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WO/2017/051898A1 |
Provided is a metal foil that, when the metal foil has been provided with a release layer and then stuck onto a resin substrate, makes it possible for the resin substrate to be physically peeled away and, as a result, during a process wh...
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WO/2017/051897A1 |
Provided is a metal foil which is provided with a mold release layer, thereby enabling physical separation of a rein base in cases where the metal foil is bonded to the resin base, and which is removed at a low cost without deteriorating...
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WO/2017/051767A1 |
Provided is a thin, high-strength electrolytic copper foil such that curling can be prevented. This electrolytic copper foil has a tensile strength in an ordinary state of not less than 350 MPa and a tensile strength measured at ambient ...
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WO/2017/039402A1 |
Disclosed is a method for producing various alloy thin films having desired compositions and controlled nanoscale cracks therein by means of an ultrasonic pulse electroforming process. Said method comprises the steps of: forming multi-la...
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WO/2017/038992A1 |
Provided is a method for manufacturing a high-quality electrolytic aluminum foil having excellent peeling characteristics from a cathode surface. This method for manufacturing an electrolytic aluminum foil comprises a step for depositing...
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WO/2017/020272A1 |
A shadow mask (200) includes a frame (210) made of a metallic material, and one or more mask patterns (205) coupled to the frame (210), the one or more mask patterns (205) comprising a metallic material having a coefficient of thermal ex...
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WO/2017/018655A1 |
An electrolytic copper foil for a lithium secondary battery, according to one embodiment of the present invention, has a curl indicator (C) value of zero to 4.0, the curl indicator (C) value defined as 1.21ΔR+1.12ΔCr+0.01ΔG, wherein t...
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WO/2017/018232A1 |
Provided is a roughened copper foil that has good adhesiveness to resin as well as good abrasion resistance in spite of fine projections and recesses thereof having a low roughness suitable for fine-pitch circuit formation and high-frequ...
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WO/2016/208858A1 |
An electrolytic copper foil for a lithium secondary battery according to the present invention is characterized by having a yield strength ratio of 30 kgf/mm2 to 60 kgf/mm2, a surface area ratio of one to three, and a weight deviation of...
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WO/2016/208863A1 |
Disclosed are an electrolytic copper foil which can guarantee a secondary battery having a high capacity maintaining rate, a current collector including the electrolytic copper foil, an electrode including the current collector, a second...
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WO/2016/171074A1 |
[Problem] The present invention provides: a method for forming a mask with which it is possible to easily and reliably form a resin layer on the surface of a base layer in a closely bonded state; and a method for manufacturing a printed ...
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WO/2016/156024A1 |
Disclosed herein is a method of electroforming a needle cannula (100) for an injection device, wherein the electroforming method is performed in an electroforming system (1) comprising a cathode (10), an anode (60) and an electrolyte (50...
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WO/2016/150757A1 |
The invention relates to a method for the production of a reflective optical element with a base body, said element being filigree and yet sufficiently dimensionally stable, comprising the steps of: - providing a molded body having a sur...
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WO/2016/132811A1 |
A method for producing a nickel alloy porous body, which comprises: a step wherein the surface of the skeleton of a resin molded body having a three-dimensional network structure is coated with a coating material that contains a nickel a...
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WO/2016/129534A1 |
The present invention addresses the problem of providing a method for manufacturing, using a plating treatment, a deposition mask in which a through-hole having a complicated shape is formed. This method for manufacturing a deposition ma...
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WO/2016/117587A1 |
Provided is an ultrathin copper foil with carrier capable of obtaining both microcircuit formability and laser processability, from the machining of a copper-clad laminate to the manufacture of a printed wiring board. This ultrathin copp...
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WO/2016/117498A1 |
[Problem] To provide: a surface-treated electrolytic copper foil for a lithium-ion secondary cell in which the anti-curling characteristics during heating of the copper foil are improved, thereby preventing separation of an active materi...
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WO/2016/110409A1 |
The present invention relates to a process for producing zinc nanowires comprising at least the process step of electrochemically depositing zinc directly onto at least one surface of an electrode from a solution comprising at least one ...
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WO/2016/108735A1 |
The invention relates to portable electronic devices, and can be used in the designs of housings and detachable panels for mobile phones, smart phones, USB flash drives, notebooks, etc. A housing for a portable electronic device (1) c...
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WO/2016/102473A1 |
Process for forming a precious metal layer (5) on a surface of a substrate (1) comprising steps of: providing a substrate (1); activation of a surface of said substrate (1) by wetting the said surface with a suspension (2) of precious me...
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WO/2016/104871A1 |
An Fe-Ni-based alloy metal foil with excellent thermal stability, and a preparation method therefor are disclosed. One aspect of the present invention provides an Fe-Ni-based alloy metal foil having excellent thermal stability, prepared ...
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WO/2016/104981A2 |
The present invention relates to a Fe-P-Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides a Fe-P-Cr alloy thin plate comprising, in terms of wt%, P (6.0-13.0%), Cr (0.002-0.1%), ...
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WO/2016/105009A1 |
The present invention relates to a high-rigidity metal foil and a method for manufacturing the same. The present invention provides: a sulfur-containing metal foil which comprises 70-1500 ppm of sulfur and is formed by electroforming; an...
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WO/2016/094562A2 |
A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patc...
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WO/2016/093355A1 |
In the manufacture of a first electroformed component (40) and a second electroformed component (60) having parts which are brought into close contact with each other when the components are engaged, after the first electroformed compone...
