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WO/2006/074412A2 |
An intelligent coating system for forming a product on at least a portion of a substrate is disclosed. The intelligent coating system includes a coating applicator, a thickness monitor, a multiple-axis device, and, optionally, at least o...
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WO/2006/070452A1 |
A method for manufacturing a semiconductor device, which comprises providing a tank (21) for storing a plating solution in addition to a plating treatment tank (20), and arranging magnets (33a to 33d) in the plating solution storage tank...
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WO/2006/066689A2 |
The invention relates to a method for depositing metallic layers from acid or alkaline zinc or zinc alloy baths, which contain organic additives selected from brighteners, wetting agents and complexing agents, and contain a soluble zinc ...
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WO/2006/066920A1 |
The invention relates to an electrodeposition coating installation for painting workpieces, in particular vehicle bodywork, comprising at least one immersion bath, in which at least one electrode is located, a transport device, which int...
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WO/2006/051879A1 |
Disclosed is an electroplating method of an alloy composed of an iron group metal and Mo and/or W which enables to continuously and stably obtain good adhesion between an enamel layer and a steel sheet. In electroplating of an alloy comp...
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WO/2006/038335A1 |
An electrochemical deposition method and apparatus for determining the structure of a substance deposited on the surface of a working electrode, and a microstructure. A positive electrode (1) and a negative electrode (2) functioning as a...
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WO/2006/018173A1 |
The invention relates to a device for removing foreign matter from process solutions. Said device comprises an electrolytic system having at least one cell divided up by at least two current-carrying dividing walls which define at least ...
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WO/2006/016603A1 |
Disclosed is an electroplating method realizing short-time processing which has been difficult for conventional tin-zinc alloy electroplating methods. Specifically disclosed is a method for performing tin-zinc alloy electroplating under ...
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WO/2006/013855A2 |
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WO/2006/006992A1 |
An electrolyte bath (10) and method of electrolytically plating a layer of metallic chromium on a substrate comprises providing an electrolyte bath (10) of a trivalent chromium, passing a current through the bath from an anode to a catho...
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WO/2005/123989A1 |
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liq...
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WO/2005/118918A2 |
Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is perf...
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WO/2005/116303A1 |
A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive bre...
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WO/2005/116300A1 |
In an external plating structure of a semiconductor package, a Pd or Pd alloy film is used as a material replacing the conventional solder plating as a soldering metal. The highly reliable semiconductor component external plating structu...
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WO/2005/111275A2 |
The present invention relates in general to real-time analysis of electrochemical deposition (ECD) metal plating solutions, for the purpose of reducing plating defects and achieving high quality metal deposition. The present invention pr...
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WO/2005/108649A2 |
The present invention relates to a method for mathematically re-calibrating and adjusting an initial concentration analysis model that suffers from electrochemical measurement errors caused by surface state changes in the working/counter...
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WO/2005/108650A1 |
The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measur...
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WO/2005/090639A2 |
For an electrolytic cell, an apparatus and method are described that use one or more sensors to measure magnetic field strength about a conductor carrying electrical current. A processor is in electrical communication with the sensors an...
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WO/2005/090644A2 |
A system, device, and method include a cell-powered first electronic device powered using electrical potential imposed across an electrolytic cell. The potential is voltage-boosted to accomplish this task. If the electrical potential imp...
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WO/2005/083134A1 |
The present invention relates to a process to recover zinc from zinc containing residues or scraps, especially those produced by hot-dip galvanizing lines. The process comprises the steps of: - selecting a Si-bearing compound which, at a...
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WO/2005/076977A2 |
The present invention comprises a metal plating apparatus and method, particularly suitable for autocatalytic (i.e.. electroless) plating, comprising a pressurized sealable vessel for disposing a substrate to be plated and for the circul...
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WO/2005/075712A2 |
An improved electrochemical IR calculation and correction system allows for the precise measurement and control of the interfacial voltage drop at an electrode double layer. In an exemplary use of the invention, this improved IR correcti...
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WO/2005/076680A2 |
The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of - immersing the substrate with the pattern present thereon in an elect...
