Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 2,084

Document Document Title
WO/2012/057073
Disclosed is a solar thermal collector member (10A, 10B) provided with a metal layer (M) having a surface. The surface of the metal layer (M) has a moth eye structure containing multiple convexities (10p) or an inverted moth eye structur...  
WO/2012/049991
The objective of the present invention is to provide: an aluminum-made porous metal body having a three-dimensional mesh structure as a porous metal body suitable for use as an electrode of a molten salt battery; a method for producing t...  
WO/2012/046804
Provided is a copper foil with carrier capable of providing wirings of line/space=15 μm/15 μm or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed ci...  
WO/2012/039287
Provided are: a method for producing an aluminum structure using a porous resin molded body that has a three-dimensional network structure, by which an aluminum structure that has a small amount of oxide on the aluminum surface (namely, ...  
WO/2012/036065
Provided is a method for producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, wherein an aluminum structure with a small amount of oxide (with a thin oxide film) on an aluminum su...  
WO/2012/007526
A device for electrochemical pattern replication, ECPR, is provided. The device comprises; a base; a bottom chuck on a X-Y-Theta stage, said bottom chuck being configured to hold a master electrode or a substrate; and a Z-stage with an a...  
WO/2012/007524
A chuck (100) for holding a substrate or master electrode in an ECPR process is provided. The chuck comprises an interaction surface (101) for holding a master electrode or a substrate; a buffer surface (102) circumferentially of the int...  
WO/2012/007520
A chuck (100, 200, 500) for holding a master electrode (107, 207) or a substrate (111, 211) during an ECPR process is provided. The chuck comprises an interaction surface (102, 201) onto which the master electrode (107, 207) or the subst...  
WO/2012/007523
A chuck for holding a substrate or master electrode in an ECPR process is provided. The chuck has a proximal and a distal end, and comprises an interaction surface (205) for holding the substrate or master electrode positioned in a first...  
WO/2012/007522
Methods for separating a master electrode (101, 201) and a substrate (102, 202) in an ECPR process after printing are disclosed. The master electrode (101, 201) or the substrate (102, 202) is arranged on a first chuck (103, 104, 203, 204...  
WO/2012/007526
A device and method for electrochemical pattern replication, ECPR, is provided. The device comprises;a base;a bottom chuck on a X-Y-Theta stage;and a Z-stage with an attached top chuck, said chucks being configured to hold a master elect...  
WO/2012/002526
Disclosed is an electrodeposited copper foil which can exhibit various properties stably even when the chlorine content therein is varied. Specifically disclosed is an electrodeposited copper foil produced by electrolyzing a copper elect...  
WO/2011/156500
Probe-based methods are provided for wire bonding and joining of structures. The wire bonds are formed via a meniscus-confined electrodeposition technique. The electrodeposition technique of the invention can also be used for fabricating...  
WO/2011/156500
Probe-based methods are provided for wire bonding and joining of structures. The wire bonds are formed via a meniscus-confined electrodeposition technique. The electrodeposition technique of the invention can also be used for fabricating...  
WO/2011/142338
The disclosed method involves an conductivity-imparting step for forming on a surface of a resin molded body a conductive layer comprising one or more types of metal selected from a group comprising gold, silver, platinum, rhodium, ruthe...  
WO/2011/132538
Disclosed is a high purity aluminum structure formed by using a resin porous body having a three-dimensional network structure, plating, with aluminum in a molten salt bath, a resin molded body, at least the surface of which has been ren...  
WO/2011/129633
Provided is a copper electrolysis solution for producing an electrolytic copper foil, according to an embodiment of the present invention, includes a Cl- ion, and collagen peptide, wherein the collagen peptide has a number average molecu...  
WO/2011/129633
Provided is a copper electrolysis solution for producing an electrolytic copper foil, according to an embodiment of the present invention, includes a Cl- ion, and collagen peptide, wherein the collagen peptide has a number average molecu...  
WO/2011/119818
An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode...  
WO/2011/111639
Disclosed is a composition for manufacturing contacts, which includes prescribed quantities of cobalt and sulphur and has a specified mean particle size, and a contact and connector using the same. The composition for manufacturing conta...  
WO/2011/111517
Provided are a porous Ni-Mo plating film that can be made thick and a manufacturing method therefor.  
WO/2011/099371
Disclosed is a manufacturing method which enables more accurate and precise manufacturing of an ultra-fine, thin contact for current inspection jigs which is provided with a spring structure. After a metal or gold alloy plating layer is ...  
WO/2011/079850
The invention relates to a method for producing a composite body (100) made of at least one self-supporting surface (30) and at least one element (20, 20a, 20b, 20c) connected to the surface (30) in a coating process, wherein the followi...  
WO/2011/078087
A perforated metallic foil configured so that, even if the aperture ratio of the foil is increased, a reduction in the tensile strength of the foil is minimized to prevent the foil from breaking during handling thereof. A perforated meta...  
WO/2011/067957
Disclosed is a porous metal foil which is formed from a two-dimensional network structure made up of metal fibres. The porous metal foil has excellent characteristics and may be obtained with high productivity and at low cost.  
