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Matches 1 - 50 out of 14,662

Document Document Title
WO/2020/177066A1
An array composite electric field metal electrochemical micro-nano scale additive manufacturing device and method, relating to the field of metal material electrochemical 3D printing. An array type high speed electrochemical 3D printing ...  
WO/2020/175934A1
An anodizing device is disclosed. The anodizing device according to an embodiment of the present invention may comprise: a base for supporting a product to be anodized, the product having a first bore for which an anodizing surface treat...  
WO/2020/173950A1
This invention relates to a method for electrolytically depositing a chromium oxide layer onto i) blackplate or onto ii) blackplate coated with a chromium electrodeposited coating produced based on chromium(III) technology electroplating...  
WO/2020/173953A1
This invention relates to a method for electroplating a steel strip with a plating layer and an improvement thereof.  
WO/2020/169439A1
The invention relates to an assembly (1) for electrically contacting a microchip substrate (2) during electrolytic metallization comprising: - a holder (6) having a recess (10), to which negative pressure can be applied, for receiving th...  
WO/2020/168881A1
Disclosed are a device and a method for fine electrodeposition by means of a laser assisted flexible following tool electrode, which relate to the technical field of localized fine electrodeposition. The method comprises: enhancing local...  
WO/2020/168074A1
Systems and methods are provided for method for etch assisted gold (Au) through silicon mask plating (EAG-TSM). An example method comprises providing a seed layer on a substrate and providing a silicon mask on at least a portion of the s...  
WO/2020/158567A1
A workpiece-holding jig (30), which can hold a workpiece (20) having a surface to be processed and can electrically connect to a rectifier that controls voltage so as to conduct a constant current, wherein a conductive member that can el...  
WO/2020/158570A1
A workpiece holding jig (30), which holds a workpiece (20) having a surface to be processed so as to hang down and is capable of being electrically connected to a rectifier, comprises: a conductive upper clamping part (510) that clamps t...  
WO/2020/158568A1
A workpiece holding jig (30), which is capable of holding a workpiece having a surface to be processed and being electrically connected to a rectifier, comprises: at least one conductive support part (521, 522) that can conduct a current...  
WO/2020/158569A1
A workpiece holding jig (30), which holds a workpiece (20) so as to hang down and can electrically connect to a rectifier, comprises support parts (531, 532) that can conduct power in conjunction with the rectifier, and conductive clamps...  
WO/2020/106253A3
The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the...  
WO/2020/152920A1
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to able...  
WO/2020/152208A1
The present invention is related to a membrane anode system for electrolytic zinc-nickel alloy deposition, a method for electrolytic deposition of a zinc- nickel alloy layer on a substrate to be treated using a membrane anode system, and...  
WO/2020/152921A1
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be a...  
WO/2020/152922A1
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be a...  
WO/2020/144880A1
Provided is a technique for treating a surface of a rolling element without leaving uncoated portions or without causing scratching. A jig for a rolling element is used, which can be used in the treatment of a surface of a rolling elem...  
WO/2020/133149A1
A plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first a...  
WO/2020/124649A1
The invention relates to the technical field of electroplated thin PCB manufacturing. Specifically disclosed are a method and system for manufacturing an electroplated high-precision thin circuit PCB. The system comprises a PCB conveyor ...  
WO/2020/123458A1
An electrodeposition system, for additive manufacturing of a three-dimensional structure, includes at least one electrochemical cell. The at least one electrochemical cell includes a receptacle containing an electrolytic bath. At least o...  
WO/2020/114000A1
A water retaining device and a vertical electroplating device, comprising a fixing frame (2), a water blocking component (5), a gear set, a transmission shaft (4), a rotating component (3) and transmission guide rods (6); the fixing fram...  
WO/2020/105524A1
A jig conveyance member (100) comprises: a jig-holding section (110) on which a workpiece-holding jig (10) for holding a workpiece W suspended therefrom is detachably installed; a support section (120) for supporting the jig-holding sect...  
WO/2020/106253A2
The invention relates to a plating hanger (10) which provides a homogeneous plating by equalizing the high current and low current zones by changing the distances of the part connections (17) holding the material to be coated (15) to the...  
WO/2020/106590A1
The embodiments herein relate to apparatuses and methods for electroplating one or more materials onto a substrate. Embodiments herein utilize a cross flow conduit in the electroplating cell to divert flow of fluid from a region between ...  
WO/2020/095152A1
The metallization of a metallic rack employed in galvanic metallization processes of plastic material items, coated by immersion in PVC Plastisol, is inhibited thanks to the fact that PVC Plastisol is mixed with a C8-C18 thiol selected f...  
WO/2020/072649A1
In one example, an electroplating apparatus is provided for electroplating a wafer. The electroplating apparatus comprises a wafer holder for holding a wafer during an electroplating operation and a plating cell configured to contain an ...  
