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WO/2011/010883A2 |
The present invention relates to a method for manufacturing a dimensionally stable anode for electrolytic sterilization. The anode of the present invention is manufactured by processes including a titanium etching step, a drying step, a ...
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WO/2010/151561A1 |
Apparatus, systems and methods for performing gel electrophoresis using a monolithic electrophoresis unit that at least includes first and second chambers containing one or more buffer solutions and a gel chamber containing a pre-cast ge...
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WO/2010/142330A1 |
Device (1) for holding pieces of goods, while treating the goods during a surface treatment process. The device (1) comprises a plurality of hangers (2), each hanger including an elongated element (3) having one end (4) arranged for the ...
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WO/2010/144330A2 |
An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the i...
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WO/2010/144424A2 |
Electrodes, particularly electrochemically active electrodes, may benefit from one or more pretreatment cycles in which the electrode is substantially oxidized, reduced or otherwise exhausted prior to use in an end use application, for e...
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WO/2010/138996A1 |
A mercury vapour sensor in which the sensor surface is a gold substrate, and gold nanostructures with controlled crystallographic facets are strongly adhered to the substrate. A substantial increase in response magnitude and stability of...
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WO/2010/133223A1 |
The invention relates to a method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material (1) in continuous installations or bath installations having rotating transport and contact means (2) al...
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WO/2010/133222A2 |
The invention relates to a method and a device for the electrochemical treatment of substrates in continuous installations or dip coating installations including the electric contacting of the material (1) on opposite edges by means of r...
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WO/2010/133221A2 |
The invention relates to a device and a method for electrically contacting plate-shaped or strip-shaped material (1) which is conveyed on a conveyor belt through a continuous electroplating plant by means of rotating transport means and/...
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WO/2010/130750A2 |
The invention relates to a device for simultaneously coating a plurality of workpieces, wherein the plurality of workpieces is arranged in a common flow shaft through which an electrolyte flows and wherein each workpiece is conductively ...
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WO/2010/128641A1 |
An insoluble anode for use in an electrolysis step accompanied by oxygen generation, which has sufficient durability even in electrolysis accompanied by cathodic polarization besides anodic polarization. The electrode hence has a prolong...
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WO/2010/128000A1 |
An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the b...
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WO/2010/125515A1 |
The invention relates to a machine for the surface processing of metal parts by immersion into at least one processing liquid contained in a processing tank comprising a plurality of tanks (101, 102, 103) arranged in series and to a devi...
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WO/2010/127094A2 |
Copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous s...
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WO/2010/125283A2 |
The invention relates to a method consisting of spraying a metallization on a delimited area (2) of the part (1). Said method comprises the following steps: making a notch on the entire outline delimiting said delimited area (2), the not...
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WO/2010/121815A1 |
In order to transport a flat material feedstock (21) in a system for the chemical and/or electro-chemical treatment of the material feedstock (21), in which the material feedstock (21) is transported in a transport plane in a transport d...
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WO/2010/120158A2 |
The present invention relates to an electroplating apparatus which comprises: a plating vessel containing electrolyte solution; and a supply unit which is connected to the plating vessel and which sprays the electrolyte solution containi...
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WO/2010/108996A1 |
The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: - a container (10) intended to contain an electrolyte (E), - a support (2...
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WO/2010/102917A1 |
An electrolytic pickling, passivating and cleaning machine (100) of metal surfaces is described, comprising: a dispensing nozzle or gun (1) used to dispense ionizable detergent liquid, a tank (2) containing said ionizable detergent liqui...
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WO/2010/103749A1 |
A jig for plating (10) removably holds a rectangular substrate (50) and immerses the substrate (50) in a plating solution. The jig for plating (10) is provided with a pair of longitudinal members (21, 22) which hold the both sides (51, 5...
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WO/2010/100894A1 |
Proposed are a method for very efficient anodic oxidation of an aluminum film formed on a substrate having a large area and an electrode structure used in this method. A method for manufacturing a moth eye mold includes (a) a process for...
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WO/2010/095415A1 |
Disclosed is a method for producing a mold for moth eye structures, which comprises: a step (a) wherein a porous alumina layer having a plurality of fine recessed portions is formed by anodizing a surface (10a) of an aluminum film or alu...
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WO/2010/088326A2 |
A method and apparatus for plating parts like lug nuts or other metal parts that have both an easily plated outside surface as well as a recessed cavity. The invention works in combination with a standard multi-station plating process. A...
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WO/2010/079735A1 |
A copper material for plating which comprises a coil constituted of a spirally wound copper wire. A process for producing a copper material for plating is provided which comprises the step of supplying a copper wire, the step of winding...
