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Matches 301 - 350 out of 14,683

Document Document Title
WO/2015/091219A1
The present invention is related to a device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition on a flat substrate to be treated, wherein t...  
WO/2015/087551A1
A plating device (1) can electroplate an internal thread (20b) formed on a tube edge part (20a) of a steel pipe (20). The plating device (1) is equipped with a pipe inside sealing member (2), a cap (3), a drain port (3c), an opening (3b)...  
WO/2014/018084A3
A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an el...  
WO/2015/076685A1
A method of connecting optical fibers coated with conductive layer, preferably metalized, with metal elements, comprising the following stages: 1. preparing the electrolyte, 2. clearing the optical fiber surface and clearing the electrod...  
WO/2015/072481A1
Provided are: a film forming apparatus for a metal coating film, which is capable of stably forming a homogeneous metal coating film having a uniform thickness regardless of the surface state of a positive electrode; and a film forming m...  
WO/2015/019152A3
A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between th...  
WO/2015/019154A3
A film deposition device (1 A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to ...  
WO/2015/055537A1
The invention relates to a method and to a device for galvanically coating in particular head-restraint bows (11) or head-restraint rods in successive treatment tanks (9) through which current for the electrolytic liquid bath flows, wher...  
WO/2015/050969A2
The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner t...  
WO/2015/050593A1
This application relates to systems and methods for controlling current density in an electrochemical bath using an anode assembly that comprises a plurality of anodes arranged across a surface of the anode assembly. In one embodiment, e...  
WO/2015/050192A1
 Provided is a nickel solution for forming a film that makes it possible to inhibit generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are in contact w...  
WO/2015/044022A1
The invention relates to a method for structuring layers of oxidizable materials. In said method, at least one layer of an oxidizable material arranged on a substrate is subjected to a local oxidation process having at least one oxidatio...  
WO/2015/039152A1
The invention relates to a novel electrolyte bath having a Cu and Sn content, and a zinc content which is a maximum of 5 g/l, preferably a maximum 3 g/l, for the deposition of a white layer on metallic substrates, in particular jewelery ...  
WO/2015/010220A3
The invention relates to an electrode-rigidifying device which prevents short-circuits from being produced between anodes and cathodes during electrodeposition processes, where said device comprises a rigid monolithic body with inclined ...  
WO/2015/029864A1
Provided is a method for manufacturing solar cells that can prevent melting of a second conductive layer when forming a plating layer that forms part of a collector electrode. Also provided is a plating jig that can be used in this metho...  
WO/2015/025693A1
Provided are: a plating apparatus which is simpler than conventional plating apparatuses and can be easily reduced in size; and a sensing device which uses this plating apparatus. A plating apparatus (1) is provided with: a holding membe...  
WO/2015/026348A1
An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an elect...  
WO/2015/022846A1
The present invention suppresses a temperature increase due to resistance during electrolysis, and prevents an anode from dropping. On one side of an electrode plate formed of a low melting point metal or a low melting point alloy having...  
WO/2015/016452A1
The present invention relates to a plating method and a plating apparatus, the plating method comprising the steps of: inserting objects to be plated in a plating bath which is filled with a plating solution such that the objects to be p...  
WO/2015/011130A1
This invention relates to an anode system for use in an electroplating cell for the coating of a moving metal strip and a method using said anode system.  
WO/2015/010220A2
The invention relates to an electrode-rigidifying device which prevents short-circuits from being produced between anodes and cathodes during electrodeposition processes, where said device comprises a rigid monolithic body with inclined ...  
WO/2015/007307A1
Supporting tool (1) for supporting a substantially cylindrical part, like a landing gear rod or cylinder, said supporting tool comprising a metallic frame carrying at least one metallic ring (3) in electrical conductive relation with the...  
WO/2014/127997A3
A method and a device for the surface treatment of workpieces, in particular using electroplating, said device comprising a container which can be filled with a solvent and into which the workpiece that is provided as a first electrode c...  
WO/2015/005767A1
The invention relates to a transport member for transporting plate- shaped substrates which are to be electrolytically galvanized in a bath, comprising a carrier belt with first contact members fastened thereto which each have a first co...  
WO/2015/000817A1
The present invention is related to a method for conditioning of a galvanic electrolyte and for activation of electrodes of a galvanic device for galvanic metal, in particular copper, deposition on a substrate to be treated, which compri...  
WO/2014/199908A1
Provided is a power-supply member such that it is possible to favorably perform plating for a long period of time. A second power-supply member (30) is contacted to an article (1) to be plated, which is positioned so as to form a space t...  
WO/2014/199907A1
Provided is an anode capable of favorably plating for a long period of time. The anode (10) is cylindrical, forms a space through which a plating solution flows between itself and an article (1) to be plated and positioned in the interio...  
