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Matches 1 - 50 out of 14,345

Document Document Title
WO/2019/159163A1
A method of no-bath plasma electrolytic oxidation of a workpiece made of a valve metal or an alloy thereof is disclosed. The aforesaid method comprises the steps of: (a) deploying the workpiece to form a first electrode; (b) providing an...  
WO/2019/156514A1
A sulfur powder, a sulfur electrode, a battery comprising same, and a manufacturing method therefor are disclosed. The manufacturing method of a sulfur powder comprises the steps of: positioning an electrode plate connected to an anode o...  
WO/2019/152555A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/151487A1
The present invention relates to a surface treatment device and a surface treatment method. Electrodes (30) of a surface treatment device (10) comprise a first electrode (36) and a second electrode (38). The first electrode (36) is inser...  
WO/2019/148107A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  
WO/2019/143281A1
Holder device (1) for a surface treatment system, where the holder device (1) is adapted to holdan object (20) comprising a circular member (21), where the holder device (1) comprises a housing (2) having an open upper end (3) and an ope...  
WO/2019/138818A1
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...  
WO/2019/127014A1
An electroplating assembly mechanism comprises an electroplating drum (3). The electroplating drum (3) has a circular drum body (31), a rotary shaft (32), an engagement portion (33), and a plurality of vortex blades (37). A first end (32...  
WO/2019/130859A1
Provided is a method for producing a photoelectric conversion element, which improves the production efficiency. The present invention is a method for producing a photoelectric conversion element that comprises a photoelectric conversion...  
WO/2019/119820A1
Disclosed is an electroplating transmission system. The electroplating transmission system comprising: a fixed bracket; two steel wheels rotatably mounted on the fixed bracket; a conveyor belt made of an electrically conductive material,...  
WO/2019/119807A1
Disclosed is a coil-type vertical continuous electroplating production line, comprising a machine frame; an uncoiling mechanism, a process tank and a coiling mechanism successively provided on the machine frame; and a fixed portion and a...  
WO/2019/115938A1
The invention relates to a tool for electroplating that limits, or even prevents a chemical metallization of the plastisol covering it during an operation for metallization by electroplating of plastic parts in chromium-free baths, the p...  
WO/2019/111556A1
This electricity storage device (1, 1A, 1B, 1C) is provided with a laminate (2) of a bipolar electrode (3), which comprises a steel sheet (S) and a plating layer (30) that is provided on the surface of the steel sheet (S). The plating la...  
WO/2019/107339A1
The present invention relates to a plating apparatus and plating method for partially forming a plating film on an object to be plated. The plating apparatus is provided with: a rotary electrode capable of rotational operation; a plating...  
WO/2019/102867A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; a treatment liquid supply unit which supplies a treatment liquid to the substrate that is held by the substrate holding...  
WO/2019/102866A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; an electrolytic treatment unit which performs an electrolytic treatment on the substrate that is held by the substrate ...  
WO/2019/099034A1
The present invention includes a hypochlorite-producing device and method comprising: at least one hollow body suitable for partial or total immersion in an aqueous solution, said body comprising in its inside at least two electrodes whe...  
WO/2019/089282A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating s...  
WO/2019/059738A3
The present invention relates to a method for manufacturing a Cu delafossite photoelectrode by using electro-deposition, which is capable of producing a photoelectrode by efficiently electro-depositing Cu delafossite on a substrate throu...  
WO/2019/082554A1
In the present invention, a plurality of first pins (31) of a frame (2) pass through a plurality of first holes in a back panel (1). A fastening body (33) is caused to move outwardly by a moving mechanism (34) of a locking mechanism (3)....  
WO/2019/078063A1
A surface treatment device (1) comprising: a treatment tank (3-1) accommodating a treatment fluid; at least one positive electrode (20) disposed inside the treatment tank; at least one negative electrode rail (40–1); intermittent conve...  
WO/2019/077446A1
Frame with rotating baskets for galvanic treatments, provided with plates (13-13'), each of which irreversibly fixed between two uprights (11), fixed and connected by means of gears (14-14') provided with a central metal plate (15) with ...  
