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Patent Searching and Data


Matches 401 - 450 out of 5,656

Document Document Title
WO/2004/107833A1
Disclosed is a method for manufacturing a copper foil for use in formation of various circuit networks in the state of being layered on a printed circuit board. The method of the current invention includes electrolyzing a copper foil set...  
WO/2004/101862A1
Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhance...  
WO/2004/101861A1
An electrochemical fabrication process for producing three-dimensional structures from a plurality of adhered layers is provided where each layer comprises at least one structural material (e.g. nickel or nickel alloy) and at least one s...  
WO/2004/101858A1
Equipment and a method for manufacturing a metal ferrule capable of providing a high coaxiality while maintaining a mass-productivity, the equipment comprising a titan mesh case (21) for holdingly immersing nickel particles (22a) in elec...  
WO/2004/101859A1
A low surface roughness electrolytic copper foil having a surface roughness Rz not higher than 2.5 μm and an elongation percentage not smaller than 6% at 180&ring C in which tensile strength at 25&ring C measured within 20 min of the po...  
WO/2004/101857A2
Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. for...  
WO/2004/092435A1
A metal structure being reduced in brittleness and excellent in hardness and creep resistance, characterized in that it has been subjected to annealing at a temperature below the temperature at which crystals of the metal material begin ...  
WO/2004/090197A1
An electrolytic copper foil with low roughness surface whose surface roughness (Rz) is 2.0 μm or less, the surface uniformly provided with low roughness without uneven surge, which electrolytic copper foil exhibits a percent elongation ...  
WO/2004/080887A1
Method for making three-dimensional structures. A template is provided having at least two conductive regions separated by a non-conductive region. The template is disposed in an electrolyte in an electrodeposition cell (10) and a voltag...  
WO/2004/079053A1
A process for producing an electrolytic copper foil using sampled copper sulfate solution being discharged from a copper refining process in order to supply a low-cost electrolytic copper foil for printed wiring board to the market. The ...  
WO2004055246A8
A copper electrolytic solution for obtaining a low profile electrolytic copper foil having reduced surface roughness on the rough surface side (side opposite to glossy surface) in the production of an electrolytic copper foil by the use ...  
WO/2004/070188A2
The invention relates to a production method for a perforated disk, which is provided for discharging a fluid and which, in particular, serves as a nozzle disk during the injection of fuel into the cylinders of an internal combustion eng...  
WO/2004/067199A1
A method of cutting an ultrafine pipe or bar and an ultrafine pipe or bar cut by it are disclosed, in which the ultrafine pipe or bar is cut at an exact length by remarkably reducing their processing steps without undergoing any ultra-pr...  
WO/2004/067806A1
A method of forming a screen-printing stencil comprising electroforming the stencil using a bi-polar electrical signal. The bi-polar signal comprises a cathodic pulse (22) and an anodic pulse (24) . When the cathodic pulse (22) is applie...  
WO/2004/067811A1
A method of manufacturing a cut electroforming member which has a stepped form and a cut electroforming member made by it are disclosed, in which a nonconductive section is formed in a core material and the cut electroforming member has ...  
WO/2004/067805A1
An ultrafine pipe and a method for manufacturing the same are disclosed. The method includes the steps of covering a core material passing through a die with a forming material existing at a melted state or partially melted state in the ...  
WO/2004/067810A1
A method of manufacturing a cut electroforming member and a cut electroforming member made by it are disclosed, in which an electroforming process is performed in an electroforming tub by connecting a negative electrode to a core materia...  
WO/2004/064135A1
A composite shape electroforming master, its electroforming master and a method for manufacturing the same are disclosed, in which the electroforming member has various sections. The electroforming master is made by the steps of forming ...  
WO/2004/064156A1
A method for manufacturing a laminated electroforming member includes the steps of forming a conducting portion on a surface of an electrode base at the same shape as that of the laminated electroforming member, forming an insulating por...  
WO/2004/064155A1
An electro-forming master repeatedly manufactured by an electro-forming process, its manufacturing method, and a metal minute pattern formed by the electro-forming master are disclosed. The method for manufacturing an electro-forming mas...  
WO/2004/059040A1
In the production of an electrolytic copper foil by means of a cathode drum, there is obtained a low-profile electrolytic copper foil having a low surface roughness on the roughened surface side (side opposite to glossy surface), especia...  
WO/2004/057669A1
An electro-forming master, its manufacturing method, and a metal minute pattern repeatedly formed by the electro-forming master are disclosed. The electro-forming master includes a concave portion formed on an upper surface of an electro...  
WO/2004/057055A1
An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist...  
WO2004012287A3
This invention relates to a method of manufacturing a metal-supported tubular micro-solid oxide fuel cell, and a fuel cell made from such method. The method comprises the steps of coating a wooden substrate member with a conductive subst...  
WO/2004/055892A1
An electro-forming master, a minute metal pattern repeatedly formed by the electro-forming master, and a method for manufacturing the minute metal pattern by the electro-forming process are disclosed. The electro-forming master is manufa...  
WO/2004/055246A1
