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Matches 351 - 400 out of 4,748

Document Document Title
WO/2015/040998A1
The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order ...  
WO/2015/033917A1
The purpose of the present invention is to provide a surface-processed copper foil with which there is very little variation in the adherence of the surface-processed copper foil and an insulating resin substrate which constitute a print...  
WO/2015/029881A1
The present invention addresses the problem of providing a method for manufacturing a metal-filled microstructure that enables micropores to be easily filled with metal and the generation of residual stress accompanying the metal filling...  
WO/2015/030209A1
Provided is a surface-treated metal material having excellent heat absorbancy and heat dissipation properties. The surface-treated metal material has a heat conductivity of 32W/(m•K) or above, and the color difference ΔL of the surfac...  
WO/2015/029437A1
[Problem] In a method for manufacturing metal parts using electrotyping, to make it possible to peel the metal part without relief pattern defects even when the scale of the pattern is microscopic. [Solution] Metal parts such as a metal ...  
WO/2015/016271A1
Provided is a copper foil which is a thin foil of no more than 18μm in thickness that is required for a copper foil for a printed wiring board such as a flexible copper clad laminate (FCCL) or a flexible printed circuit board (FPC), for...  
WO/2015/016099A1
A contact element (25) (electroformed product) is manufactured by electroforming. An insulating film (28), formed using a dry film resist or the like, is provided on the surface of the contact element (25). The insulating film (28) is pr...  
WO/2015/012376A1
Provided is a surface-treated copper foil with which very fine wiring can consistently be formed and which has high adhesiveness with respect to an electroless copper-plated film, it being possible to impart the profile shape of the subs...  
WO/2015/008564A1
Provided are a continuous manufacturing method and manufacturing device for electrolytic metal foil that can prevent nonuniformity of current caused by lead adhering to insoluble metal positive electrodes, can prevent reductions in quali...  
WO/2015/006445A1
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...  
WO/2015/006438A1
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...  
WO/2015/006479A1
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...  
WO/2015/006647A1
A method of manufacturing an architectural building element, including providing a mold or master having a surface that is conductive. The mold or master is suspended in an electrolyte solution. Electro-deposition of a material disposed ...  
WO/2015/006400A1
A wind turbine component is disclosed. The wind turbine component may comprise a polymer substrate and a metal plating layer plated on a surface of the polymer substrate. The wind turbine component may be a nacelle or a wind turbine blade.  
WO/2015/006485A1
Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric materi...  
WO/2014/208176A1
The purpose of the present invention is to provide, at a low price, a metal porous body usable for the electrode of a fuel cell, etc., as well as having exceptional corrosion resistance. The present invention provides a sheet-shaped meta...  
WO/2014/203594A1
Provided is a porous metal body that excels in corrosion resistance in comparison to conventional porous metal bodies comprising nickel-tin binary alloys or nickel-chromium binary alloys. The porous metal body has a three-dimensional mes...  
WO/2014/198380A1
The present invention relates to a method for casting an object from solid metallic glass, comprising the following steps: providing a model (1) of the object; applying an electrically conductive coating (2) to the model; galvanically ap...  
WO/2014/200106A1
Provided is a copper foil with carrier, having good visibility and working precision. The copper foil with carrier has, in order, a carrier, an intermediate layer, and an ultrathin copper layer. The color difference (ΔL) of the ultrathi...  
WO/2014/192645A1
Provided is a production method for a porous aluminum body that comprises: a step in which a resin structure is produced by using molten salt electrolytic plating to form an aluminum film of the surface of a resin substrate having a thre...  
WO/2014/156362A1
Provided is a surface-treated copper foil having superior welding characteristics of copper foil to copper foil or the copper foil to another metal by means of resistance welding. A surface treatment coating film is formed at least at on...  
WO/2014/156161A1
[Problem] To enable the simplified release of metal components from molds when manufacturing metal components. [Solution] A release film (16) containing a compound represented by X-L-Si-(O-R)3 is formed on a relief pattern on a casting m...  
WO/2014/156361A1
Provided is a surface-treated copper foil having superior welding properties of copper foil to copper foil or the copper foil to another member by means of resistance welding. A surface treatment coating film is formed at least at one su...  
WO/2014/142067A1
Electrocasting is used to manufacture de Laval nozzles, which are a variety of nozzle used in aerospace applications and diverse industrial fields. de Laval nozzles are not suited to complex machining or cutting tools. In order for compo...  
WO/2014/132947A1
A carrier foil, an ultrathin copper foil, and an ultrathin copper foil with a carrier in which a separation layer is formed between the carrier foil and the ultrathin copper foil, wherein the invention is characterized in that the separa...  