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WO/2016/025021A1 |
Compositions, films, collection devices, apparatuses, kits and methods related to biologic analyte collection and analysis include thin films of modified polycaprolactone. Methods of production and use thereof are described herein. The f...
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WO/2015/198626A1 |
An aluminum plating solution capable of electrodepositing aluminum on a substrate surface, wherein: as components, the aluminum plating solution comprises (A) an aluminum halide, (B) one or more compounds selected from a group consisting...
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WO/2015/198819A1 |
Provided is an aluminum plating solution capable of continuously manufacturing an aluminum film, the surface of which is smooth and which has excellent elongation. The aluminum plating solution, which is capable of electrodepositing alum...
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WO/2015/181706A1 |
A plating or coating method for producing a metal-ceramic composite coating on a substrate is provided. The method comprises adding a sol of a ceramic phase to a plating solution or electrolyte and controlling the pH, degree of mixing, a...
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WO/2015/177311A1 |
An aperture plate is manufactured by plating metal around a mask of resist columns (2) having a desired size, pitch, and profile, which yields a wafer about 60μιη thickness. This is approximately the full desired target aperture plate...
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WO/2015/170715A1 |
The purpose of the present invention is to provide a copper foil with carrier that enables stable peel-off, by reducing the variation in peeling strength of the interface between the carrier and the copper foil layer. In order to achieve...
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WO/2015/160527A1 |
A method for making a metallic leading edge guard (30) of the type having a nose (32) with first and second wings (34, 36) extending therefrom, the method including: machining from a metallic blank a first half (42) comprising a first po...
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WO/2015/152380A1 |
In order to provide a copper foil having a carrier, said copper foil being resistant to oxidation subsequent to carrier removal, this copper foil having a carrier includes a carrier, a peeling layer, and a copper foil that are laminated ...
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WO/2015/131977A1 |
The invention relates to a film composite material that has a thickness of 5 to 50 μm, can be used simultaneously as a current collector and electrode material in a battery, especially as cathode material, and is composed of a dispersoi...
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WO/2015/133296A1 |
The purpose of the present invention is to provide, at low cost, a porous metal body which has more excellent corrosion resistance and is able to be utilized for electrodes of fuel cells. A porous metal body which contains nickel (Ni), t...
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WO/2015/129108A1 |
Provided is a porous aluminum body, the skeleton of which has a hollow three-dimensional network structure, wherein the porous aluminum body has a microporous layer on the surfaces of the hollow portions of the skeleton. The microporous ...
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WO/2015/125900A1 |
The present invention addresses the problem of providing: an electrolytic aluminum foil in which there is not a large difference in the characteristics of one surface and the other surface thereof; and a production method for the electro...
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WO/2015/125899A1 |
The problem addressed by the present invention is to provide a thin electrolytic aluminum foil with a thickness of 20 µm or less having superior flexibility without giving rise to interference in winding because of the foil doubling up ...
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WO2015122258A1 |
Provided is a carrier-equipped ultrathin copper foil for which carrier peel strength can easily be adjusted. This carrier-equipped ultrathin copper foil (10) is formed by sequentially layering an antiproliferation layer (12), a peeling l...
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WO/2015/122301A1 |
Provided is a porous metal foil which has a two-dimensional network structure composed of metallic fibers that are laid unregularly, wherein each of the metallic fibers has an approximately semicircular or approximately semielliptical cr...
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WO/2015/118977A1 |
The purpose of the present invention is to provide an aluminum film manufacturing method and manufacturing device with which there is no intrusion of moisture or oxygen into a plating chamber. Provided is an aluminum film manufacturing m...
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WO/2015/111533A1 |
Provided is an aluminum plating solution with a large current density region in which aluminum plating is possible and small solution resistance. An aluminum plating solution comprises: an aluminum halide; one or more species selected fr...
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WO/2015/107568A1 |
A resin mold, comprising a thermosetting resin substrate on which an inverted contact pin pattern is printed and a thermoplastic resin, is used to form a contact pin pattern in the resin mold, after which the thermoplastic resin is disso...
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WO/2015/108191A1 |
Provided is a surface-treated copper foil having excellent fine wiring formability. This surface-treated copper foil is obtained by forming a surface treatment layer on a copper foil. In cases where this surface-treated copper foil is sp...
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WO/2015/104999A1 |
Provided is an electrolytic copper foil that exhibits excellent handling properties during production of a secondary battery and that does not suffer from a decrease in tensile strength even after being heated at 150 °C for 1 hour. Also...
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WO/2015/088523A1 |
The present invention provides a cold rolled and annealed steel sheet comprising, by weight percent 0.1 ≤ C ≤ 0.13%, 2.5 ≤ Mn ≤ 2.8%, 0.3 ≤ Si ≤ 0.5%, 0.3 ≤ Cr ≤ 0.56%, 0.020 ≤ Ti ≤ 0.050%, 0.0020 ≤ B ≤ 0.0040%, 0...
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WO/2015/080052A1 |
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a coppe...
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WO/2015/080227A1 |
Provided is a copper foil with a carrier, which comprises an ultrathin copper layer having a surface with good circuit formation properties. This copper foil with a carrier sequentially comprises a carrier, an intermediate layer and an u...
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WO/2015/076180A1 |
Provided are: a roll with a pattern, which has excellent releasability of a photosensitive material during a photosensitive material releasing process during the production of this roll with a pattern and excellent releasability of a mat...
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WO/2015/049919A1 |
A drum electrode for a device that can plate a metal onto the surface of a long base material having electrical conductivity, said drum electrode comprising a power feeding layer, an insulating layer which covers the surface of the power...
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