WO/2014/198723A1
The present invention is related to device for moving a substrate holder, which comprises at least a substrate to be treated, during a vertical galvanic metal, preferably copper, deposition on such a substrate to be treated characterized...  
WO/2014/199909A1
Provided is a holding device capable of holding a plurality of types of workpieces, and definitively preventing the leakage of the solution in a solution tank. A holding device (40) is equipped with a holding member (41) for holding an a...  
WO/2014/076078A3
The device (1) according to the invention is suggested for gentle treatment of a flat material (B) to be treated with a treatment liquid (F). The device (1) has the following components: at least one treatment chamber (20), in which the ...  
WO/2014/188898A1
 An electrolytic treatment method in which a predetermined treatment is performed using treatment subject ions contained in a treatment liquid, the method including: an electrode positioning step for positioning a direct electrode and ...  
WO/2014/185160A1
The purpose of the present invention is to provide a plating device, whereby it becomes possible to make the flow rate to become uniform in an area located between the bottom of a plating bath and a solution level without the need of pro...  
WO/2014/167366A1
An electroplating rack for holding a plurality of sliding bearing shells whilst a coating is electroplated onto their concave inner surfaces, comprising an end bracket, wherein the end bracket comprises a liquid supply conduit for receiv...  
WO/2014/168314A1
The present invention relates to an electroplating device for preventing the excessive plating of an edge, and the electroplating device for plating a steel plate between anodes which are formed at a predetermined distance from each othe...  
WO/2014/167201A1
A method and device for electrodeposition in cylindrical geometry. The invention relates to a method for electrochemically depositing a thin layer on a flexible substrate, comprising the following steps: -providing, in an electrolysis ba...  
WO/2014/037229A3
A device is designed for electroplating a material being treated (8) and has a hollow space (9) with an inner surface (51) to be coated. The device comprises a first frame part (11) with a first electrode (21) for holding and electricall...  
WO/2014/153597A1
The present disclosure provides a method of anodising a surface of a semiconductor device comprising a p-n junction. The method comprises exposing a first surface portion of the semiconductor device to an electrolytic solution that is su...  
WO/2014/160886A2
A system for treating at least one surface of a material may include a reaction vessel containing a first electrode and a second electrode separated by a gap. A power source may generate an electrical potential across the first electrode...  
WO/2014/159715A1
Broadly, the present disclosure relates to sidewall features (e.g. inner sidewall or hot face) of an electrolysis cell, which protect the sidewall from the electrolytic bath while the cell is in operation (e.g. producing metal in the ele...  
WO/2014/156310A1
Provided are an apparatus and a method for forming a metal coating film, whereby it becomes possible to form a metal coating film having a desired film thickness on the surfaces of multiple bases continuously and it also becomes possible...  
WO/2014/147180A1
The present invention is related to an apparatus and a method for the electrolytic deposition of a zinc or zinc alloy layer on a workpiece, the apparatus comprising a container to hold the metal plating bath divided into at least two com...  
WO/2014/141736A1
 A molten-salt electrolysis plating apparatus using a molten salt in a liquid electrolyte, wherein the molten-salt electrolysis plating apparatus is one of (i) to (iv) below. (i) At least the portion in contact with the liquid electrol...  
WO/2014/138840A1
An electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; the piece...  
WO/2014/076664A3
A method for electrochemical surface treatment of metal parts by immersion in at least one treatment liquid contained in at least one treatment tank (1), and a tank and machine for carrying out this method, comprising at least one electr...  
WO/2014/029667A3
The invention relates to a method for light entrapment in coating baths, in order thereby to deposit metal on a surface of a semiconductor component in a light-induced or light-supported manner. The method comprises at least the followin...  
WO/2014/127997A2
A method and a device for the surface treatment of workpieces, in particular using electroplating, said device comprising a container which can be filled with a solvent and into which the workpiece that is provided as a first electrode c...  
WO/2013/189828A3
The galvanization plant has a plurality of baths (22, 24, 26), at least one goods carrier (28) for accommodating goods (30) to be treated, and a transporting device (36) for transporting the at least one goods carrier (28) to the individ...  
WO/2014/121121A1
A radiolytic electrochemical system that comprises a cathode, an anode that comprises a semiconductor, an aqueous electrolyte solution disposed between the cathode and anode, and ionizing radiation, wherein the ionizing radiation splits ...  
WO/2014/053563A3
The invention relates to a holder device and a carrier with components made from aluminium and titanium materials for anodizing supports. The invention also relates to a method for producing a holder device with a carrier for anodizing s...  
WO/2014/115203A1
This method for forming a chrome plating film uses electroplating to form a chrome plating film on an object (negative electrode)(1) to be plated. A chrome plating solution (15) is provided with: trivalent chromium ions; an organic carbo...  

Matches 301 - 350 out of 14,683