A copper electrolytic solution for obtaining a low profile electrolytic copper foil having reduced surface roughness on the rough surface side (side opposite to glossy surface) in the production of an electrolytic copper foil by the use ...  
WO/2004/053972A1
A lead frame and its manufacturing method are disclosed. The lead frame is detachably formed on overlapped electrode bases having the same pattern as that of the lead frame by performing an electroforming process in a lead frame master i...  
WO/2004/043659A1
A metal screen material (32) having a flat side, in particular electroformed screen material, preferably seamless cylindrical screen material, comprises a network of dykes (34) which are connected to one another by crossing points (36), ...  
WO/2004/040042A1
The present invention is a nano meter crystal metal material, in particular, to a nano bicrystals copper material with super high strength and conductivity, and to a method of preparing thereof. High purity polycrystal Cu material is pre...  
WO/2004/040043A2
Disclosed is a method for producing a band comprising a support band (11), according to which a textured metal layer (17) is created by producing a structured band (12) that is then joined in a fixed manner to the support band (11) by me...  
WO/2004/038071A2
A process for electroplating of metal utilizing a valve metal electrode substrate containing multiple coating layers is disclosed. A top coating layer of a valve metal oxide is applied over a first coating layer of an electrochemically a...  
WO/2004/035874A1
Production of an electrolytic copper foil with the use of a cathode drum, wherein there is obtained an electrolytic copper foil of low profile having a low surface roughness on the roughened surface side (side opposite to glossy surface)...  
WO/2004/025758A1
A metal foil for the current collector of a secondary battery satisfying the following relations; 4.9×108≤T×S×Y≤31×108, and 4.5≤&epsiv -(0.0005×T2)≤15 assuming the thickness (T) is 8-40µm, the breaking strength is (S, MPa),...  
WO2003069705B1
This invention relates to a stack comprising a continuous solid-phase matrix and tubular fuel cells embedded in the matrix. Each fuel cell comprises an inner electrode layer, an outer electrode layer, and an electrolyte layer sandwiched ...  
WO/2004/016831A1
A method of producing a sleeve of high precision and high hardness, comprising the steps of using matrices in the form of bar−like members or tubular matrixes having an inside hole for receiving a core wire of electric conductivity, ef...  
WO/2004/012285A1
A nickel foil for electrode on which it is easy to form indented portions for supporting an active substance for battery or an active substance holding material; and a process for producing the nickel foil for electrode. Nickel foil (1) ...  
WO/2004/012287A2
This invention relates to a method of manufacturing a metal-supported tubular micro-solid oxide fuel cell, and a fuel cell made from such method. The method comprises the steps of coating a wooden substrate member with a conductive subst...  
WO/2004/011130A1
A filter for a hydrogen production, which is used in a reformer of a fuel cell and enables stable production of a hydrogen gas of a high purity, is manufactured by attaching a metal plate onto one side of a conductive base having a plura...  
WO/2004/009876A1
A copper electrolyte which comprises, as additives, an organic sulfur compound and an amine compound which is prepared by the addition reaction of a compound having one or more epoxy groups in one molecule with an amine compound and has ...  
WO/2004/005588A1
An electrolytic copper foil with carrier foil that enables easily performing a multilayering process and enables forming circuits of finer pitch as demanded in contemporary printed wiring boards. In particular, an electrolytic copper foi...  
WO/2004/003258A2
The invention relates to a method for producing a structured metal layer, as is used for example as an antenna for RFID labels. The structured metal layer is galvanically deposited on a cathode, on whose surface conductive and non-conduc...  
WO/2004/001100A1
The invention relates to a process for forming coatings or free-standing deposits of nano-crystalline metals, metal alloys or metal matrix composites. The process employs drum plating or selective plating processes involving pulse electr...  
WO2003028895A3
An aperture plate (10) comprises a plate body (12) having a top surface (16), a bottom surface (18), and tapered walls that form a plurality of apertures (14) that taper from the bottom surface (18) to the top surface (16) wherein the pl...  
WO2003027011B1
A method is described for catalyst-induced growth of carbon nanotubes, nanofibers, and other nanostructures on the tips of nanowires, cantilevers, conductive micro/nanometer structures, wafers and the like. The method can be used for pro...  
WO/2003/101698A1
In one embodiment, a microreplication tool includes gas release features that allow gas to escape from microreplication cavities of the tool. The gas release features can be disposed at the bottoms of the respective cavities to avoid air...  
WO2003030186A3
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passibe circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copp...  
WO/2003/100881A2
This invention relates to a fuel cell system (10) comprising an outer tubular solid oxide fuel cell (13), a solid phase porous matrix (20) located inside the outer fuel cell and attached to its inner electrode layer, and at least one inn...  
WO/2003/095714A1
A process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil from which detachment of a carrier foil is easy even after press working at 200ºC or higher. In particular, for example, a process for ...  
WO/2003/095713A1
Electroplating processes (e.g. conformable contact mask plating and electrochemical fabrication processes) that include in situ activation of a surface onto which a deposit will be made are described. At least one material to be deposite...  
WO/2003/096776A1
A flexible printed wiring board that has an insulating layer of high light transmission, is excellent in adhesive strength and migration resistance and is suitable for chip-on-film (referred to as COF). In particular, a flexible printed ...  

Matches 401 - 450 out of 5,656