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WO/2022/149257A1 |
The purpose of the present invention is to suppress or prevent a plating solution from intruding into a sealed space in a substrate holder, while detecting intrusion of the plating solution in an early stage. Provided is a substrate ho...
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WO/2022/144987A1 |
The present invention optimizes the operation control and component disposition of this plating apparatus in order to avoid contamination by particles. A plating apparatus 1000 for performing a plating process on substrates is provided...
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WO/2022/144985A1 |
Provided is a technology that can prevent air bubbles from accumulating on the underside of an electric field shielding plate. A plating device comprises: a plating tank in which a plating solution is stored and in which an anode is di...
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WO/2022/145170A1 |
The purpose of the present invention is to provide a method and system for electroplating without requiring ancillary facilities or anode solution control, while using an anode that is able to be relatively easily produced without requir...
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WO/2022/144988A1 |
The present invention uses a simple structure to reduce the quantity of air bubbles that adhere to a plating-receiving surface. This substrate wetting method includes: a retention step 102 in which a backplate is used to retain a back ...
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WO/2022/138999A1 |
The present invention relates to a 3D printing device using selective electrochemical deposition and particularly to a 3D printing device capable of selectively depositing metal materials onto a substrate by using additive manufacturing ...
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WO/2022/137277A1 |
Provided is a technology for causing a plating solution to be stirred without using a paddle. This plating device 1000 comprises a holder cover 50 that is disposed on a substrate holder 30 and rotates with the substrate holder when the...
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WO/2022/139000A1 |
The present invention relates to a three-dimensional printing device using selective electrochemical deposition and particularly to a three-dimensional printing device capable of selectively depositing metal materials onto a substrate by...
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WO/2022/134491A1 |
Disclosed in the present invention are a device and method for preventing crystallization of a plating solution on a squeezing assembly of an electroplating apparatus in the technical field of electroplating copper film manufacturing. Th...
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WO/2022/137935A1 |
This treatment method is performed after Sn or Sn alloy plating and is for preventing accumulation of contamination by compounds of the Sn or Sn alloy deposited on a substrate, transfer jig, etc. The treatment method is characterized by ...
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WO/2022/137380A1 |
The present invention easily adjusts the position of a substrate holder. A plating module 400 includes: a plating tank 410 for storing a plating fluid; a substrate holder 440 for holding a substrate Wf while a surface Wf-a to be plated...
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WO/2022/137339A1 |
Provided is a technology by which the size of a plating device can be reduced. This plating device is provided with a discharge module 50. The discharge module is provided with: a module body 51 which has multiple nozzles 52 from which...
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WO/2022/129231A1 |
The invention relates to a method for applying a nanolaminate to a metal workpiece, wherein a coating of a nanolaminate is applied in a region exposed to a notch effect, for a example a weld seam, which nanolaminate consists of a sequenc...
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WO/2022/127515A1 |
Disclosed in the present invention is a cup-shaped chuck of a substrate holding device. The cup-shaped chuck comprises an inner pressing ring, a middle frame, a sealing member, an outer pressing ring and a contact ring. The inner pressin...
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WO/2022/128482A1 |
The present application relates to a system for a surface treatment of a substrate with a fluid and a method for a surface treatment of a substrate with a fluid. The system for a surface treatment of a substrate with a fluid comprises a ...
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WO/2022/123681A1 |
The present invention achieves a substrate holder with high substrate holding reliability. According to the present invention, a plating module includes a plating tank for containing a plating solution, a substrate holder 440 for holdi...
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WO/2022/118431A1 |
Provided is a plating apparatus that is capable of shielding specified portions of a wafer at a prescribed timing. The plating apparatus comprises: a plating bath 410 for accommodating a plating solution; an anode 430 disposed in the p...
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WO/2022/119821A1 |
In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a subst...
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WO/2022/116509A1 |
Disclosed are a device and method for preventing a conductive roller from being plated with copper, belonging to the technical field of the manufacturing of electroplated copper films. The conductive roller and an electroplating anode ar...
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WO/2022/118876A1 |
The purpose of the present invention is to provide an acidic plating system which is not likely to generate chlorine gas even if chloride ions enter an anode chamber. This acidic plating system comprises: an acidic plating bath contain...
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WO/2022/117737A1 |
A method of recovering metal from a chemical bath (100) for chemically treating a structure with metal, wherein the method comprises supplying a chemical composition comprising metal from the chemical bath (100) to a membrane distillatio...
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WO/2022/112015A1 |
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for an electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary ca...
