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Patent Searching and Data


Matches 1 - 50 out of 14,376

Document Document Title
WO/2019/176586A1
Provided is a current collecting member for a cylinder body plating apparatus, which is used at the base end of the spindle of a chuck cone, thereby making it possible to plate a sliding surface without oiling and to prevent efficiently ...  
WO/2019/174174A1
A turnover mechanism and a coating production line. The turnover mechanism comprises a jacking device (200), which is configured to enable a bearing member (100) to ascend or descend; and a turnover device (400), which comprises a first ...  
WO/2019/175990A1
Provided is a plating device capable of appropriately measuring microthrowing power. A first plating device (1A) is provided with: a first positive electrode (12A) provided inside a first plating tank (11A); an insulating substrate (4), ...  
WO/2019/173282A1
A floating metallized element assembly and method of manufacturing thereof are disclosed. The floating metallized element assembly includes a work piece of a plateable resin and a non-plateable resin including a front side and a back sid...  
WO/2019/164920A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. An inert anode (or an auxiliary electrode that can act as inert anode when needed)...  
WO/2019/162026A1
A station (1) for the localised surface treatment of an industrial component (2) to be treated, comprising a system (6) for applying a vacuum in the treatment chamber (5) and the feed and drain circuit (22, 23) making it possible to feed...  
WO/2019/159163A1
A method of no-bath plasma electrolytic oxidation of a workpiece made of a valve metal or an alloy thereof is disclosed. The aforesaid method comprises the steps of: (a) deploying the workpiece to form a first electrode; (b) providing an...  
WO/2019/156514A1
A sulfur powder, a sulfur electrode, a battery comprising same, and a manufacturing method therefor are disclosed. The manufacturing method of a sulfur powder comprises the steps of: positioning an electrode plate connected to an anode o...  
WO/2019/152555A1
Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position...  
WO/2019/151487A1
The present invention relates to a surface treatment device and a surface treatment method. Electrodes (30) of a surface treatment device (10) comprise a first electrode (36) and a second electrode (38). The first electrode (36) is inser...  
WO/2019/148107A1
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...  
WO/2019/143281A1
Holder device (1) for a surface treatment system, where the holder device (1) is adapted to holdan object (20) comprising a circular member (21), where the holder device (1) comprises a housing (2) having an open upper end (3) and an ope...  
WO/2019/138818A1
The electroplating device according to one embodiment of the present invention has: a mounting part 21 which, when mounted to a box-like object 13, forms a sealed space 22 together with the box-like object 13; a plating solution containe...  
WO/2019/127014A1
An electroplating assembly mechanism comprises an electroplating drum (3). The electroplating drum (3) has a circular drum body (31), a rotary shaft (32), an engagement portion (33), and a plurality of vortex blades (37). A first end (32...  
WO/2019/130859A1
Provided is a method for producing a photoelectric conversion element, which improves the production efficiency. The present invention is a method for producing a photoelectric conversion element that comprises a photoelectric conversion...  
WO/2019/119820A1
Disclosed is an electroplating transmission system. The electroplating transmission system comprising: a fixed bracket; two steel wheels rotatably mounted on the fixed bracket; a conveyor belt made of an electrically conductive material,...  
WO/2019/119807A1
Disclosed is a coil-type vertical continuous electroplating production line, comprising a machine frame; an uncoiling mechanism, a process tank and a coiling mechanism successively provided on the machine frame; and a fixed portion and a...  
WO/2019/115938A1
The invention relates to a tool for electroplating that limits, or even prevents a chemical metallization of the plastisol covering it during an operation for metallization by electroplating of plastic parts in chromium-free baths, the p...  
WO/2019/111556A1
This electricity storage device (1, 1A, 1B, 1C) is provided with a laminate (2) of a bipolar electrode (3), which comprises a steel sheet (S) and a plating layer (30) that is provided on the surface of the steel sheet (S). The plating la...  
WO/2019/107339A1
The present invention relates to a plating apparatus and plating method for partially forming a plating film on an object to be plated. The plating apparatus is provided with: a rotary electrode capable of rotational operation; a plating...  
WO/2019/102867A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; a treatment liquid supply unit which supplies a treatment liquid to the substrate that is held by the substrate holding...  
WO/2019/102866A1
An apparatus for producing a semiconductor device, which comprises: a substrate holding unit which holds a substrate; an electrolytic treatment unit which performs an electrolytic treatment on the substrate that is held by the substrate ...  
WO/2019/099034A1
The present invention includes a hypochlorite-producing device and method comprising: at least one hollow body suitable for partial or total immersion in an aqueous solution, said body comprising in its inside at least two electrodes whe...  
WO/2019/089282A1
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating s...  
WO/2019/059738A3
