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Matches 1 - 50 out of 14,142

Document Document Title
WO/2018/190202A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or mo...  
WO/2018/189901A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more s...  
WO/2018/189916A1
This electroplating method includes: a stirring step in which a group of substrates (51) that have settled in an electrolytic solution in an electroplating tank (10) are made to flow in a circumferential direction along an inner wall (19...  
WO/2018/181941A1
Provided is a surface treatment device that can easily reduce the time required for surface treatment while maintaining flow of an electrolytic treatment solution. An electrode device 16 is provided with a closed part 15 facing a bottom ...  
WO/2018/181550A1
A base material is provided which is suitable for forming a plating process conveyance tape which is used in a process in which a flexible printed circuit board is bonded, conveyed to a plating tank and plated, and which suppresses shrin...  
WO/2018/171513A1
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...  
WO/2018/168129A1
According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positiv...  
WO/2018/165329A1
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...  
WO/2018/164491A1
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...  
WO/2018/146041A1
The present invention relates to a method for electrodepositing zinc and zinc alloy coatings from an alkaline coating bath with reduced depletion of organic bath additives. This involves using as an anode an electrode which is insoluble ...  
WO/2018/142955A1
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...  
WO/2018/142430A1
The present invention refers to a galvanic deposition process for obtaining the deposit of ruthenium and/or of its alloys, on an object in order to obtain final ruthenium layers with particular colorations, otherwise not obtainable with ...  
WO/2018/138444A1
The invention relates to an assembly for attaching and detaching parts (23) for treating parts (23). The said assembly comprises at least: a frame (22), a positioning line (24) inside the frame (22) and comprising two ends fixed to the f...  
WO/2018/140750A1
Disclosed herein are a system and method for electroplating an alpha emitting radionuclide, such as an actinide, for use in alpha spectroscopy. The electrodeposition system for electroplating an alpha emitting radionuclide can include an...  
WO/2018/136637A1
The present application relates to systems and methods for electrodepositing multi-component alloys, and products made by the same. The electrodeposition may be accomplished to deposit one or more multi-component alloy layers on a substr...  
WO/2018/121526A1
Disclosed in the present invention is an electroplating device for a small component. The electroplating device for a small component comprises one or more electroplating units. Each electroplating unit is provided with an electroplating...  
WO/2018/115706A1
The invention relates to a method for extracting tin and/or lead contained in an electrically conductive mixture derived from waste, using a solution comprising methane sulphonic acid as an electrolytic solution.  
WO/2018/109848A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/109983A1
Provided is an electroplating method with which a plating film having excellent uniformity and adhesion can be easily formed on an exposed surface of each element of a metal fastener even if the elements are not electrically connected to...  
WO/2018/109998A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/103621A1
An acid copper electroplating process using an insoluble anode and equipment therefor. In the process and the equipment, a separator (10) is used to separate electroplating solutions in a cathode region (1) and an anode region (2), to av...  
WO/2018/103793A1
The invention relates to a continuous separation installation (10; 20; 30; 50) for the galvanic deposition of a substance on objects (1), wherein said continuous separation installation (10; 20; 30; 50) comprises contacting devices (12; ...  
WO/2018/096768A1
The present invention stably conveys a substrate (to-be-treated item) while minimizing flexure of the to-be-treated item. Provided is a treatment device that has: a conveyor part which conveys the to-be-treated item such that a flat surf...  
WO/2018/091723A3
The present invention relates to an injector component of an injector for introducing a fluid, the injector component comprising a main body (40), a coating (10) on at least one first end face (43) of the main body (40), wherein the coat...  
WO/2018/093684A1
A fluid clean apparatus includes a container that has an opening for loading metal parts therein, and an internal loading platform system that includes a platform that is positioned inside the container, and a lift cylinder that is coupl...  
WO/2018/091723A2
The present invention relates to an injector component of an injector for introducing a fluid, the injector component comprising a main body (40), a coating (10) on at least one first end face (43) of the main body (40), wherein the coat...  
WO/2018/091960A1
Method for the electrochemical marking of a metal surface of aluminium devoid of a treatment of protection from oxidation, comprising the phases of soaking a buffer that covers an electrode in an aqueous-based electrolytic solution; arra...  
