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WO/2009/040250A2 |
A power control device (1) of a power network (2), which comprises a number of anodes (5) and a number of cathodes (3), of an electrochemical coating facility is disclosed, having a plurality of control modules (6), each control module (...
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WO/2009/040483A1 |
The invention relates to an equipment (1) for the electrolytic tinning of a continuously running steel strip (2) in at least one electrodeposition tank (30) containing an acidic electrolyte. The equipment (1) further includes a tin disso...
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WO/2009/031508A1 |
A treatment bath provided with a noncontact liquid seal section is used. The noncontact liquid seal section is not brought into contact with a web and suppresses liquid leakage.
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WO/2009/032238A1 |
The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurem...
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WO/2009/019333A1 |
The present invention relates to a plant (1) for the electrolytic tinning of a steel strip (2) travelling continuously in at least one electrodeposition tank (30) containing an acid electrolyte. The plant (1) comprises, in addition, a ti...
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WO/2009/016292A2 |
The invention relates to a method for the electrolytic tinning of steel bands (2), using a soluble anode (600, 6000). The invention also relates to an electrotinning unit (1) and a removable, renewable soluble anode (600, 6000) for imple...
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WO/2009/016291A2 |
The invention relates to a method for the electrolytic tinning of steel bands (20), using an insoluble anode (60). The invention also relates to a unit (1) for implementing same and a module (80, 800) for recovering acid from the electro...
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WO/2009/013398A2 |
The invention relates to equipment for the electrolytic tinning (1) of a continuously running steel strip (2) in at least one coating tank (30) fitted with at least one non-soluble anode (60) and containing an acidic electrolyte. The equ...
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WO/2009/012891A1 |
A description is given of a process for producing a metallic coating on a substrate, which comprises deposition of at least one metal in an electroplating bath comprising an aqueous electrolyte containing organic additives and at least o...
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WO/2009/002385A2 |
An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (...
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WO/2008/152506A2 |
The invention relates, inter alia, to a method for depositing or removing a layer on/from a workpiece, wherein an electrolyte is present between said workpiece and at least one counter electrode and a potential difference is applied betw...
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WO/2008/148578A1 |
An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparat...
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WO2007115318B1 |
The present invention provides methods of electroplating a film or films onto a top surface of a sheet, preferably a continuously moving roll-to-roll sheet. In certain aspects of the invention, there are provided methods in which the mol...
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WO/2008/136223A1 |
Disclosed is a chromium hydroxide which is characterized by having an average particle diameter D of 40-200 nm and an aggregation degree, which is represented by the ratio D50/D between the volume average particle diameter D50 measured b...
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WO/2008/137459A2 |
In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the...
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WO/2008/137951A2 |
A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point...
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WO/2008/108341A1 |
[PROBLEMS] To provide a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retard...
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WO/2008/105489A1 |
Disclosed is an apparatus for removing a cation from a plating solution additive comprising an aqueous solution containing an organic or inorganic acid salt, which can remove an undesirable cationic component such as sodium and potassium...
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WO/2008/102332A1 |
A method of forming an insulator that passes through a metal substrate (302) comprising: anodizing a region (312a, 312b, 314,316a, 316b, 318, 320a, 320b, 322, 324a, 324b) of the substrate to form the insulator; illuminating the region wi...
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WO/2008/101740A1 |
To achieve uniform electroplating of a metal on a work piece a device is provided, which comprises at least one anode and a diaphragm comprising a fill made of packing material. The diaphragm is located in the device such that electric f...
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WO/2008/084524A1 |
A process for producing a semiconductor device, comprising the wiring region forming step of forming a wiring region on a semiconductor substrate; the copper wiring layer forming step of forming a copper wiring layer on the formed wiring...
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WO/2008/081536A1 |
[PROBLEMS] To efficiently derive accurate operating condition parameters most suitable for plating operation. [MEANS FOR SOLVING PROBLEMS] First, preliminary test operation (S12) is carried out in current passage condition. Taking result...
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WO/2008/082004A1 |
This invention provides a plating member which, while adopting a lead-free plating material, can suppress the occurrence of whiskers in a plating layer (16) and, at the same time, can realize good soldability. The plating member comprise...
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WO/2008/080515A2 |
The invention relates to a set for creating a process reactor for forming metallic layers on at least one substrate, the layers being formed by the precipitation of metal ions contained in a fluid onto the substrates. Said set essentiall...