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WO/2010/067754A1 |
Provided is an electrolytic electrode used as an anode arranged at a distance from a rotatable cathode. The electrolytic electrode includes a base (10) having an arc-shaped cross section and a plurality of electrode plates (12) arranged...
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WO/2010/062162A2 |
The present invention relates to a method for chlorination of silver materials in the forms of wire, thick film paste and metallic sheet/disc. The method is environmentally friendly since the process does not produce hazardous chemicals ...
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WO/2010/054677A1 |
A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the ...
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WO/2010/052246A2 |
The invention relates to a device (1, 101, 201) for electrochemically coating a work piece (22), comprising a coating reservoir (2, 102, 202) with a feed opening (5) and comprising a supply reservoir (3, 103, 203), wherein the two reserv...
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WO/2010/043402A1 |
The present application relates to a method and to a device for producing a low-wear nickel- and boron-containing hard coating on a metal surface. In the method according to the invention, boron or boron compound particles are dispersed ...
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WO/2010/037689A1 |
A process for incorporating one or more particles in a conducting or semiconducting surface layer of a surface layer of the support, which comprises the steps of positioning one or more particles on the surface of the conducting surface ...
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WO/2010/036758A2 |
A material (20) is coated to enhance and add desirable properties through a metalliding process employing an atmosphere (14) substantially free of oxygen and an electrolytic bath (18) within the atmosphere (14). An electrically conductiv...
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WO/2010/036298A1 |
Stainless steel (8) sinks are disclosed which have a chrome surface coating layer. In one highly preferred form the layer is electroplated in a non-uniform manner such that high wear areas automatically receive an extra thickness of the ...
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WO/2010/037085A1 |
In one aspect, described herein are field effect chemical sensor devices useful for chemical and/or biochemical sensing. Also provided herein are methods for single molecule detection. In another aspect, described herein are methods usef...
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WO/2010/031516A1 |
The invention relates to a device for dip coating a bodywork part (1), comprising a bath (2) for receiving a coating liquid (3). Said device has two parallel guides (10, 11) for guiding the bodywork part (1) and an anode body (6). The bo...
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WO/2010/033367A2 |
Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outs...
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WO/2010/031215A1 |
The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers beari...
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WO/2010/026958A1 |
A device for plating a cylinder block for subjecting the cylinder inner peripheral surface of a cylinder of a cylinder block to plating pretreatment or plating treatment by circulating a treatment liquid with one end side of the cylinder...
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WO/2010/022824A2 |
The invention relates to the wet processing and electroplating of one side and/or the edge of a flat product (1) used as a substrate in production systems containing process chambers (4), through which treatment liquid flows (8), wetting...
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WO/2010/019767A1 |
A method for reclaiming a semiconductor material from a glass substrate is disclosed, the method comprises the steps of providing at least one glass substrate having the semiconductor material disposed thereon, reducing the glass substra...
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WO/2009/152915A2 |
The invention relates to a method for the copper electroplating of a workpiece (50), in particular an impression cylinder (50), according to which copper carbonate (74, 79) is fed to a sulphuric-acid copper plating bath (30, 32, 34) for ...
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WO/2009/152896A1 |
The invention relates to the wet-chemical or electrolytic treatment of flat material, for example a wafer, which according to the prior art is treated by means of technically complex frames or grippers in treatment chambers. Particularly...
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WO/2009/150083A1 |
The invention relates to a method for selectively depositing a precious metal (32) on a metal substrate (10), the method sequentially comprising: a masking step, consisting of depositing a mask element (16) on one treated surface (12) of...
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WO/2009/146773A1 |
The invention relates to the electrical contact of flat material (1) as sections in straight-through installations for the electrolytic and/or chemical wet treatment of the treatment side (10) of the material using external electric curr...
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WO/2009/146684A2 |
The present invention relates to a device for use in a method for the galvanic production of a protective layer comprising hard material particles on a component of a turbomachine, particularly a blade tip armoring of a blade tip of a ro...
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WO/2009/145994A1 |
An apparatus for protection of metallic materials from corrosion comprising an electrical power source (5) and a conductor (7) coupled to the power source. An anode (11) is electrically coupled to the conductor. The anode is configured t...
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WO/2009/143426A1 |
A continuous electro-cleaning, pickling and electroplating apparatus and method using a plurality of elongate tubes that are electrically conductive.
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WO/2009/127037A1 |
An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coati...
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WO/2009/126021A2 |
The present invention provides a method for producing solar cells, comprising the steps of - providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, - success...
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WO/2009/114965A1 |
An electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface (10) for receiving semiconductor wafers, a mainframe (11) comprising a mainframe transfer robot (102,106) and a plurality of wafer ho...
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WO/2009/111582A2 |
Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar bo...
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