| Document |
Document Title |
|
WO/2019/078063A1 |
A surface treatment device (1) comprising: a treatment tank (3-1) accommodating a treatment fluid; at least one positive electrode (20) disposed inside the treatment tank; at least one negative electrode rail (40–1); intermittent conve...
|
|
WO/2019/077446A1 |
Frame with rotating baskets for galvanic treatments, provided with plates (13-13'), each of which irreversibly fixed between two uprights (11), fixed and connected by means of gears (14-14') provided with a central metal plate (15) with ...
|
|
WO/2019/078065A1 |
A surface treatment device (1) having: treatment tanks (3–1 – 3–n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a ...
|
|
WO/2019/079193A1 |
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating st...
|
|
WO/2019/078712A1 |
The invention relates to a method for applying a layer on a substrate surface, comprising applying the layer on a plating part of the substrate surface by plating to which end the plating part is brought into contact with an electrolyte....
|
|
WO/2019/078064A1 |
A surface treatment device (1) having: a treatment tank (3–1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails ...
|
|
WO/2019/063197A1 |
The present invention is related to a method for electrolytically depositing a zinc-nickel alloy layer on a substrate, wherein the method comprises an interrupting of the execution of the electrolytical deposition of a zinc-nickel alloy ...
|
|
WO/2019/064098A1 |
Multi-directional modulatable frame (200) for galvanic treatments, constituted by at least four base elements (20) made of plastic material, adapted to be mutually engaged, forming a parallelepiped for supporting the lead wires (17) conn...
|
|
WO/2019/061582A1 |
A hanger lifting hook (100), the hanger lifting hook (100) comprising a fixed member (10) and a movable member (20); the fixed member (10) comprises a connecting plate (11) and a mounting plate (12) which are vertically connected; the mo...
|
|
WO/2019/067841A1 |
The present disclosure relates to a reflective layer manufacturing apparatus which forms a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same. The present disclosure provid...
|
|
WO/2019/059058A1 |
This electrolytic treatment assembly 100, which is fitted to a surface treatment tank 10 that performs an electrolytic treatment on the surface of a work 1 that is set on a negative electrode, comprises a nozzle unit 200 and a positive e...
|
|
WO/2019/058860A1 |
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...
|
|
WO/2019/059423A1 |
The present invention relates to a method for producing a porous nanostructure and, in more detail, comprises: a preparation step for preparing an electrically conductive substrate; a foam forming step wherein an electrochemical depositi...
|
|
WO/2019/059738A2 |
The present invention relates to a method for manufacturing a Cu delafossite photoelectrode by using electro-deposition, which is capable of producing a photoelectrode by efficiently electro-depositing Cu delafossite on a substrate throu...
|
|
WO/2019/055962A1 |
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...
|
|
WO/2019/040111A1 |
Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimi...
|
|
WO/2019/036207A1 |
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...
|
|
WO/2019/035236A1 |
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the an...
|
|
WO/2019/029856A1 |
The invention relates to the technical field of galvanizing of iron-based or ferrous components, in particular steel-based components or components containing steel (steel components). In particular, the invention relates to a hot-dip ga...
|
|
WO/2019/026578A1 |
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...
|
|
WO/2019/021607A1 |
This work holding jig (1A) is provided with a back panel (11) and a frame body (12). The frame body (12) comprises: an annular main body (13); a conductive member (15) which is provided on the entire circumference of the main body (13); ...
|
|
WO/2019/021599A1 |
A printed wiring board production method for forming a base film and an electroconductive pattern on said base film by an additive method or a subtractive method, wherein: the printed wiring board production method has a plating step for...
|
|
WO/2019/016543A1 |
EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber co...
|
|
WO/2019/013111A1 |
The purpose of the present invention is to partially or locally control the thickness of a plating film on a square substrate. Provided is a regulation plate for regulating current between an anode and a square substrate. This regulation...