WO/2020/071321A1
A plating device 1 is provided with a first plating tank 11A filled with a plating solution 3, an anode 14 disposed in the first plating tank 11A so as to face an article 2 to be plated, a cathode 12 for supplying power to the article 2 ...  
WO/2020/069630A1
The invention relates to a system having a self-supporting structure that can be assembled by pieces and can be adapted to the space for the electrowinning of metals, both in an already operational cell or in a tank (SELLE NG), character...  
WO/2020/067622A1
Disclosed is a method comprising the steps of: preparing an electrolyte containing a metal oxide active material precursor; and forming a metal oxide coating layer by loading a titanium (Ti) substrate into the electrolyte, wherein the me...  
WO/2020/050009A1
The present invention relates to a substrate processing device for processing a substrate using a processing fluid. The substrate processing device according to an embodiment is provided with: a support unit which has a mounting surface ...  
WO/2020/007407A3
The invention relates to a silver electrolyte for depositing silver layers on substrates, comprising potassium silver cyanide, potassium cyanide having a content of at least 10 g/l, at least one grain refiner having a content of 0.2 to 1...  
WO/2020/034557A1
Disclosed in the present invention is a continuous plating method. The method comprises: connecting onto a second continuous material strip a plurality of products to be plated, the main body direction of said products forming a set angl...  
WO/2020/032476A1
An electroplating system according to one embodiment of the present invention, which has a constant current control function and includes a reservoir having a plating solution received therein, may comprise: a power source; a positive el...  
WO/2020/025351A1
The invention relates to an electrode for electroplating or electrodeposition of a metal and to the method for obtaining the same. The electrode comprises a conductive sub- strate, at least one layer of an electrochemically active coatin...  
WO/2020/025090A1
The invention relates to a flow generator (2a, 2b), which has an electrolyte feed device (12) for feeding an electrolyte (7), and an electrolyte distribution device (13). The invention also relates to a deposition device (1, 33, 35) havi...  
WO/2020/015672A1
The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive mat...  
WO/2020/015673A1
Provided are a conductive structure and an electric plating device, wherein the conductive structure is configured to transmit an electric signal to a circuit board, and the conductive structure comprises a conductive frame made of a con...  
WO/2020/015674A1
A transmission structure and an electroplating device. The transmission structure comprises a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) that is connected to the mounting member (...  
WO/2020/014423A1
Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber ...  
WO/2020/007407A2
The invention relates to a silver electrolyte for depositing silver layers on substrates, comprising potassium silver cyanide, potassium cyanide having a content of at least 10 g/l, at least one grain refiner having a content of 0.2 to 1...  
WO/2020/006761A1
Disclosed are an electrolyte, a method for preparing a single crystal copper by means of electrodeposition using the electrolyte, and an electrodeposition device. In the case of excluding existing heat treatment methods, a single crystal...  
WO/2020/008662A1
A belt conveyor 7 has a metal belt-form conveyor main body 9 and metal clips 8 held by the conveyor main body 9, and an edge portion of one side of a workpiece 14 can be clamped by the spring force of the metal clips 8. A roller conveyor...  
WO/2020/009161A1
Provided is a double-pipe-structure pressure contact roll having an outer tube member made from at least a carbon-fiber-reinforced resin, wherein the pressure contact roll is configured so that a metal plating layer is uniformly and firm...  
WO/2020/006457A1
A method of forming a lithium metal film is provided. In a general embodiment, the present disclosure provides a deposition cell comprising an anode and a substrate provided within the deposition cell. A lithium ion containing electrolyt...  
WO/2019/235047A1
The present invention is an anodic oxidation device for forming a porous layer on a substrate of interest, the anodic oxidation device being characterized by being provided with an electrolysis vessel filled with an electrolyte solution,...  
WO/2019/232299A1
A computerized method and system include (a) estimating parameters that quantify rock fabric features (e.g., tortuosity, effective pore size, throat-size distribution) by joint interpretation of electrical resistivity, dielectric permitt...  
WO/2019/226840A1
A method for electroplating (or electrodeposition) a lithiated transition metal oxide composition using low purity starting precursors. The method includes electrodepositing the electrochemically active material onto an electrode in an e...  
WO/2019/223499A1
Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, the electroplating apparatus comprising a plurality of electrodes, the plurality of electrodes forming electric fields o...  
WO/2019/218095A1
The invention relates to a single-chamber electrolytic cell for electrodepositing metal from electrolytic solutions, which comprises: - a negative electrode plate (5) and a positive electrode plate (10); - lower (4) and upper (12) plasti...  
WO/2019/214879A1
The invention relates to an electrode (10) for eloxing a component (50), in particular a component (50) of a vehicle brake system, comprising an electrolyte inlet (14) for feeding an electrolyte into the electrode (10), an inlet channel ...  

Matches 1 - 50 out of 14,662