The present invention relates to a method for manufacturing a Cu delafossite photoelectrode by using electro-deposition, which is capable of producing a photoelectrode by efficiently electro-depositing Cu delafossite on a substrate throu...  
WO/2019/082554A1
In the present invention, a plurality of first pins (31) of a frame (2) pass through a plurality of first holes in a back panel (1). A fastening body (33) is caused to move outwardly by a moving mechanism (34) of a locking mechanism (3)....  
WO/2019/078063A1
A surface treatment device (1) comprising: a treatment tank (3-1) accommodating a treatment fluid; at least one positive electrode (20) disposed inside the treatment tank; at least one negative electrode rail (40–1); intermittent conve...  
WO/2019/077446A1
Frame with rotating baskets for galvanic treatments, provided with plates (13-13'), each of which irreversibly fixed between two uprights (11), fixed and connected by means of gears (14-14') provided with a central metal plate (15) with ...  
WO/2019/078065A1
A surface treatment device (1) having: treatment tanks (3–1 – 3–n) that have arranged therein a plurality of nozzle tubes (60) that spray treatment fluid on to a plurality of workpieces (2) to be immersed in treatment fluid; and a ...  
WO/2019/079193A1
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating st...  
WO/2019/078712A1
The invention relates to a method for applying a layer on a substrate surface, comprising applying the layer on a plating part of the substrate surface by plating to which end the plating part is brought into contact with an electrolyte....  
WO/2019/078064A1
A surface treatment device (1) having: a treatment tank (3–1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails ...  
WO/2019/063197A1
The present invention is related to a method for electrolytically depositing a zinc-nickel alloy layer on a substrate, wherein the method comprises an interrupting of the execution of the electrolytical deposition of a zinc-nickel alloy ...  
WO/2019/064098A1
Multi-directional modulatable frame (200) for galvanic treatments, constituted by at least four base elements (20) made of plastic material, adapted to be mutually engaged, forming a parallelepiped for supporting the lead wires (17) conn...  
WO/2019/061582A1
A hanger lifting hook (100), the hanger lifting hook (100) comprising a fixed member (10) and a movable member (20); the fixed member (10) comprises a connecting plate (11) and a mounting plate (12) which are vertically connected; the mo...  
WO/2019/067841A1
The present disclosure relates to a reflective layer manufacturing apparatus which forms a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same. The present disclosure provid...  
WO/2019/059058A1
This electrolytic treatment assembly 100, which is fitted to a surface treatment tank 10 that performs an electrolytic treatment on the surface of a work 1 that is set on a negative electrode, comprises a nozzle unit 200 and a positive e...  
WO/2019/058860A1
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at l...  
WO/2019/059423A1
The present invention relates to a method for producing a porous nanostructure and, in more detail, comprises: a preparation step for preparing an electrically conductive substrate; a foam forming step wherein an electrochemical depositi...  
WO/2019/059738A2
The present invention relates to a method for manufacturing a Cu delafossite photoelectrode by using electro-deposition, which is capable of producing a photoelectrode by efficiently electro-depositing Cu delafossite on a substrate throu...  
WO/2019/055962A1
Various embodiments herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. The apparatus includes an ionically resistive element that separates the plating chamber into a cross flow manifold (a...  
WO/2019/040111A1
Various embodiments described herein relate to methods and apparatus for electroplating material onto a semiconductor substrate. In some cases, one or more membrane may be provided in contact with an ionically resistive element to minimi...  
WO/2019/036207A1
A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein th...  
WO/2019/035236A1
A printed circuit board plating device, comprising: a plating tank for retaining a plating solution; a plurality of metal tools; an anode provided opposite a printed-circuit-board substrate; and a mechanism for applying voltage to the an...  
WO/2019/029856A1
The invention relates to the technical field of galvanizing of iron-based or ferrous components, in particular steel-based components or components containing steel (steel components). In particular, the invention relates to a hot-dip ga...  
WO/2019/026578A1
The purpose of the present invention is to provide: a positive electrode for electrolytic copper plating with which plating characteristics such as plating facilitation and via-filling properties can be improved without increasing the co...  
WO/2019/021607A1
This work holding jig (1A) is provided with a back panel (11) and a frame body (12). The frame body (12) comprises: an annular main body (13); a conductive member (15) which is provided on the entire circumference of the main body (13); ...  
WO/2019/021599A1
A printed wiring board production method for forming a base film and an electroconductive pattern on said base film by an additive method or a subtractive method, wherein: the printed wiring board production method has a plating step for...  
WO/2019/016543A1
EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber co...  
WO/2019/013111A1
The purpose of the present invention is to partially or locally control the thickness of a plating film on a square substrate. Provided is a regulation plate for regulating current between an anode and a square substrate. This regulation...  

Matches 1 - 50 out of 14,376