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WO/2022/107926A1 |
Provided is a substrate transport equipment for continuously transporting substrates arranged in a vertical direction in a plating section. Provided may be a substrate transport equipment, according to one aspect of the present invention...
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WO/2022/107551A1 |
Provided in a jet-type plating device is a plating process that sufficiently achieves the benefits of an insoluble anode. The present invention is a plating device comprising a plating tank that has an opening, a liquid feed tube, an ins...
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WO/2022/102119A1 |
The present invention improves, in each part of a plate, the accuracy of porosity and/or the degree of freedom in adjusting porosity. This plate is disposed between a substrate and an anode in a plating tank, the plate comprising a hol...
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WO/2022/101541A1 |
Described is a coated electrode comprising a conductive substrate and a coating, wherein the coating comprises an outer coating composition forming at least one outer coating layer and comprising manganese and iridium. The molar ratio of...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/086881A1 |
Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode materia...
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WO/2022/087487A1 |
Solution electro writing systems, solution electrowriting methods, products made by the solution electrowriting systems or methods, and uses thereof. A solution electro written product can include one or more layer(s) of fibers in a pred...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/081386A1 |
Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a...
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WO/2022/070983A1 |
The purpose of the present invention is to provide a tin plating liquid for barrel plating that can suppress the occurrence of mold in washing water for a washing step that follows a tin plating step, even in bath temperature environment...
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WO/2022/072390A1 |
A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during...
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WO/2022/061948A1 |
The present invention relates to an insoluble anode methyl sulfonic acid coating low-lead content tin plate production method. The method comprises the following steps: step 1: an alkaline washing process section, first performing electr...
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WO/2022/057703A1 |
A diamond drill bit production electroplating device, comprising a bottom plate, an outer barrel being provided on the bottom plate, and an electroplating barrel being provided within the outer barrel; a circular first rotary disc which ...
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WO/2022/042892A1 |
The disclosure relates to a plating frame unit for holding a substrate in a chemical and/or electrolytic surface treatment of the substrate and a method for assembling a plating frame unit for holding a substrate in a chemical and/or ele...
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WO/2022/039060A1 |
Provided is a plating device for producing a highly precise plating layer. This plating device (10) is provided with a plating vessel (9), cathodes (1a to 1f), a holding mechanism (2), an anode (3), and a rotation mechanism (4). In the p...
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WO/2022/036237A1 |
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath....
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WO/2022/033990A1 |
The invention comprises a process for the galvanic nickel plating of a fin wall (FW), which has at least one wall part (FW') which is formed from a number of tubes R1, R2, …, R5) running alongside one another in a longitudinal directio...
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WO/2022/022967A1 |
The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate and a manufacturing method for a distribution system for a process fluid for a chemical and/or electr...
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WO/2022/018383A1 |
The present invention relates to composite beads coated with H-Birnessite layered manganese oxide with a sheet nanostructure, the average thickness of the sheets being between 1 and 50 nm, and the length L of the sheets being between 0.2...
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WO/2022/013387A1 |
This invention relates to a method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution a...
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WO/2022/011889A1 |
A continuous production line using an mSAP process, the production line comprising a flying target (4) for vertically conveying a circuit board and a continuous wire provided along the conveying direction of the flying target (4). The co...
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WO/2022/014316A1 |
A plating electrode (100) comprises a nozzle (1) and a retaining part (2). The nozzle (1) includes a tip section (1e). The nozzle (1) is for supplying a plating solution (PS) through the tip section (1e). The retaining part (2) covers th...
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WO/2022/010434A1 |
This invention relates to a body (2), at least one substrate (3) on which various physical and/or chemical processes are applied, a coating (4) enabling to improve the mechanical and/or chemical properties of the substrate (3) by success...
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WO/2022/002309A1 |
In order to provide a device and a method for treating workpieces, which allow optimum treatment of the workpieces, a treatment station comprises a treatment chamber that can be flooded for the purpose of treating the workpiece.
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WO/2021/259528A1 |
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a subs...
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WO/2021/249230A1 |
The present invention relates to the field of electroplating, and specifically relates to a coating conductive mechanism (200), a coating apparatus (100), and a coating method for a conductive film (101). The coating conductive mechanism...
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WO/2021/241052A1 |
A plating tank according to an embodiment of the present disclosure for electroplating a substrate for a flexible printed wiring board comprises a container configured so that the substrate is inserted as a cathode along the vertical dir...
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WO/2021/227762A1 |
Provided is a spreader plate in an electrochemical deposition device. The spreader plate comprises: an accommodation housing, wherein the accommodation housing comprises a first wall, a second wall arranged opposite the first wall, and a...
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