WO/2011/064614
The invention relates to a method for fabricating nanowires and a method for fabricating an electrode of an electrochemical device. The nanowire fabrication method according to the invention comprises: a) a step of depositing, on one of ...  
WO/2011/059213
The present invention relates to a method for producing a three dimensional metal thin-film in which a fine three-dimensional pattern is formed, wherein the production comprises the steps of: (A) making a plate mould on which a three dim...  
WO/2011/059023
Disclosed is an aluminum foil which can be easily produced and has low surface resistance. The aluminum foil is capable of providing a thinner positive electrode collector film that enables an electricity storage device to have a smaller...  
WO/2011/040451
Disclosed is a sliding member which is used in direct sliding contact with a partner material in a rotational, oscillatory or reciprocating configuration and which has excellent wear resistance, has a high-precision sliding surface shape...  
WO/2011/027184
The invention relates to: a device for the cold production of pure silicon nanowires by means of electrodeposition in an enclosure insulated from the atmosphere, the associated method, and the resulting nanowires. The device includes at ...  
WO/2011/023398
The invention relates to a method for producing at least one strip conductor on a substrate, characterised by the following method steps: a. preparation of an electrically conductive polymer structure by means of electrochemical polymeri...  
WO/2011/001932
Provided is a method for manufacturing a highly-ductile, high-purity aluminum foil at high speed by electrolysis using a plating solution having a low chlorine concentration. Said method is characterized by the formation of an aluminum f...  
WO/2010/142529
The invention relates to a method for manufacturing a plurality of metal microstructures characterised in that said method includes the following steps: a) obtaining a conductive substrate or an insulating substrate covered with a conduc...  
WO/2010/137568
Provided are a method for manufacturing perforated metal foil and perforated metal foil which achieve stable quality and improved production efficiency. Specifically provided is perforated metal foil with a substrate characterized by bei...  
WO/2010/105598
The invention relates to a device for calibrating a melted plastic strand, with a single-piece, galvanically deposited moulded body (20) having a round cross-section in its stress-free initial state and a separation (6, 7) in the longitu...  
WO/2010/102516
A method of forming hard gold jewellery includes forming a mandrel of low melting point material, electroplating a gold layer over the mandrel, electroplating a copper layer over the gold layer, forming holes through the electroplated la...  
WO/2010/079515
A one step, room temperature, electrochemical process for the synthesis of rutile titanium dioxide nanoneedles with high aspect ratio is disclosed herein.  
WO/2010/072861
It comprises the following steps: (i) Depositing on glass a nickel electrode layer; (ii) depositing a layer of photosensitive material (photoresist) on the electrode layer; (iii) conferring a pattern on the photoresist having photolithog...  
WO/2010/065989
A process for forming a porous metal oxide or metalloid oxide material, the process including: - providing an anodic substrate including a metal or metalloid substrate;- providing a cathodic substrate; - contacting the anodic substrate a...  
WO/2010/067754
Provided is an electrolytic electrode used as an anode arranged at a distance from a rotatable cathode. The electrolytic electrode includes a base (10) having an arc-shaped cross section and a plurality of electrode plates (12) arranged...  
WO/2010/063071
An apparatus (10) for separating a deposit of metal deposited on an inside of a generally cylindrical cathode member comprises a separator (12) adapted to be positioned such that an edge of the separator is positioned adjacent a junction...  
WO/2010/049246
The invention relates to a method for making metal microtructures, including the steps of : a) providing a substrate (1, 2) comprising a conductive priming surface (2); b)-d) forming a first resin mould (3b) by UV photolithography, the o...  
WO/2010/035417
A matrix (11) is fabricated by opening a cavity (15) in an insulating layer (14) formed over the upper face of an electroconductive base material (13). The matrix (11) is arranged in an electrolytic bath, and a voltage is applied theret...  
WO/2010/029550
A process of preparing a plurality of nanostructures, each being composed of at least one target material is disclosed. The process comprises sequentially electrodepositing a first material and the at least one target material into pores...  
WO/2010/027052
Disclosed is an ultrathin copper foil with carrier that suppresses blistering and stabilizes peeling strength, specifically an ultrathin copper foil with carrier in which the carrier foil and ultrathin copper foil can be easily peeled ap...  
WO/2010/005993
The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be la...  
WO/2010/005993
The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be la...  
WO/2010/004885
Disclosed is a surface treated copper foil that comprises a chromium-free surface treatment layer and, after working into a printed wiring board, for example, has an excellent peeling strength of a circuit and an excellent percentage che...  
WO/2010/004988
In order to provide an electrolytic copper foil having flexibility/bending ability equivalent to or better than that of rolled copper foil, electrolytic copper foil is produced such that after thermal treatment is applied to the electrol...  
WO/2009/157768
The invention provides a process for preparing a flexible substrate onto which a film of a transparent conductive oxide has been applied, which process comprises the steps of: (a) providing a metal carrier; (b) chemically and/or thermall...  

Matches 1 - 50 out of 2,084