WO/2019/078065A1
A surface treatment device (1) having: treatment tanks (3–1 – 3–n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a ...  
WO/2019/079193A1
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating st...  
WO/2019/078712A1
The invention relates to a method for applying a layer on a substrate surface, comprising applying the layer on a plating part of the substrate surface by plating to which end the plating part is brought into contact with an electrolyte....  
WO/2019/078064A1
A surface treatment device (1) having: a treatment tank (3–1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails ...  
WO/2019/063197A1
The present invention is related to a method for electrolytically depositing a zinc-nickel alloy layer on a substrate, wherein the method comprises an interrupting of the execution of the electrolytical deposition of a zinc-nickel alloy ...  
WO/2019/064098A1
Multi-directional modulatable frame (200) for galvanic treatments, constituted by at least four base elements (20) made of plastic material, adapted to be mutually engaged, forming a parallelepiped for supporting the lead wires (17) conn...  
WO/2019/061582A1
A hanger lifting hook (100), the hanger lifting hook (100) comprising a fixed member (10) and a movable member (20); the fixed member (10) comprises a connecting plate (11) and a mounting plate (12) which are vertically connected; the mo...  
WO/2019/067841A1
The present disclosure relates to a reflective layer manufacturing apparatus which forms a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same. The present disclosure provid...  
WO/2019/059058A1
This electrolytic treatment assembly 100, which is fitted to a surface treatment tank 10 that performs an electrolytic treatment on the surface of a work 1 that is set on a negative electrode, comprises a nozzle unit 200 and a positive e...  
WO/2019/058860A1
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...  
WO/2019/059423A1
The present invention relates to a method for producing a porous nanostructure and, in more detail, comprises: a preparation step for preparing an electrically conductive substrate; a foam forming step wherein an electrochemical depositi...  
WO/2019/059738A2
The present invention relates to a method for manufacturing a Cu delafossite photoelectrode by using electro-deposition, which is capable of producing a photoelectrode by efficiently electro-depositing Cu delafossite on a substrate throu...  
WO/2019/055962A1
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...  
WO/2019/040111A1
Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimi...  
WO/2019/036207A1
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...  
WO/2019/035236A1
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the an...  
WO/2019/029856A1
The invention relates to the technical field of galvanizing of iron-based or ferrous components, in particular steel-based components or components containing steel (steel components). In particular, the invention relates to a hot-dip ga...  
WO/2019/026578A1
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...  
WO/2019/021607A1
This work holding jig (1A) is provided with a back panel (11) and a frame body (12). The frame body (12) comprises: an annular main body (13); a conductive member (15) which is provided on the entire circumference of the main body (13); ...  
WO/2019/021599A1
A printed wiring board production method for forming a base film and an electroconductive pattern on said base film by an additive method or a subtractive method, wherein: the printed wiring board production method has a plating step for...  
WO/2019/016543A1
EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber co...  
WO/2019/013111A1
The purpose of the present invention is to partially or locally control the thickness of a plating film on a square substrate. Provided is a regulation plate for regulating current between an anode and a square substrate. This regulation...  
WO/2019/013002A1
[Problem] To provide a plating solution assessment method and plating solution assessment mechanism that have a simple configuration and make it possible to estimate the state of a plating solution and a coating while plating treatment i...  
WO/2019/006540A1
In a method for cathodically protecting and/or passivating a metal section in an ionically conductive material such as steel reinforcement in concrete or mortar, an impressed current or sacrificial anode communicates ionic current to the...  
WO/2019/003459A1
A masking jig 100 is provided with: a contact member 130 that has formed therein a through-hole 133 through which a rod-like piston rod 10 is passed, and has, around the through-hole 133, a deformable part 134 which gets elastically defo...  
WO/2019/004717A1
In the present invention, a photosensitive layer is formed on the top surface of a planar substrate, and a protruding part and a space part are formed on the photosensitive layer through an exposure and development process. On the basis ...  
WO/2019/003891A1
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the sa...  
WO/2019/006009A1
Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal d...  

Matches 1 - 50 out of 14,345