2022/032048A1
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer...  
WO/2022/026523A1
A method of generating oxygen and at least one of hydrogen or ammonia includes receiving ambient air containing moisture, collecting liquid water from the ambient air, receiving, by a water electrolyzer, the collected liquid water and el...  
WO/2022/014720A1
The metal layer-coated zinc foil according to the present invention has: a foil body comprising zinc as a base material; and a metal layer disposed on a surface of the foil body. A metal element contained in a coating metal layer is at l...  
WO/2022/012903A1
The invention relates to a connecting element (1) comprising a plurality of sections (2) which are successively arranged along an axis (x) of the connecting element (1), wherein the sections (2) each have a plurality of nanowires (3), wh...  
WO/2022/014669A1
[Problem] The purpose of the present invention is to provide an electrolytic foil and battery current collector in which the risk of breakage or tearing during manufacturing presented by decreased thickness can be suppressed, and which p...  
WO/2022/014668A1
[Problem] The purpose of the present invention is to provide an electrolytic foil and a battery current collector capable of suppressing the risk of breakage and tearing during manufacturing due to reduction in film thickness and also ex...  
WO/2022/009886A1
Provided is a fine metal linear body having a lower sintering temperature than the conventional one. The fine metal linear body has a length of 0.5-200 µm and a thickness of 30 nm or more and 10 µm or less. Where the length of a metal ...  
WO/2022/004608A1
Provided is a metal formed product manufacturing method which includes an electroforming process wherein with a substrate having electrically non-conductive masks partly formed on an electrically conductive surface being immersed in an e...  
WO/2021/259528A1
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a subs...  
WO/2021/253838A1
An energy-efficient automatic copper dissolving technique comprises a peripheral member (1). The peripheral member (1) comprises a vessel (101) as a main body. A base (102) is fixedly installed around a base portion of the vessel (101). ...  
WO/2021/242457A2
A discretized-flow electrode for use in electrochemical machining (ECM) and a corresponding method and system for using the discretized-flow cathode are disclosed. The machining face of the discretized-flow cathode is divided into a plur...  
WO/2021/235034A1
This electrolytic solution contains magnesium chloride, lithium chloride, and an aprotic solvent. In the electrolytic solution, the concentration at which the total of magnesium chloride and lithium chloride are dissolved with respect to...  
WO/2021/225259A1
The present invention relates to a multilayer copper foil, a method for manufacturing same, and an electroplating apparatus therefor. A multilayer copper foil according to an aspect of the present invention comprises: a recrystallization...  
WO/2021/219606A1
The invention relates to a method for producing metal micro- or nanostructures, preferably nanowires, having the steps of: (a) providing an aluminum substrate; (b) oxidizing the aluminum substrate by applying an electric voltage in an el...  
WO/2021/209291A1
A mold (21) obtained by providing a monolithic optical lens element having at least a finished optical surface, the monolithic optical lens element being made of an organic material; - coating the finished optical surface with an electri...  
WO/2021/192563A1
A zinc foil having crystal grains of zinc that have a particle size of 0.2–50 µm. The zinc foil ideally has zinc as the base material therefor and includes a metal element other than zinc. The metal element is ideally at least one typ...  
WO/2021/193246A1
Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened su...  
WO/2021/192698A1
Provided is a porous metal body in the shape of a flat plate having a three-dimensional net-like skeleton, the porous metal body comprising a plurality of cells, wherein expressions (1) and (2) below are satisfied. (1): 0.4≤cell diamet...  
WO/2021/185619A1
The invention relates to a method for providing a large number of nanowires (14) on a surface (15), comprising: a) providing an electrolyte distributor (1), b) providing a film (16) having a large number of continuous pores (17), c) arra...  
WO/2021/177030A1
The productivity of an aluminum-based brazing material is poor. This method for producing an aluminum-based brazing material is characterized by including: a step for producing a plating solution containing an Al ion and a Ti ion; and a ...  
WO/2021/171808A1
Provided are: a metal-filled microstructure that suppresses defects in the filling of a plurality of pores with metal as well as defects in the structure of conductors formed from the metal; a production method for the metal-filled micro...  
WO/2021/152582A1
A method for producing a structure, comprising providing a Composite Conductive Substrate (CCS) with a conductive layer, a non-conductive layer and a release layer, implemented on top of the conductive layer; determining an empty conduct...  
WO/2021/153257A1
Provided is an electrolytic copper foil that exhibits a high degree of flexibility suited to a flexible substrate (particularly high flexibility after being annealed for one hour at 180°C) while having a high degree of smoothness. The e...  