WO/2018/087135A1
This invention relates to a method for electroplating an uncoated steel strip with a plating layer from a trivalent Cr-electrolyte, where the uncoated strip is subjected to a cleaning and pickling step prior to the plating process and th...  
WO/2018/083496A1
Herein is disclosed, a method of plating an item with a first metal, the method comprising providing a plating solution comprising a liquid medium, a precursor species for forming a layer of the first metal on the items, and a plurality ...  
WO/2018/068983A1
The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a...  
WO/2018/070188A1
This electrolytic treatment tool, which uses a treatment liquid supplied to a substrate to be processed and performs an electrolytic treatment on the substrate to be processed, has: a base body having a planar shape, a recessed part form...  
WO/2018/068931A1
The invention relates to a system (1) for the simultaneous electrocoating of a number of items to be treated (3) arranged next to one another along a y axis in a holder (2) in an electrolytic bath (4), with a treatment tank (5), which re...  
WO/2018/066297A1
Disclosed is an electrolytic treatment tool that is used at the time of subjecting a substrate to be treated to an electrolytic treatment by using a treatment solution supplied to the substrate to be treated, the electrolytic treatment t...  
WO/2018/062259A1
A workpiece holding jig that has: a conductive frame-like member 630; a plurality of conductive first chuck members 610 that are supported on an upper frame member 631 and grip an upper side of a rectangular workpiece 20; a plurality of ...  
WO/2018/062260A1
This workpiece holding jig 10 has a jig main body 20 that includes: a pair of upper lateral members 31, 32; a pair of lower lateral members 41, 42; and a connection part 50 that connects the pair of upper lateral members and the pair of ...  
WO/2018/047908A1
This substrate holder is provided with first and second holding members which clamp and fix a substrate. The substrate holder is configured such that: the first holding member has a first holding member body and a clamp which is disposed...  
WO/2018/049062A1
Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment a...  
WO/2018/044930A1
A method creating a patterned film with cuprous oxide and light comprising the steps of electrodepositing copper from a solution onto a substrate; illuminating selected areas of said deposited copper with light having photon energies abo...  
WO/2018/036924A1
The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate comprising at least a first device element and a second device element, which are arranged in a vertical manner parall...  
WO/2018/035800A1
An electrochemical machining apparatus, containing at least one electrode member (202), a guide member (203) and an actuating member (201). The electrode member (202) contains a conductive end (202b) and a free end (202a); the guide memb...  
WO/2018/030972A3
The invention is a metal coating device in which the sheet metal (100) fed to a coating container for being copper-coated by electrolysis in the coating container (300) comprising a first roll device (400) having a roll (450) in contact ...  
WO/2018/016362A1
Provided are a metal electrodeposition cathode plate, the non-conductive film of which is not susceptible to failure and which can be used repeatedly, and a production method therefor. This cathode plate 1 comprises a metal plate 2 on wh...  
WO/2018/017379A3
The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disc...  
WO/2018/008343A1
An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to co...  
WO/2018/000778A1
Provided is an automatic board-lowering machine for an electrolytic plating device, provided with a machine frame (1) and a linear drive apparatus (2), transfer-loading apparatus (3), suction-cup apparatus (4), sensing control apparatus,...  
WO/2018/005155A1
An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module...  
WO/2018/003826A1
Provided is a carrier system capable of reliably carrying a substrate that is in a bent state. This carrier system is provided with an upper hand 237 on which a substrate WF is loaded. The upper hand 237 is provided with a base part 132 ...  
WO/2017/217216A1
To suppress variation in the thickness of a plating film formed by a plating treatment. A plating apparatus 100 is provided with a plating tank 10, and a plating unit 20 for carrying out electrolytic plating on an object to be plated 2. ...  
WO/2017/212785A1
Provided are a plating apparatus and plating method with which the appropriate barrier membrane exchange time can be determined. The plating apparatus comprises: an anode tank for holding plating liquid and an insoluble anode; a cathode ...  
WO/2017/206969A1
The invention relates to a device for chemically or electrochemically coating balls (1), comprising at least one spacing apparatus (2) for holding and spacing a plurality of balls (1) and a rotation apparatus (3) for holding and rotating...  

Matches 1 - 50 out of 14,142