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Matches 1 - 50 out of 14,231

Document Document Title
WO/2019/055962A1
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...  
WO/2019/040111A1
Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimi...  
WO/2019/036207A1
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...  
WO/2019/035236A1
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the an...  
WO/2019/029856A1
The invention relates to the technical field of galvanizing of iron-based or ferrous components, in particular steel-based components or components containing steel (steel components). In particular, the invention relates to a hot-dip ga...  
WO/2019/026578A1
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...  
WO/2019/021607A1
This work holding jig (1A) is provided with a back panel (11) and a frame body (12). The frame body (12) comprises: an annular main body (13); a conductive member (15) which is provided on the entire circumference of the main body (13); ...  
WO/2019/021599A1
A printed wiring board production method for forming a base film and an electroconductive pattern on said base film by an additive method or a subtractive method, wherein: the printed wiring board production method has a plating step for...  
WO/2019/016543A1
EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber co...  
WO/2019/013111A1
The purpose of the present invention is to partially or locally control the thickness of a plating film on a square substrate. Provided is a regulation plate for regulating current between an anode and a square substrate. This regulation...  
WO/2019/013002A1
[Problem] To provide a plating solution assessment method and plating solution assessment mechanism that have a simple configuration and make it possible to estimate the state of a plating solution and a coating while plating treatment i...  
WO/2019/006540A1
In a method for cathodically protecting and/or passivating a metal section in an ionically conductive material such as steel reinforcement in concrete or mortar, an impressed current or sacrificial anode communicates ionic current to the...  
WO/2019/003459A1
A masking jig 100 is provided with: a contact member 130 that has formed therein a through-hole 133 through which a rod-like piston rod 10 is passed, and has, around the through-hole 133, a deformable part 134 which gets elastically defo...  
WO/2019/004717A1
In the present invention, a photosensitive layer is formed on the top surface of a planar substrate, and a protruding part and a space part are formed on the photosensitive layer through an exposure and development process. On the basis ...  
WO/2019/003891A1
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the sa...  
WO/2019/006009A1
Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal d...  
WO/2018/236877A1
Methods of cleaning an electroplating device may include processing a substrate coupled with the electroplating device. The substrate may be coupled with a substrate holder of the electroplating device. The substrate holder may include a...  
WO/2018/225535A1
Transport jigs 30 and 30A have transport units 300, 320, 330 and a workpiece holding unit 500 for hanging from and supported by the transport unit. The workpiece holding unit has: a fixed member 510; two movable members 550 supported sli...  
WO/2018/221395A1
A surface treatment device 10 is provided with: a surface treatment tank 200 which contains a treatment liquid Q, and has an upper opening 200A; a transport jig 30 which includes a workpiece holding part 340 which holds a workpiece 20 in...  
WO/2018/220979A1
Provided are: a cathode plate for metal electrodeposition which makes it less likely to lose a non-conductive film on a metal plate, which can be used repeatedly, and for which maintenance is easy even if a non-conductive film is lost; a...  
WO/2018/221792A1
The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a unifor...  
WO/2018/208074A1
The present invention relates to a method for processing a vertically grown electroform by using a vertical growth master that enables vertical growth of deposits, and an electroform manufactured thereby. Protrusions and spaces are forme...  
WO/2018/195516A1
Provided herein are tubular articles comprising electrodeposited nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance. The present disclosure further provides apparatuses, systems, and methods for the...  
WO/2018/190202A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or mo...  
WO/2018/189901A1
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more s...  
WO/2018/189916A1
This electroplating method includes: a stirring step in which a group of substrates (51) that have settled in an electrolytic solution in an electroplating tank (10) are made to flow in a circumferential direction along an inner wall (19...  
WO/2018/181941A1
Provided is a surface treatment device that can easily reduce the time required for surface treatment while maintaining flow of an electrolytic treatment solution. An electrode device 16 is provided with a closed part 15 facing a bottom ...  