WO/2021/153647A1
Provided are: a metal foil having a cathode surface lacking microscopically observable linear protrusions and recesses; a production method therefor; and a method for processing an electrodeposition drum to be used for said production me...  
WO/2021/153256A1
Provided is electrolytic copper foil that has a high degree of smoothness and yet exhibits high flexibility which is suitable for a flexible substrate (in particular, high flexibility obtained after being annealed for 1 hour at 180°C). ...  
WO/2021/149486A1
The present invention addresses the problem of providing a method for manufacturing a perforated metal foil in which the hole diameter of through-holes does not change before and after polishing a rotary drum surface. This method for man...  
WO/2021/142187A1
A system for printing metal interconnects on a substrate includes an anode substrate. A plurality of anodes are arranged on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. ...  
WO/2021/131689A1
A porous body provided with a framework having a three-dimensional network structure. A main body of the framework includes nickel, cobalt, a first element and a second element as constituent elements. The proportion of the mass of the c...  
WO/2021/127690A1
A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively ...  
WO/2021/125959A1
Process of electroforming a metal structure, in particular a structure with a tip protruding from adjacent outer layers. The process comprises the following steps; - a first layer is deposited on a substrate followed by one or more next ...  
WO/2021/109211A1
A method for fabricating an easy-to-demold Fresnel mold: a mold release layer (170) is deposited on the surface of a metal sub-mold (160) that has the same feature pattern as a metal master mold (110), and then a first metal layer (180) ...  
WO/2021/101177A1
Provided in one embodiment of the present invention is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 ...  
WO/2021/101176A1
An embodiment of the present invention provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8-12.5, a texture coefficient of (220) face (TC (220)) of 0.49-1.28, a tensile strength of 2...  
WO/2021/097334A1
The present invention provides a metal mold and the method of making the metal mold for casting directional gecko-inspired adhesives that require deep, slanted features and an undercut wedge structure. The durable metal mold can be used ...  
WO/2021/093007A1
A metal template preparation method, comprising the following steps: S1, screening out target metals to serve as target materials of a seed layer according to the crystal type, the metal conductivity and the corrosion resistance of an el...  
WO/2021/091250A1
One embodiment of the present invention provides an electrolytic copper foil including a copper layer and having a weight deviation of 5% or less in the width direction calculated by following Equation 1, a tensile strength of 25 to 62 k...  
WO/2021/075253A1
[Problem] An objective of the present invention is to provide an electrolytic foil and battery current collector in which the risk of breakage or tearing during manufacturing presented by decreased thickness can be suppressed, and which ...  
WO/2021/058706A1
The present invention relates to methods for producing metal foam bodies in which metal-containing powders which may comprise aluminium and chromium or molybdenum are applied to metal foam bodies which may comprise nickel, cobalt, copper...  
WO/2021/053013A1
A nanowire structure (5) is manufactured by forming islands (30a, 30b) of conductive material on a substrate (10-20), and a conductive sacrificial layer (40) in the space (35) between conductive islands. The conductive islands (30a,30b) ...  
WO/2021/041265A1
Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousand...  
WO/2021/019449A1
A method for manufacturing a three-dimensional structure by localized electroforming of a material (M) from an electrolytic solution is disclosed. The method comprises: - emitting a jet (J) of the electrolytic solution towards one impact...  
WO/2021/014778A1
The present invention relates to a method for producing an electrolytic copper foil, whereby it becomes possible to provide an electrolytic copper foil which has an electric conductivity of 99% or more and a thickness of 10 μm or less, ...  
WO/2020/252448A1
Disclosed herein is a method comprising growing a shim by disposing a mandrel having an optional textured surface in an electrolytic bath, where the shim contains a negative image of the optional textured surface formed by electrolytic d...  
WO/2020/246467A1
A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughe...  
WO/2020/217668A1
This metal porous body has a porous metal skeleton and a metal oxide thin film formed on at least a portion of the metal skeleton surface. The metal skeleton is Ni or an Ni alloy, and the metal oxide is a metal oxide other than NiO.  
WO/2020/195748A1
Provided is a metal foil for manufacturing a printed wiring board, whereby the occurrence of seed layer defects can be suppressed even when chemical processing is performed after perforation. Also provided is a metal foil for manufacturi...  
WO/2020/191808A1
Disclosed is a photoinduced conductive electrode plate-based micro-electroforming device, comprising a power supply, a first electrode plate electrically connected to the power supply, a second electrode plate electrically connected to t...  
WO/2020/173601A1
The present invention is related to a method of manufacturing a mirror. The objective of the present invention is to propose very thin, mechanically and thermally stable mirrors with excellent surface properties as well as a manufacturin...  

Matches 101 - 150 out of 4,748