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WO/2005/065208A2 |
A method and apparatus for treating an electroless plating solution is provided. The apparatus includes a reaction vessel, a cathode and an anode disposed in the interior of the reaction vessel and in electrical communication with a powe...
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WO/2005/065436A2 |
Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (98) (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance...
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WO/2005/065430A2 |
Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus ...
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WO2004081261B1 |
The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connecte...
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WO/2005/052220A1 |
Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or mea...
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WO/2005/042804A2 |
A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during ...
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WO2005035836B1 |
Embodiments of the invention generally provide an electrochemical processing system configured to provide selected amounts of electrolyte composition components for plating processes. The selected amounts of components to be added to an ...
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WO/2005/033655A2 |
The present invention relates to an electrode assembly useful for analyzing metal electroplating solutions. Such electrode assembly comprises a measuring electrode, preferably a rotating disc electrode or a microelectrode, and at least o...
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WO/2005/033377A2 |
An electroplating tool (200) is operated in combination with a controller (250), which automatically determines the individual currents for a multi-anode configuration (102A, …, 102N) of the plating tool. The calculation of the anode c...
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WO/2005/028717A1 |
A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume po...
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WO/2005/026688A2 |
A method and system for analysis of additives in electrolysis plating solutions, using a flow management system that minimizes loss of plating solutions and decreases sampling time. The system includes at least one analysis chamber, a sa...
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WO/2005/007933A1 |
Embodiments of the invention provide an electrochemical plating cell (100). The plating cell includes a fluid basin (101), (102) having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane (112) positio...
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WO/2005/003411A1 |
Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell (102) containing an anolyte compartment (106) and a catholyte compartment (104) separated ...
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WO/2004/111313A1 |
The invention relates to a method for the recovery of gold and/or silver from a cyanide complexes solution of gold and/or silver, particularly from spent electrolytic baths. The inventive method comprises the following steps consisting i...
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WO/2004/107834A1 |
The invention provides a process for filling µ-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising...
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WO/2004/101866A2 |
The invention relates to a method and devices for increasing the service life of a process solution used for chemical-reductive metal deposition. In said method, the pH-value is adjusted and the ions of the coating metal are replenished ...
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WO/2004/101863A2 |
The invention relates to a method and a device (11, 111) for coating, for example, printed circuit boards (17, 117), using a coating bath (13, 113). Said coating bath (13) contains sound sources (21) which generate ultrasound towards the...
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WO/2004/101860A1 |
Disclosed is a solution for an electrochemical process, the solution containing a sulfonic acid and having a low concentration of sulfur compounds, either low or high valence, that are susceptible to reduction and which is intended for u...
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WO/2004/096717A2 |
The present invention relates to a method and apparatus for removing and recovering metal such as copper from various kinds of waste water containing copper. A method for treating waste water includes treating waste water in a copper tre...
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WO/2004/097929A2 |
The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a deg...
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WO/2004/094701A2 |
It is an object of the present invention to provide a system and method for monitoring, dosing and distribution of a chemical composition in a material treatment process, the chemical composition containing at least one additive for main...
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WO/2004/094702A2 |
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating ce...
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WO/2004/090200A1 |
The invention relates to a device and a method for the galvanic deposition of alloys, whereby, during the deposition process, the deposition parameters are varied according to time and in a program-controlled manner, on the basis of mult...
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WO/2004/088003A2 |
The invention relates to a method and a device for controlling at least one operating parameter of an electrolytic bath. The invention has the aim of providing a method and a device that enable the production of improved quality platings...
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WO/2004/085715A1 |
A time-dependent change in potential at a cathode current density of 0.1-20 A/dm2 is measured to thereby judge the effective embeddability and uniform electrodepositing property of an electrolytic copper plating solution. The measurement...
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WO/2004/079053A1 |
A process for producing an electrolytic copper foil using sampled copper sulfate solution being discharged from a copper refining process in order to supply a low-cost electrolytic copper foil for printed wiring board to the market. The ...
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WO/2004/078411A2 |
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conduc...
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