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WO/2008/071371A2 |
Disclosed is a method for the galvanic deposition of a metal coating from an electrolyte bath in which the concentrations of at least two components of the electrolyte bath are monitored and in which the following steps are carried out: ...
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WO/2008/071298A1 |
A method for galvanic coating of workpieces (68, 68') is disclosed, wherein the workpieces (68, 68') are firstly hung on a frame, then pre-treated and passed through a zinc-containing electrolyte bath (46, 48, 50), wherein the workpieces...
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WO/2008/070786A1 |
Methods and systems for screening for the effect of bath composition on the performance of electroplating, electroless-plating, electrochemical-etching, electropolishing, and chemical-etching processes are provided. The methods and syste...
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WO/2008/047509A1 |
This invention provides a plating apparatus which can apply at a high speed a magnetic alloy plating having a uniform thickness and a homogeneous composition on the surface of a shaft-shaped member. A plating apparatus (1) has a plating ...
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WO/2008/023778A1 |
A plating solution regenerating apparatus for electroplating, comprising a circulation tank, a sludge removing unit, a concentrating unit, an iron compound crystallizing unit, an iron compound separating unit, an iron compound re-dissolv...
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WO/2008/014987A2 |
The invention relates to a method for deposition of chromium layers as hard-chrome plating for protection against wear or corrosion and/or for decorative purposes and also an electroplating bath with which chromium layers of this type ca...
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WO/2007/120357A2 |
Embodiments of the invention generally provide a method for electrochemically removing material from a substrate. In one embodiment, a method for electrochemically processing a substrate includes determining a process target for a substr...
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WO/2007/116775A1 |
The present invention provides a washing apparatus which washes a web while conveying the web. The washing apparatus includes a squirting component which ejects fresh washing liquid at the web and a first washing tank which is disposed a...
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WO/2007/102605A1 |
This invention provides a method for electroplating on a mesh pattern on a film having high surface resistivity evenly without increasing the line width, and an electroconductive film having excellent electroconductivity and a light-tran...
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WO/2007/103304A2 |
The present invention relates to a mobile apparatus and/or system that measures the thickness at one or more locations of a surface on at least a part of a substrate and methods of using said apparatus and/or system. The mobile apparatus...
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WO/2007/088008A2 |
The invention relates to a method for coating substrate surfaces with a metal or oxide layer in a coating bath. Said bath has at least one component the concentration of which changes during the coating process and which therefore has to...
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WO/2007/082528A1 |
The invention relates to a method for producing an alloy having a predetermined composition, said alloy having three or more components. The method according to the invention comprises the following steps: (a) determining the selectivity...
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WO/2007/082275A2 |
The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with el...
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WO/2007/058603A1 |
Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple e...
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WO/2007/058605A1 |
A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a...
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WO/2007/055223A1 |
Disclosed is a method for forming a metal film which is characterized by comprising a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt ...
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WO/2007/047215A2 |
Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electropro...
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WO2002029137A9 |
An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in...
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WO/2007/024331A1 |
One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs) . The system comprises a deposition chamber sealed from- ambient air. A mixture of phosphor material and solution ...
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WO/2006/137555A1 |
A conductive surface 5 of a film 4 is plated with copper by allowing the film 4 to pass through a plating solution 7 in a plating bath 6 while conveying the film in a direction indicated by the arrow. Air knife devices 20A and 20B are di...
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WO/2006/132397A1 |
A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000 O/ in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a la...
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WO/2006/126518A1 |
Gravure cylinder-use copper plating method and device which can perform a uniform-thickness copper plating on a gravure cylinder over its entire length without causing defects such as rashes and pits regardless of the size of a gravure c...
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WO/2006/117035A1 |
The invention relates to an electrolytic cell comprising a device provided with at least two cuboidal/column-shaped/prismatic chambers having identical cross-sections and made of a thermoplastic, mechanical resistant, electrical resistan...
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WO/2006/118537A1 |
The invention relates to a combined process for the adsorption of metals in a liquid and for the neutralisation of metal- containing waste acids. The adsorption material used in the process is in the form of a geological mineral containi...
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WO/2006/095817A1 |
Real time measurement of film properties of a translucent film is performed and the film properties are controlled at a high accuracy by a base material processing apparatus, which is provided for forming a translucent film on a surface ...
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WO/2006/074106A2 |
A system for forming an anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The system includes a bath, a coating thickness monitor, at least one probe and at least one controller. T...
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