WO/2018/181550A1
A base material is provided which is suitable for forming a plating process conveyance tape which is used in a process in which a flexible printed circuit board is bonded, conveyed to a plating tank and plated, and which suppresses shrin...  
WO/2018/171513A1
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...  
WO/2018/168129A1
According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positiv...  
WO/2018/165329A1
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...  
WO/2018/164491A1
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...  
WO/2018/146041A1
The present invention relates to a method for electrodepositing zinc and zinc alloy coatings from an alkaline coating bath with reduced depletion of organic bath additives. This involves using as an anode an electrode which is insoluble ...  
WO/2018/142955A1
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...  
WO/2018/142430A1
The present invention refers to a galvanic deposition process for obtaining the deposit of ruthenium and/or of its alloys, on an object in order to obtain final ruthenium layers with particular colorations, otherwise not obtainable with ...  
WO/2018/138444A1
The invention relates to an assembly for attaching and detaching parts (23) for treating parts (23). The said assembly comprises at least: a frame (22), a positioning line (24) inside the frame (22) and comprising two ends fixed to the f...  
WO/2018/140750A1
Disclosed herein are a system and method for electroplating an alpha emitting radionuclide, such as an actinide, for use in alpha spectroscopy. The electrodeposition system for electroplating an alpha emitting radionuclide can include an...  
WO/2018/136637A1
The present application relates to systems and methods for electrodepositing multi-component alloys, and products made by the same. The electrodeposition may be accomplished to deposit one or more multi-component alloy layers on a substr...  
WO/2018/121526A1
Disclosed in the present invention is an electroplating device for a small component. The electroplating device for a small component comprises one or more electroplating units. Each electroplating unit is provided with an electroplating...  
WO/2018/115706A1
The invention relates to a method for extracting tin and/or lead contained in an electrically conductive mixture derived from waste, using a solution comprising methane sulphonic acid as an electrolytic solution.  
WO/2018/109848A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/109983A1
Provided is an electroplating method with which a plating film having excellent uniformity and adhesion can be easily formed on an exposed surface of each element of a metal fastener even if the elements are not electrically connected to...  
WO/2018/109998A1
The purpose of the present invention is to provide an electroplating method for a metal fastener, the method enabling each element of a metal fastener to be easily plated with high uniformity. Provided is an electroplating method for a f...  
WO/2018/103621A1
An acid copper electroplating process using an insoluble anode and equipment therefor. In the process and the equipment, a separator (10) is used to separate electroplating solutions in a cathode region (1) and an anode region (2), to av...  
WO/2018/103793A1
The invention relates to a continuous separation installation (10; 20; 30; 50) for the galvanic deposition of a substance on objects (1), wherein said continuous separation installation (10; 20; 30; 50) comprises contacting devices (12; ...  
WO/2018/096768A1
The present invention stably conveys a substrate (to-be-treated item) while minimizing flexure of the to-be-treated item. Provided is a treatment device that has: a conveyor part which conveys the to-be-treated item such that a flat surf...  
WO/2018/091723A3
The present invention relates to an injector component of an injector for introducing a fluid, the injector component comprising a main body (40), a coating (10) on at least one first end face (43) of the main body (40), wherein the coat...  
WO/2018/093684A1
A fluid clean apparatus includes a container that has an opening for loading metal parts therein, and an internal loading platform system that includes a platform that is positioned inside the container, and a lift cylinder that is coupl...  
WO/2018/091723A2
The present invention relates to an injector component of an injector for introducing a fluid, the injector component comprising a main body (40), a coating (10) on at least one first end face (43) of the main body (40), wherein the coat...  
WO/2018/091960A1
Method for the electrochemical marking of a metal surface of aluminium devoid of a treatment of protection from oxidation, comprising the phases of soaking a buffer that covers an electrode in an aqueous-based electrolytic solution; arra...  

Matches 1 - 50 out of 14,231