|
|
WO/2019/013002A1 |
[Problem] To provide a plating solution assessment method and plating solution assessment mechanism that have a simple configuration and make it possible to estimate the state of a plating solution and a coating while plating treatment i...
|
|
WO/2019/006540A1 |
In a method for cathodically protecting and/or passivating a metal section in an ionically conductive material such as steel reinforcement in concrete or mortar, an impressed current or sacrificial anode communicates ionic current to the...
|
|
WO/2019/003459A1 |
A masking jig 100 is provided with: a contact member 130 that has formed therein a through-hole 133 through which a rod-like piston rod 10 is passed, and has, around the through-hole 133, a deformable part 134 which gets elastically defo...
|
|
WO/2019/004717A1 |
In the present invention, a photosensitive layer is formed on the top surface of a planar substrate, and a protruding part and a space part are formed on the photosensitive layer through an exposure and development process. On the basis ...
|
|
WO/2019/003891A1 |
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the sa...
|
|
WO/2019/006009A1 |
Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal d...
|
|
WO/2018/236877A1 |
Methods of cleaning an electroplating device may include processing a substrate coupled with the electroplating device. The substrate may be coupled with a substrate holder of the electroplating device. The substrate holder may include a...
|
|
WO/2018/225535A1 |
Transport jigs 30 and 30A have transport units 300, 320, 330 and a workpiece holding unit 500 for hanging from and supported by the transport unit. The workpiece holding unit has: a fixed member 510; two movable members 550 supported sli...
|
|
WO/2018/221395A1 |
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...
|
|
WO/2018/220979A1 |
Provided are: a cathode plate for metal electrodeposition which makes it less likely to lose a non-conductive film on a metal plate, which can be used repeatedly, and for which maintenance is easy even if a non-conductive film is lost; a...
|
|
WO/2018/221792A1 |
The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a unifor...
|
|
WO/2018/208074A1 |
The present invention relates to a method for processing a vertically grown electroform by using a vertical growth master that enables vertical growth of deposits, and an electroform manufactured thereby. Protrusions and spaces are forme...
|
|
WO/2018/195516A1 |
Provided herein are tubular articles comprising electrodeposited nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance. The present disclosure further provides apparatuses, systems, and methods for the...
|
|
WO/2018/190202A1 |
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or mo...
|
|
WO/2018/189901A1 |
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more s...
|
|
WO/2018/189916A1 |
This electroplating method includes: a stirring step in which a group of substrates (51) that have settled in an electrolytic solution in an electroplating tank (10) are made to flow in a circumferential direction along an inner wall (19...
|
|
WO/2018/181941A1 |
Provided is a surface treatment device that can easily reduce the time required for surface treatment while maintaining flow of an electrolytic treatment solution. An electrode device 16 is provided with a closed part 15 facing a bottom ...
|
|
WO/2018/181550A1 |
A base material is provided which is suitable for forming a plating process conveyance tape which is used in a process in which a flexible printed circuit board is bonded, conveyed to a plating tank and plated, and which suppresses shrin...
|
|
WO/2018/171513A1 |
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...
|
|
WO/2018/168129A1 |
According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positiv...
|
|
WO/2018/165329A1 |
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...
|
|
WO/2018/164491A1 |
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...
|
|
WO/2018/146041A1 |
The present invention relates to a method for electrodepositing zinc and zinc alloy coatings from an alkaline coating bath with reduced depletion of organic bath additives. This involves using as an anode an electrode which is insoluble ...
|
|
WO/2018/142955A1 |
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...
|
|
WO/2018/142430A1 |
The present invention refers to a galvanic deposition process for obtaining the deposit of ruthenium and/or of its alloys, on an object in order to obtain final ruthenium layers with particular colorations, otherwise not obtainable with ...
|
|
WO/2018/138444A1 |
The invention relates to an assembly for attaching and detaching parts (23) for treating parts (23). The said assembly comprises at least: a frame (22), a positioning line (24) inside the frame (22) and comprising two ends fixed to the f...
|