WO/2014/128834A1
[Problem] To provide a copper foil for graphene production and a graphene production method using the copper foil, whereby it is possible to produce high-quality large-area graphene at low cost. [Solution] A copper foil (10) for graphene...  
WO/2014/119583A1
An electrolytic copper foil is provided in which the tensile strength measured at ordinary temperature after a 300ºC×1 hour heat treatment is 500 MPa or higher. Also provided is an electrolytic copper foil which, when laminated to a po...  
WO/2014/119582A1
Provided is an electrolytic copper foil which has a tensile strength at ordinary temperature of 650 MPa or higher, a tensile strength measured at ordinary temperature after a 1-hour heat treatment at 300ºC of 450 MPa or higher, and an e...  
WO/2014/119355A1
An electrolytic copper foil (1) characterized by comprising copper crystal grains (3) and, present inside the copper crystal grains (3) or at the boundaries thereamong, inclusions (5) having an average diameter of 0.5-100 nm, wherein the...  
WO/2014/119656A1
A purpose of the present invention is to provide an electrolytic copper foil which is superior in physical properties after high-temperature heating to conventional electrolytic copper foils and which is suitable also as the negative-ele...  
WO/2014/115681A1
[Problem] To provide an electrolytic copper foil having high mechanical strength under normal conditions, and resistant to thermal deterioration even when heated to about 300ºC. [Solution] An electrolytic copper foil containing a metal ...  
WO/2014/109081A1
Provided is an extremely useful electrolytic copper foil for an electrode in an electronic device. The electrolytic copper foil according to the present invention is used for an electrode in an electronic device and made of copper or a c...  
WO/2014/104233A1
Provided is an electrolytic copper foil for flexible circuit boards, the foil being easy to handle in production/processing lines, having excellent low spring-back after the heat treatment applied in the film application process, being a...  
WO/2014/098774A1
The present disclosure relates to a method of forming a metallic layer having pores extending therethrough, the method comprising the steps of: (a) contacting a cathode substrate with an electrolyte solution comprising at least one catio...  
WO/2014/100299A1
Methods of making fuel nozzles are described. More specifically, methods of making fuel nozzles including injection molding are described. The injection molding may include polymer injection molding, powder injection molding, or micro po...  
WO/2014/088666A2
Electroformed housings for electronic devices and methods for making the same are provided. An electronic device is provided having at least one electronic part and an electroformed housing constructed from a metal that encloses the at l...  
WO/2014/080958A1
Provided is a copper foil having a carrier, endowed with high cohesive force between the carrier and an ultra-thin copper film prior to the step of lamination to an insulating substrate, the cohesion of the carrier and the ultra-thin cop...  
WO/2014/081041A1
Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrol...  
WO/2014/080959A1
Provided is a copper foil with carrier that is suitable for fine pitch formation. The copper foil with carrier is equipped with, in the following order, a carrier, a release layer, an ultra thin copper layer, and an optional resin layer....  
WO/2014/073695A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, and a laminate using the same. A surface-treated copper foil in which the sk...  
WO/2014/073696A1
Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching, and a laminate using the same. A surface-treated copper foil, wherein when adhering the copper foil to both s...  
WO/2014/073692A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a color difference (ΔE*ab) ba...  
WO/2014/073694A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent resin transparency after removing the copper foil by etching, a laminate using the same, a copper-clad laminate, a printed circuit board, ...  
WO/2014/073693A1
Provided are a surface-treated copper foil which adheres favorably to resin and achieves excellent visibility when seen through the resin, and a laminate using the same. A surface-treated copper foil having a surface treatment performed ...  
WO/2014/069531A1
The purpose of the present invention is to provide a copper foil that has excellent cycle properties and is used as a power collector of a negative electrode for a non-aqueous electrolyte secondary cell. The present invention uses a copp...  
WO/2014/065430A1
Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactor...  
WO/2014/057747A1
A process for manufacturing aluminum foil, including: a step for electrodepositing aluminum on a drum in an electrolytic bath while rotating the drum, and thus forming an aluminum film: and a step for peeling the aluminum film from the d...  
WO/2014/045986A1
A method for manufacturing an aluminum film by electrodepositing aluminum onto a substrate in an electrolytic cell to which a molten-salt-containing electrolyte is supplied. On the basis of a prescribed relationship between the overpoten...  
WO/2014/042201A1
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper l...  
WO/2014/038716A1
Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been ...  

Matches 351 - 400 out of 4,748